MICROCHIP 24AA256, 24LC256, 24FC256 Technical data

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256K Bit I
24AA256/24LC256/24FC256
2
C
CMOS Serial EEPROM
DEVICE SELECTION TABLE
Part
Number
24AA256 1.8-5.5V 400 kHz 24LC256 2.5-5.5V 400 kHz 24FC256 2.5-5.5V 1 MHz I
100 kHz for V
100 kHz for E temperature range.
V
CC
Range
CC
< 2.5V.
Max Clock Frequency
Temp
Ranges
† ‡
I
I, E
FEATURES
• Low power CMOS technology
- Maximum write current 3 mA at 5.5V
- Maximum read current 400 µA at 5.5V
- Standby current 100 nA typical at 5.5V
• 2-wire serial interface bus, I
• Cascadable for up to eight devices
• Self-timed ERASE/WRITE cycle
• 64-byte page-write mode available
• 5 ms max write-cycle time
• Hardware write protect for entire array
• Output slope control to eliminate ground bounce
• Schmitt trigger inputs for noise suppression
• 100,000 erase/write cycles guaranteed
• Electrostatic discharge protection > 4000V
• Data retention > 200 years
• 8-pin PDIP and SOIC (208 mil) packages
• Temperature ranges:
- Industrial (I): -40 ° C to +85 ° C
- Automotive (E): -40 ° C to +125 ° C
2
C compatible
DESCRIPTION
The Microchip Technology Inc. 24AA256/24LC256/ 24FC256 (24XX256*) is a 32K x 8 (256K bit) Serial Electrically Erasable PROM, capable of operation across a broad voltage range (1.8V to 5.5V). It has been developed for advanced, low power applications such as personal communications or data acquisition. This device also has a page-write capability of up to 64 bytes of data. This device is capable of both random and sequential reads up to the 256K boundary. Func­tional address lines allow up to eight devices on the same bus, for up to 2M bit address space. This device is available in the standard 8-pin plastic DIP and 8-pin SOIC (208 mil) packages.
P ACKA GE TYPE
PDIP
A0
1
A1
2
A2
3
Vss
4
SOIC
1
A0
2
A1
3
A2
SS
V
4
BLOCK DIAGRAM
A0 A1 A2
WP
SCL
MEMORY
CONTROL
LOGIC
CONTROL
LOGIC
I/O
SDA
VCC VSS
I/O
24XX256
8
24XX256
7 6 5
XDEC
Vcc
8
WP
7
SCL
6
SDA
5
VCC WP SCL SDA
HV GENERATOR
PAGE LATCHES
SENSE AMP
R/W CONTROL
EEPROM
ARRAY
YDEC
2
I
C is a trademark of Philips Corporation.
*24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices.
1998 Microchip Technology Inc.
Preliminary
DS21203D-page 1
µ
µ
24AA256/24LC256/24FC256
1.0 ELECTRICAL CHARACTERISTICS
1.1 Maxim
V
.................................................................................................7.0V
CC
All inputs and outputs w.r.t. V
Storage temperature...................................................-65°C to +150°C
Ambient temp. with power applied...............................-65°C to +125°C
Soldering temperature of leads (10 seconds)...........................+300°C
ESD protection on all pins........................................................... ≥ 4 kV
*Notice: Stresses above those listed under “Maximum Ratings” may
cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended peri­ods may affect device reliability.
TABLE 1-2 DC CHARACTERISTICS
All parameters apply across the specified operating ranges, unless otherwise noted.
SCL, SDA, and WP pins:
High level input voltage V
Low level input voltage V
Hysteresis of Schmitt Trigger
inputs (SDA, SCL pins)
Low level output voltage V
Output leakage current I
Note: This parameter is periodically sampled and not 100% tested.
