Micro-Electro-Magnetical Tech Co.
SCHOTTKY DIE SPECIFICATION TYPE: MBR1640
General Description:
40 V 15 A (Low Ir) Single Anode
ELECTRICAL CHARACTERISTICS
SYM Die Sort UNIT
DC Blocking Voltage: Ir=1mA(for wafer form) VRRM 42.5 Volt
Spec. Limit
40
Ir=0.5mA (for dice form)
Average Rectified Forward Current
IFAV Amp
15
Maximum Instantaneous Forward Voltage
@ 15 Ampere, Ta=25°C
@ 20 Ampere, Ta=25°C
VF MAX 0.55 Volt
0.575
0.69
0.68
Maximum Instantaneous Reverse Voltage
@ VR= 40 Volt, Ta=25°C
Maximum Junction Capacitance @ 0V, 1MHZ
IR MAX 0.15 mA
Cj MAX pF
0.2
MAXIMUM RATINGS
Nonrepetitive Peak Surge Current
Operating Junction Temperature
Storage Temperature
IFSM Amp
Tj °C
TSTG °C
250
-65 to +125
-65 to +125
Specifications apply to die only. Actual performance may degrade when assembled.
MEMT does not guarantee device performance after assembly.
Data sheet information is subjected to change without notice.
DICE OUTLINE DRAWING
DIM um
A 3116 122.67
B 3016 118.70
A
C
C 3036 119.50
D 254 10.00
Die Size
Top Metal Pad Size
Passivation Seal
Thickness (Min)
ITEM
Thickness (Max)
B
Top-side Metal
SiO2 Passivation
D
P+ Guard Ring
Back-side Metal
PS:
(1)Cutting street width is around 80um(3.14mil).
(2)Both of top-side and back-side metals are Ti/Ni/Ag.
2
305 12.00
Mil
2