Meridian Data 16i User Manual

EMD

storage

EXCEL
MERIDIAN
DATA, INC.

SecurStor 16i

iSCSI to SATA-II
RAID Subsystem

Installation and Hardware

Reference Manual

For all technical support assistance:

Phone: [phone] or [phone]

Web: http://www.emdstorage.com

SecurStor 16i Installation and Hardware Reference Manual

Contact Information

Company Address: Excel Meridian Data, Inc.

3220 Commander Drive, Suite 101
Carrollton, Texas 75006, U.S.A.

Phone: [phone] or [phone]

Fax: [phone]

URL: www.EMDStorage.com
Hours: Mon-Fri 7:30am to 6:30pm Central Time

Copyright 2006

This Edition First Published 2006

All rights reserved. This publication may not be reproduced, transmitted, transcribed,
stored in a retrieval system, or translated into any language or computer language, in
any form or by any means, electronic, mechanical, magnetic, optical, chemical,
manual or otherwise, without the prior written consent of Excel Meridian Data.

Disclaimer

Excel Meridian Data makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of merchantability
or fitness for any particular purpose. Furthermore, Excel Meridian Data reserves the
right to revise this publication and to make changes from time to time in the content
hereof without obligation to notify any person of such revisions or changes. Product
specifications are also subject to change without prior notice.

Trademarks

Excel Meridian Data and the Excel Meridian logo are registered trademarks of Excel
Meridian Data, Inc. SecurStor 16i and other names prefixed with “EMD” and “SS”
are trademarks of Excel Meridian Data, Inc. PowerPC® is a trademark of
International Business Machines Corporation and Motorola Inc. Solaris and Java ar e
trademarks of Sun Microsystems, Inc. All other names, brands, products or services
are trademarks or registered trademarks of their respective owners.

RMA Policy

Please visit www.emdstorage.com for a detailed explanation of our RMA policy.

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SecurStor 16i Installation and Hardware Reference Manual

Warnings and Certifications

Restricted Access Location:

This equipment is intended to be installed in a RESTRICTED ACCESS LOCAT IO N only .

Electric Shock Warning!

To Prevent Electric Shock:
Access to this equipment is granted to trained operators and service personnel only. Only

modules housed in hot-swap canisters are field-serviceable. Accessing the backplane can
cause electric shock.

FCC (applies in the U.S. and Canada)

FCC Class B Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC Rules (47 CFR, Part
2, Part 15 and CISPR PUB. 22 Class B). These limits are designed to
provide reasonable protection against harmful interference when the
equipment is operated in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in
accordance with this user’s guide, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by
turning the equipment off and on, you are encouraged to try to correct the
interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from

that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of FCC Rules. Operation is subject to the
following two conditions: 1) this device may not cause harmful interference,
and 2) this device must accept any interference received, including
interference that may cause undesired operation.

Warning:

A shielded power cord is requir ed in ord er to meet FC C emission limit s and
also to prevent interference with nearby radio and television reception.

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SecurStor 16i Installation and Hardware Reference Manual

Use only shielded cables to connect I/O devices to this equipment. You are
cautioned that changes or modifications not expressly approved by the party
responsible for compliance could void your authority to operate the
equipment.

This device is in conformity with the EMC.

CB

(Certified Worldwide)

This device meets the requirements of the CB standard for electrical
equipment with regard to establishi ng a satisfactory level of safety for
persons using the device and for the area surrounding the apparatus. This
standard covers only safety aspects of the above apparatus; it does not
cover other matters, such as style or performance.
For Power Supplies’ compatibility to China Compulsory Certification.

CCC

ITE BSMI Class A,

This device is in conformity with UL standards for safety .

Disposal of Old Electrical & Electronic Equipment (Applicable in the
European Union and other European countries with separate collection
systems)

This symbol on the product or on its packaging indicates that this product
shall not be treated as household waste. Instead it shall be handed over to
the applicable collection point for the recycling of electrical and
electronic equipment. By proper waste handling of this product you
ensure that it has no negative consequences for the environment and
human health, which could otherwise be caused if this product is thrown
into the garbage bin. The recycling of materials will help to conserve
natural resources.

For more details information about recycling of this product, please
contact your local city office, your household waste disposal service or
the shop where you purchased the product.

CNS 13438 (for Taiwan)

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SecurStor 16i Installation and Hardware Reference Manual

Safety Precautions

Precautions and Instructions

• Prior to powering on the subsystem, ensure that the correct power range is being

used.

• The SecurStor 16i subsystem comes with 16 drive bays. Leaving any of these

drive bays empty will greatly affect the efficiency of the airflow within the
enclosure, and will consequently lead to the system overheating, which can
cause irreparable damage.

