MICROCHIP 24AA16, 24LC16B Technical data

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24AA16/24LC16B

16K I2C™ Serial EEPROM

Device Selection Table

Part

Number

24AA16 1.8-5.5 400 kHz

24LC16B 2.5-5.5 400 kHz I, E

Note 1: 100 kHz for VCC <2.5V

Vcc

Range

Max Clock Frequency

(1)

Temp

Ranges

Features:

• Single supply with operation down to 1.8V

• Low-power CMOS technology:

- 1 mA active current, typical

-1μA standby current (max.) (I-temp)

• Organized as 8 blocks of 256 bytes (8 x 256 x 8)

• 2-wire serial interface bus, I

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (2.5V) and 400 kHz (≥2.5V) compatibility

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 16 bytes

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-lead PDIP, SOIC, TSSOP, DFN and MSOP packages

• 5-lead SOT-23 package

• Pb-free finish available

• Available temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

C™ compatible

Description:

The Microchip Technology Inc. 24AA16/24LC16B (24XX16*) is a 16 Kbit Electrically Erasable PROM. The device is organized as eight blocks of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.8V with standby and active currents of only 1 μA and 1 mA, respectively. The 24XX16 also has a page write capability fo r up to 16 bytes of data. The 24X X16 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages, and is also available in the 5-lead SOT-23 package.

Package Types

A0 A1

SOIC, TSSOP

1 2 3 4

DFN

SCL

SDA

SCL

6 5

SDA

PDIP, MSOP

SOT-23-5

SCL

Vss

SDA

Note: Pins A0, A1 and A2 are not used by the 24XX16 (no

internal connections).

VCC

SCL

SDA

Vcc

Block Diagram

Generator

I/O

Control

Logic

I/O

SCL

SDA

*24XX16 is used in this document as a generic part

VSS

number for the 24AA16/24LC16B devi ce s.

Memory

Control

Logic

XDEC

EEPROM

Array

Page

Latches

YDEC

Sense Amp. R/W Control

24AA16/24LC16B

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-65°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indica ted in the opera tional li stings of this sp ecification is not i mplied. Ex posure to maximum rating conditions for extended periods may affect device reliability.

SS ......................................................................................................... -0.3V to VCC +1.0V

(†)

TABLE 1-1: DC CHARACTERISTICS

DC CHARACTERISTICS

Param.

No.

D1 V D2 — High-level input voltage 0.7 V D3 VIL Low-level input voltage — — 0.3 VCC V— D4 VHYS Hysteresis of Schmitt

D5 V D6 ILI Input leakage current ——±1μAVIN = VSS or VCC D7 ILO Output leakage current ——±1μAVOUT = VSS or VCC D8 CIN,

D9 I D10 ICC read — 0.01 1 mA — D11 ICCS Standby current —

Note 1: This parameter is periodically sampled and not 100% tested.

Symbol Characteristic Min Typ Max Units Conditions

IH WP, SCL and SDA pins — ————

Trigger inputs

OL Low-level output voltage — — 0.40 V IOL = 3.0 mA, VCC = 2.5V

Pin capacitance

OUT

CC write Operating current ——3mAVCC = 5.5V, SCL = 400 kHz

2: Typical measurements taken at room temperature.

(all inputs/outpu t s)

Industrial (I): TA = -40°C to +85°C, VCC = +1.8V to +5.5V Automotive (E): T

CC ——V—

.05 VCC ——V(Note 1)

——10pFVCC = 5.0V (Note 1)

—

A = -40°C to +125°C, VCC = +2.5V to +5.5V

A = 25°C, FCLK = 1 MHz

0.3 .01

1 5

μAμAIndustrial

Automotive SDA = SCL = VCC WP = VSS

24AA16/24LC16B

TABLE 1-2: AC CHARACTERISTICS

AC CHARACTERISTICS

Param.

No.

