MLX80001
4-channel Master LIN Transceiver
Features
Compliant to LIN Specification Version 1.3, 2.x and J2602
4 channel independent enhanced master transceiver function
Slew rate selection for 10.4kbps (J2602) and 20kbps (LIN 2.x) for optimized radiated
emission behavior
Disable of slew rate control for fast programming or test modes
High EMC immunity
Fully integrated receiver filter
LIN terminals proof against short-circuits and transients in the automotive environment
High impedance LIN in case of loss of ground , loss of battery and under voltage condition
LIN short to ground protection
Control output for voltage regulator
Only 25µA typical power consumption in sleep mode
Remote wake up via LIN traffic
Integrated master termination resistors (1kOhm) and decoupling diodes
Thermal overload protection
5V and 3.3V compatible digital inputs
20-pin thermally enhanced QFN 5x5 package
±4kV ESD protection pin LIN
Ordering Information
Part No. Temperature Range Package
MLX80001 KLQD K (-40 to 125 °C) LQD (MLPQ 5x5 20pins)
General Description
The MLX80001 is a 4 channel physical layer device for applications of low speed vehicle serial data network
communication using the Local Interconnect Network (LIN) protocol. The device is designed in accordance
to the physical layer definition of the LIN Protocol Specification Package 2.x and the SAE J2602 standard.
The IC furthermore can be used in ISO9141 systems.
Because of the very low current consumption of the MLX80001 in the recessive state it’s suitable for ECU
applications with hard standby current requirements. An advanced sleep mode capability allows a shutdown
of a complete master node. The included wake-up function detects incoming dominant LIN messages and
enables the voltage regulator.
MLX80001 – Datasheet Page 1 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
Contents
1. Functional Diagram....................................................................................................4
2. Electrical Specification ..............................................................................................5
2.1 Operating Conditions.............................................................................................5
2.2 Absolute Maximum Ratings................................................................................... 6
2.3 Static Characteristics.............................................................................................7
2.4 Dynamic Characteristics........................................................................................9
2.5 Timing Diagrams .................................................................................................10
2.6 Test Circuits for Dynamic and Static Characteristics...........................................12
3. Functional Description .............................................................................................13
3.1 TxDx Input pin - Logic command to transmit on LINx bus as follows:..................13
3.2 RxDx Output pin - Logic data as sensed on the LINx bus...................................13
3.3 Mode 0 and Mode 1 pins respectively are used to select transceiver operating
modes: ...........................................................................................................................14
3.4 Power on procedure , INH Pin – INHIBIT............................................................15
3.5 Pin LIN.................................................................................................................16
4. Fail-save Features ....................................................................................................17
5. Application Hints......................................................................................................19
5.1 Bus loading requirements....................................................................................19
5.2 Duty Cycle Calculation ........................................................................................20
5.3 Application Circuitry.............................................................................................22
6. Pin Description.........................................................................................................23
7. Mechanical Specification MLPQ5x5 20...................................................................24
8. ESD/EMC Remarks...................................................................................................25
9. Revision History.......................................................................................................26
10. Assembly Information ..........................................................................................27
11. Disclaimer..............................................................................................................28
MLX80001 – Datasheet Page 2 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
List of Figures
Figure 1 - Block diagram.......................................................................................................................... 4
Figure 3 – Receiver debouncing and propagation delay....................................................................... 10
Figure 4 - Sleep mode and wake up procedure .................................................................................... 11
Figure 5 - Test circuit for dynamic characteristics ................................................................................. 12
Figure 6 - Test circuit for automotive transients .................................................................................... 12
Figure 7 - State diagram MLX80001 ..................................................................................................... 15
Figure 8 - Duty cycle calculation in accordance to LIN 2.x.................................................................... 20
Figure 9 - Duty cycle measurement in accordance to LIN 2.x for baud rates of 10.4Kbps................... 21
Figure 10 - Typical application circuitry of the MLX80001..................................................................... 22
Figure 11 - Pin description MLPQ 20 package...................................................................................... 23
MLX80001 – Datasheet Page 3 of 28
3901080001
March 2007
Rev 001
1. Functional Diagr a m
MLX80001
4-channel Master LIN Transceiver
VS
MODE0
MODE1
Aux.
