The KSZ8041NL is a single s upply 10Bas e-T/100Bas e-TX
Physical Layer Transceiver, which provides MII/RMII
interfaces to transm it and receive data. An unique mixed
signal design extends signaling distance while reducing
power consumption.
HP Auto MDI/MDI-X provid es the most robust solution f or
eliminating the need to differentiate between crossover
and straight-through cables.
Functional Diagram
Data Sheet Rev. 1.2
The KSZ8041NL represents a new level of features and
performance and is an ideal choice of physical layer
transceiver for 10Base-T/100Base-TX applications.
The KSZ8041NL com es in a 32-pin , lead-free MLF
per JDEC) package (See Ordering Information).
Data sheets and support doc umentation can be found on
Micrel’s web site at: www.micrel.com.
®
(QFN
MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
• HP auto MDI/MDI-X for reliable detection and
correction for straight-through and crossover cables
with disable and enable option
• Robust operation over standard cables
• Power down and power saving modes
• MII interface support
• RMII interface support with external 50MHz s ystem
clock
• MIIM (MDC/MDIO) management bus to 6.25MHz for
rapid PHY register configuration
• Interrupt pin option
• Programmable LED outputs for link, activity and
speed
• ESD rating (6kV)
• Single power supply (3.3V)
• Built-in 1.8V regulator for core
®
• Available in 32-pin (5mm x 5mm) MLF
package
• Printer
• LOM
• Game Console
• IPTV
• IP Phone
• IP Set-top Box
Ordering Information
Part Number Temp. Range Package Lead Finish Description
KSZ8041NL 0°C to 70°C 32-Pin MLF® Pb-Free Commercial Temperature Device
KSZ8041NLI
KSZ8041NL AM
Note:
1. Contact factory for lead time.
(1)
-40°C to 85°C 32-Pin MLF® Pb-Free Industrial Temperature Device
(1)
-40°C to 85°C 32-Pin MLF® Pb-Free Automotive Qualified Device
July 2008 2 M9999-071808-1.2
Micrel, Inc. KSZ8041NL
Revision History
Revision Date Summary of Changes
1.0 10/13/06 Data sheet created.
1.1 4/27/07 Added maximum MDC clock speed.
Added 40K +/-30% to note 1 of Pin Description and Strapping Options tables for internal pull-ups/pull-
downs.
Changed Model Number in Register 3h – PHY Identifier 2.
Changed polarity (swapped definition) of DUPLEX strapping pin.
Removed DUPLEX strapping pin update to Register 4h – Auto-Negotiation Advertisement bits [8, 6].
Set “Disable power saving” as the default for Register 1Fh bit [10].
Corrected LED1 (pin 31) definition for Activity in LED mode 01.
Added Symbol Error to MII/RMII Receive Error description and Register 15h – RXER Counter.
Added a 100pF capacitor on REXT (pin 10) in Pin Description table.
1.2 7/18/08 Added Automotive Qualified part number to Ordering Information.
Added maximum case temperature.
Added thermal resistance (θ
Added chip maximum current consumpti on.
SQE and Jabber Function (10Base-T only)......................................................................................................................14
MII Management (MIIM) Interface ....................................................................................................................................16
MII Data Interface .............................................................................................................................................................16
MII Signal Definition..........................................................................................................................................................17
Transmit Data [3:0] (TXD[3:0]) .....................................................................................................................................17
Receive Data Valid (RXDV)..........................................................................................................................................18
Receive Data [3:0] (RXD[3:0])......................................................................................................................................18
Carrier Sense (CRS) ....................................................................................................................................................18
Reduced MII (RMII) Data Interface...................................................................................................................................18
RMII Signal Definition .......................................................................................................................................................19
Transmit Data [1:0] (TXD[1:0]) .....................................................................................................................................19
Carrier Sense/Receive Data Valid (CRS_DV)..............................................................................................................19
Receive Data [1:0] (RXD[1:0])......................................................................................................................................19
HP Auto MDI/MDI-X..........................................................................................................................................................20
Power Management ..........................................................................................................................................................22
Power Saving Mode .....................................................................................................................................................22
Power Down Mode .......................................................................................................................................................22
Reference Circuit for Power and Ground Connections ....................................................................................................23
MII SQE Timing (10Base-T) .............................................................................................................................................33
