Micro-Electro-Magnetical Tech Co.
SCHOTTKY DIE SPECIFICATION TYPE: MBR8100
General Description:
100 V 8 A ( Low Ir) Single Anode
ELECTRICAL CHARACTERISTICS
SYM Die Sort UNIT
DC Blocking Voltage: Ir=1mA(for wafer form) VRRM 105 Volt
Spec. Limit
100
Ir=0.5mA (for dice form)
Average Rectified Forward Current
IFAV Amp
8
Maximum Instantaneous Forward Voltage
VF MAX 0.88 Volt
0.89 @ 8 Amperes, Ta=25°C
Maximum Instantaneous Reverse Voltage
VR= 100 Volt, Ta=25°C
Maximum Junction Capacitance @ 0V, 1MHZ
IR MAX 0.09 mA
Cj MAX pF
0.1
MAXIMUM RATINGS
Nonrepetitive Peak Surge Current
Operating Junction Temperature
Storage Temperatures
IFSM Amp
Tj °C
TSTG °C
150
-65 to +125
-65 to +125
Specification apply to die only. Actual performance may degrade when assembled.
MEMT does not guarantee device performance after assembly.
Data sheet information is subjecedt to change without notice.
DICE OUTLINE DRAWING
DIM um
A 2220 87.40
B 2120 83.5
A
C
C 2140 84.3
D 254 10
Die Size
Top Metal Pad Size
Passivation Seal
Thickness (Min)
ITEM
Thickness (Max)
B
Top-side Metal
SiO2 Passivation
D
P+ Guard Ring
Back-side Metal
PS:
(1)Cutting street width is around 80um(3.14mil).
(2)Both of top-side and back-side metals are Ti/Ni/Ag.
2
305 12
Mil
2