Supply
Bandgap
VBG
Mode
Control
Sleep timer
RxDx time out
TSHD
Bias
Slew rate
Temp.
Protection
Wake-up
Control
RCO
Vs
Charge
Adjustment
Active
decoupling
diode
pump
Vs
monitor/
POR
4
Master
Pull up
fuse
fuse
fuse
fuse
INH
UV/POR
P0
P1
P2
P3
RxD1
TxD1
RxD2
TxD2
RxD3
TxD3
RxD4
TxD4
VCC
Wake-
Filter
Rec-Filter
TSHD
Filter
Driver
control
MR
channel1
channel2
channel3
channel4
Figure 1 - Block diagram
Receiver
200K
VS
1K
LIN1
LIN2
LIN3
LIN4
MLX80001 – Datasheet Page 4 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2. Electrical Specification
All voltages are referenced to ground (GND). Positive currents flow into the IC.
The absolute maximum ratings (in accordance with IEC 60 134) given in the table below are limiting values
that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long
term exposure to limiting values may effect the reliability of the device.
2.1 Operating Conditions
Parameter Symbol Min Max Unit
Battery supply voltage
Short time battery supply voltage V
Low battery supply voltage V
Operating ambient temperature T
[1]
V
7 18 V
S
18 26.5 V
S_S
5 7 V
s_L
-40 +125 °C
amb
[1] Vs is the IC supply voltage including voltage drop of reverse battery protection diode, V
is 6 to 26.5V
= 0.4 to 1V, V
DROP
BAT_ECU
voltage range
MLX80001 – Datasheet Page 5 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2.2 Absolute Maximum Ratings
Parameter Symbol Condition Min Max Unit
Battery Supply Voltage VS
Transients at battery supply voltage V
Transients at battery supply voltage V
Transients at high voltage signal pins V
Transients at high voltage signal pins V
Transients at high voltage signal and power supply
pins
DC voltage LIN V
DC voltage logic I/O’s V
VS.tr1
VS.tr2
LINx..tr1
LINx..tr2
V
HV..tr3
LIN_DC
logic_DC
t < 1 min 30
ISO 7637/2 pulse 5, t < 400ms
ISO 7637/2 pulse 1
ISO 7637/3 pulse 2
ISO 7637/3 pulses 1
ISO 7637/3 pulses 2
ISO 7637/2 pulses 3A, 3B
t < 500ms , Vs = 18V
Vs = 0V
[1]
-100 V
[1]
+50 V
[2]
-30 V
[2]
+30 V
[3]
-0.3
V
45
-200 +200 V
-22
-40
+40 V
-0.3 +7 V
Human body model,
ESD capability any pins V
ESDHB
equivalent to discharge
-2 +2 kV
100pF with 1.5kΩ,
Human body model,
ESD capability LINx V
ESDHB_HV
equivalent to discharge
-4 +4 kV
100pF with 1.5kΩ,
Maximum latch – up free current at any Pin I
Maximum power dissipation
[4]
P
Thermal impedance
Storage temperature T
-500 +500 mA
LATCH
Tamb = +125 °C
tot
Tamb = +105 °C
Tamb = + 95 °C
Θ
stg
in free air 34 K/W
JA
-55 +150 °C
0.75
1.3
1.6
W
Junction temperature Tvj -40 +150 °C
[1] ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor.
[2] ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF.
[3] ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a
reverse polarity diode and >10uF blocking capacitor
[4] Simulated values for low conductance board (JEDEC)
MLX80001 – Datasheet Page 6 of 28
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March 2007
Rev 001
2.3 Static Characteristics
MLX80001
4-channel Master LIN Transceiver
Unless otherwise specified all values in the following tables are valid for VS = 5 to 26.5V and T
= -40 to
AMB
125°C. All voltages are referenced to ground (GND), positive currents are flow into the IC.