Symbol Characteristic Min Max Units Conditions

CLK Clock frequency —

2 THIGH Clock high time 600

LOW Clock low time 1300

4TR SDA and SCL rise time

(Note 1)

5T 6T

F SDA and SCL fall time — 300 ns (Note 1) HD:STA Start condition hold time 600

7TSU:STA Start condition setup time 600

8THD:DAT Data input hold time 0 — ns (Note 2) 9TSU:DAT Data input setup time 100

10 TSU:STO Stop condition setup time 600

11 T

AA Output valid from clock

(Note 2)

12 TBUF Bus free time: Time the bus

must be free before a new transmissi on can start

13 T

OF Output fall time from VIH

minimum to V

IL maximum

14 TSP Input filter spike suppression

(SDA and SCL pins)

15 T

WC Write cycle time

(byte or page) 16 — Endurance 1M — cycles 25°C, (Note 4) Note 1: Not 100% tested. C

B = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined T

SP and VHYS specificat io ns are due to new Schm it t Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, ple ase co ns ult the T o tal Endurance™ Model which c an be obtained from Microchip’s web site at www.microchip.com.

Industrial (I): TA = -40°C to +85°C, VCC = +1.8V to +5.5V Automotive (E): T

—

4000

4700

— —

A = -40°C to +125°C, VCC = +2.5V to +5.5V

400 100

— —

300

1000

kHz 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V (Note 1)

1.8V ≤ V

CC < 2.5V (24AA16)

(Note 1)

4000

4700

250

4000

— —

1300 4700

20+0.1C

—

— —

900

3500

— —

250 250

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

CC < 2.5V (24AA16)

ns 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ V

ns 2.5V ≤ V

1.8V ≤ V

CC < 2.5V (24AA16)

CC ≤ 5.5V CC <2.5V (24AA16)

—50ns(Notes 1 and 3)

—5ms—

TI specification for standard operation.

24AA16/24LC16B

FIGURE 1-1: BUS TIMING DATA

SCL

SDA

OUT

FIGURE 1-2: BUS TIMING START/STOP

SCL

SDA

Start Stop

24AA16/24LC16B

2.0 FUNCTIONAL DESCRIPTION

The 24XX16 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX16 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated.

3.0 BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus is not busy.

• During data transfer, the data line must remain stable when ever the c lock lin e is high. Cha nges i n the data line while the clock line is high will be interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have been defined (Figure 3-1).

3.1 Bus Not Busy (A)

Both data and clock lines remain high.

3.2 Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition.

3.3 Stop Data Transfer (C)

A low-to-h i gh t ran si t io n of t h e SD A l in e whi l e t h e c lo ck (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition.

3.4 Data Valid (D)

The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal.

The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data.

Each data transfer is initiated with a S tart conditi on and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is determined by the master device and is, theoretically unlimited, (although only the last sixteen will be stored when doing a write operation). When an overwrite does occur it will replace data in a first-in first-out (FIFO) fashion.

3.5 Acknowledge

Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The ma ster devi ce m ust gener at e an ex tr a cloc k pulse which is associated with this Acknowledge bit.

Note: The 24XX16 does not generate any

Acknowledge bits if an internal programming cycle is in progress.

The device that acknowledges, has to pull down the SDA line during the ackn owledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the sla ve by no t gene rating a n Ack nowl edge b it on the last byte that has be en c loc ke d ou t of th e sl av e. In this case, the sl ave (24 XX16) will leave the data lin e high to enable the master to generate the Stop condition.

FIGURE 3-1: DAT A TRANSFER SEQUENCE ON THE SERIAL BUS

SCL

SDA

(A) (B) (D) (D) (A)(C)

Start

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

Stop

Condition

24AA16/24LC16B

3.6 Device Addressi ng

A control byte is th e first byte received following the Start condition from the master device (Figure 3-2). The control byte consists of a four-bit control code. For the 24XX16, this is set as ‘ and write operations. The next three bits of the control byte are the block-sel ect bits (B2, B1, B0). T hey are used by the master device to select which of the eight 256 word-blocks of memory are to be accessed. These bits are in effect the thr ee Mo st S ignif ica nt bits of the word address. It should be noted that the protocol limits the si ze of the me mory to eight block s of 256 wor ds , th er efore, the protocol can support only one 24XX16 per system .

The last bit of the control byte defines the operation to be performed. When set to ‘ selected. When set to ‘ Following the Start condition, the 24XX16 monitors the SDA bus, checking the device type identifier being transmitted and, upon receiving a ‘ slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX16 will select a read or write operation.

Operation

Read Write

0’, a write operation is se lecte d.