um Ratings*
SS
............................. -0.6V to V
Industrial (I): V Automotive (E): V
Parameter Symbol Min Max Units Conditions
A0, A1, A2,
Input leakage current I
Pin capacitance
C
(all inputs/outputs)
Operating current I
Standby current I
CC
+1.0V
= +1.8V to 5.5V Tamb = -40°C to +85°C
CC
= +4.5V to 5.5V Tamb = -40°C to 125°C
CC
0.7 V
IH
IL
CC
0.3 V
0.2 V
V
IN
CC
I
CC
0.05 V
HYS
LO
, C
OL
LI
OUT
CC
0.40 V I
-10 10
-10 10 —10pFV
Read 400 µA V
Write 3 mA V
CCS
—1 µ A SCL = SDA = V
TABLE 1-1 PIN FUNCTION TABLE
Name Function
A0, A1, A2 User Configurable Chip Selects
Ground
SS
V SDA Serial Data SCL Serial Clock
WP Write Protect Input
V
+1.8 to 5.5V (24AA256)
CC
+2.5 to 5.5V (24LC256,24FC256)
—V
CC CC
V V
—VV
AV
AV
CC
V
2.5V
V
CC
< 2.5V
2.5V (Note)
CC
OL
= 3.0 mA @ V
I
= 2.1 mA @ V
OL
= V
or V
IN
SS
IN
V
= V
OUT
= V
= 5.0V (Note)
CC
Tamb = 25°C, f
CC
= 5.5V, SCL = 400 kHz = 5.5V
CC
CC
SS
CC
or V
SS
or V
CC
= 1 MHz
c
CC
A0, A1, A2, WP = V
CC CC
, WP = V , WP = V
= 5.5V
= 4.5V = 2.5V
SS CC
SS
FIGURE 1-1: BUS TIMING DATA
TF
SCL
SDA IN
SDA OUT
WP
DS21203D-page 2
TSU:STA
TSP
TLOW
THD:STA
THIGH
THD:DAT TSU:DAT TSU:STO
TAA
(protected)
(unprotected)
VHYS
TR
TSU:WP
Preliminary
TBUF
THD:WP
1998 Microchip Technology Inc.
24AA256/24LC256/24FC256
TABLE 1-3 AC CHARACTERISTICS
All parameters apply across the spec­ified operating ranges unless other­wise noted.
Parameter Symbol Min Max Units Conditions
Clock frequency F
Clock high time T
Clock low time T
SDA and SCL rise time (Note 1)
SDA and SCL fall time (Note 1)
START condition hold time THD:STA 4000
START condition setup time TSU:STA 4700
Data input hold time THD:DAT 0 ns (Note 2) Data input setup time TSU:DAT 250
STOP condition setup time TSU:STO 4000
WP setup time TSU:WP 4000
WP hold time THD:WP 4700
Output valid from clock (Note 2)
Bus free time: Time the bus must be free before a new transmission can start
Output fall time from VIH minimum to VIL maximum CB 100 pF
Industrial (I): V Automotive (E): V
CLK
HIGH
LOW
R
T
TF
TAA
TBUF 4700
TOF 10 + 0.1CB250
— — — —
4000 4000
600 500
4700 4700 1300
500
— — — —
4000
600 250
4700
600 250
250 100 100
4000
600 250
4000
600 600
4700 1300 1300
— — —
4700 1300
500
= +1.8V to 5.5V Tamb = -40°C to +85°C
CC
= +4.5V to 5.5V Tamb = -40°C to 125°C
CC
100
kHz 4.5V ≤ V 100 400
1000
— — — —
— — — —
1000 1000
300 300
300 100
— — — —
— — — —
— — — —
— — — —
— — — —
— — — —
3500 3500
900 400
— — — —
1.8V ≤ V
2.5V ≤ V 24FC256 (2.5 V ≤ Vcc ≤ 5.5 V)
ns 4.5V ≤ V
1.8V ≤ V
2.5V ≤ V 24FC256 (2.5 V ≤ Vcc ≤ 5.5 V)
ns 4.5V ≤ V
1.8V ≤ V
2.5V ≤ V 24FC256 (2.5 V ≤ Vcc ≤ 5.5 V)
ns 4.5V ≤ V
1.8V V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns All except 24FC256
24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V VCC 5.5V (E Temp range)
1.8V VCC 2.5V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V VCC 5.5V (E Temp range)
1.8V VCC 2.5V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V VCC 5.5V (E Temp range)
1.8V VCC 2.5V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V VCC 5.5V (E Temp range)
1.8V VCC 2.5V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V VCC 5.5V (E Temp range)
1.8V VCC 2.5V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V VCC 5.5V (E Temp range)
1.8V VCC 2.5V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V V
1.8V V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns 4.5V VCC 5.5V (E Temp range)
1.8V VCC 2.5V
2.5V VCC 5.5V 24FC256 (2.5 V Vcc 5.5 V)
ns All except 24FC256 (Note 1)
250
24FC256 (Note 1)
CC
5.5V (E Temp range)
CC
2.5V
CC
5.5V
CC
5.5V (E Temp range)
CC
2.5V
CC
5.5V
CC
5.5V (E Temp range)
CC
2.5V
CC
5.5V
CC
5.5V (E Temp range)
