Memtech AT3550 User Manual

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AT3550 3.5” Wolverine
3.5” IDE Solid State Flash Drive
User Guide
Revision 1.1
February 11, 2005
Memtech SSD Corporation
7628 Las Positas Road
Livermore, CA 94550
(925) 294-8483 (800) 445-5511
www.memtech.com
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Table of Contents
1. HIGHLIGHTS...............................................................................3
2. INTRODUCTION..........................................................................3
3. INSTALLATION ...........................................................................4
3.1 PROCEDURE...........................................................................................................4
3.2 JUMPERS................................................................................................................7
3.3 IDE INTERFACE.......................................................................................................9
4. OPERATION..............................................................................11
4.1 ACTIVE REMAPAND WRITE LIMITATIONS ..............................................................11
4.2 ECC......................................................................................................................11
4.3 POWER ................................................................................................................12
4.4 TROUBLE SHOOTING GUIDE ....................................................................................13
5. MAINTENANCE.........................................................................13
6. SPECIFICATIONS .....................................................................14
6.1 INTERFACE ...........................................................................................................14
6.2 PERFORMANCE.....................................................................................................14
6.3 ENVIRONMENTAL...................................................................................................14
6.4 POWER REQUIREMENTS ........................................................................................14
6.5 MECHANICAL.........................................................................................................15
6.6 RELIABILITY ..........................................................................................................15
7. APPENDIX.................................................................................16
7.1 CONTACT INFORMATION.........................................................................................16
7.2 ATA SPECIFICATION INFORMATION.........................................................................16
7.3 LIMITED LIFETIME WARRANTY................................................................................16
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1. HIGHLIGHTS
12 Gbyte capacity under 16mm (0.63”)
60 Gbyte maximum capacity
Full -55
o
C to +125oC military temperature range
3.5” drive low profile form-factor
UDMA-66 compliant IDE interface
16 byte CRC/ECC and Active Remap™ for exceptional data reliabilit y
Kicker™ Hold Up Circuit
Active Remap™ Data Reliability Feature
5 volt, low power operation
Completely solid state - no moving parts
2000G operating shock
20G operating vibration
0.1 millisecond random access time
26 Mbyte/sec cached Read performance
20 Mbyte/sec cached Write performance
8 year product warranty
8 million erase/write cycle endurance
2. INTRODUCTION
The AT3550 “Wolverine” is a series of IDE solid state drives available in a low­profile 3.5-inch for m at. The drive is completely solid state, making it exceptionally rugged and able to operate in extreme environm ent al conditions.
Sector Erasable NAND E
2
PROM (Flash) is used to provide over 60 Gbytes of nonvolatile, solid state storage in an extremely small, r ugged form factor. The drive is 100% IDE compatible and requires no special drivers to operat e. It is essentially a drop in replacement for standard rotating media.
The IDE interface is implem ent ed using a commercially available IDE controller. It supports UDMA-66 transfers, LBA mode addr essing, and incorporates a 1 Mbyte buffer, and a 16-byte hardware error detection and correction logic. The CRC/ECC circuitry, in conjunction with Memtech’s proprietar y Active Remap™ technology, makes for a virtually bulletproof medium for data retention.
The drive is available in a number of standard capacities ranging from 1 to 60 Gbytes. Drives under 12 Gbytes are 16mm tall, while 60 Gbyte capacity drives are under 35.5mm.
Each drive is fully tested under environmental extremes at t he factory using Memtech’s proprietary EnduroTest™ to guar antee data integrity in even the harshest conditions. Full functionality of t he pr oduct is guaranteed out of the box.
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3. INSTALLATION
3.1 PROCEDURE
3.1.1 ESD PRECAUTIONS The AT3550 is sensitive to static electricit y. Before handling the AT3550, please
observe the following precautions to avoid ESD damage to t he unit :
Keep the drive in its shielded bag until ready to install.
Ground yourself by touching a grounded chassis frame of the computer, or
use a grounded wrist strap before and during the installation process.
Do not touch the exposed drive electronics or connectors. Always handle the
drive by the edges or mounting rails.
