Meet MS WMBM1 User Manual

Features

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128KB memory: 64KB RAM and 64KB ROM

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Bluetooth® v4.0 specification

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-92.5dBm Bluetooth low energy receive sensitivity

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Support for Bluetooth v4.0 specification host stack including ATT, GATT, SMP, L2CAP, GAP

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RSSI monitoring for proximity applications

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<600nA current consumption in dormant mode

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32kHz and 16MHz crystal or system clock

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Switch-mode power supply

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Programmable general purpose PIO controller

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10-bit ADC

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12 digital PIOs

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3 analogue AIOs

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UART

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I²C / SPI for EEPROM / flash memory ICs and peripherals

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Debug SPI

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4 PWM modules

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Wake-up interrupt and watchdog timer

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QFN 32-lead, 5 x 5 x 0.6mm, 0.5mm pitch

CSR μEnergy® CSR1010™ QFN

Bluetooth low energy Single-mode IC

Production Information

CSR1010A05

Issue 3

CSR1010 QFN

General Description

CSR1010 QFN is a CSR µEnergy platform device. CSR µEnergy are CSR's single-mode Bluetooth low energy products for the Bluetooth Smart market. CSR1010 QFN increases application code and data space for greater application development flexibility.

CSR μEnergy enables ultra low-power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. The CSR μEnergy platform provides everything required to create a Bluetooth low energy product with RF, baseband, MCU, qualified Bluetooth v4.0 stack and customer application running on a single IC.

16MHz

32k Hz

Bluetooth LE

Radio and Modem

MCU

ROM

Clock

Generation

I/O

UART

LED P WM

PIO

AIO

DebugRAM

I2C / SPI

Applications

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Building an ecosystem using Bluetooth low energy

CSR is the industry leader for Bluetooth low energy, also known as Bluetooth Smart. Bluetooth Smart enables connectivity and data transfer to leading smartphone, tablet and personal computing devices including Apple iPhone, iPad, iPod and Mac products and leading Android devices.

Bluetooth low energy takes less time to make a connection than conventional Bluetooth wireless technology and can consume approximately 1/20th of the power of Bluetooth Basic Rate. CSR1010 QFN supports profiles for health and fitness sensors, watches, keyboards, mice and remote controls.

Typical Bluetooth Smart applications:

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HID: keyboards, mice, touchpads, remote controls

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Sports and fitness sensors: heart rate, runner speed and cadence, cycle speed and cadence

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Health sensors: bloo d p ressure, thermometer and glucose meters

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Mobile accessories: watches, proximity tags, alert tags and camera controls

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Smart home: heating control and lighting control

Data Sheet

Production Information © Cambridge Silicon Radio Limited 2012 This material is subject to CSR's non-disclosure agreement

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Ordering Information

Device

Type Size

Package

Shipment

Method

Order Number

CSR1010 QFN

Note:

The minimum order quantity is 2kpcs taped and reeled.

Supply chain: CSR's manufacturing policy is to multisource volume products. For further details, contact your local sales account manager or representative.

QFN‑32-lead

(Pb free)

5 x 5 x 0.6mm

0.5mm pitch

Tape and reel CSR1010A05-IQQM-R

CSR1010 QFN Development Kit Ordering Information

Description Order Number

CSR1010 QFN Development Kit example design DK-CSR1010-10138-1A

Contacts

General information Information on this product Customer support for this product Details of compliance and standards Help with this document

www.csr.com Sales@csr.com www.csrsupport.com Product.compliance@csr.com Comments@csr.com

CSR1010 QFN

Data Sheet

Production Information © Cambridge Silicon Radio Limited 2012 This material is subject to CSR's non-disclosure agreement

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Device Details

Bluetooth Radio

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On-chip balun (50Ω impedance in TX and RX modes)

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No external trimming is required in production

■

Bluetooth v4.0 specification compliant

Bluetooth Transmitter

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No external power amplifier or TX/RX switch required

Bluetooth Receiver

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-92.5dBm sensitivity

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Integrated channel filters

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Digital demodulator for improved sensitivity and cochannel rejection

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Fast AGC for enhanced dynamic range Bluetooth Stack CSR's protocol stack runs on the integrated MCU:

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Support for Bluetooth v4.0 specification features:

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Master and slave operation

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Including encryption

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Software stack in firmware includes:

■

GAP

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L2CAP

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Security manager

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Attribute protocol

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Attribute profile

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Bluetooth low energy profile support

Synthesiser

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Fully integrated synthesiser requires no external VCO varactor diode, resonator or loop filter