CC 2.5V
CC 5.5V (E Temp range) CC 2.5V
1998 Microchip Technology Inc.
Preliminary
DS21203D-page 3
24AA256/24LC256/24FC256
TABLE 1-3 AC CHARACTERISTICS
All parameters apply across the spec­ified operating ranges unless other­wise noted.
Parameter Symbol Min Max Units Conditions
Input filter spike suppression (SDA and SCL pins)
Write cycle time (byte or page) TWC —5 Endurance 100K cycles 25°C, VCC = 5.0V, Block Mode (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt trigger inputs which provide improved noise spike
suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application,
please consult the Total Endurance Model which can be obtained on Microchip’s website @www.microchip.com.
Industrial (I): VCC = +1.8V to 5.5V Tamb = -40°C to +85°C Automotive (E): V
T
SP 50 ns All except 24FC256 (Notes 1 and 3)
CC = +4.5V to 5.5V Tamb = -40°C to 125°C
ms
DS21203D-page 4 Preliminary  1998 Microchip Technology Inc.
24AA256/24LC256/24FC256
2.0 PIN DESCRIPTIONS
2.1 A0, A1, A2 Chip Address Inputs
The A0, A1, A2 inputs are used by the 24XX256 for multiple device operations. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true.
Up to eight devices may be connected to the same bus by using different chip select bit combinations. If left unconnected, these inputs will be pulled down inter­nally to V
SS.
2.2 SDA Serial Data
This is a bi-directional pin used to transfer addresses and data into and data out of the device. It is an open­drain terminal, therefore, the SDA bus requires a pullup resistor to V kHz and 1 MHz).
For normal data transfer SDA is allo wed to change only during SCL low. Changes during SCL high are reserved for indicating the START and STOP condi­tions.
CC (typical 10 k for 100 kHz, 2 kfor 400
2.3 SCL Serial Clock
This input is used to synchronize the data transfer from and to the device.
2.4 WP
This pin can be connected to either VSS, VCC or left floating. An internal pull-down resistor on this pin will keep the device in the unprotected state if left floating. If tied to V is enabled (read/write the entire memory 0000-7FFF).
If tied to V operations are not affected.
SS or left floating, normal memory operation
CC, WRITE operations are inhibited. Read
3.0 FUNCTIONAL DESCRIPTION
The 24XX256 supports a bi-directional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, and a device receiving data as a receiver. The bus must be con­trolled by a master device which generates the serial clock (SCL), controls the bus access, and generates the START and STOP conditions while the 24XX256 works as a slave. Both master and slav e can operate as a transmitter or receiver, but the master device deter­mines which mode is activated.
4.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable whenever the cloc k line is HIGH. Changes in the data line while the clock line is HIGH will be interpreted as a START or STOP condition.
Accordingly, the following bus conditions have been defined (Figure 4-1).
4.1 Bus not Busy (A)
Both data and clock lines remain HIGH.
4.2 Start Data Transfer (B)
A HIGH to LOW transition of the SDA line while the clock (SCL) is HIGH determines a START condition. All commands must be preceded by a START condi­tion.
4.3 Stop Data Transfer (C)
A LOW to HIGH transition of the SDA line while the clock (SCL) is HIGH determines a STOP condition. All operations must end with a STOP condition.
4.4 Data Valid (D)
The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal.
The data on the line must be changed during the LOW period of the clock signal. There is one bit of data per clock pulse.
Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of the data bytes transferred between the START and STOP conditions is determined by the master device.
4.5 Acknowledge
Each receiving device, when addressed, is obliged to generate an acknowledge signal after the reception of each byte. The master device must generate an extra clock pulse which is associated with this acknowledge bit.