3.1.2 CONFIGURATION Before applying power to the drive, configure the drive using the jumper diagrams
given in Section 3.2. The default configuration is for a single drive system or as the master in a two-drive system. Change the configuration as required. Never attempt to change the jumpers while the drive is plugged in and the computer is on.
3.1.3 CABLE With the com puter off, attach the 40-pin, 0.1inch cable t o t he unitized IDE
connector on the drive. Note pin 1 orientation and alig nment. Care should be taken when installing the cable, as misalignment can permanently damage the drive interface. Attach the separ at e power cable using the 4-pin AT Power connector.
The AT3550 is UDMA66 compliant with the appropriate cable. If the host system does not detect the correct cable type, the int er face will restrict transfers to UDMA33 speeds or slower. The type of cable is detected using the sig nal CBLI D. On UDMA66 compliant cables, this signal is grounded.
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3.1.4 CONNECTOR The drive may be interfaced directly to a standard 3. 5”, 0.1in IDE socket connector
or a standard 40pin IDE ribbon and AT power cable. See drawing below for pin 1 location. Care should be taken when installing the AT3550 into the system, as misalignment can permanently damage t he dr ive inter face connector or electronics.
Figure 1 - Drive Connector
3.1.5 MOUNTING The AT3550 may be mounted in any orientation. A total of four bottom and six
side mounting holes are available for installat ion. The mounting holes require 6­32 screws with a maximum depth of 0.25 inch.
The diagram given below is valid for all capacities of the AT3550 drive. The overall outside dimensions are 4 inches (101.7 mm) wide, 5.75 inch (146.05m m ) long, and 0.630 inch (16mm) tall. Please refer to the following drawing for dimensions and mounting hole locations.
The diagram given below is for a 12 Gbyte dr ive. Dr ives with higher capacit ies will be 0.760 inches (19.3mm) or taller. All other dimensions remain identical.
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3.1.6 COMPUTER SETUP To be recognized by the computer, the drive tr anslat ion information must typically
be entered into the System Setup or CMOS Setup utility. For non-PC compatible computers, this may not apply. The AT3550 suppor ts automatic configuration if offered by the BIOS. Automatic CHS translation and LBA mode is also supported.
3.1.7 PARTITION The drive must be partitioned using the system’s FDISK utility. For operating
systems other than DOS, please ref er t o your O S oper at ing guides. Note that changing the partition inf ormation will erase all data currently on the drive. Refer to your OS manual for infor mation regarding partitioning a hard disk.
3.1.8 FORMAT The AT3550 is low-level formatted at t he factory, which establishes the 512-byte
sector size. A high-level format is r equired after the partition has been established on the drive. Refer to your OS manual for information regarding hard disk drive format procedures.
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3.2 JUMPERS
The following diagram illustrates the locations of the jumpers on the AT3550 controller card. The jumpers ar e found on both the J1 interface header and the J2 jumper header. Refer t o the illustration below. The option jumpers control the master/slave configurat ion of the drive, the use of cable selection, drive write protection, and other factor y relat ed functions. All headers are on 2mm centers.
3.2.1 MAIN HEADER (J1) JUMPERS
3.2.2 MASTER/SLAVE If no jumper is installed or t he MA jumper is in place, the drive is selected as the
C: or Master drive. If the drive is to be a Slave device (drive D), inst all t he jumper ion the SL location. This jumper is part of the unitized ATA interface header and is on 0.1 inch centers. This location is fact or y shipped with no jumper or with the jumper in the MA position, configur ing the drive as the master drive.
3.2.3 CABLE SELECT Jumper CS can be used to let the IDE Cable Select signal select the drive
configuration as either t he m aster or slave device. Shorting the CS pins enables the Cable Select feature. Leaving t he pins unconnect ed disables t he Cable Select feature. The drive is f act or y shipped with these pins open.
3.2.4 WRITE PROTECT The WP j u m per is used to write protect the drive. Installing this jumper on either
the J1 or J2 header forces the drive to a write-pr otect condition, blocking any and
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X
X
j
all writes from occurring. This jumper must be prior to the drive powering up to be recognized.