Baseband and Software

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Hardware MAC for all packet types enables packet handling without the need to involve the MCU

Physical Interfaces

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SPI master interface

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SPI programming and debug interface

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I²C

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Digital PIOs

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Analogue AIOs

■

UART

Auxiliary Features

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Battery monitor

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Power management features include software shutdown and hardware wake-up

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CSR1010 QFN can run in low power modes from an external 32.768kHz clock signal

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Integrated switch-mode power supply

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Linear regulator (internal use only)

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Power-on-reset cell detects low supply voltage

Package

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32-lead 5 x 5 x 0.6mm, 0.5mm pitch QFN

CSR1010 QFN

Data Sheet

Production Information © Cambridge Silicon Radio Limited 2012 This material is subject to CSR's non-disclosure agreement

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Functional Block Diagram

Wake-up

I2C EEPROM

SPI Serial Flash

AES-CCS and

AES Encryption

I2C / SPI Serial Flash

I2C / SPI

Serial Flash

Control State Machine

DMA

Bluetooth Radio

Blutetooth LE Modem

and LC

RAM Arbiter

RAM 64KB

Memory

Protection

XTAL_16M XTAL_32K

Clock Generation

I/O

UART

PIO and LED

PWM

AUX / CLK /

PSU Control

PIO

VDD_PADS

CSR1010 QFN

Data Sheet

Production Information © Cambridge Silicon Radio Limited 2012 This material is subject to CSR's non-disclosure agreement

ROM

Debug

MCU

Interrupt

Debug

Timer

DataCode

SMPULDO

VDDREG_IN

VDD_BAT

G-TW-0005362.7.2

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Document History

Revision Date Change Reason

1 21 SEP 12 Original publication of this document.

2 23 OCT 12 Updated to Production Information.

3 20 NOV 12

Update to CSR µEnergy® branding.

CSR1010 QFN

Data Sheet

Production Information © Cambridge Silicon Radio Limited 2012 This material is subject to CSR's non-disclosure agreement

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Status Information

The status of this Data Sheet is Production Information.

CSR Product Data Sheets progress according to the following format:

Advance Information

Information for designers concerning CSR product in development. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values.

All detailed specifications including pinouts and electrical specifications may be changed by CSR without notice.

Pre-production Information

Pinout and mechanical dimension specifications finalised. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values.

All electrical specifications may be changed by CSR without notice.

Production Information

Final Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications.

Production Data Sheets supersede all previous document versions.

Life Support Policy and Use in Safety-critical Applications

CSR's products are not authorised for use in life-support or safety-critical applications. Use in such applications is done at the sole discretion of the customer. CSR will not warrant the use of its devices in such applications.

CSR Green Semiconductor Products and RoHS Compliance

CSR1010 QFN devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS).

CSR1010 QFN devices are also free from halogenated or antimony trioxide-based flame retardants and other hazardous chemicals. For more information, see CSR's

Semiconductor Products

Trademarks, Patents and Licences

Unless otherwise stated, words and logos marked with affiliates. Bluetooth CSR. Other products, services and names used in this document may have been trademarked by their respective owners.

The publication of this information does not imply that any license is granted under any patent or other rights owned by CSR plc and/or its affiliates.

CSR reserves the right to make technical changes to its products as part of its development programme.

While every care has been taken to ensure the accuracy of the contents of this document, CSR cannot accept responsibility for any errors.

Refer to www.csrsupport.com for compliance and conformance to standards information.

and the Bluetooth ® logos are trademarks owned by Bluetooth ® SIG, Inc. and licensed to

Environmental Compliance Statement for CSR Green

™

or ® are trademarks registered or owned by CSR plc or its

CSR1010 QFN

Data Sheet

Production Information © Cambridge Silicon Radio Limited 2012 This material is subject to CSR's non-disclosure agreement

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Contents

Ordering Information ....................................................................................................................................... 2

CSR1010 QFN Development Kit Ordering Information ......................................................................... 2

Contacts ................................................................................................................................................. 2

Device Details ................................................................................................................................................. 3

Functional Block Diagram .............................................................................................................................. 4

1 Package Information ..................................................................................................................................... 10

1.1 Pinout Diagram .................................................................................................................................... 10

1.2 Device Terminal Functions .................................................................................................................. 11

1.3 Package Dimensions ........................................................................................................................... 14

1.4 PCB Design and Assembly Considerations ......................................................................................... 15

1.5 Typical Solder Reflow Profile ............................................................................................................... 15

2 Bluetooth Modem .......................................................................................................................................... 16