MII Transmit Timing (10Base-T).......................................................................................................................................34
MII Receive Timing (10Base-T)........................................................................................................................................35
MII Transmit Timing (100Base-TX) ..................................................................................................................................36
MII Receive Timing (100Base-TX) ...................................................................................................................................37
Reference Circuits for LED Strapping Pins......................................................................................................................43
Selection of Isolation Transformer....................................................................................................................................44
Selection of Reference Crystal ..........................................................................................................................................44
Figure 4. 25MHz Crystal / Oscillator Reference Clock for MII Mode...................................................................................22
Figure 5. 50MHz Oscillator Reference Clock for RMII Mode...............................................................................................22
Figure 6. KSZ8041NL Power and Ground Connections......................................................................................................23
Figure 7. MII SQE Timing (10Base-T) .................................................................................................................................33
Figure 8. MII Transmit Timing (10Base-T)...........................................................................................................................34
Figure 9. MII Receive Timing (10Base-T)............................................................................................................................35
Figure 10. MII Transmit Timing (100Base-TX).....................................................................................................................36
Figure 11. MII Receive Timing (100Base-TX)......................................................................................................................37
Figure 12. RMII Timing – Data Received from RMII............................................................................................................38
Figure 13. RMII Timing – Data Input to RMII .......................................................................................................................38
Figure 14. Auto-Negotiation Fast Link Pulse (FLP) Timing .................................................................................................39
Figure 18. Recommended Reset Circuit for interfacing with CPU/FPGA Reset Output......................................................42
Figure 19. Reference Circuits for LED Strapping Pins.........................................................................................................43
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Micrel, Inc. KSZ8041NL
List of Tables
Table 1. MII Management Frame Format ............................................................................................................................16
Table 2. MII Signal Definition...............................................................................................................................................17
Table 3. RMII Signal Description..........................................................................................................................................19
Table 16. Qualified Single Port Magnetics...........................................................................................................................44
1 GND Gnd Ground
2 VDDPLL_1.8 P 1.8V analog VDD
3 VDDA_3.3 P 3.3V analog VDD
4 RX- I/O Physical receive or transmit signal (- differential)
5 RX+ I/O Physical receive or transmit signal (+ differential)
6 TX- I/O Physical transmit or receive signal (- differential)
7 TX+ I/O Physical transmit or receive signal (+ differential)
8 XO O Crystal feedback
9 XI /
REFCLK
10 REXT I/OSet physical transmit output current
11 MDIO I/O Management Interface (MII) Data I/O
12 MDC I Management Interface (MII) Clock Input
13 RXD3 /
PHYAD0
14 RXD2 /
PHYAD1
15 RXD1 /
RXD[1] /
PHYAD2
16 RXD0 /
RXD[0] /
DUPLEX
17 VDDIO_3.3 P 3.3V digital VDD
18 RXDV /
CRSDV /
CONFIG2
19 RXC O MII Mode: Receive Clock Output
(1)
Type
Pin Function
This pin is used only in MII mode when a 25 MHz crystal is used.
This pin is a no connect if oscillator or external clo ck sou r ce i s used, or if RMII
mode is selected.
I Crystal / Oscillator / External Clock Input
MII Mode: 25MHz +/-50ppm (crystal, oscillator, or external clock)
RMII Mode: 50MHz +/-50ppm (oscillator, or external clock only)
Connect a 6.49KΩ resistor in parallel with a 100pF capacitor to ground on this
pin. See KSZ8041NL reference schematics.
This pin requires an external 4.7KΩ pull-up resistor.
This pin is synchronous to the MDIO data interface.
Ipu/O
MII Mode: Receive Data Output[3]
(2)
/
Config Mode: The pull-up/pull-down value is latched as PHYADDR[0] during
power-up / reset. See “Strapping Options” section for details.
Ipd/O
MII Mode: Receive Data Output[2]
(2)
/
Config Mode: The pull-up/pull-down value is latched as PHYADDR[1] during
power-up / reset. See “Strapping Options” section for details.
Ipd/O
MII Mode: Receive Data Output[1]
RMII Mode: Receive Data Output[1]
(2)
(3)
/
/
Config Mode: The pull-up/pull-down value is latched as PHYADDR[2] during
power-up / reset. See “Strapping Options” section for details.
Ipu/O
MII Mode: Receive Data Output[0]
RMII Mode: Receive Data Output[0]
(2)
(3)
/
/
Config Mode: Latched as DUPLEX (register 0h, bit 8) during power-up /
reset. See “Strapping Options” section for details.