Parameter Symbol Condition Min Typ Max Unit
PIN VS
Undervoltage lockout V
Supply current single channel, dominant I
Supply current four channel, dominant I
Supply current, recessive ISr V
Supply current, sleep mode I
Supply current, sleep mode I
MODE0/1=1, TxDx=0 2 4.5 V
S_UV
V
= 26.5V, TxDx=0
Sd_single
Sd_four
Ssl
Ssl
no load current
V
= 26.5V, TxDx=0
S
No load current
= 18V, TxDx=H 950 1500 µA
S
MODE0/1=0
= 12V, Tamb= 25°
V
S
MODE0/1=0 50 µA
S
25 µA
30
2
120
4
mA
mA
PIN LINx – Transmitter
Short circuit LIN current I
Pull up resistor LIN R
Pull up current LIN , sleep mode I
_LIN_PU_SLEEP VLIN
LIN reverse current, recessive I
LIN reverse current loss of battery I
LIN current during loss of Ground
[2]
I
Transmitter dominant voltage V
Transmitter driving capability low battery I
Recessive output voltage V
LIN input capacitance
[1]
C
_LIN_LIM
_LIN_PU
V
= VS, TxD=0 120 200 mA
LIN
V
=0, TxD open 900 1100 Ω
LIN
=0, VS=12V, sleep mode -100 -75
V
_LIN_rec
_LIN_LOB
_LIN_LOG
olLIN_3
_LIN_dom_min
ohLIN
LIN
5V < V
< 26.5V, TxD open
S
VS=0V, 0V < V
VS=12V, 0V < V
=18V, network load =500Ω,
V
S
TxDx = 0
VS=7V, V
LIN
TxDx open 0.8*Vs Vs V
Pulse response via 1KΩ,
= 12V, VS open
V
PULSE
> VS, 5V < V
LIN
< 26.5V ,
LIN
< 26.5V 20 µA
LIN
< 26.5V -150 100 µA
LIN
20 µA
2 V
=1.5V, TxDx = 0 40 mA
25 35 pF
µA
PIN LINx – Receiver
Receiver dominant voltage V
Receiver recessive voltage V
Center point of receiver threshold V
Receiver hysteresis V
0.4 *VS V
ilLIN
0.6 *VS V
ihLIN
iLIN_cnt
iLIN_hys
V
V
LIN_cnt
LIN_cnt
= ( V
= ( V
ilLIN
ihLIN
_ + V
)/2 0.475 *VS 0.5 *VS 0.525 *VS V
ihLIN
-V
) 0.175 *VS V
ilLIN
PIN TXD_x, MODE 0/1
High level input voltage Vih 2.0 V
Low level input voltage Vil 0.65 V
TxD pull up current -I
MODE pull down resistor R
TxD_x =L, MODE0&1=H 10 50 µA
IL_TXD
10 50
MODE_pd
kΩ
MLX80001 – Datasheet Page 7 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
Parameter Symbol Condition Min Typ Max Unit
PIN RXD_x
Low level output voltage V
High level output leakage
ol_rxd
Iih_rxd
I
RxD
V
RxD
= 2mA 0.9 V
= 5.5V -10 +10 µA
PIN INH
High level output voltage V
Leakage current INH I
I
oh_INH
EN = L ,V
INH_lk
= -180µA VS -0.8V VS -0.5V V
INH
= 0V -10 10 µA
INH
Thermal Protection
Thermal shutdown
Thermal recovery
[1]
T
[1]
T
160 190 °C
sd
126 150 °C
hys
[1] No production test, guaranteed by design and qualification
[2] The current is determined by the master pull up, to prevent discharge battery the master pull up path will be disconnected under
LOG conditions
MLX80001 – Datasheet Page 8 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2.4 Dynamic Characteristics
Unless otherwise specified all values in the following table are valid for VS = 5 to 26.5V and
T
= -40 to 125oC.