Control

Code

1010

1010’ binary for read

1’, a read operation is

1010’ code, the

Block Select R/W

Block Address Block Address

FIGURE 3-2: CONTROL BYTE

ALLOCATION

Start Read/Write

Slave Address

1010B2 B1 B0

R/W

24AA16/24LC16B

4.0 WRITE OPERATION

4.1 Byte Write

Following the Start condition from the master, the device code (4 bits), the block address (3 bits) and the R/W bit, which is a lo gic-low, is placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow once it has generated an Ac knowledge b it during the ninth clock cycl e. Therefore, th e next byte trans mitted by the master is the word address and will be written into the Address Pointer of the 24XX16. After receiving another Acknowledge signal from the 24XX16, the master device will transmit the data word to be written into the addressed memory location. The 24XX16 acknowledges again and the master generates a Stop condition. This initiates the internal write cycle and, during this time, the 24XX16 will not generate Acknowledge signals (Figure 4-1).

4.2 Page Wri te

The write control byte, word address and the first data byte are transmitted to the 24 XX16 in th e same w ay a s in a byte write. However, instead of generating a Stop condition, the master transmits up to 16 data bytes to the 24XX16, which are temporarily stored in the onchip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the four lower-order Address Pointer bits are internally incremented by ‘ higher-order 7 bits of the word address remain constant. If the master should transmit more than 16 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwri tten. As w ith the by te writ e operation, once the Stop condition is received an internal write cycle will begin (Figure 4-2).

Note: Page write operatio ns are lim ited to wri ting

bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buf fer size (or ‘page-size’) and end a t ad dresses that a re integer multiples of [page size – 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might b e expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary.

1’. The

FIGURE 4-1: BYTE WRITE

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

S T A R T

S P

Control

Byte

Word

Address

A C K

Data

S T O P

A C K

FIGURE 4-2: PAGE WRITE

S T

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

Control

A R T

S P

Byte

A C K

Word

Address

(n)

Data (n) Data (n + 15)

A C K

Data (n + 1)

A C K

S T O P

A C K

24AA16/24LC16B

5.0 ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issu ed from the mas ter , the device initiates the int ernally-timed wri te cycle and ACK pol ling can then be initiated immediately. This involves the master sending a S tart c ondition fo llowed by the contro l byte for a Write c ommand (R/W busy with the write cycle, no ACK will be returned. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 5-1 for a flow diagram of this operation.

FIGURE 5-1: ACKNOWLEDGE POLLING

FLOW

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

= 0). If the device is still

6.0 WRITE-PROTECTION

The 24XX16 can be used as a serial ROM when the WP pin is connected to V inhibited and the entire memory will b e writ e-protected.

CC. Programming will be

Send Start

Send Control Byte

with R/W

Acknowledge

= 0

Did Device

(ACK = 0)?

Yes

Operation

24AA16/24LC16B

7.0 READ OPERATION

Read operations are initiated in the same way as write operations, with the exception that the R/W slave address is set to ‘

1’. There are three basic types

of read operations: current addr ess read , rand om rea d and sequential read.

7.1 Current Address Read

The 24XX16 contains an address counter that maintains the address of the last word accessed, internally incremented by ‘

1’. Therefore, if the previous access

(either a read or write opera tio n) w as to address next current address read operati on would access da ta from address with R/W

n + 1. Upon receipt of the sl ave add res s

bit set to ‘1’, the 24XX16 issues an acknowledge and transmits the 8-b it data w ord. The master will not acknowledge the tra nsfer , but does generate a S top condition and the 24XX16 discontinues transmission (Figure 7-1).

7.2 Random Read

Random read operations allow the master to access any memory location in a random manner. To perform this type of read operatio n, th e w ord add ress m us t firs t be set. This is accomplished by sending the word address to the 24XX16 as part of a write operation. Once the word address is sent , the master ge nerates a Start condition following the acknowledge. This terminates the write operation, but not before the internal Address Pointer is set. The master then issues the control byte agai n, but wi th the R /W 24XX16 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer , but does generate a S top con dition and the 24XX16 will discontinue transmission (Figure 7-2).

bit set to a ‘1’. The

bit of the

n, the

7.3 Sequential Read

Sequential reads are initiated in the same way as a random read, except that once the 24XX16 transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read. This directs the 24XX16 to transmit the next sequentiallyaddressed 8-bit word (Figure 7-3).

To provide se quential read s, the 24XX16 co ntains an internal Address Pointer that is incremented by one upon completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation.

7.4 Noise Protection

The 24XX16 employs a VCC threshold detector circuit which disables the internal erase/write logic if the V is below 1.5V at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and filter circuits which suppress noise spikes to assure proper device operation, even on a noisy bus.