Ipd/O MII Mode: Receive Data Valid Output /
RMII Mode: Carrier Sense/Receive Data Valid Output /
Config Mode: The pull-up/pull-down value is latched as CONFIG2 during
power-up / reset. See “Strapping Options” section for details.
22 TXC O MII Mode: Transmit Clock Output
23 TXEN /
TX_EN
24 TXD0 /
TXD[0]
25 TXD1 /
TXD[1]
26 TXD2 I
27 TXD3 I
28 COL /
CONFIG0
29 CRS /
CONFIG1
30 LED0 /
NWAYEN
(1)
Type
Pin Function
Ipd/O MII Mode: Receive Error Output /
RMII Mode: Receive Error Output /
Config Mode: The pull-up/pull-down value is latched as ISOLATE during
power-up / reset. See “Strapping Options” section for details.
Register 1Bh is the Interrupt Control/Status Register for programming the interrupt
conditions and reading the interrupt status. Register 1Fh bit 9 sets the interrupt
output to active low (default) or active high.
I MII Mode: Transmit Enable Input /
RMII Mode: Transmit Enable Input
I
MII Mode: Transmit Data Input[0]
RMII Mode: Transmit Data Input[0]
I
MII Mode: Transmit Data Input[1]
RMII Mode: Transmit Data Input[1]
MII Mode: Transmit Data Input[2]
MII Mode: Transmit Data Input[3]
(4)
(5)
(4)
(5)
(4)
(4)
/
/
/
/
Ipd/O MII Mode: Collision Detect Output /
Config Mode: The pull-up/pull-down value is latched as CONFIG0 during
power-up / reset. See “Strapping Options” section for details.
Ipd/O MII Mode: Carrier Sense Output /
Config Mode: The pull-up/pull-down value is latched as CONFIG1 during
power-up / reset. See “Strapping Options” section for details.
Ipu/O LED Output: Programmable LED0 Output /
Config Mode: Latched as Auto-Negotiation Enable (register 0h, bit 12) during
power-up / reset. See “Strapping Options” section for details.
The LED0 pin is programmable via register 1Eh bits [15:14], and is defined as
follows.
LED mode = [00]
Link/Activity Pin State LED Definition
1. P = Power supply.
Gnd = Ground.
I = Input.
O = Output.
I/O = Bi-directional.
Ipd = Input with internal pull-down (40K +/-30%).
Ipu = Input with internal pull-up (40K +/-30%).
Opu = Output with internal pull-up (40K +/-30%).
Ipu/O = Input with internal pull-up (40K +/-30%) during power-up/reset; output pin otherwise.
Ipd/O = Input with internal pull-down (40K +/-30%) during power-up/reset; output pin otherwise.
2. MII Rx Mode: The RXD[3..0] bits are synchronous with RXCLK. When RXDV is asserted, RXD[3..0] presents valid data to MAC through the MII.
RXD[3..0] is invalid when RXDV is de-asserted.
3. RMII Rx Mode: The RXD[1:0] bits are synchronous with REF_CLK. For each clock period in which CRS_DV is asserted, two bits of recovered
data are sent from the PHY.
4. MII Tx Mode: The TXD[3..0] bits are synchronous with TXCLK. When TXEN is asserted, TXD[3..0] presents valid data from the MAC through
the MII. TXD[3..0] has no effect when TXEN is de-asserted.
5. RMII Tx Mode: The TXD[1:0] bits are synchronous with REF_CLK. For each clock period in which TX_EN is asserted, two bits of data are
received by the PHY from the MAC.
(1)
Type
Pin Function
Ipu/O LED Output: Programmable LED1 Output /
Config Mode: Latched as SPEED (register 0h, bit 13) during power-up / reset.
See “Strapping Options” section for details.
The LED1 pin is programmable via register 1Eh bits [15:14], and is defined as
follows.
LED mode = [00]
Speed Pin State LED Definition
10BT H OFF
100BT L ON
LED mode = [01]
Activity Pin State LED Definition
No Activity H OFF
Activity Toggle Blinking
LED mode = [10]
Reserved
LED mode = [11]
Reserved
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Micrel, Inc. KSZ8041NL
Strapping Options
Pin Number Pin Name
15
14
13
18
29
28
20 ISO Ipd/O ISOLATE mode
31 SPEED Ipu/O SPEED mode
16 DUPLEX Ipu/O DUPLEX mode
30 NWAYEN Ipu/O Nway Auto-Negotiation Enable
Note:
1. Ipu/O = Input with internal pull-up (40K +/-30%) during power-up/reset; output pin otherwise.
Ipd/O = Input with internal pull-down (40K +/-30%) during power-up/reset; output pin otherwise.