• If a module fails, leave it in place until you have a replacement unit and you are

ready to replace it.

• Airflow Consideration: The subsystem requires an airflow clearance, especially

at the front and rear. The airflow direction is from front to back.

• Handle subsystem modules using the retention screws, eject levers, and the metal

frames/face plates. Avoid touching PCB boards and connector pins.

• To comply with safety, emission, or thermal requirements, none of the covers or

replaceable modules should be removed. Make sure that all enclosure modules
and covers are securely in place during operation.

• Be sure that the rack cabinet into which the subsystem chassis will be installed

provides sufficient ventilation channels and airflow circulation around the
subsystem.

• Provide a soft, clean surface to place your subsystem on before working on it.

Servicing on a rough surface may damage the exterior of the chassis.

• If it is necessary to transport the subsystem, repackage all drives separately.

• Dual-redundant controller models come with two controller modules that must

be installed into the subsystem. Single controller modules come with a single
controller module and a metal sheet is placed over the lower controller bay at the
rear of the subsystem. Since single-controller modules cannot be upgraded, this
metal sheet should NEVER be removed.

ESD Precautions

Observe all conventional anti-ESD methods while handling system modules. The
use of a grounded wrist strap and an anti-static work pad are recommended. Avoid
dust and debris in your work area.

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SecurStor 16i Installation and Hardware Reference Manual

About This Manual

This manual:

 Introduces the SecurStor 16i Subsystem series.
 Describes all the active components in the system.
 Provides recommendations and details about the hardware installation

process of the subsystem.

 Briefly describes how to monitor the subsystem.
 Describes how to maintain the subsystem.

This manual does not:

 Describe components that are not user-serviceable.
 Describe the configuration options of firmware, using terminal

emulation programs, or the RAIDWatch GUI that came with your
subsystem.

 Give a detailed description of the RAID processing units or the RAID

controllers embedded within the subsystem.

Who should read this manual?

This manual assumes that its readers are experienced with computer
hardware installation and are familiar with storage enclosures.

Related Documentation

• Generic Operation Manual

• Quick Install Guide

Conventions

Naming

From this point on and throughout the rest of this manual, the SecurStor 16i
series is referred to as simply the “subsystem” or the “system” and
SecurStor is frequently abbreviated as “SS.”

Important Messages

Important messages appear where mishandling of components is possible or
when work order can be misconceived. These messages also provide
important information associated with other aspects of system operation.
The word “important” is written as “IMPORTANT,” both capitalized and
bold and is followed by text in italics. The italicized text is the message to
be delivered.

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SecurStor 16i Installation and Hardware Reference Manual

Warnings

Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken seriously.
Warnings are easy to recognize. The word “warning” is written as
“WARNING,” both capitalized and bold and is followed by text in italics.
The italicized text is the warning message.

Cautions

Cautionary messages should also be heeded to help you reduce the chance
of losing data or damaging the system. Cautions are easy to recognize. The
word “caution” is written as “CAUTION,” both capitalized and bold and is
followed by text in italics. The italicized text is the cautionary message.

Notes

These messages inform the reader of essential but non-critical information.
These messages should be read carefully as any directions or instructions
contained therein can help you avoid making mistakes. Notes are easy to
recognize. The word “note” is written as “NOTE,” both capitalized and bold
and is followed by text in italics. The italicized text is the cautionary
message.

Steps

Steps are used to describe sequential steps of a specific work procedure.
Adherence to the sequential steps can guarantee effectiveness and lower the
chance of failure.

Lists

Bulleted Lists: Bulleted lists are statements of non-sequential facts. They
can be read in any order. Each statement is preceded by a round black dot
“•.”

Numbered Li sts: Numbered lists are used to describe sequential steps you
should follow in order.

Software and Firmware Updates

Please contact Excel Meridian Data for the latest software or firmware updates. NOTE that
the firmware version installed on your system should provide the complete functionality listed
in the specification sheet/user’s manual. We provide special revisions for various application
purposes. Therefore, DO NOT upgrade your firmware unless you fully understand what a
firmware revision will do.

Problems that occur during the updating process may cause unrecoverable errors and system
down time. Always consult technical personnel before proceeding with any firmware upgrade.