AMB
Parameter Symbol Condition Min Typ Max Unit
Propagation delay receiver
Propagation delay receiver
Propagation delay receiver symmetry
Receiver debounce time
LIN duty cycle 1
LIN duty cycle 2
LIN duty cycle 3
LIN duty cycle 4
[3] [4]
[3] [4]
[3] [4]
[3] [4]
[1]
t
[1]
t
[2]
t
[2]
t
rec_pdf
rec_pdr
rec_sym
rec_deb
D1
D2
D3
D4
trec(max) – tdom(min) ∆t3
trec(min) – tdom(max) ∆t4
Rise time in high speed mode t
Fall time in high speed mode t
r_hs
f_hs
C
C
=25pF falling edge 6 µs
RxD
=25pF rising edge 6 µs
RxD
Calculate ttrans_pdf ttrans_pdr
-2 2 µs
LIN rising & falling edge 0.5 4 µs
20kbps operation ,
normal mode
20kbps operation ,
normal mode
10.4kbs operation ,
low speed mode
10.4kbs operation ,
low speed mode
10.4kbs operation ,
low speed mode
10.4kbs operation ,
low speed mode
Network τ < 1µs
Network τ < 1µs
0.396
0.581
0.417
0.590
15.9 µs
17.28 µs
2 µs
2 µs
Wake-up filter time twu
Delay from Standby to Sleep Mode t
RxD time out t
MODE0/1 – debounce time t
dsleep
RxD_to
MODE_deb
Sleep mode
LIN_x rising & falling edge
15 150 µs
MODE0/1 = L 100 500 ms
Active modes, RxD_x = L 25 50 ms
Active <--> standby mode
transitions
2 5 20 µs
[1] This parameter is tested by applying a square wave signal to the LIN. The minimum slew rate for the LIN rising and falling
edges is 50V/us
[2] See figure 4 - receiver debounce and propagation delay
[3] See figure 5 and 6 – duty cycle measurement & calculation,
[4] Standard loads for duty cycle measurements are 1KΩ/1nF , 660Ω/6.8nF, 500Ω/10nF,internal termination disabled
MLX80001 – Datasheet Page 9 of 28
3901080001
March 2007
Rev 001
2.5 Timing Diagrams
V
BUS
t < t
rec_deb
MLX80001
4-channel Master LIN Transceiver
t < t
rec_deb
t
t
REC_PDF
t
REC_PDR
V
RxD
50%
t
Figure 2 – Receiver debouncing and propagation delay
MLX80001 – Datasheet Page 10 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
V
LINx
t
t > t
wu
V
INH
t
wu
V
CC_ECU
V
M0/1
V
RxDx
t
t
t
wake-up interrupt
t
Figure 3 - Sleep mode and wake up procedure
MLX80001 – Datasheet Page 11 of 28
3901080001
March 2007
Rev 001
4-channel Master LIN Transceiver
2.6 Test Circuits for Dynamic and Static Characteristics
MLX80001
Figure 4 - Test circuit for dynamic characteristics
Figure 5 - Test circuit for automotive transients
MLX80001 – Datasheet Page 12 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
3. Functional Description
3.1 TxDx Input pin - Logic command to transmit on LINx bus as follows:
TxD Polarity
• TxD = logic 1 (or floating) on this pin applies a recessive bus state (high bus voltage)
• TxD = logic 0 on this pin applies a bus dominant state depending on the transceiver mode state (low
bus voltage)
If the TxD pin is driven to a logic low state while the Mode 0,1 pins are in the 0,0 state or open, the
transceiver does not drive the LIN pin to the dominant state.
The pin contains an internal pull up to guarantee a recessive LIN behaviour in case of an open TxD pin. For
5V ECU supply systems an external pull up resistor is recommended.
TxD input thresholds are standard CMOS logic levels for 3.3V and 5V supply voltages.
3.2 RxDx Output pin - Logic data as sensed on the LINx bus
RxD polarity
• RxD = logic 1 on this pin indicates a bus recessive state (high bus voltage)
• RxD = logic 0 on this pin indicates a bus dominant state (low bus voltage)
The RxDx output is a low side open drain output. An external pull up resistor is required to realize the level
shift of an logic 1 level (high impedance output) to the Vcc_ECU voltage level.
Wake up source recognition
RxDx do not pass signals to the micro processor while in sleep mode until a valid wake up bus voltage level
is received or the Mode 0,1 pins are not 0,0 respectively. When the valid wake up bus signal awakens the
transceiver, the RxDx pin signalized an active low interrupt. This interrupt is active as long as no MODE pin
is switched to logic 1. After the MLX80001 enters an active mode, all valid bus signals will be sent out to the
RxD output.
The micro can detect the source of the wake up event and start the transmission only to the network caused
the wake up.
RxD time out feature
A dominant RxDx level longer than the specified time indicates a faulty blocked bus caused by a LIN node
itself or a short circuit to ground. The master pull up resistor of the LIN channel affected by the short will be
disconnected from the network in order to prevent thermal overload conditions or failure currents from the
battery without any intervention from the micro. The RxD timeout will be disabled with the next L->H
transition.