FIGURE 7-1: CURRENT ADDRESS READ

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

T A R

Control

Byte

Data (n)

A C K

T O P

N O

A C K

24AA16/24LC16B

FIGURE 7-2: RANDOM READ

S BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

Control

S P

Byte

FIGURE 7-3: SEQUENTIAL READ

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

Control

Byte

Data (n) Data (n + 1) Data (n + 2) Data (n + x)

A C K

Word

Address (n)

S T

Control

A R T

A C K

Byte

A C K

Data (n)

A C K

S T O P

N O

A C K

S T O P

A C K

24AA16/24LC16B

8.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 8-1.

TABLE 8-1: PIN FUNCTION TABLE

Name PDIP SOIC TSSOP DFN MSOP SOT-23 Description

A0 1 1 1 1 1 — Not Connected A1 2 2 2 2 2 — Not Connected A2 3 3 3 3 3 — Not Connected

SS 4 4 4 4 4 2 Ground

V SDA 5 5 5 5 5 3 Serial Address/Data I/O SCL 6 6 6 6 6 1 Serial Clock

WP 7 7 7 7 7 5 Write-Protect Input

CC 8 8 8 8 8 4 +1.8V to 5.5V Power Supply

8.1 Serial Address/Data Input/Output (SDA)

SDA is a bidirectional pin used to transfer addresses and data into and out of the de vice . Sinc e it i s an opendrain terminal, the SDA bus requires a pull-up resistor

CC (typical 10 kΩ for 100 k Hz, 2 kΩ for 400 kHz).

to V For normal data transfer, SDA is allowed to change

only during SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions.

8.2 Serial Clock (SCL)

The SCL input is used to sync hro ni ze th e da t a tra ns fer to and from the device.

8.3 Write-Protect (WP)

The WP pin must be connected to either VSS or VCC. If tied to V

(read/write the entire memory If tied to V

memory will be write-protected. Read operations are not affected.

This feature allows the user to use the 24XX16 as a serial ROM when WP is enabled (tied to V

SS, normal memory operation is enabled

00-07FFH).

CC, write operations are inhibited. The entire

CC).

8.4 A0, A1, A2

The A0, A1 and A2 pins are not used by the 24XX16. They may be left floating or tied to either V

SS or VCC.

24AA16/24LC16B

9.0 PACKAGING INFORMATION

9.1 Package Marking Information

8-Lead PDIP (300 mil)

XXXXXXXX T/XXXNNN

YYWW

8-Lead SOIC (150 mil)

XXXXXXXT

XXXXYYWW

NNN

8-Lead TSSOP

XXXX

TYWW

NNN

8-Lead MSOP

XXXXXT

YWWNNN

Example:

24LC16B I/P 13F

0527

Example:

24LC16BI

SN 0527

13F

Example:

4L16

I527

13F

Example:

4L16I

52713F

8-Lead 2x3 DFN

XXX YWW

5-Lead SOT-23

XXNN

Example:

254 527 13

Example:

B53F

24AA16/24LC16B

1st Line Marking Codes

Part Number

24AA16 4A16 4A16T B5NN — 251 — 24LC16B 4L16 4L16T M5NN N5NN 254 255

Note: T = Temperature grade (I, E)

NN = Alphanumeric traceability code

Legend: XX...X Part number or part number code

Note: For very small packages with no room for the Pb-free JEDEC designator

Note: In the event the full Microchip part num ber can not be ma rked on one line , it wil

TSSOP MSOP

T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

, the marking will only appear on the outer carton or reel label.

be carried over to the next line, thus limiting the number of available characters for customer-specific information.

I Temp. E Temp. I Temp. E Temp.