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SecurStor 16i Installation and Hardware Reference Manual

Table of Contents

ONTACT INFORMATION ..................................................................................................... II

C

COPYRIGHT 2006 ..................................................................................................................II

Disclaimer........................................................................................................................... ii

Trademarks.........................................................................................................................ii

RMA Policy.........................................................................................................................ii

WARNINGS AND CERTIFICATIONS ....................................................................................IIIV

TABLE OF CONTENTS ........................................................................................................VIII

CHAPTER 1 NTRODUCTION

1.1 PRODUCT OVERVIEW ............................................................................................ 1-1

1.1.1 Product Introduction..........................................................................................1-1

1.1.2 Enclosure Chassis............................................................................................. .1-2

1.1.2.1 Chassis Overview...............................................................................................1-2

1.1.2.2 Physical Dimensions ..........................................................................................1-3

1.1.2.3 Front Panel Overview.........................................................................................1-3

1.1.2.4 Hard Drive Numbering........................................................................................1-4

1.1.2.5 Rear Panel Overview.........................................................................................1-4

1.1.2.6 Backplane Board................................................................................................1-5

1.2 SUBSYSTEM COMPONENTS....................................................................................1-5

1.2.1 Drive Trays.........................................................................................................1-6

1.2.2 The RAID Controller Module ..............................................................................1-6

1.2.3 Controller Module Interfaces ..............................................................................1-7

1.2.4 DIMM Module.....................................................................................................1-8

1.2.5 BBU....................................................................................................................1-8

1.2.6 Power Supply Units............................................................................................1-8

1.2.7 Cooling Modules.................................................................................................1-9

1.3 SUBSYSTEM MONITORING .................................................................................. 1-10

1.3.1 I2C bus.............................................................................................................1-10

1.3.2 LED Indicators..................................................................................................1-10

1.3.3 Firmware (FW) .................................................................................................1-11

1.3.4 Audible Alarms.................................................................................................1-11

1.4 HOT-SWAPPABLE COMPONENTS......................................................................... 1-11

1.4.1 Hot-swap Capabilities.......................................................................................1-11

1.4.2 Components.....................................................................................................1-12

1.4.3 Normalized Airflow...........................................................................................1-12

CHAPTER 2 HARDWARE INSTALLATION

2.1 INTRODUCTION...................................................................................................... 2-1

2.2 SAFETY PRECAUTIONS .......................................................................................... 2-1

2.3 GENERAL INSTALLATION PROCEDURE ................................................................ 2-3

2.3.1 Installation Procedure Flowchart........................................................................2-4

2.4 UNPACKING THE SUBSYSTEM...............................................................................2-4

2.5 INSTALLATION OVERVIEW...................................................................................2-4

2.6 BBU INSTALLATION .............................................................................................2-5

2.6.1 BBU Module Installation Overview.....................................................................2-5

2.6.2 BBU Warnings and Precautions.........................................................................2-5

2.6.3 Installation Procedure.........................................................................................2-5

2.7 HARD DRIVE INSTALLATION................................................................................ 2-7

2.7.1 Hard Drive Installation Prerequisites..................................................................2-7

2.7.2 Hard Drive/Drive Tray Installation.......................................................................2-7

2.8 RACK/CABINET INSTALLATION ............................................................................2-9

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SecurStor 16i Installation and Hardware Reference Manual

CHAPTER 3 SUBSYSTEM MONITORING

3.1 SUBSYSTEM MONITORING OVERVIEW ................................................................ 3-1

3.2 STATUS-INDICATING LEDS .................................................................................. 3-2

3.2.1 Brief Overview of the LEDs................................................................................3-2

3.2.2 Drive Tray LEDs.................................................................................................3-2

3.2.3 Controller Module LEDs .....................................................................................3-3

Restore NVRAM Defaults – a Push Button......................................................................3-4

3.2.4 Ethernet Port LEDs............................................................................................3-5

3.2.5 BBU Module LED...............................................................................................3-6

3.2.6 PSU LEDs..........................................................................................................3-6

3.2.7 Cooling Module LEDs.........................................................................................3-7

3.3 AUDIBLE ALARM .................................................................................................. 3-8

3.3.1 Default Threshold Values...................................................................................3-8

3.3.2 Failed Devices....................................................................................................3-9

3.4 I2C MONITORING.................................................................................................. 3-9

CHAPTER 4 SUBSYSTEM CONNECTION AND OPERATION

4.1 CONNECTION OVERVIEW ..................................................................................... 4-1

4.1.1 Cabling...............................................................................................................4-1

4.1.2 Network Topologies............................................................................................4-2

4.1.3 Points of Failure .................................................................................................4-2

4.2 HOST CONNECTION TOPOLOGIES........................................................................4-2

4.2.1 Sample Topology – Direct-Attached, Dual-path Connection ..............................4-2

4.3 POWER ON............................................................................................................ 4-5

4.3.1 Check List...........................................................................................................4-6