RxD Typical Load
Resistance: 2.7 kΩ (recommended pull up resistor)
Capacitance: < 25 pF (parasitic board capacitance)
MLX80001 – Datasheet Page 13 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
3.3 Mode 0 and Mode 1 pins respectively are used to select transceiver operating
modes:
The MLX80001 provides a weak internal pull down current on each of these pins. In case of open pins or
during the micro I/O initialisation procedure after power on or ECU wake up a stable passive behaviour of the
MLX80001 is given.
The MODE0/1 input thresholds are standard CMOS logic level for 3.3V and 5V supply voltages.
M0 M1 Mode
L L Sleep Mode
H L High Speed Mode (slew rate control disabled)
L H Low speed mode
H H Normal Mode
Mode 0 = 0, Mode 1 = 0 - Sleep mode.
Transceiver is in low power state, waiting for remote wake up via LIN or by mode changes to any state other
than 0,0. In this mode, the LINx pin is not in the dominant state regardless of the voltage at the TxDx pin.
As long as the MODE0/1 pin are logic 0, the transceiver returns to sleep mode after power on or remote
wake up after the specified time.
Mode 0 = 1, Mode 1 = 0. High Speed mode
This mode allows high speed data download up to 100Kbit/s. The slew rate control is disabled in this mode
all the six transmission channels. The falling edge is the active driven edge, the rising edge additional is
determined by the network time constant.
Mode 0 = 0, Mode 1 = 1. Transmit with reduced slew rate for low speed applications with
10.4kbps or below
This mode is the recommended operating mode for J2602 applications. The slew rate control of any channel
is optimized for minimum radiated noise, especially in the AM band.
Mode 0 = 1, Mode 1 = 1. Normal speed mode
Transmission bit rate in normal mode is up to 20kbps. The slew rate control of any channel is optimized for
maximum allowed bit rate in the LIN specification package 2.x.
MLX80001 – Datasheet Page 14 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
LINx termination
1kOhm
Low Slew Mode
M1
high
M1
low
M1
high
RxDx
LINx-
data
RxDx
LINx-
data
RxDx
LINx-
data
S
VS on
S
S
M0&1 =>High
Thermal
shutdown
High resistive LINx
termination
RxDx = low
No TxDx -> LINx
transmission possible
RxD L->H > 150us
M0&1=>Low
M0 INH
low V
High Speed Mode
M0 INH
high V
Normal Slew Mode
M0 INH
high V
RxDx
time out
Only faulty blocked
channels switched to high
resistive LIN termination
[1]
active low interrupt, indicates source of wake up
after power on all channel RxDx are active low
RxD=L > 10ms
M0&1=>Low
after 200ms
-> no mode change
-> no valid wake up
Figure 6 - State diagram MLX80001
3.4 Power on procedure , INH Pin – INHIBIT
M0/1 =>High
(if V
CC_ECU
on)
Sleep Mode
M0&1 INH
RxDx
low floating
high/
VCC
ECU
High resistive LINx
termination
Standby
RxDx
INH
M0/1
low
High resistive LINx
termination
wake up
request
from LINx
[1]
V
low
S
After power on the MLX80001 automatically enters an intermediate standby mode, the INH output becomes
HIGH (VBAT) and therefore the external voltage regulator will provide the Vcc supply voltage for the ECU . If
there is no mode change within the time stated (typically 350ms), the IC re-enters the sleep mode and the
INH output is going to become floating (logic 0).
When the device detects a valid wake up condition (bus traffic on any of the four LIN networks exceeds the
wake up filter time delay) the INH output becomes HIGH (VBAT) again and the same procedure starts as
described after power on. In case of a mode change to any active mode the sleep timer is stopped and INH
keeps HIGH(VBAT). If the transceiver enters the sleep mode (M0/1=0) , INH goes to logic 0 (floating) after
typically 350 ms when no valid wake up is detected.
MLX80001 – Datasheet Page 15 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
3.5 Pin LIN
The LINx pins are the four physical interfaces to the automotive environment. The related circuitry consists of
three parts:
• Transmitter with slew rate control
The slew rate of the transmitter is configurable by the MODE0/1 pins and depends from the application.
