MICROCHIP 24AA00, 24LC00, 24C00 Technical data

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24AA00/24LC00/24C00

128-Bit I2C™ Bus Serial EEPROM

Device Selection Table

Device VCC Range Temp Range

24AA00 1.8-5.5 C,I 24LC00 2.5-5.5 C,I

24C00 4.5-5.5 C,I,E

Features:

• Low-power CMOS technology:

- 500 μA typical ac tive current

- 250 nA typical standby current

• Organized as 16 bytes x 8 bits

• 2-wire serial interface bus, I

• 100 kHz (1.8V) and 400 kHz (5V) compatibility

• Self-timed write cycle (including auto-erase)

• 4 ms maximum byte write cycle time

• 1,000,000 erase/write cycles

• ESD protection > 4 kV

• Data retention > 200 years

• 8L PDIP, SOIC, TSSOP, DFN and 5L SOT-23 packages

• Pb-free finish available

• Temperature ranges available:

- Commercial (C): 0°Cto+70°C

- Industrial (I): -40°Cto+85°C

- Automotive (E): -40°C to +125°C

C™ compatible

Package Types

8-PIN PDIP/SOIC

NC NC NC

Vss

8-PIN TSSOP

5-PIN SOT-23

SCL

SDA

Block Diagram

I/O

Control

Logic

Memory Control

1 2 3 4

Logic

VCC

XDEC

NC NC

8 7

SCL

SDA

VCC

SCL

SDA

DFN

1 2

HV Generator

8 7 6 5

EEPROM

Array

V NC SCL SDA

Description:

SCL

The Microchip Technology Inc. 24AA00/24LC00/ 24C00 (24XX00*) is a 128-bit Electrically Erasable PROM memory organized as 16 x 8 with a 2-wire serial interface. Low-voltage design permits operation down to 1.8 volts for th e 24AA00 version, an d every version maintains a maximum standby current of only 1 μA and typical active current of only 500 μA. This device was designed for where a small amount of EEPROM is needed for the storage of calibration values, ID numbers or manufacturing information, etc. The 24XX00 is available in 8-pin PDIP, 8-pin SOIC (150 mil), 8-pin TSS OP, 8-pin 2x3 DFN and the 5-pin SOT-23 packages.

I2C is a trademark of Philips Corporation. *24XX00 is used in this document as a generic part number for

the 24AA00/24LC00/24C00 devices.

SDA

VCC

VSS

Pin Function Table

Name Function

SS Ground

SDA Serial Data SCL Serial Clock

CC +1.8V to 5.5V (24AA00)

+2.5V to 5.5V (24LC00) +4.5V to 5.5V (24C00)

NC No Internal Connection

YDEC

Sense AMP

R/W

Control

24AA00/24LC00/24C00

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-65°C to +125°C

ESD protection on all pins..........................................................................................................................................4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indica ted in the opera tional li stings of this sp ecification is not i mplied. Ex posure to maximum rating conditions for extended periods may affect device reliability.

(†)

SS ......................................................................................................... -0.6V to VCC +1.0V

TABLE 1-1: DC CHARACTERISTICS

All Parameters apply across the recommended operating ranges unless otherwise noted

Parameter Symbol Min. Max. Units Conditions

SCL and SDA pins:

High-level input voltage Low-level input voltage VIL —0.3 VCC V (Note) Hysteresis of Schmitt Trigger

inputs Low-level output voltage V

Input leakage current I Output leakage current ILO —±1μAVOUT = VCC or VSS Pin capacitance (all inputs/outputs) CIN,

Operating current ICC Write — 2 mA VCC = 5.5V, SCL = 400 kHz

Standby current I

Note: This parameter is periodically sampled and not 100% tested.

Commercial (C): TA = 0°C to +70°C, VCC = 1.8V to 5.5V Industrial (I): T Automotive (E) T

VIH 0.7 VCC —V(Note)

VHYS .05 VCC —VVCC ≥ 2.5V (Note)

OL —0.4VIOL = 3.0 mA, VCC = 4.5V

LI —±1μAVIN = VCC or VSS

OUT

ICC Read — 1 mA VCC = 5.5V, SCL = 400 kHz

CCS —1μAVCC = 5.5V, SDA = SCL = VCC

A = -40°C to +85°C, VCC = 1.8V to 5.5V A = -40°C to +125°C, VCC = 4.5V to 5.5V

OL = 2.1 mA, VCC = 2.5V

—10pFVCC = 5.0V (Note)