4.3.2 Power On Procedure..........................................................................................4-6

4.3.3 Power On Enclosure ..........................................................................................4-6

4.3.4 Power On Status Check.....................................................................................4-7

4.4 POWER OFF PROCEDURE ..................................................................................... 4-8

CHAPTER 5 SUBSYSTEM MAINTENANCE AND UPGRADING

5.1 OVERVIEW ............................................................................................................5-1

5.1.1 Maintenance......................................................................................................5-1

5.1.2 General Notes on Component Replacement......................................................5-1

5.2 REPLACING CONTROLLER MODULE COMPONENTS ........................................... 5-2

5.2.1 Overview............................................................................................................5-2

5.2.2 Notes on Controller Module Maintenance..........................................................5-3

5.2.3 Removing the Controller Module........................................................................5-3

5.2.4 Replacing the Controller Module........................................................................5-5

5.3 REPLACING OR UPGRADING MEMORY MODULES .............................................. 5-6

5.3.1 Memory Module Installation Overview................................................................5-6

5.3.2 Selecting the Memory Modules..........................................................................5-6

5.3.3 DIMM Module Installation...................................................................................5-7

5.4 REPLACING A FAULTY BBU.................................................................................5-8

5.4.1 BBU Warnings and Precautions.........................................................................5-9

5.4.2 Replacing a Faulty BBU.....................................................................................5-9

5.5 REPLACING A FAILED PSU MODULE ................................................................. 5-12

5.5.1 Notes on PSU Module Maintenance ................................................................5-12

5.5.2 Replacing the PSU Module...................................................................... ........5-13

5.6 COOLING MODULE MAINTENANCE................................................................... 5-15

5.6.1 Notes on Cooling Module Maintenance............................................................5-15

5.6.2 Replacing a Cooling Module.............................................................................5-16

5.7 REPLACING A FAILED HARD DRIVE ................................................................... 5-18

5.7.1 Hard Drive Maintenance Overview...................................................................5-18

5.7.2 Replacing a Hard Drive....................................................................................5-19

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SecurStor 16i Installation and Hardware Reference Manual

APPENDIX A TECHNICAL SPECIFICATIONS

A.1 TECHNICAL SPECIFICATIONS...............................................................................A-1

System Weight..................................................................................................A-1

Vibration............................................................................................................ A-2

A.2 CONTROLLER SPECIFICATIONS ...........................................................................A-3

A.2.1 Configuration.....................................................................................................A-3

A.2.2 Architecture.......................................................................................................A-3

A.3 DRIVE TRAY SPECIFICATIONS .............................................................................A-4

A.4 POWER SUPPLY SPECIFICATIONS ........................................................................A-4

A.5 COOLING MODULE SPECIFICATIONS...................................................................A-4

A.6 RAID MANAGEMENT...........................................................................................A-5

A.7 FAULT TOLERANCE MANAGEMENT.....................................................................A-5

APPENDIX B PINOUTS

B.1. D-SUB 9 AND AUDIO JACK PINOUTS.........................................................................B-1

B.1.1. COM1 Serial Port Cable....................................................................................B-1

B.1.2. COM2 Serial Port Cable to UPS........................................................................B-2

B.2. NULL MODEM ............................................................................................................B-2

B.3. ETHERNET PORT PINOUTS.........................................................................................B-3

B.4. STP LAN CABLE........................................................................................................B-4

B.5. MAIN POWER .............................................................................................................B-4

APPENDIX C UNINTERRUPTIBLE POWER SUPPLY

C.1 UNINTERRUPTIBLE POWER SUPPLY OVERVIEW.................................................C-1

C.2 COMPATIBLE UPS SUPPLIES................................................................................C-1

C.3 SERIAL COMMUNICATION CABLE........................................................................C-1

C.4 CONNECTING THE UPS TO THE SUBSYSTEM.......................................................C-1

C.4.1 Connect the PSU Module Power Cords ............................................................C-1

C.4.2 Set the Baud Rate.............................................................................................C-2

C.4.3 Connect COM2..................................................................................................C-2

C.5 POWER ON............................................................................................................C-2

C.6 UPS STATUS MONITORING ..................................................................................C-3

C.6.1 Normal Operational Status ................................................................................C-3

C.6.2 UPS Messages..................................................................................................C-3

C.6.3 UPS Message Summary...................................................................................C-4

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1.1 Product Overview

1.1.1 Product Introduction

This chapter briefly introduces the SecurStor 16I iSCSI-to-SATA-II storage
subsystem. The SecurStor 16i subsystem comes with four (4) GbE host ports capable
of large I/O transfers over iSCSI packets.