• Receiver
The receiver guarantees the specified input threshold levels and a very high robustness to external
disturbances.
• Termination
This circuitry contains the master pull up resistor and decoupling diodes. The integrated solution allows a
very comfortable control of failure situations, see description below. To guarantee the specified value of +/10% and to minimize the power dissipation, this circuitry is adjustable on wafer level. In order to allow a
battery current limitation in failure situations, a high resistive termination is placed in parallel to the master
pull up resistor.
MLX80001 – Datasheet Page 16 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
4. Fail-save Features
Loss of battery
If the ECU is disconnected from the battery, the LIN pin is in high impedance state. There is no impact to the
LIN bus traffic and to the ECU self, no damage can occur.
Loss of Ground
In case of an interrupted ECU ground connection the LIN pin is in high impedance state. There is no impact
to the LIN bus traffic and to the ECU self, no damage can occur.
Short circuit to battery
The transmitter output current is limited to the specified value in case of short circuit to battery in order to
protect the MLX80001 itself against high current densities. Otherwise the micro of the master ECU or the
slave nodes will not detect any bus traffic until the failure disappears and will switch into sleep mode.
Ground shift and short circuit to ground
If the LIN wire is shorted to negative shifted ground levels, there is no current flow from the ECU ground to
the LIN bus and no distortion of the LIN bus traffic.
A permanent failure current from battery via LIN short to ground can be reduced dramatically by
disconnection of the master pull up resistor. The following different situations may occur:
• The master node is in sleep mode, there is no bus traffic at any channel. If a short circuit to ground is
applied to a LIN network, the H ->L transition will awakens the shorted LIN network and the master
node. Due to the wake up source recognition the master is able to detect the wake up channel and
will not awaken the other LIN networks too. If there is no bus traffic possible with the shorted
network, the connected nodes will go to sleep mode again and the failure current to ground is
limited. If the failure disappears, the high resistive termination is able to drive a recessive voltage
level and the master node and the network will wake up due to the L->H transition.
• The master node is busy and there is bus traffic on one or more connected LIN networks. If a short
circuit to ground is applied to a LIN network, the integrated RxD timeout circuit will disconnect the
master pull up resistor from the shorted LIN network (high resistive termination present now). The
failure current to ground is limited and the thermal overload condition of the MLX80001 is removed
without any intervention of the micro. If the failure disappears, the RxD L->H transition will reset the
RxD timer circuit and the master termination will be reconnected to the LIN network.
Thermal overload
The MLX80001 is protected against thermal overloads.
Independent from the source of a LIN bus transmission (master channel1...4 or any slave node), the most
significant part of the power dissipation will be produced in the master pull up resistor(s) during normal
operation. Assuming a duty cycle of 50% and all channels are busy by bus traffic, the chip only can exceed
the specified trip off temperature if the ambient temperature is higher than the specified maximum of125°C.
Due to failure situations such as short of a LIN channel vs. battery voltage or ground, the power dissipation
can become higher than expected in the operating temperature range.
In these situations any transmit path will be interrupted and any master pull up resistor will be disconnected
from the LIN interfaces until thermal recovery, independent from the operating mode of the MLX80001 and
without any intervention of the micro. The thermal shutdown can be detected by the micro due to the active
low interrupt applied to any RxD output.
Usually the short to ground situation is covered by the sleep mode behaviour or the RxD timeout feature for
each channel. Thereby very high system availability is guaranteed.
MLX80001 – Datasheet Page 17 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
Undervoltage Vs
If the supply voltage is missing or will be decreased under the specified value, the transmitter is switched off
to prevent undefined LIN bus traffic. If the supply voltage is in the range of Vs = 5V…7V (low battery
operation), the transmitter operates in the mode as indicated by the MODE0/1 pins. Communication can not
be guaranteed under all worst case conditions (plug & play specification of LIN2.x and SAE J2602 standard
is defined from 7V…18V IC battery supply voltage).
Overvoltage Vs
If the supply voltage is in the range of Vs = 18V…26.5, the transmitter operates in the mode as indicated by
the MODE0/1 pins. In case of multi channel bus traffic the power consumption can exceed the expected
maximum value for the normal operation voltage range up to Vs = 18V and the thermal overload protection
will operate as described above. Communication can not be guaranteed under all worst case conditions (
plug & play specification of LIN2.x and SAE J2602 standard is defined from 7V..18V IC battery supply
voltage).