A = 25°C, FCLK = 1 MHz

FIGURE 1-1: BUS TIMING DATA

SCL

SDA IN

SDA OUT

TSU:STA

TSP

HD:STA

TLOW

THIGH

THD:DAT

TAA

TSU:DAT

TSU:STO

TBUF

TABLE 1-2: AC CHARACTERISTICS

24AA00/24LC00/24C00

All Parameters apply across all recommended operating ranges unless otherwise noted

Commercial (C): T Industrial (I): T Automotive (E): T

A = 0°C to +70°C, VCC = 1.8V to 5.5V A = -40°C to +85°C, VCC = 1.8V to 5.5V A = -40°C to +125°C, VCC = 4.5V to 5.5V

Parameter Symbol Min Max Units Conditions

Clock frequency F

Clock high time THIGH 4000

Clock low time TLOW 4700

SDA and SCL rise time

(Note 1)

CLK —

— —

4000

600

4700 1300

TR —

— —

100 100 400

— — —

1000 1000

300

kHz 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V SDA and SCL fall time TF —300ns(Note 1) Start condition hold time THD:STA 4000

4000

600

Start condition setup time TSU:STA 4700

4700

600

— — —

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V Data input hold time THD:DAT 0—ns(Note 2) Data input setup time T

Stop condition setup time T

Output valid from clock

(Note 2)

Bus free time: T i me the b us must be free before a new transmission can start

Output fall time from V

minimum to VIL maximum Input filter spike suppression

SU:DAT 250

250 100

SU:STO 4000

4000

600

AA —

— —

BUF 4700

4700 1300

OF 20+0.1

— — —

3500 3500

900

— — —

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

250 ns (Note 1), CB ≤ 100 pF

SP —50ns(Notes 1, 3)

(SDA and SCL pins) Write cycle time T

WC —4ms

Endurance 1M — cycles (Note 4) Note 1: Not 100% tested. C

B = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combine d T

SP and VHYS specifications are due to new Schmit t Trigger inputs w h ic h p rov id e i mp rov ed

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by c haracterization. For endurance estimates in a speci fic

application, please consult the Total Endurance™ Model which can be obtained at www.microchip.com.

24AA00/24LC00/24C00

2.0 PIN DESCRIPTIONS

2.1 SDA Serial Data

This is a bidirectional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pull-up resistor to V 400 kHz).

For normal data t ransfer SDA is all owed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions.

CC (typical 10 kΩ for 100 kHz, 2 kΩ for

2.2 SCL Serial Clock

This input is u sed t o sy nchron ize the d ata trans fer fro m and to the device.

2.3 Noise Protection

The SCL and SDA inputs have Schmitt Trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus.

3.0 FUNCTIONAL DESCRIPTION

The 24XX00 supports a bidirectional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, and a device receiving data as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access, and generates the Start and Stop conditions, while the 24XX00 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated.

4.0 BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus is not busy.

• During data transfer, the data line must remain stable wheneve r the cl ock lin e is high . Changes i n the data line while the clock line is high will be interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have been defined (Figure 4-1).

4.1 Bus Not Busy (A)

Both data and clock lines remain high.

4.2 Start Data Transfer (B)

A high-to- lo w t ran si t i on of t h e SD A l in e whi l e t h e c lo ck (SCL) is high determines a Start condition. All commands must be preceded by a Start condition.

4.3 Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition.

4.4 Data Valid (D)

The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal.

The data on the line must be changed during the low period of the clock signal. There is one bit of data per clock pulse.

Each data transfer is initiated with a S tart condition and terminated with a Stop condition. The number of the data bytes transferred between the Start and Stop conditions is determined by the master device and is theoretically unlimited.

24AA00/24LC00/24C00

4.5 Acknowledge

Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit.

Note: The 24XX00 does not generate any

Acknowledge bits if an internal programming cycle is in progress.

The device that acknowledges has to pull down the SDA line during the Acknowl edge cloc k pulse in s uch a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. A master must signal an end of data to the slave by not gene rati ng an Ac kno w led ge bi t o n th e last byte that has been clocked out of the slave. In this case, the slave must leave the data line high to enable the master to generate the Stop condition (Figur e 4-2).

FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS

SCL

SDA

(A)

Condition

(B)

Start

(C)

Address or

Acknowledge

Valid

Data

Allowed

to Change

(D)

FIGURE 4-2: ACKNOWLEDGE TIMING

Acknowledge

Bit

Stop

Condition

(A)(C)

SCL

SDA

Data from transmitter

Transmitter must release the SDA line at this point allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data.

987654321 123

Data from transmitter

Receiver must release the SDA line at this point so the Transmitter can continue sending data.

24AA00/24LC00/24C00

5.0 DEVICE ADDRESSING

After generating a Start condition, the bus master transmits a control byte consisting of a slave address and a Read/Write bit that indicates what type of operation is to be perfo rmed. The sl ave addres s for the 24XX00 consists of a 4-bit device code ‘1010’ followed by three “don’t care” bits.

The last bit of the control byte determine s the operation to be performed. When set to a o ne a read operati on is selected, and when set to a zero a write operation is selected (Figure 5-1). The 24XX00 monitors the bus for its corresponding slave address all the time. It generates an Ackn owledge bit if the sla ve addres s was true and it is not in a programming mode.

FIGURE 5-1: CONTROL BYTE FORMAT

Bit

Bits

Start Bit

Read/Write

Device Select

Bits

1010xxxSACKR/W

Slave Address

Don’t Care

Acknowledge Bit

6.0 WRITE OPERATIONS

6.1 Byte Write

Following the Start signal from the master, the device code (4 bits), the “don’t care” bits (3 bits), and the R/W bit (which is a logic low) are placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an Acknowl edge bit durin g the ninth clock cycl e. Therefore, the next byte t ransmitted by the master is the word address and will be written into the Address Pointer of the 24XX00. Only the lower four address bit s are us ed by t he device , and the upper four bits are “don’t cares.” The 24XX00 will acknowledge the address byte and the master device will then transmit the data word to be written into the addressed memory location. The 24XX00 acknowledges again and the master generates a Stop condition. This initiates the internal write cycle, and during this time the 24XX00 will not ge nerate Ack now ledge signals (Figure7-2). After a by te Wr ite co mmand, the internal address counter will not be incremented and will point to the s ame address lo cation that was jus t written. If a Stop bit is transmitted to the device at any point in the Write comman d sequenc e before the e ntire sequence is complete, then the command will abort and no data will be written. If more than 8 data bits are transmitted before the Stop bit is sent, then the device will clear the previously loaded byte and begin loading the data buffer again. If more than one data byte is transmitted to the device and a Stop bit is sent before a full eight data bits have been transmitted, then the Write command will abort and no data will be written. The 24XX00 employs a V which disables the internal erase/write logic if the V is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00) at nominal conditions.

CC threshold detector circuit

24AA00/24LC00/24C00

7.0 ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issu ed from the mas ter , the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W busy with the write cycle, then no ACK will be returned. If no ACK is returne d, then th e S t art bit and control byte must be re-sent. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 7-1 for flow diagram.

= 0). If the device is still

FIGURE 7-1: ACKNOWLEDGE

POLLING FLOW

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

Yes

FIGURE 7-2: BYTE WRITE

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

x = “don’t care” bit

T A R T

10 x10 xxx

Control

Byte

Operation

Word

Address

A C K

xxx

A C K

Data

S T O P

A C K

24AA00/24LC00/24C00

8.0 READ OPERATIONS

Read operations are initiated in the same way as write operations with the exception that the R/W slave address is set to one. The re are three ba sic types of read operations: current add ress read , rand om rea d and sequential read.

8.1 Current Address Read

The 24XX00 contains an address counter that maintains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address n, the next current address read operation would acc ess dat a f rom add ress n + 1. Upon receipt of the slave a ddress with the R/W the device issues an acknowledge and transmits the eight-bit data word. The master will not acknowledge the transfer , but does generate a S top con dition and the device discontinues transmission (Figure8-1).

8.2 Random Read

Random read operations allow the master to access any memory location in a random manner. To perform this type of read operatio n, fi rst the word address must be set. This is d one by sending the word a ddress to the device as part of a write operation.

bit of the

bit set to one,

After the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal Address Pointer is set. Then the master issues the control byte again, but with the R/W

bit set to a one. The 24XX00 will then i ssue an ack nowledge a nd transmits the eight bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the device discontinues transmission (Figure 8-2). After this command, the internal address counter will point to the address location following the one that was just read.