EMD Storage’s iSCSI storage supports
network initiators compatible with the
IETF iSCSI standard (RFC 3720) with
the following functionalities:

Chapter 1

Introduction

 Access control via

IQN and IP

 CHAP security
 Jumbo frames
 Header Digest mode

Internet SCSI (iSCSI) protocols are embedded in firmware and I/Os are rapidly
processed via dedicated algorithms. The iSCSI storage is built around reliable
hardware and sophisticated RAID technologies. I/O requests are packaged and
transmitted over local area networks (LANs), wide area networks (WANs), or the
Internet using the existing networking hardware and thus the total cost of ownership
is reduced. With the help of the networking flexibility, the subsystem is ideal for
location-independent data storage, backup, and retrieval.

The subsystem delivers extreme performance that result from the combined
performance of multiple disk drives and the level of data protection unseen in other
iSCSI storages. Featuring all standard RAID functionalities as other SecurStor
subsystems, the SS 16i subsystem provides a reliable platform for IT operations such
as backup, data-mining, or str a te g ic a llocation.

This subsystem features a high-density architecture that supports up to sixteen (16)
hot swappable, SATA-II hard drives in a 3U-profile chassis. The subsystem is
powered by a RAID controller board featuring the latest ASIC400, RAID6 ASIC as
the XOR engine. The pre-installed 512MB DDR RAM DIMM module can be
upgraded to a 2GB capacity DIMM to support complicated applications that hold
numerous ID/LUN combinations.

Figure 1-1: SecurStor 16i Subsystem

The controller board is housed in a metal canister and is referred to as the “controller
module.” The controller module is comprised of a main circuit board, an interface
faceplate, and a metal canister. The controller module is accessed through the rear of
the SecurStor 16i with the help of ejection levers. An optional battery backup unit

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SecurStor 16i Installation and Hardware Reference Manual

(BBU) is now equipped with an EEPROM that helps record the installation date and
notify system administrators if the battery’s life expectancy is reached. The BBU is
hot swappable and is accessed through the controller’s faceplate.

Four (4) RJ-45 connectors connect the subsystem to network switches or Ethernet
ports of independent devices. Dual-redundant, hot-swappabl e cooling modules and
power supplies protect the subsystem from overheating and the down time by power
outage. The modular nature of the subsystem and the easy accessibility to all major
components ensure the ease of the subsystem maintenance.

NOTE:

On receiving and unpacking your subsystem, please check the
package contents against the included Unpacking Checklist. If
any modules are missing, please contact your vendor
immediately.

1.1.2 Enclosure Chassis

1.1.2.1 Chassis Overview

The SecurStor 16I RAID storage is housed in a 3U metal chassis that is
divided into front and rear sections. Key components are respectively
accessed through the front (see
The enclosure chassis can be mounted into a standard 19-inch rack or
enclosure cabinet using support brackets that are separately-purchased.

Figure 1-3) and rear (see Figure 1-4) panels.

NOTE:

Components accessed through the front panel are referred to as “Front
Panel Components” and components accessed through the rear panel are
referred to as “Rear Panel Components.”

1-2

Chapter 1 Introduction

Figure 1-2: Locations of Key Components

1.1.2.2 Physical Dimensions

The SecurStor 16I comes in a 3U chassis with the following dimensions:

 With handles: 483mm (W) x 131mm (H) x 504.3mm (L) (19 x 5.2

x 21 inches)

 Without handles: 445mm x 130mm x 487mm (17.5 x 5.1 x 19.2

inches)

1.1.2.3 Front Panel Overview

The front section of the subsystem features a 4x3 layout for twelve (12) 3.5­inch drives. The two (2) handles on the front of the subsystem enable you to
easily insert/extract the chassis into/from a rack or cabinet. The front panel
of the SecurStor 16I RAID subsystem described in this manual is shown in
Figure 1-3. A description of each front panel component is given below:

Figure 1-3: SecurStor 16I Front View

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SecurStor 16i Installation and Hardware Reference Manual

The front panel shown in Figure 1-3 accommodates the following
components:

• Drive bays with drive tray canisters: The drive bays house the

SecurStor 16I hard drives.

• Forearm handles: The subsystem has right and left handles for

easier rackmounting and handling.

1.1.2.4 Hard Drive Numbering

The front section of the SecurStor 16I enclosure houses sixteen (16) hard
drives in a 4x4 configuration. When viewed from the front, the drive bays
(slots) are numbered 1 to 16 from left to right and then from top to bottom.

Figure 1-4: Hard Drive Numbering

1.1.2.5 Rear Panel Overview

The rear section of the SecurStor 16I subsystem is accessed through the rear
panel and is reserved for a single RAID controller module, one (1) optional
BBU, two (2) power supply units (PSUs), and two (2) cooling modules.