MLX80001 – Datasheet Page 18 of 28
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March 2007
Rev 001
5. Application Hints
5.1 Bus loading requirements
Parameter Symbol Min Typ Max Unit
MLX80001
4-channel Master LIN Transceiver
Operating voltage range V
Voltage drop of reverse protection diode V
Voltage drop at the serial diode in pull up path V
Battery shift voltage V
Ground shift voltage V
Master termination resistor R
Slave termination resistor R
BAT
Drop_rev
SerDiode
Shift_BAT
0 0.1 V
Shift_GND
900 1000 1100
master
20 30 60
slave
8 18
0.4 0.7 1
0.4 0.7 1
0 0.1
V
kΩ
Number of system nodes N 2 16
Total length of bus line LEN
Line capacitance C
Capacitance of master node C
Capacitance of slave node C
Total capacitance of the bus including slave and master
capacitance
Network Total Resistance R
40 m
BUS
100 150 pF/m
LINE
220 pF
Master
195 220 300 pF
Slave
C
0.47 4 10 nF
BUS
500 862
Network
V
V
V
BAT
BAT
Ω
Ω
Time constant of overall system
τ
1 5
µs
Table 1 - Bus loading requirements
MLX80001 – Datasheet Page 19 of 28
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Rev 001
5.2 Duty Cycle Calculation
MLX80001
4-channel Master LIN Transceiver
TxD
V
BUS
RxD
SUP
V
t
Bit
t
dom(max)
100%
t
dom(min)
58.1%
28.4%
0%
SS
42.2%
74.4%
t
Bit
t
rec(min)
58.1%
t
rec(max)
28.4%
Figure 7 - Duty cycle calculation in accordance to LIN 2.x
With the timing parameters shown in Figure 7 two duty cycles , based on t
calculated as follows :
D1 = t
D2 = t
rec(min)
rec(max)
/ (2 * t
/ (2 * t
)
Bit
)
Bit
For proper operation at 20KBit/s ( t
= 50µs) the LIN driver has to fulfill the duty cycles specified in chapter
Bit
2.4 for supply voltages of 7 to 18V and the defined standard loads .
Due to this simplified definition there is no need to measure slew rates, slope times, transmitter delays and
dominant voltage levels as specified in the LIN physical layer specification 1.3.
The device within the D1/D2 duty cycle range operates also in applications with reduced bus speed of
10.4KBit/s or below.
In order to minimize EME, the slew rates of the transmitter can be reduced (approximately by 2 times). Such
devices have to fulfill the duty cycle definition D3/D4 in the LIN physical layer specification 2.x. Devices
within this duty cycle range cannot operate in 20KBit/s applications.
rec(min)
and t
rec(max)
can be
MLX80001 – Datasheet Page 20 of 28
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MLX80001
4-channel Master LIN Transceiver
Figure 8 - Duty cycle measurement in accordance to LIN 2.x for baud rates of 10.4Kbps
With the timing parameters shown in the above diagram two duty cycles , based on trec(min) and trec(max)
can be calculated as follows : tBit =96µs
D3 = trec(min) / (2 x tBit)
D4 = trec(max) / (2 x tBit)
MLX80001 – Datasheet Page 21 of 28
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Rev 001
5.3 Application Circuitry
Car Battery Cl30
V
BAT_ECU
Voltage regulator
V
BAT
+5V
MLX80001
4-channel Master LIN Transceiver
LINx network
10uF1N4001
100nF
INH
Master
ECU
100nF
2.7K
4 times
Rx/Tx LIN
µP
Control
LIN
Control
CAN
Rx/Tx
CAN
GND
V
BAT
Voltage regulator
V
BAT
+5V
INH
10K
RxDx
MLX80001
TxDx
MODE0
MODE1
SWCAN
TH8056
HSCAN
47nF
VS
LINx
INH
GNDx
INH
or
CAN
2.2uF1N4001
100nF
4 times
10Ohm
180pF
Slave
ECU
ESD
protection
Bus
Single Wire LIN
ECU connector to
47nF
100nF
µP
2.7K
VCC
TH8082
RxD
TxD
EN
47nF
INH
VS
BUS
GNDGND
10Ohm
180pF
ESD
protection
Bus
Single Wire LIN
ECU connector to
Figure 9 - Typical application circuitry of the MLX80001
MLX80001 – Datasheet Page 22 of 28
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March 2007
Rev 001
6. Pin Description
MLX80001
4-channel Master LIN Transceiver
Vs
GNDL
18
LIN3
17
16
LIN4
RxD4
19
20
TxD4
MODE0
MODE1
GNDD
TxD1