Note: The 24XX256 does not generate any
acknowledge bits if an internal program­ming cycle is in progress.
A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. Dur­ing reads, a master must signal an end of data to the slave by NOT generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX256) will leav e the data line HIGH to enable the master to generate the STOP condition.
1998 Microchip Technology Inc. Preliminary DS21203D-page 5
24AA256/24LC256/24FC256
FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A) (B) (D) (D) (C) (A)
SCL
SDA
START
CONDITION
ADDRESS OR
ACKNOWLEDGE
VALID
FIGURE 4-2: ACKNOWLEDGE TIMING
SCL
SDA
Data from transmitter
Transmitter must release the SDA line at this point allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data.
DATA
ALLOWED
TO CHANGE
Acknowledge
Bit
987654321 123
Data from transmitter
Receiver must release the SDA line at this point so the Transmitter can continue sending data.
STOP
CONDITION
DS21203D-page 6 Preliminary  1998 Microchip Technology Inc.
24AA256/24LC256/24FC256
5.0 DEVICE ADDRESSING
A control byte is the first byte received following the start condition from the master device (Figure 5-1). The control byte consists of a 4-bit control code; for the 24XX256 this is set as 1010 binary for read and write operations. The next three bits of the control byte are the chip select bits (A2, A1, A0). The chip select bits allow the use of up to eight 24XX256 devices on the same bus and are used to select which device is accessed. The chip select bits in the control byte must correspond to the logic levels on the corresponding A2, A1, and A0 pins for the device to respond. These bits are in effect the three most significant bits of the word address.
The last bit of the control byte defines the operation to be performed. When set to a one a read operation is selected, and when set to a zero a write operation is selected. The next two bytes received define the address of the first data byte (Figure 5-2). Because only A14…A0 are used, the upper address bits is a don’t care. The upper address bits are transferred first, followed by the less significant bits.
Following the start condition, the 24XX256 monitors the SDA bus checking the device type identifier being transmitted. Upon receiving a 1010 code and appropri­ate device select bits, the slave device outputs an acknowledge signal on the SDA line. Depending on the state of the R/W write operation.
bit, the 24XX256 will select a read or
FIGURE 5-1: CONTROL BYTE FORMAT
ite Bit
Read/Wr
Control Code
1 0 1 0 A2 A1 A0SACKR/W
Slave Address
Start Bit
5.1 Contiguous Ad
Chip Select
Bits
Acknowledge Bit
dressing Across
Multiple Devices
The chip select bits A2, A1, A0 can be used to expand the contiguous address space for up to 2 Mbit by add­ing up to eight 24XX256's on the same bus. In this case, software can use A0 of the control b address bit A15; A1, as address bit A16; and A2, as address bit A17. It is not possible to sequentially read across device boundaries.
yte as
FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS
CONTROL BYTE ADDRESS HIGH BYTE ADDRESS LOW BYTE
A
1010
CONTROL
CODE
1998 Microchip Technology Inc. Preliminary DS21203D-page 7
A2A1A
CHIP
SELECT
BITS
R/W X
0
A13A
A11A10A
12
14
A
9
A
••••••
7
8
X = Don’t Care Bit
A 0
24AA256/24LC256/24FC256
6.0 WRITE OPERATIONS
6.1 Byte Write
Following the start condition from the master, the control code (four bits), the chip select (three bits), and the R/W
bit (which is a logic low) are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that the address high byte will follow after it has generated an acknowledge bit during the ninth clock cycle. Therefore, the next byte transmitted by the master is the high-order byte of the word address and will be written into the address pointer of the 24XX256. The next byte is the least sig­nificant address byte. After receiving another acknowl­edge signal from the 24XX256, the master device will transmit the data word to be written into the addressed memory location. The 24XX256 acknowledges again and the master generates a stop condition. This ini­tiates the internal write cycle, and, during this time, the 24XX256 will not generate acknowledge signals (Figure 6-1). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command but no write cycle will occur, no data will be written, and the device will immediately accept a new command. After a byte write command, the inter­nal address counter will point to the address location following the one that was just written.