A rear view is of the subsystem is shown below. Descriptions of each rear
panel component are given below:

Figure 1-5: SecurStor 16I-2 Rear View

The rear panel shown in
components:

• RAID controller module: The RAID controller module

manages all functionalities provided with the subsystem,
and all interface connectors are on located on the
controller’s faceplate. (See Section

Figure 1-5 accommodates the following

0)

1-4

Chapter 1 Introduction

• BBU module: An optional BBU module sustains

unfinished writes cached in memory during a power

outage in order to prevent data loss. (See Section

• PSU modules: The hot-swappable PSUs receive single-

phase power and deliver +5V, +12V, and +3.3V power to
the subsystem. A power switch is located on each PSU to
turn the system on and off. (See Section

• Cooling modules: The redundant cooling modules

ventilate the subsystem to maintain a cooling airflow
across the subsystem. (See Section

0)

0)

0)

1.1.2.6 Backplane Board

An internal backplane board separates the front and rear sections of the
SecurStor 16I. The PCB board consists of traces for logic level signals and
low voltage power paths. It contains no user-serviceable components.

WARNING!

When inserting a removable module, DO NOT USE EXCESSIVE
FORCE! Forcing or slamming a module can damage the pins on the

module connectors either on the module itself or on the backplane. Gently
push the module until it reaches the end of module slot. Feel the contact
resistance and use slightly more pressure to ensure the module connectors
are correctly mated. If the module comes with ejection levers or retenti on
screws, use them to secure the module.

1.2 Subsystem Components

The SecurStor 16I houses many active components and most of them can be accessed
through either the front or rear panel. The modular design of the active components
facilitates their easy installation and removal. Hot-swap mechanisms are incorporated
to eliminate power surges and signal glitches that might occur while removing or
installing these modules.

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SecurStor 16i Installation and Hardware Reference Manual

1.2.1 Drive Trays

Figure 1-6: Drive Tray Front View

The SecurStor 16I subsystem comes with sixteen (16) drive trays (see
Figure 1-6) designed to accommodate separately purchased, standard 1-inch
pitch, 3.5-inch SATA-II disk drives. The drive bays are accessible from the
enclosure front panel. Two (2) LEDs on the front bezel indicate the
operating statuses. A key-lock on each drive tray secures the hard drive in
place, while a release button enables fast retrieval of a hard drive.

WARNING!

Be careful not to warp, twist, or contort the drive tray in any way (e.g., by
dropping it or resting heavy objects on it). The drive tray has been
customized to fit into the drive bays of the subsystem. If the drive bay
superstructure is deformed or altered, the dri ve trays may not fit into the
drive bays.

1.2.2 The RAID Controller Module

The default size for the DDR RAID controller module is 512MB. RAID
controller module contains a main circuit board, a preinstalled 512MB
capacity or above DDR RAM DIMM module, and the controller module
interfaces. The controller module contains no user-serviceable components
and should never be removed or opened, except when installing/upgrading
the cache memory inside.

WARNING!

Although the RAID controller can be removed, the only time you should
touch the controller itself is to install the memory modules. The RAID
controller is built of sensitive components and unnecessary tampering can
damage the controller.

The heart of the SecurStor 16I RAID controller subsystem is the iSCSI-to­SATA controller board. The controller comes with four (4) GbE Ethernet
host ports. The subsystem connects to the host through RJ-45 connectors,
while the connectors are also ready to connect to one or more network

1-6

Chapter 1 Introduction

switches, enabling access to your storage volumes in complex

configurations such as data-sharing or network zoning.

The docking connector at the rear of the controller board connects the
controller module to the backplane board. A DDR RAM DIMM socket is
strategically placed in an easily accessible location on the controller board
for easy insertion of the DDR R AM DIMM module.

1.2.3 Controller Module Interfaces

All external interfaces that connect to external devices are located on the
controller module rear panel shown below. The interfaces are listed below.

Figure 1-7: Controller Module Interfaces – 2-port version

 Host ports: Four (4) Gigabit Ethernet host ports (simulated and

indicated as CH0 to CH3 in the diagram shown above) connect the
SecurStor subsystem to the networked iSCSI initiators through RJ­45 connectors.

 COM port: The controller module comes with two (2) COM ports.

The serial ports are used for local access to the firmware embedded
configuration utility and the connection to a UPS device.

 LED indicators: Six (6) LED indicators illustrate the system

statuses for system monitoring. Please see Chapter 3 for more
information.

 Ejection Levers: Two (2) ejection levers located on the sides of

the controller ensure that the back-end connectors are properly
seated in the module slot and properly mated with the backplane.