8.3 Sequential Read

Sequential reads are initiated in the same way as a random read except that after the device transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read. This directs the device to transmit the next sequentially addressed 8-bit word (Figure 8-3).

To provide se quential reads the 2 4XX00 contains an internal Address Pointer which is incremented by one at the complet ion o f e ach r ead o peratio n. Thi s Add ress Pointer allows the entire memory contents to be serially read during one operation.

FIGURE 8-1: CURRENT ADDRESS READ

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

x = “don’t care” bit

T A R T

1100xxx1

Control

Byte

Data

A C K

T O P

N O

FIGURE 8-2: RANDOM READ

BUS ACTIVITY MASTER

SDA LINE

Control

A R T

Byte

S 1100xxx0

BUS ACTIVITY

x = “don’t care” bit

FIGURE 8-3: SEQUENTIAL READ

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

Control

Byte

Data n Data n + 1 Data n + 2 Data n + x

A C K

xxxx

A C K

Word

Address(n)

24AA00/24LC00/24C00

S T

Control

A R T

Byte

S 110 0xxx 1

A C K

Data (n)

A C K

S T O P

N O

A C K

S T O P

N O

A C K

24AA00/24LC00/24C00

9.0 PACKAGING INFORMATION

9.1 Package Marking Information

8-Lead PDIP (300 mil)

XXXXXXXX T/XXXNNN

YYWW

8-Lead SOIC (150 mil)

XXXXXXXT

XXXXYYWW

NNN

8-Lead TSSOP

XXXX

TYWW

NNN

Example:

24LC00 I/P 13F

Example:

0527

24LC00I

SN 0527

13F

4L00

I527

13F

8-Lead 2x3 DFN

XXX YWW NN

5-Lead SOT-23

XXNN

Example:

204 527 13

Example:

M03F

24AA00/24LC00/24C00

1st Line Marking Codes

Part Number

24AA00 4A00 A0NN B0NN — 201 — 24LC00 4L00 L0NN M0NN — 204 — 24C00 4C00 C0NN D0NN E0NN 207 208

Note: NN = Alphanumeric traceability code

Legend: XX...X Part number or part number code

Note: For very small packages with no room for the Pb-free JEDEC designator

Note: In the event the full Microchip part num ber can not be ma rked on one line , it wil

TSSOP

T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (w eek of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

, the marking will only appear on the outer carton or reel label.

be carried over to the next line, thus limiting the number of available characters for customer-specific information.

C Temp. I Temp. E Temp. I Temp. E Temp.

SOT-23 DFN

Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

24AA00/24LC00/24C00

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

Number of Pins Pitch Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018

Dimension Limits MIN NOM MAX MIN NOM MAX

Units INCHES* MILLIMETERS

n p

α β

.008 .012 .015 0.20 0.29 0.38

.100 2.54

51015 51015 51015 51015

24AA00/24LC00/24C00

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

Number of Pins Pitch

Standoff §

Foot Angle Lead Thickness

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057

45°

n p

048048

MILLIMETERSINCHES*Units

MAXNOMMINMAXNOMMINDimension Limits

1.27.050

1.751.551.35.069.061.053AOverall Height

1.551.421.32.061.056.052A2Molded Package Thickness

0.250.180.10.010.007.004

6.206.025.79.244.237.228EOverall Width

3.993.913.71.157.154.146E1Molded Package Width

5.004.904.80.197.193.189DOverall Length

0.510.380.25.020.015.010hChamfer Distance

0.760.620.48.030.025.019LFoot Length

0.250.230.20.010.009.008

0.510.420.33.020.017.013BLead Width 1512015120 1512015120

24AA00/24LC00/24C00

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

Units

n p

α β

048048

Number of Pins Pitch

Standoff §

Foot Angle Lead Thickne ss

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086

MILLIMETERS*INCHES

0.65.026

MAXNOMMINMAXNOMMINDimension Limits

1.10.043AOverall Height

0.950.900.85.037.035.033A2Molded Package Thickness

0.150.100.05.006.004.002

6.506.386.25.256.251.246EOverall Width

4.504.404.30.177.173.169E1Molded Package Width

3.103.002.90.122.1 18.114DMolded Package Length

0.700.600.50.028.024.020LFoot Length

0.200.150.09.008.006.004

0.300.250.19.012.010.007BLead Wi dth 10501050 10501050

24AA00/24LC00/24C00

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

PIN 1

ID INDEX

AREA

(NOTE 2)

TOP VIEW

Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length

(Note

Exposed Pad Length Overall Width Exposed Pad Width Contact Width Contact Length

*Controlling Parameter Notes:

Package may have one or more exposed tie bars at ends.1. Pin 1 visual index feature may vary, but must be located within the hatched area.2.