PHYAD2
PHYAD1
PHYAD0
CONFIG2
CONFIG1
CONFIG0
Pin strap-ins are latc hed during power-u p or reset. In some s ystems, the MAC receive in put pins may drive high during
power-up or reset, and c on s equen tl y cause the PHY strap-in pi ns on t he MII/RMII signals to be latch ed h ig h. In th is c ase ,
it is recomm ended to add 1K pull-do wns on these PHY strap- in pins to ensure the P HY does no t strap-in to ISOLAT E or
PCS Loopback mode, or is not configured with an incorrect PHY Address.
Type
Ipd/O
Ipd/O
Ipu/O
Ipd/O
Ipd/O
Ipd/O
(1)
Pin Function
The PHY Address is latched at power-up / reset and is configurable to any value from
1 to 7.
The default PHY Address is 00001.
PHY Address bits [4:3] are always set to ‘00’.
The CONFIG[2:0] strap-in pins are latched at power-up / reset and are defined as
follows:
CONFIG[2:0] Mode
000 MII (default)
001 RMII
010 Reserved – not used
011 Reserved – not used
100 PCS Loopback
101 Reserved – not used
110 Reserved – not used
111 Reserved – not used
Pull-up = Enable
Pull-down (default) = Disable
During power-up / reset, this pin value is latched into register 0h bit 10.
Pull-up (default) = 100Mbps
Pull-down = 10Mbps
During power-up / reset, this pin value is latched into register 0h bit 13 as the Speed
Select, and also is latched into register 4h (Auto-Negotiation Advertisement) as the
Speed capability support.
Pull-up (default) = Half Duplex
Pull-down = Full Duplex
During power-up / reset, this pin value is latched into register 0h bit 8 as the Duplex
Mode.
Pull-up (default) = Enable Auto-Negotiation
Pull-down = Disable Auto-Negotiation
During power-up / reset, this pin value is latched into register 0h bit 12.
July 2008 12 M9999-071808-1.2
Micrel, Inc. KSZ8041NL
Functional Description
The KSZ8041NL is a single 3.3V supply Fast Ethernet transceiver. It is fully compliant with the IEEE 802.3u Specification.
On the media side, the KS Z8041NL supports 10Base- T and 100Base-TX with HP auto MD I/MD I -X f or reliabl e detec t ion of
and correction for straight-through and crossover cables.
The KSZ8041NL off ers a choice of MII or RMII data interfac e connection with th e MAC processor. T he MII managem ent
bus option gives the M AC processor complete access to the K SZ8041NL control and status registers. Additionally, an
interrupt pin eliminates the need for the processor to poll for PHY status change.
Physical signal trans mission and reception are enha nced through the use of patented a nalog circuitries that make the
design more efficient and allow for lower power consumption and smaller chip die size.
100Base-TX Transmit
The 100Base-TX transmit function performs parallel-to-serial conversion, 4B/5B coding, scrambling, NRZ-to-NRZI
conversion, and MLT3 encoding and transmission.
The circuitry starts with a p arallel-t o-seria l conversion, which conver ts the MII dat a from the MAC into a 125 MHz serial bit
stream. The data and contr ol stream is then converted into 4B/5B coding, f ollowed by a scr ambler. The s erialized data is
further converted from NRZ-to-NRZI format, and then transmitted in MLT3 current output.
The output current is set by an extern al 6.49kΩ 1% res istor for the 1:1 tra nsform er ratio. It has typical r ise/fall tim es of 4
ns and complies with the ANSI TP-PMD standard regarding am plitude balance, overshoot an d timing jitter. The waveshaped 10Base-T output drivers are also incorporated into the 100Base-TX drivers.
100Base-TX Receive
The 100Base-TX receiver function performs adaptive equalization, DC restoration, MLT 3-to-NRZI conversion, data and
clock recovery, NRZI-to-NRZ conversion, de-scrambling, 4B/5B decoding, and serial-to-parallel conversion.
The receiving side star ts with the equali zation filter to c ompensate for inter-symbol inter ference (ISI) over the twisted pair
cable. Since the amplitude loss and phase distortion is a function of the cable length, the equalizer must adjust its
characteristics to optimize performance. In this design, the variable equalizer makes an initial estimation based on
comparisons of i ncom ing signal s trength against some k nown cable c haracter istics , and then t unes its elf f or optim ization.