3.2.5 OPTION HEADER J2 The Option Header is located on the LED-side of the drive, as illustrated below:
J2 Option Jumpers,
2x6, 2mm
Jumper Header – J2
3.2.6 WRITE PROTECT The WP j umper on header J2 is used to write-protect the drive. The default
position of this jumper is O FF. Installing the WP jum per inhibits all further writes to the drive, while read accesses occur as normal.
WP OPT1 OPT2
GND
LED
T R
XP
WP: Write Protect configured for normal operation --
umper off
3.2.7 OPTION JUMPERS The OPT1 and OPT2 jumpers ar e used for factory test functions or special
functions only, and should always be left open.
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3.2.8 TX/RX CONNECTIONS The TX and RX connections are f or manufacturing use only.
GND
TX
GND
RX
3.2.9 EXTERNAL POWER
OPT1,2: Option Jumpers configured for normal operation -- jumpers off
TX/RX: RS232 Communications
The XP pins on the Option Header are used to connect exter nal st andby power to the drive. These pins are connected to the Kick er ™ Holdup Circuit. Applied power should be 5 volts +/- 10%. Do not exceed 6 volts on this line, as internal damage to the drive may result.
The two outside pins on the header are used to connect power to the holdup circuit. A third pin is needed to connect the grounds of the drive to the power source.
GND
XP
XP
GND
GND
3.3 IDE INTERFACE
The AT3550 uses a unitized ATA connector that com bines t he 40- pin 0.1” IDE header, the 4-pin AT Power connector, and an 8-pin opt ion j umper header mounted on the drives controller PCB. Maximum cable length is 18 inches. Recommended cable length is 12 inches or less, especially if an advanced PIO or UDMA transfer modes are being used. T o achieve full drive performance, a UDMA cable is required.
Jumper Header – J2
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3.3.1 IDE CONNECTOR PHYSICAL ORIENTATION The diagram below depicts connector orientation and locat ion.
3.3.2 IDE CONNECTOR PINOUT The following table depicts the 40-pin, 0. 1 inch signal cable interface pin out.
PIN SIGNAL PIN SIGNAL
1 RESET- 2 GND 3 DATA7 4 DATA8 5 DATA6 6 DATA9 7 DATA5 8 DATA10
9 DATA4 10 DATA11 11 DATA3 12 DATA12 13 DATA2 14 DATA13 15 DATA1 16 DATA14 17 DATA0 18 DATA15 19 GND 20 KEY (NO PIN) 21 DRQ 22 GND 23 IOW- 24 GND 25 IOR- 26 GND 27 IOCHRDY 28 CSEL 29 DACK- 30 GND 31 IRQ 32 IOCS16­33 ADDR1 34 PDIAG­35 ADDR0 36 ADDR2 37 CS0- 38 CS1­39 DASP- 40 GND
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4. OPERATION
4.1 ACTIVE REMAP™ AND WRITE LIMITATIONS
Unlike mechanical drives, wherein the wear-out mechanism results from starting and stopping the platters and the rot ation of the spindle motors, the wear-out mechanism for any solid state flash dr ive resides in writing to the non-volatile memory, which in Memtech's case is NAND E devices requires that electrons be fir st removed from, and then trapped on the floating gate in each cell using Fowler-Nor dheim t unneling techniques. This process is inherently harsh on the oxide layer isolating the floating gate from the silicon substrate in the device, and establishes the write cycle endurance of each cell in a device as specified by the device manufacturer.
To overcome this limitation, Memtech Solid State Flash Drives have been designed with Active Remap™, which, on a detected cell failure, moves the entire failing block to a reserved location and maps the failing block out of active memory. This process is automatic and invisible to the user. It extends the device's useful life almost 100 fold, and makes the Memtech series of Solid State Drives suitable for both read mostly and read/write applications.
In an ongoing effort to determine the durability of the flash components and in turn extend the life of our products, Memtech has also conducted several endurance tests using our flash drives. The results were very encouraging. During testing, done under both benign and harsh operating conditions, Memtech observed and documented an erase/write cycle endurance of 8 to 30 million cycles. This is compared to the flash manufacturer's test and report of only 100,000 to 250,000 erase/write cycles for the flash devices.