Exposed pad dimensions vary with paddle size.

4. JEDEC equivalent: MO-229

Drawing No. C04-123

Units

n p

b L

EXPOSED

MIN

.031 .000 .001

.055

.047 .008 .012

METAL

PAD

BOTTOM VIEW

EXPOSED

TIE BAR

(NOTE 1)

INCHES

NOM

.020 BSC

.039

.002 .008 REF. .079 BSC

-- --

.118 BSC

-- -.010 .016

.064

.071 .012 .020

MINMAX NOM

0.80

0.00

1.39

1.20

0.20

0.30

MILLIMETERS*

0.50 BSC

0.90.035

0.02

0.20 REF.

2.00 BSC

3.00 BSC

0.25

0.40

Revised 05/24/04

MAX

1.00

0.05

1.62

1.80

0.30

0.50

24AA00/24LC00/24C00

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

E E1

Number of Pins Pitch Outside lead pitch (basic)

Foot Angle Lead Thickne ss

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091

n p

α β

.038

MILLIMETERSINCHES*Units

0.95

1.90.075

MAXNOMMINMAXNOMMINDimension Limits

1.451.180.90.057.046.035AOverall Height

1.301.100.90.051.043.035A2Molded Package Thickness

0.150.080.00.006.003.000A1Standoff §

3.002.802.60.118.110.102EOverall Width

1.751.631.50.069.064.059E1Molded Package Width

3.102.952.80.122.116.110DOverall Length

0.550.450.35.022.018.014LFoot Length 10501050

0.200.150.09.008.006.004

0.500.430.35.020.017.014BLead Width 10501050 10501050

APPENDIX A: REVISION HISTORY

Revision E

Added DFN package.

24AA00/24LC00/24C00

NOTES:

24AA00/24LC00/24C00

THE MICROCHIP WEB SITE

Microchip provides onlin e support v ia our W WW site at www.m ic roc hi p.c om . Thi s web si te i s us ed as a m ean s to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, lat est softwa re releases and archived software

• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultan t program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of s eminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified produ ct family or develo pment tool of inte rest.

To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sal es Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line Customers should contact their distributor,

representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

T echnic al support is avail able throug h the web si te at: http://support.microchip.com

In addition, there is a Development Systems Information Line which lists the latest versions of Microchip’s development systems software products. This line also provides information on how customers can receive currently available upgrade kits.

The Development Systems Information Line numbers ar e:

1-800-755-2345 – United States and most of Canada 1-480-792-7302 – Other International Locations

24AA00/24LC00/24C00

READER RESPONSE

It is our intentio n to pro vi de you with the best documentation possible to ens ure suc c es sfu l u se of y ou r M ic roc hip product. If you wish to provid e your c omment s on org anizatio n, clarity, subject matter, and ways in w hich o ur docum entatio n can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To: RE: Reader Response From:

Application (optional): Would you like a reply? Y N

Device: Literature Number: Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

Technical Publications Manager

Name Company

Address City / State / ZIP / Country

Telephone: (_______) _________ - _________

Total Pages Sent ________

FAX: (______) _________ - _________

DS21178E24AA00/24LC00/24C00

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

24AA00/24LC00/24C00

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

X /XX

PackageTemperature

Lead Finish

Range

Device: 24AA00: = 1.8V, 128 bit I2C™ Serial EEPROM

Temperature Range:

Package: P = Plastic DIP (300 mil body), 8-lead

Lead Finish Blank= Pb-free – Matte Tin (see Note 1)

24AA00T: = 1.8V, 128 bit I

(Tape and Reel) 24LC00: = 2.5V, 128 bit I 24LC00T: = 2.5V, 128 bit I

(Tape and Reel) 24C00: = 5V, 128 bit I 24C00T: = 5V, 128 bit I

(Tape and Reel)

Blank = 0°C to 70°C I = -40°C to +85°C E = -40°C to +125°C

SN = Plastic SOIC (150 mil body), 8-lead ST = Plastic TSSOP (4.4 mm), 8-lead OT = SOT-23, 5-lead (Tape and Reel only) MC = 2x3 DFN, 8-lead