FIGURE 6-1: BYTE WRITE
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
X = don’t care bit
S T
CONTROL
A
BYTE
R T
S1010 0
A1A
A
0
2
X
A C K
ADDRESS
HIGH BYTE
6.2 Page Write
The write control byte, word address, and the first data byte are transmitted to the 24XX256 in the same way as in a byte write. But instead of generating a stop con­dition, the master transmits up to 63 additional bytes, which are temporarily stored in the on-chip page buffer and will be written into memory after the master has transmitted a stop condition. After receipt of each word, the six lower address pointer bits are internally incremented by one. If the master should transmit more than 64 bytes prior to generating the stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the stop condition is received, an inter­nal write cycle will begin (Figure 6-2). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command but no write cycle will occur, no data will be written, and the device will immediately accept a new command.
6.3 Write Protection
The WP pin allows the user to write-protect the entire array (0000-7FFF) when the pin is tied to V V
SS or left floating, the write protection is disabled. The
WP pin is sampled at the STOP bit for every write command (Figure 1-1) Toggling the WP pin after the STOP bit will have no effect on the execution of the write cycle.
ADDRESS
A C K
LOW BYTE
DATA
A C K
CC. If tied to
S T O P
P
A C K
FIGURE 6-2: PAGE WRITE
S
T BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
X = don’t care bit
DS21203D-page 8 Preliminary  1998 Microchip Technology Inc.
CONTROL
A
BYTE
R
T
S1010 0
A2A1A
ADDRESS
HIGH BYTE
X
0
A C K
A C K
ADDRESS LOW BYTE
DATA BYTE 0
A C K
A C K
DATA BYTE 63
S T O P
P
A C K
24AA256/24LC256/24FC256
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput.) Once the stop condition for a write com­mand has been issued from the master, the device ini­tiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a start condition, followed by the control byte for a write command (R/W with the write cycle, then no ACK will be returned. If no ACK is returned, then the start bit and control byte must be resent. If the cycle is complete, then the device will return the ACK, and the master can then proceed with the next read or write command. See Figure 7-1 for flow diagram.
= 0). If the device is still b usy
FIGURE 7-1: ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
YES
Next
Operation
NO
1998 Microchip Technology Inc. Preliminary DS21203D-page 9
24AA256/24LC256/24FC256
8.0 READ OPERATION
Read operations are initiated in the same way as write operations with the exception that the R/W control byte is set to one. There are three basic types of read operations: current address read, random read, and sequential read.
8.1 Current Address Read
The 24XX256 contains an address counter that main­tains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address n (n is any legal address), the next current address read operation would access data from address n + 1.
Upon receipt of the control byte with R/W the 24XX256 issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a stop condition and the 24XX256 discontinues transmission (Figure 8-1).
FIGURE 8-1: CURRENT ADDRESS READ
S
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
T A R T
S
1100
CONTROL
BYTE
AAA 210
1
A C K
bit of the
bit set to one,
DATA BYTE
N O
A C K
8.2 Random Read
Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, first the word address must be set. This is done b y sending the word address to the 24XX256 as part of a write operation (R/W
bit set to 0). After the word address is sent, the master generates a start condition following the acknowledge. This termi­nates the write operation, but not before the internal address pointer is set. Then, the master issues the control byte again but with the R/W
bit set to a one. The 24XX256 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer but does generate a stop condition which causes the 24XX256 to discontinue transmission (Figure 8-2). After a random read command, the inter­nal address counter will point to the address location following the one that was just read.
8.3 Sequential Read
Sequential reads are initiated in the same way as a ran­dom read except that after the 24XX256 transmits the
S T O P
P
first data byte, the master issues an acknowledge as opposed to the stop condition used in a random read. This acknowledge directs the 24XX256 to transmit the next sequentially addressed 8-bit word (Figure 8-3). Following the final byte transmitted to the master, the master will NOT generate an acknowledge b ut will gen­erate a stop condition. To pro vide sequential reads , the 24XX256 contains an internal address pointer which is incremented by one at the completion of each opera­tion. This address pointer allows the entire memory contents to be serially read during one operation. The internal address pointer will automatically roll over from address 7FFF to address 0000 if the master acknowl­edges the byte received from the array address 7FFF.