Reading the NAND E oxide layers, and is therefore unlimited.
4.2 ECC
2
PROM has no adverse effects on the storage cells or
2
PROM. Writing the to the memory
The NRZ data interface used by the IDE cont r oller implements a CRC/ECC mechanism to detect and correct any errors in t he data stored in the flash. This polynomial is capable of correcting three 8-bit data bursts in a single sector, and detecting up to six 8-bit error bursts per sect or .
An extensive retry algorithm is implemented on the AT3550, so that single event disturbances such as ESD can be readily overcome. Probability of miscorrect ion is approximately 10
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-20
per bit corrected for a 512-byte field.
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4.3 POWER
4.3.1 POWER DOWN Whenever possible, do not power down the computer dur ing a write command
sequence to any mass storage device. This includes during the normal operation of the drive, and with the use of disk cache programs such as Microsft SmartDrive. If a write routine must interrupted, use the push button reset or a soft reset. Powering down the AT3550 while it is being written may cause an incomplete write sequence, and leave as many as 32 sectors with an Address Mark Found Error or Uncorrectable Err ors. DOS will report these with a message “Error Reading Drive C:”.
4.3.2 POWER SUPPLY The AT3550 voltage requirem ent is specified at +5 volts, +/- 5% on the drive itself.
Operation outside of these limits is not guaranteed. Note that the drive will “operate” down to 4 volts, but reliability issues such as Uncorrectable Er r or s or invalid data reads may occur. An on board voltage monitor will inhibit writes when the supply voltage falls below 4.70 volts, thus preserving data integrity on the drive.
4.3.3 POWER ROUTING
®
To avoid “glitches” or noise on the Vcc and gr ound lines, power in the system should be routed so that all peripherals are sourced direct ly from the power supply as opposed to routing a single continuous supply line to each device in the system as in daisy chaining. Routing power in the star configuration, as is done on most desktop PCs, will minimize the effect of one device’s current draw on another device. This is key to maintaining data integrity on the AT3550. See diagrams below.
Star Topology Daisy Chain - Do Not Use
Power Supply
Main Board
Hard Disk
Floppy
Main Board
Power Supply
Floppy
Hard Disk
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4.4 TROUBLE SHOOTING GUIDE
4.4.1 SELF-TEST DIAGNOSTIC CODES The AT3550 has been designed to issue blink codes via the LED in the event of a
low-level or catastrophic failure. A blink code of five would be defined as five fast blinks, a pause with no blinks, and a repeat of the process. The drive will not respond to commands or a soft reset when in this state. Only powering down the drive will clear the drive state and restart internal diagnostics.
Blink codes and their associated failure m echanism s ar e defined below. In the event a blink code is encountered, contact the f actory for further assistance.
Number of
Blinks 2 ROM Firmware Checksum error 3 ASIC initialization error 4 SRAM Test failed 5 IDE buffer failure 6 IDE controller error 7 NRZ data path error
4.4.2 UNCORRECTABLE ERRORS
Error
If a drive has been subjected to a power down during a write command, or as been run under marginal or dirty power conditions, uncorrect able errors may be introduced into the media. This may result in dat a r ead errors, a corrupted FAT table entry or directory, or an invalid boot partition or par tition table. Microsoft Scandisk or Norton Disk Doctor partition table errors, but should not be allowed to mar k a sector in the data area as bad. On a rewrite to a data sector with uncorrectable err ors, all synchronization and ECC codes will be rewritten and the error will be eliminated.
5. MAINTENANCE
No maintenance is required during t he normal use of this drive. If data is to be archived for long periods of time (> 10 years), it is recommended
that the data on the drive be refreshed every 5 to 10 years. The manufacturer of the NAND E years. Programs such as Norton Speedisk drive, or Microsoft during its surface test , achieve this end very well.