G = Pb-free – Matte Tin only

C Serial EEPROM

C™ Serial EEPROM

Examples:

a) 24AA00-I/P: Industrial T emperature,1.8V

PDIP package

b) 24AA00-I/SN: Industrial Temperature,

1.8V , SOIC package

c) 24AA00T-I/OT: Industrial Temperature,

1.8V , SOT-23 package, tape and reel

d) 24LC00-I/P: Industrial Temperature,

2.5V, PDIP package

e) 24C00-E/SN: Extended Temperature,

5V, SOIC package

f) 24LC00T-I/OT : Industrial Temperature,

2.5V , SOT-23 package, tape and reel

Note 1: Most products manufactured after January 2005 will have a Matte Tin (Pb-free) finish. Most products manufactured

before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please visit www.microchip.com for the latest information on Pb-free conversion, including conversion date codes.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

24AA00/24LC00/24C00

NOTES:

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today , when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of M icrochip’s prod ucts as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K

EELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programmin g, IC SP, ICEPIC, MPASM, MPLIB, MPL I N K , MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

8-bit MCUs, KEELOQ

code hopping

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com

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Boston

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Chicago

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Los Angeles

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San Jose

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Toronto

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ASIA/PACIFIC

Australia - Sydney

Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100 Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8676-6200 Fax: 86-28-8676-6599

China - Fuzhou

Tel: 86-591-8750-3506 Fax: 86-591-8750-3521

China - Hong Kong SAR

Tel: 852-2401-1200 Fax: 852-2401-3431

China - Shanghai

Tel: 86-21-5407-5533 Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829 Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660 Fax: 86-755-8203-1760

China - Shunde

Tel: 86-757-2839-5507 Fax: 86-757-2839-5571

China - Qingdao

Tel: 86-532-502-7355 Fax: 86-532-502-7205

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-2229-0061 Fax: 91-80-2229-0062

India - New Delhi

Tel: 91-11-5160-8631 Fax: 91-11-5160-8632

Japan - Kanagawa

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea - Seoul

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934

Singapore

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan - Kaohsiung

Tel: 886-7-536-4818 Fax: 886-7-536-4803

Taiwan - Taipei

Tel: 886-2-2500-6610 Fax: 886-2-2508-0102

Taiwan - Hsinchu

Tel: 886-3-572-9526 Fax: 886-3-572-6459

EUROPE

Austria - Weis

Tel: 43-7242-2244-399 Fax: 43-7242-2244-393

Denmark - Ballerup

Tel: 45-4450-2828 Fax: 45-4485-2829

France - Massy

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany - Ismaning

Tel: 49-89-627-144-0 Fax: 49-89-627-144-44

Italy - Milan

Tel: 39-0331-742611 Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399 Fax: 31-416-690340

England - Berkshire

Tel: 44-118-921-5869 Fax: 44-118-921-5820

03/01/05

MICROCHIP 24AA00, 24LC00, 24C00 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

Device Selection Table

Features:

Package Types

Block Diagram

Description:

Pin Function Table

1.0 ELECTRICAL CHARACTERISTICS

TABLE 1-1: DC CHARACTERISTICS

FIGURE 1-1: BUS TIMING DATA

TABLE 1-2: AC CHARACTERISTICS

2.0 PIN DESCRIPTIONS

3.0 FUNCTIONAL DESCRIPTION

4.0 BUS CHARACTERISTICS

FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS

FIGURE 4-2: ACKNOWLEDGE TIMING

5.0 DEVICE ADDRESSING

FIGURE 5-1: CONTROL BYTE FORMAT

6.0 WRITE OPERATIONS

7.0 ACKNOWLEDGE POLLING

FIGURE 7-2: BYTE WRITE

8.0 READ OPERATIONS

FIGURE 8-1: CURRENT ADDRESS READ

FIGURE 8-2: RANDOM READ

FIGURE 8-3: SEQUENTIAL READ

9.0 PACKAGING INFORMATION

THE MICROCHIP WEB SITE

CUSTOMER CHANGE NOTIFICATION SERVICE

CUSTOMER SUPPORT

READER RESPONSE

PRODUCT IDENTIFICATION SYSTEM

Trademarks

WORLDWIDE SALES AND SERVICE