 Management LAN Port: Another 10/100BaseT Ethernet port

connects the subsystem to a management computer. Available
management interfaces include: telnet, Java-based RAIDWatch
manager, or the web-based manager invoked by an http console.

 Restore Default LED and button: The push button and LED are

used to restore firmware defaults in cases when upgrading

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SecurStor 16i Installation and Hardware Reference Manual

firmware or if an administrator forgets system password. For more
details, please refer to Chapter 3.

1.2.4 DIMM Module

The controller module comes with a preinstalled 512MB capacity or above
DDR RAM DIMM module and the allocable size can reach 2GB. The
memory socket is located on the side of the controller board.

1.2.5 BBU

An optional, separately purchased Li-ION battery backup unit (BBU)
module (see the diagram below) can sustain cache memory for days during
the event of power outage. The battery module comes with an EEPROM
that marks the installation date, and system administrators will be notified
when the one-year left expectancy is reached. Please refer to Section 2.6 for
installation instructions.

Figure 1-8: BBU Module

In accordance with international transportation regulations, the BBU module
is only charged to between 35% and 45% of its total capacity when shipped.
Therefore, when powering on the subsystem for the first time (see Section

4.4) the BBU will begin to charge its batteries to their full capacity. It
normally requires approximately twelve (12) hours for the battery to be fully
charged. If the battery is not fully charged after twelve (12) hours, there may
be a problem with the BBU module. You may re-install the battery; and if
the battery still shows problems with charging, contact your subsystem
vendor for a replacement. While the battery is being charged, the LED on
the BBU will start flashing. (See Chapter 3.2.6 for details on the LED
indicators.)

You can check battery’s charge level using the RAIDWatch software or the
embedded firmware utility.

1.2.6 Power Supply Units

The subsystem is equipped with two (2) redundant, hot-swappable, 530W
PSUs, which are installed into the rear section of the chassis. The PSU is
permanently mounted into a 2U (dual-level) bracket especially designed to
house both the PSU and a cooling module, which is mounted at the end of
the 2U bracket.

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Chapter 1 Introduction

NOTE:

Hot-swapping the PSU also removes the cooling module at the lower
slot.

As shown in Figure 1-9, each PSU comes with a power socket and a power
switch to turn the subsystem on and off. Two (2) embedded cooling fans
provide sufficient airflow. A single LED indicates the PSU status. When a
power supply failure occurs, the red LED lights come on. A rejection handle
at the rear of the PSU is especially designed to help properly install or
remove the module.

A screw hole on the ejection handle helps secure the PSU to the chassis.

Figure 1-9: PSU Module

Please refer to Appendix B for the technica l inf ormation of the PSUs.

1.2.7 Cooling Modules

Two cooling modules are implemented within the rear sections of PSU
modules. (see
levels. When the subsystem operates normally, the cooling fans operate at
the lower speed. If a major component fails or when one of the temperature
thresholds is violated, the cooling fans automaticall y raise its rotation speed.

More technical information can be found in Appendix B.

Figure 1-10.) The cooling fans operate at two (2) fan speed

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SecurStor 16i Installation and Hardware Reference Manual

Figure 1-10: Cooling Module

1.3 Subsystem Monitoring

The iSCSI RAID subsystem comes with a number of different monitoring methods
that provide you with continual updates on the operating statuses of the subsystem
and individual components. The following monitoring features are included:

1.3.1 I2C bus

The following subsystem elements are interfaced to the RAID controller

2

over a non-user-serviceable I

• Cooling modules

• Module presence detection circuits

• Temperature sensors (for detecting the temperature of the

backplane board and controller board)

C bus:

1.3.2 LED Indicators

The following components come with LEDs to indicate the operating
statuses of individual components:

• RAID controller

• BBU module

• Cooling modules (on PSU faceplates)

• PSU modules (1 LED on each module)

• Drive trays (2 LEDs on each tray)

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Chapter 1 Introduction

1.3.3 Firmware (FW)

Firmware: The firmware is pre-installed software used to configure the

subsystem. The latest firmware functionalities include Task Scheduler,
Intelligent Drive Handling, and Media Scan. Media Scan handles low
quality drives in both the degraded mode and during the rebuild process.
Maintenance tasks will then be performed on an entire array or specific hard
drives. Various options are user-configurable such as priority, start time, and
execution intervals. For more information, please refer to the Generic
Operation Manual in the product utility CD.

1.3.4 Audible Alarms

The subsystem comes with an audible alarm that is triggered when a
component fails or when the pre-configured temperature or voltage
thresholds are exceeded. Whenever you hear an audible alarm, it is
imperative that you determine the cause and rectify the problem
immediately.