2
PROM devices will only guarantee data integrity for a period of 10
will successfully correct FAT table problems and
©
®
Scandisk, which writes and reads every sector on the disk
, which reallocates all sectors on the
®
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6. SPECIFICATIONS
6.1 INTERFACE
IDE Compatibility ATA6 - T13/1410DR2A IDE Drive Number Drive 0 or 1 Raw Physical Capacity 12288 Mbytes under 16mm
61440 Mbytes maximum
Physical Sector Size 512 bytes
6.2 PERFORMANCE
Average Access 0.1 ms Track/Track Access 0.1 ms Onboard Cache 16 Mbytes Cached Read Transfer 26 Mbytes/sec Cached Write Transfer 20 Mbytes/sec Read Transfer Rate 9.5 Mbytes/sec sustained Write Transfer Rate 5.0 Mbytes/sec sustained Burst Transfers 66 Mbytes/sec
6.3 ENVIRONMENTAL
Commercial Temperatur e Range
Operating 0 Storage -65
Extended Temperature Range (E)
Operating -20 Storage -65
Industrial Temperature Range (I)
Operating -40 Storage -65
Military Temperature Range (M)
Operating -55
Storage -65 Shock - operating 1000G, 0.5ms half sine, MIL-810F, method 516.5 Vibration - operating 15G Random, MIL-810F, method 514.5 Airflow None required Humidity 5% to 95% NC (target)
6.4 POWER REQUIREMENTS
Voltage 5V +/- 5% Current 4 G byte dr ive
Idle 160 mA
Read 350 mA
Write 320 mA
o
to 70o C
o
C to 125o C
o
C to 75oC
o
C to 125o C
o
to 85o C
o
to 125o C
o
to 125o C
o
to 125o C
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6.5 MECHANICAL
Length 5.750 inches (145.05 mm) Width 4.006 inches (101.75 mm) Height -
Up to 12288 Mbytes 0.630 inches (16.00 mm)
Add. 8192 Mbytes 0.130 inches (3.30 mm) Cable Interface 40-pin, 0.1” Max. Cable Length 18 inches (460 mm) Rec. Cable Length 12 inches (305 mm) Weight (4 Gbytes) 7.9oz (246g)
6.6 RELIABILITY
6.6.1 ERROR CORRECTION A programmable 96-bit Reed-Solom on Er ror Correction and Detection capable of
correcting three random byte error s per sector.
6.6.2 MEMORY CELL ENDURANCE 8 million write/erase cycles (excluding ECC and Active Remap™).
6.6.3 DRIVE ENDURANCE 800 million write/erase cycles minimum with ECC and Active Remap™ enabled.
Read endurance is unlimited.
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7. APPENDIX
7.1 CONTACT INFORMATION
For Technical Support or Warranty Repair information, please contact Memtech at:
Memtech Technology 7628 Las Positas Road Livermore, CA U.S.A. 94551 phone: (925) 294-8483 toll free: (800) 445-5511
7.2 ATA SPECIFICATION INFORMATION
Information reg ar ding the ATA6 specification may be obtained from the following locations:
AT-Attachment Document Distribution Global Engineering 15 Inverness Way East Englewood, Co. 80112-5704 Phone: (303) 792-2181 or (800) 854-7179 Fax: (303) 792-2192
ATA Anonymous FTP Site
http://fission.dt.wdc.com
7.3 LIMITED LIFETIME WARRANTY
Memtech warrants your AT3550 against defects in material and workmanship for the life of the drive. T he warrant y is void in the case of misuse, accident, alteration, improper installation, m isapplicat ion or the result of unauthorized service or repair.
The implied warranties of merchant abilit y and fitness for a particular purpose, and all other warranties, expressed or implied, except as set f orth in this warranty, shall not apply to the products delivered.
In no event shall Memtech be liable for any lost profits, lost savings or other incidental or consequential damages arising out of the use of, or inability to use, this product.
BEFORE RETURNING PRODUCT , A RETURN MATERIAL AUTHORIZATION (RMA) MUST BE OBTAINED FROM MEMTECH.
Product shall be returned to Memtech with shipping prepaid. If the product fails to conform and warranty repair is necessary, Memtech will reimburse customer for the transportation charges incurred.
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