SOT-23 DFN

Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

24AA16/24LC16B

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

Number of Pins Pitch Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018

Dimension Limits MIN NOM MAX MIN NOM MAX

Units INCHES* MILLIMETERS

n p

α β

.008 .012 .015 0.20 0.29 0.38

.100 2.54

51015 51015 51015 51015

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

24AA16/24LC16B

Number of Pins Pitch

Standoff §

Foot Angle Lead Thickness

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057

45°

n p

α β

048048

MILLIMETERSINCHES*Units

1.27.050

MAXNOMMINMAXNOMMINDimension Limits

1.751.551.35.069.061.053AOverall Height

1.551.421.32.061.056.052A2Molded Package Thickness

0.250.180.10.010.007.004

6.206.025.79.244.237.228EOverall Width

3.993.913.71.157.154.146E1Molded Package Width

5.004.904.80.197.193.189DOverall Length

0.510.380.25.020.015.010hChamfer Distance

0.760.620.48.030.025.019LFoot Length

0.250.230.20.010.009.008

0.510.420.33.020.017.013BLead Width 1512015120 1512015120

24AA16/24LC16B

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

Units

n p

048048

Number of Pins Pitch

Standoff §

Foot Angle Lead Thickne ss

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086

MILLIMETERS*INCHES

0.65.026

MAXNOMMINMAXNOMMINDimension Limits

1.10.043AOverall Height

0.950.900.85.037.035.033A2Molded Package Thickness

0.150.100.05.006.004.002

6.506.386.25.256.251.246EOverall Width

4.504.404.30.177.173.169E1Molded Package Width

3.103.002.90.122.118.114DMolded Package Length

0.700.600.50.028.024.020LFoot Length

0.200.150.09.008.006.004

0.300.250.19.012.010.007BLead Width 10501050 10501050

24AA16/24LC16B

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

PIN 1

ID INDEX

AREA

(NOTE 2)

TOP VIEW

Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length

(Note

Exposed Pad Length Overall Width Exposed Pad Width Contact Width Contact Length

*Controlling Parameter Notes:

Package may have one or more exposed tie bars at ends.1. Pin 1 visual index feature may vary, but must be located within the hatched area.2.

Exposed pad dimensions vary with paddle size.

4. JEDEC equivalent: MO-229

Drawing No. C04-123

Units

n p

b L

EXPOSED

MIN

.031 .000 .001

.055

.047 .008 .012

METAL

PAD

BOTTOM VIEW

EXPOSED

TIE BAR

(NOTE 1)

INCHES

NOM

.020 BSC

.039

.002 .008 REF. .079 BSC

-- --

.118 BSC

-- -.010 .016

.064

.071 .012 .020

MINMAX NOM

0.80

0.00

1.39

1.20

0.20

0.30

MILLIMETERS*

0.50 BSC

0.90.035

0.02

0.20 REF.

2.00 BSC

3.00 BSC

0.25

0.40

Revised 05/24/04

MAX

1.00

0.05

1.62

1.80

0.30

0.50

24AA16/24LC16B

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

n 1

(F)

Units

Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length

Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom

*Controlling Parameter Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

MIN

n p

D L

α β

.026 BSC

.030 .000

.193 TYP. .118 BSC .118 BSC

.016 .024

.037 REFFFootprint (Reference)

0° - 8° .003 .009

5°

5° -

INCHES

NOM

.033

.006 .012

MAX NOM

.043 .037 .006

.031

.009 .016

15° 15°

MIN

0.75

0.00

0.40

0.08

0.22

MILLIMETERS*

MAX

0.65 BSC

0.85

4.90 BSC

3.00 BSC

0.60

0.95 REF

0°

1.10

0.95

0.15

0.80

8°

0.23

0.40 15°5° 15°5° -

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

E E1

24AA16/24LC16B

Number of Pins Pitch Outside lead pitch (basic)

Foot Angle Lead Thickne ss

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091

n p

α β

.038

MILLIMETERSINCHES*Units

0.95

1.90.075

MAXNOMMINMAXNOMMINDimension Limits

1.451.180.90.057.046.035AOverall Height

1.301.100.90.051.043.035A2Molded Package Thickness

0.150.080.00.006.003.000A1Standoff §

3.002.802.60.118.110.102EOverall Width

1.751.631.50.069.064.059E1Molded Package Width

3.102.952.80.122.116.110DOverall Length

0.550.450.35.022.018.014LFoot Length 10501050

0.200.150.09.008.006.004

0.500.430.35.020.017.014BLead Width 10501050 10501050

24AA16/24LC16B

APPENDIX A: REVISION HISTORY

Revision D

Corrections to Section 1.0, Electrical Characteristics.

Revision E

Added DFN package.

24AA16/24LC16B

THE MICROCHIP WEB SITE

Microchip provides onlin e support v ia our W WW site at www.m ic roc hi p.c om . Thi s web si te i s us ed as a m ean s to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, lat est softwa re releases and archived software

• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultan t program member listing

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To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line Customers should contact their distributor,

representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

T echnic al support is avail able throug h the web si te at: http://support.microchip.com

In addition, there is a Development Systems Information Line which lists the latest versions of Microchip’s development systems software products. This line also provides information on how customers can receive currently available upgrade kits.