Figure 10 - Pin description MLPQ 20 package
1
2
MLX80001
3
4
5
6
RxD1
MLPQ 5x 5
9
8
7
LIN1
LIN2
GNDL
15
14
13
12
11
10
RxD2
Pin Name IO-Typ Description
1 TxD4 I Transmit data to LIN4
2 MODE0 I Mode control pin
3 MODE1 I Mode control pin
4 GNDD P Ground for digital core
5 TxD1 I Transmit data to LIN1
6 RxD1 O Receive data from LIN1
7 LIN1 I/O Interface to LIN bus ,channel 1
INH
RxD3
TxD3
GNDA
TxD2
8 GNDL P Power ground for LIN1&2
9 LIN2 I/O Interface to LIN bus ,channel 1
10 RxD2 O Receive data from LIN2
11 TxD2 I Transmit data to LIN2
12 GNDA P Ground for analogue core
13 TxD3 I Transmit data to LIN3
14 RxD3 O Receive data from LIN3
15 INH O Control output for voltage regulator
16 Vs P Battery supply voltage
17 LIN3 I/O Interface to LIN bus ,channel 3
18 GNDL P Power ground for LIN3&4
19 LIN4 I/O Interface to LIN bus ,channel 4
20 RxD4 O Receive data from LIN4
MLX80001 – Datasheet Page 23 of 28
3901080001
March 2007
Rev 001
4-channel Master LIN Transceiver
7. Mechanical Specification MLPQ5x5 20
MLX80001
A A1 A3 b
All Dimension in mm, coplanarity < 0.1 mm
Min
nom
max
0.8
0.90
1.00
0
0.02
0.05
0.20
[1]
D D2 E E2 e L N
0.25
0.30
0.35
5.00
3.00
3.15
3.25
5.00
3.00
3.15
3.25
0.65
0.45
0.55
0.65
[6][3]
20 5 5
ND
[5]
NE
[1] Dimensions and tolerances conform to ASME Y14.5M-1994
[2] All dimensions are in Millimeters. All angels are in degrees
[3] N is the total number of terminals
[4] Dimension b applies to metallized terminal and is measured between 0.25 and 0.30mm from terminal tip
[5] ND and NE refer to the number of terminals on each D and E side respectively
[6] Depopulation is possible in a symmetrical fashion
MLX80001 – Datasheet Page 24 of 28
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Rev 001
[5]
MLX80001
4-channel Master LIN Transceiver
8. ESD/EMC Remarks
• The MLX80001 is designed for automotive environments. Typical ESD - and EMC events the device
can withstand are defined in chapter 2.2 ‘Absolute maximum ratings ‘.
• The application circuit board should be designed related to the board layout requirements in the SAE
J2602 chapter 7.6.2. .
• The MLX80001 is an ESD sensitive device and should be handled according to guideline EN100015/
part1 (“ The protection of ESD sensitive devices “)
MLX80001 – Datasheet Page 25 of 28
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March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
9. Revision History
Version Changes Remark Date
001 1st Release March 2007
MLX80001 – Datasheet Page 26 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
10. Assembly Information
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (S
• IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
• EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (S
• EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
• EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (T
• EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (S
• EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.asp
urface Mount Devices)
urface Mount Devices) and THD’s (Through Hole Devices)
hrough Hole Devices)
urface Mount Devices) and THD’s (Through Hole Devices)
MLX80001 – Datasheet Page 27 of 28
3901080001
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
11. Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2005 Melexis NV. All rights reserved.
.
For the latest version of this document. Go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe and Japan: All other locations:
Phone: +32 1367 0495 Phone: +1 603 223 2362
E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com
ISO/TS16949 and ISO14001 Certified
MLX80001 – Datasheet Page 28 of 28
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March 2007
Rev 001
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