This is an ongoing process and self-adjusts against environmental changes such as temperature variations.
Next, the equalized signal goes t hroug h a DC restor ation and data c onvers ion bl ock . The DC res tor ation c ircuit is use d to
compensate for the ef fect of baseline wander and to im prove the dynam ic range. The differ ential data conversion c ircuit
converts the MLT3 format back to NRZI. The slicing threshold is also adaptive.
The clock recovery circ uit e xtr ac ts the 125MHz clock from the edges of the NRZI sign al. T his r ecover ed c lock is then used
to convert the NRZI signal into the NRZ format. This signal is sent through the de-scrambler followed by the 4B/5B
decoder. Finally, the NRZ serial data is converted to the MII format and provided as the input data to the MAC.
PLL Clock Synthesizer
The KSZ8041NL generates 125MΗz, 25 MΗz and 20MΗz clocks for system timing. Internal clocks are generated from an
external 25MHz cr ystal or osc illator . In RMII m ode, thes e internal c lock s are gener ated fr om an exter nal 50MH z oscillat or
or system clock.
Scrambler/De-scrambler (100Base-TX only)
The purpose of the scrambler is to spread the power spectrum of the signal in order to reduce EMI and baseline wander.
10Base-T Transmit
The 10Base-T driver s are incorporated with th e 100Base-TX drivers to allow for transmiss ion using the same magnetic .
The drivers also perf orm internal wave-s hapi ng an d pr e-em phasi ze, and output 10Bas e-T sign als wit h a t ypical am plit ude
of 2.5V peak. The 10Base-T signals have harm onic contents that are at least 27dB below the fundamental frequency
when driven by an all-ones Manchester-encoded signal.
10Base-T Receive
On the receive side, input buf fer and leve l detectin g squelc h circuits ar e emplo yed. A differ ential input r eceiver circuit and
a PLL performs the decoding function. The Manchester-encoded data stream is separated into clock signal and NRZ data.
A squelch circuit r ejects signals with levels less than 400 m V or with short pu lse widths to prevent noise at the RX+ and
RX- inputs from falsely trigger the decoder. W hen the input exceeds the sq uelch limit, the PLL l ocks onto the incoming
July 2008 13 M9999-071808-1.2
Micrel, Inc. KSZ8041NL
signal and the KSZ8041NL decodes a data frame. The receive clock is kept active during idle periods in b etween data
reception.
SQE and Jabber Function (10Base-T only)
In 10Base-T operation, a s hort puls e is put out on t he COL pin af ter each fr ame is transm itted. This SQE Tes t is required
as a test of the 10Base-T transm it/receive path. If transmit enable (T XEN) is high for more than 20 ms (jabbering), th e
10Base-T transm itter is disabled and COL is as ser te d hig h. If TXEN is then dri ven low for more than 250 ms, the 10BaseT transmitter is re-enabled and COL is de-asserted (returns to low).
Auto-Negotiation
The KSZ8041NL c onforms to the a uto-negotiatio n protocol, def ined in Claus e 28 of the IEEE 802.3u specification . Autonegotiation is enabled by either hardware pin strapping (pin 30) or software (register 0h bit 12).
Auto-negotiation allo ws unshiel ded twiste d pair (UT P) link partners to sel ect the hig hest comm on m ode of operation. Link
partners advertise th eir capabiliti es to each other, an d then compare their own capabilities with those the y received from
their link partners . The highest s peed and duplex setting that is comm on to the two link partners is selec ted as the m ode
of operation.
The following list shows the speed and duplex operation mode from highest to lowest.
• Priority 1: 100Base-T X , full- dupl ex
• Priority 2: 100Base-TX , half -dupl ex
• Priority 3: 10Base-T, f ull-dupl ex
• Priority 4: 10Base-T, half- dupl ex
If auto-negotiation is not s upported or the KSZ8 041NL link partner is f orced to bypass auto-negot iation, the KSZ8041 NL
sets its operating mode by observing the signal at its receiver. This is known as parallel detection, and allows the
KSZ8041NL to establish link by listening for a fixed signal protocol in the absence of auto-negotiation advertisement
protocol.
The auto-negotiation link up process is shown in the following flow chart.
July 2008 14 M9999-071808-1.2
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