9-BIT LATCH
WITH PARITY
SY10E175
SY100E175
FEATURES
■ 9-bit latch
■ Extended 100E VEE range of –4.2V to –5.5V
■ Parity detection/generation
■ 800ps max. D to Output
■ Reset
■ Internal 75KΩ input pull-down resistors
■ Fully compatible with Motorola MC10E/100E175
■ Available in 28-pin PLCC package
BLOCK DIAGRAM
0
D
DENQ
R
bits
1 – 7
D
8
DENQ
R
Q
0
Q
8
DESCRIPTION
The SY10/100E175 are 9-bit latches. They also feature
a tenth latched output (ODDPAR) which is formed as the
odd parity of the nine data inputs (ODDPAR is HIGH if
an odd number of the inputs are HIGH).
The E175 can also be used to generate byte parity by
using D8 as the parity-type select (L = even parity, H =
odd parity) and using ODDPAR as the byte parity output.
The LEN pin latches the data when asserted with a
logical high and makes the latch transparent when placed
at a logic low level.
PIN CONFIGURATION
D
D
D
V
EE
LEN
MR
D
7
8
6
D
D
D
25
24 23 22 21 20 19
5
26
4
27
3
28
1
2
3
2
4
TOP VIEW
PLCC
J28-1
567891011
CCO
V
Q8Q
7
CCO
V
Q
Q
V
Q
Q
V
Q
6
5
CC
4
3
CCO
2
18
17
16
15
14
13
12
LEN
MR
DENQ
R
ODDPAR
1
D
PIN NAMES
Pin Function
D0 – D8 Data Inputs
LEN Latch Enable
MR Master Reset
Q0 – Q8 Data Outputs
ODDPAR Parity Output
CCO VCC to Output
V
1
0
D
CCO
V
ODDPAR
0
1
Q
Q
CCO
V
Rev.: C Amendment: /1
Issue Date: February, 1998
SY10E175
Micrel
SY100E175
TRUTH TABLE
D LEN MR Q ODDPAR
H L L H H if odd no. of Dn HIGH
LLLLH if odd no. of Dn HIGH
XHLQ0 Q0
XXHLL
DC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
TA = 0°CTA = +25°CTA = +85°C
Symbol Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Condition
IIH Input HIGH Current ——150 ——150 ——150 µA —
EE Power Supply Current mA —
I
10E — 110 132 — 110 132 — 110 132
100E — 110 132 — 110 132 — 127 152
AC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
TA = 0°CTA = +25°CTA = +85°C
Symbol Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Condition
PLH Propagation Delay to Output ps —
t
tPHL D to Q 450 600 800 450 600 800 450 600 800
D to ODDPAR 850 1150 1450 850 1150 1450 850 1150 1450
LEN to Q 525 700 900 525 700 900 525 700 900
LEN to ODDPAR 525 700 900 525 700 900 525 700 900
MR to Q (tPHL) 525 700 900 525 700 900 525 700 900
MR to ODDPAR (tPHL) 525 700 900 525 700 900 525 700 900
t
S Set-up Time ps —
D (Q) 275 100 — 275 ——275 ——
D (ODDPAR) 900 700 — 900 ——900 ——
H Hold Time ps —
t
D (Q) 175 –100 — 175 ——175 ——
D (ODDPAR) –300 –700 —–300 ——–300 ——
tRR Reset Recovery Time 850 600 — 850 600 — 850 600 — ps —
skew Within-Device Skew ps 1
t
LEN, MR — 75 ——75 ——75 —
D to Q — 75 ——75 ——75 —
D to ODDPAR — 200 ——200 ——200 —
r Rise/Fall Times 300 500 800 300 500 800 300 500 800 ps —
t
tf 20–80%
NOTE:
1. Within-device skew is defined as identical transitions on similar paths
through a device.
PRODUCT ORDERING CODE
Ordering Package Operating
Code Type Range
SY10E175JC J28-1 Commercial
SY10E175JCTR J28-1 Commercial
SY100E175JC J28-1 Commercial
SY100E175JCTR J28-1 Commercial
2