FIGURE 8-2: RANDOM READ
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
X = Don’t Care Bit
S T
CONTROL
A R
BYTE
T S1010
AAA 210
0
X
A C K
ADDRESS
HIGH BYTE
A C K
ADDRESS
LOW BYTE
S T A R T
S1010
A C K
CONTROL
BYTE
AAA 210
DATA
BYTE
1
A C K
S T O P
P
N O
A C K
FIGURE 8-3: SEQUENTIAL READ
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
DS21203D-page 10 Preliminary  1998 Microchip Technology Inc.
CONTROL
BYTE
DATA n DATA n + 1 DATA n + 2 DATA n + X
A C K
A C K
A C K
A C K
S T O P
P
N O
A C K
24AA256/24LC256/24FC256
24XX256 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
24XX256 — /P
Package:
P = Plastic DIP (300 mil Body), 8-lead
SM = Plastic SOIC (208 mil Body, EIAJ standard), 8-lead
Temperature Range:
Device:
24AA256T 256K bit 1.8V I
24LC256T 256K bit 2.5V I
24FC256T 256K bit 1MHz I
I = -40°C to +85°C
E = -40°C to +125°C
24AA256 256K bit 1.8V I
24LC256 256K bit 2.5V I
24FC256 256K bit 1MHz I
2
C Serial EEPROM
2
C Serial EEPROM (Tape and Reel)
2
C Serial EEPROM
2
C Serial EEPROM (Tape and Reel)
2
C Serial EEPROM
2
C Serial EEPROM (Tape and Reel)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277
3. The Microchip Worldwide Web Site at www.microchip.com Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using
1998 Microchip Technology Inc. Preliminary DS21203D-page 11
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
Microchip T echnology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602-786-7200 Fax: 602-786-7277
Technical Support: Web:
http://www.microchip.com
Atlanta
Microchip T echnology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307
Boston
Microchip T echnology Inc. 5 Mount Royal Avenue Marlborough, MA 01752 Tel: 508-480-9990 Fax: 508-480-8575
Chicago
Microchip T echnology Inc. 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075
Dallas
Microchip T echnology Inc. 14651 Dallas Parkway, Suite 816 Dallas, TX 75240-8809 Tel: 972-991-7177 Fax: 972-991-8588
Dayton
Microchip T echnology Inc. Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175
Detroit
Microchip T echnology Inc. 42705 Grand River, Suite 201 Novi, MI 48375-1727 Tel: 248-374-1888 Fax: 248-374-2874
Los Angeles
Microchip T echnology Inc. 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 714-263-1888 Fax: 714-263-1338
New Y ork
Microchip T echnology Inc. 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 516-273-5305 Fax: 516-273-5335
San Jose
Microchip T echnology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
602 786-7627
AMERICAS (continued)
Toronto
Microchip T echnology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253
ASIA/PACIFIC
Hong Kong
Microchip Asia Pacific RM 3801B, Tower Two Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431
India
Microchip T echnology Inc. India Liaison Office No. 6, Legacy, Convent Road Bangalore 560 025, India Tel: 91-80-229-0061 Fax: 91-80-229-0062
Japan
Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222-0033 Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip T echnology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934
Shanghai
Microchip T echnology RM 406 Shanghai Golden Bridge Bldg. 2077 Yan’an Road West, Hong Qiao District Shanghai, PRC 200335 Tel: 86-21-6275-5700 Fax: 86 21-6275-5060
ASIA/PACIFIC (continued)
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore 188980 Tel: 65-334-8870 Fax: 65-334-8850
Taiwan, R.O.C
Microchip T echnology Taiwan 10F-1C 207 Tung Hua North Road T aipei, Taiwan, ROC Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
United Kingdom
Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh T riangle Wokingham Berkshire, England RG41 5TU Tel: 44-1189-21-5858 Fax: 44-1189-21-5835
France
Arizona Microchip Technology SARL Zone Industrielle de la Bonde 2 Rue du Buisson aux Fraises 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Müchen, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-39-6899939 Fax: 39-39-6899883
7/7/98
Microchip received ISO 9001 Quality System certification for its worldwide headquarters, design, and wafer fabrication facilities in January , 1997. Our field-programmable PICmicro™ 8-bit MCUs, Serial EEPROMs, related specialty memory products and development systems conform to the stringent quality standards of the International Standard Organization (ISO).
All rights reserved. © 1998, Microchip Technology Incorporated, USA. 10/98 Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
DS21203D-page 12  1998 Microchip Technology Inc.
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