Event notification messages indicate the completion or status of array
configuration tasks and are always accompanied by two (2) or three (3)
successive and prolonged beeps.

WARNING!

Failing to respond when an audible alarm is heard can lead to
permanent damage to the subsystem. When an audible alarm is
heard, rectify the problem as soon as possible.

1.4 Hot-swappable Components

1.4.1 Hot-swap Capabilities

The subsystem comes with a number of hot-swappable components. A hot-swap
component is one that can be exchanged while the subsystem is still online without
affecting the operational integrity of the subsystem. These components should only
be removed from the subsystem when they are being replaced. At no other time
should these components be removed from the subsystem.

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1.4.2 Components

The following components are hot-swappable:

• Power supply units (PSUs)

• BBU module

• Hard disk drives

1.4.3 Normalized Airflow

Proper cooling is referred to as “normalized” airflow. Normalized airflow ensures the
sufficient cooling within the subsystem and is only attained when all components are
properly installed. Therefore, a failed component should only be removed when a
replacement is available. If a failed component is removed but not replaced, airflow
will disrupted and perm a ne n t damage to the subsystem can result.

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Chapter 2

Hardware Installation

2.1 Introduction

This chapter gives detailed instructions on how to install the subsystem. When installing the
subsystem, it is necessary to mount the chassis into a rack cabinet and to install hard drives
and drive trays. Installation into a rack or cabinet should occur before the hard drives or drive
trays are installed into the subsystem.

CAUTION!

Please note that the installation instructions described in this manual
should be carefully followed to prevent any difficulties and damage to
your subsystem.

2.2 Safety Precautions

1. Disconnect the power cords if the need should arise for cleaning the

chassis. Do not use liquid or sprayed detergent for cleaning. Use a
lightly moistened clothe for cleaning.

2. Be sure the correct power range (100-120 or 220-240VAC) is supplied

by your rack cabinet or power outlet. It is highly recommended to
connect two different power supplies to separate power sources; e.g.,
one to a power outlet, and the other to a UPS system.

3. Thermal notice: All drive trays (even if they do not contain a hard

drive) must be installed into the enclosure. Leaving a drive bay or
module slot open will severely affect the airflow efficiency within the
enclosure, and will consequently lead to system overheating. Keep a
faulty module in place until you have a replacement unit and you are
ready to replace it.

4. Rack-mounting: The subsystem is intended to be rack-mounted.

Following concerns should be heeded when mounting the enclosure
into a rack cabinet:

a. An enclosure without disk drives can weigh over 60 pounds.

Two (2) people are required to install or relocate the
subsystem. Drives should be removed from the enclosure
before moving the subsystem.

Hardware Installation

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SecurStor 16i Installation and Hardware Reference Manual

b. The subsystem is designed to operate in an environment where

the ambient temperature around the chassis must not exceed
104°F.

c. The openings on the enclosure are for air circulation and hence

the ventilation openin g s sh ould never be obstructed.

d. Proper grounding, over-current protection, and stability

features should be provided with the rack cabinet into which
the subsystem is mounted.

5. Operate the subsystem in an environment with low humidity.

6. Make sure the voltage of the power source is within the rated values as

indicated by the label attached to the power supplies before connecting
the subsystem to the power source. You may also refer to the Appendix
A of this manual for technical details.

7. Airflow considerations: The subsystem requires an airflow clearance

especially on the front and the rear sides. For proper ventilation, a
minimum of 1 inch is required between the front of the enclosure and
rack cover; a minimum of 2 inches is required between the enclosure
and end of the rack cabinet.

8. Handle the system modules by the retention screws, eject levers, or the

modules’ metal frames/faceplates only. Avoid touching the PCB boards
and connector pins.

9. None of the covers or replaceable modules should be removed in order

to maintain compliance with safety, emission, or thermal requirements.

10. If the subsystem is going to be left unused for a long time, disconnect

the subsystem from mains to avoid damages by transient over-voltage.

11. Never open the subsystem top cover, unless directed to do so by EMD

Support.

12. Always secure every enclosure module by its retaining screws or make

sure it is held in place by i ts latches or hand screws.

13. Always make sure the subsystem has a safe electrical earth connection

via power cords or chassis ground by the rack cabinet.

14. Be sure that the rack cabinet in which the subsystem chassis is to be

installed provides sufficient ventilation channels and airflow circulation
around the subsystem.

15. If it is necessary to transport the subsystem, repackage all disk drives

separately.

16. If one of the following situations arises, get the enclosure checked by

service personnel:

a. Any of the power cords or pl ugs is damaged.
b. Liquid has penetrated into the subsystem.
c. The enclosure has been exposed to moisture.

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