The Development Systems Information Line numbers ar e:

1-800-755-2345 – United States and most of Canada 1-480-792-7302 – Other International Locations

24AA16/24LC16B

READER RESPONSE

It is our intentio n to pro vi de you with the best documentation possible to ens ure suc c es sfu l u se of y ou r M ic roc hip product. If you wish to provid e your c omment s on org anizatio n, clarity, subject matter, and ways in w hich o ur docum entatio n can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To: RE: Reader Response From:

Application (optional): Would you like a reply? Y N

Device: Literature Number: Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

Technical Publications Manager

Name Company

Address City / State / ZIP / Country

Telephone: (_______) _________ - _________

Total Pages Sent ________

FAX: (______) _________ - _________

DS21703E24AA16/24LC16B

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

24AA16/24LC16B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX

Device

PackageTemperature

Range

24AA16: = 1. 8V, 16 Kbit I2C Serial EEPROM

24AA16T: = 1.8V, 16 Kbit I

24LC16B: = 2.5V, 16 Kbit I 24LC16BT: = 2.5V, 16 Kbit I

Temperature Range:

Package: MC = 2x3 DFN, 8-lead

Lead Finish Blank = Pb-free – Matte Tin (see Note 1)

I =-40°C to +85°C E = -40°C to +125°C

P = Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (150 mil body), 8-lead ST = Plastic TSSOP (4.4 mm), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead OT = SOT-23, 5-lead (Tape and Reel only)

G = Pb-free – Matte Tin only

(Tape and Reel)

C Serial EEPROM

Lead Finish

Examples:

a) 24AA16-I/P: Industrial Temperature,1.8V,

PDIP package

b) 24AA16-I/SN : Industrial Temperature,1.8V,

SOIC package

c) 24AA16T-I/OT: Industrial Temperature,

1.8V, SOT-23 package, Tape and Reel

d) 24LC16B-I/P: Industrial T emperature, 2.5V,

PDIP package

e) 24LC16B-E/SN: Automotive Temp.,2.5V

SOIC package

f) 24LC16BT-I/OT: Industrial Temperature,

2.5V, SOT-23 package, Tape and Reel

Note 1: Most products manufactured after January 2005 will have a M atte Tin (Pb-free) finish. Most products manufactured

before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please visit www.microchip.com for the latest information on Pb-free conversion, including conversion date codes.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

24AA16/24LC16B

NOTES:

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of M icrochip’s prod ucts as critical components in life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K

EELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programmin g, IC SP, ICEPIC, MPASM, MPLIB, M PL I N K, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartT el, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

8-bit MCUs, KEELOQ

code hopping

WORLDWIDE SALES AND SERVICE

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Tel: 31-416-690399 Fax: 31-416-690340

England - Berkshire

Tel: 44-118-921-5869 Fax: 44-118-921-5820

03/01/05

MICROCHIP 24AA16, 24LC16B Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

Features:

Description:

1.0 ELECTRICAL CHARACTERISTICS

FIGURE 1-1: BUS TIMING DATA

2.0 FUNCTIONAL DESCRIPTION

3.0 BUS CHARACTERISTICS

3.1 Bus Not Busy (A)

3.2 Start Data Transfer (B)

3.3 Stop Data Transfer (C)

3.4 Data Valid (D)

3.5 Acknowledge

3.6 Device Addressi ng

4.0 WRITE OPERATION

4.1 Byte Write

4.2 Page Wri te

5.0 ACKNOWLEDGE POLLING

6.0 WRITE-PROTECTION

7.0 READ OPERATION

7.1 Current Address Read

7.2 Random Read

7.3 Sequential Read

7.4 Noise Protection

8.0 PIN DESCRIPTIONS

8.1 Serial Address/Data Input/Output (SDA)

8.2 Serial Clock (SCL)

8.3 Write-Protect (WP)

8.4 A0, A1, A2

9.0 PACKAGING INFORMATION

9.1 Package Marking Information

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

THE MICROCHIP WEB SITE

CUSTOMER CHANGE NOTIFICATION SERVICE

CUSTOMER SUPPORT

READER RESPONSE

PRODUCT IDENTIFICATION SYSTEM

Sales and Support

Trademarks

WORLDWIDE SALES AND SERVICE