2.1 RF Ports ............................................................................................................................................... 16

2.2 RF Receiver ......................................................................................................................................... 16

2.2.1 Low Noise Amplifier ............................................................................................................... 16

2.2.2 RSSI Analogue to Digital Converter ....................................................................................... 16

2.3 RF Transmitter ..................................................................................................................................... 16

2.3.1 IQ Modulator .......................................................................................................................... 16

2.3.2 Power Amplifier ...................................................................................................................... 16

2.4 Bluetooth Radio Synthesiser ............................................................................................................... 16

2.5 Baseband ............................................................................................................................................. 16

2.5.1 Physical Layer Hardware Engine ........................................................................................... 16

3 Clock Generation .......................................................................................................................................... 17

3.1 Clock Architecture ................................................................................................................................ 17

3.2 Crystal Oscillator: XTAL_16M_IN and XTAL_16M_OUT ..................................................................... 17

3.2.1 Crystal Specification ............................................................................................................... 18

3.2.2 Frequency Trim ...................................................................................................................... 18

3.3 Sleep Clock .......................................................................................................................................... 19

3.3.1 Crystal Specification ............................................................................................................... 19

4 Microcontroller, Memory and Baseband Logic ............................................................................................. 20

4.1 System RAM ........................................................................................................................................ 20

4.2 Internal ROM ...................................................................................................................................... 20

4.3 Microcontroller ............................................

4.4 Programmable I/O Ports, PIO and AIO ................................................................................................ 20

4.5 LED Flasher / PWM Module ................................................................................................................ 21

5 Serial Interfaces ............................................................................................................................................ 22

5.1 Application Interface ............................................................................................................................ 22

5.1.1 UART Interface ...................................................................................................................... 22

5.2 I²C Interface ......................................................................................................................................... 22

5.3 SPI Master Interface ............................................................................................................................ 23

5.4 Programming and Debug Interface ...................................................................................................... 24

5.4.1 Instruction Cycle ..................................................................................................................... 24

5.4.2 Multi-slave Operation ............................................................................................................. 25

6 Power Control and Regulation ...................................................................................................................... 26

......................................................................................... 20

CSR1010 QFN

Data Sheet

Production Information © Cambridge Silicon Radio Limited 2012 This material is subject to CSR's non-disclosure agreement

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6.1 Switch-mode Regulator ....................................................................................................................... 26

6.2 Low-voltage VDD_DIG Linear Regulator ............................................................................................. 26

6.3 Reset ................................................................................................................................................... 26

6.3.1 Digital Pin States on Reset .................................................................................................... 27

6.3.2 Power-on Reset ..................................................................................................................... 27

7 Example Application Schematic ................................................................................................................... 28

8 Electrical Characteristics .............................................................................................................................. 29

8.1 Absolute Maximum Ratings ................................................................................................................. 29

8.2 Recommended Operating Conditions .................................................................................................. 29

8.3 Input/Output Terminal Characteristics ................................................................................................. 30

8.3.1 Switch-mode Regulator .......................................................................................................... 30

8.3.2 Low-voltage Linear Regulator ................................................................................................ 31

8.3.3 Digital Terminals .................................................................................................................... 31

8.3.4 AIO ......................................................................................................................................... 32

8.4 ESD Protection .................................................................................................................................... 32

9 Current Consumption .................................................................................................................................... 33

10 CSR Green Semiconductor Products and RoHS Compliance ..................................................................... 34

11 CSR1010 QFN Software Stack .................................................................................................................... 35

12 Tape and Reel Information ........................................................................................................................... 36

12.1 Tape Orientation .................................................................................................................................. 36

12.2 Tape Dimensions ................................................................................................................................. 37

12.3 Reel Information .................................................................................................................................. 38

12.4 Moisture Sensitivity Level .................................................................................................................... 38

13 Document References .................................................................................................................................. 39

Terms and Definitions ............................................................................................................................................ 40

CSR1010 QFN

Data Sheet

List of Figures

Figure 1.1 Pinout Diagram ............................................................................................................................... 10

Figure 3.1 Clock Architecture ........................................................................................................................... 17

Figure 3.2 Crystal Driver Circuit ....................................................................................................................... 17

Figure 3.3 Sleep Clock Crystal Driver Circuit ................................................................................................... 19

Figure 4.1 Baseband Digits Block Diagram ...................................................................................................... 20

Figure 5.1 Example of an I²C Interface EEPROM Connection ......................................................................... 23

Figure 5.2 Memory Boot-up Sequence ............................................................................................................ 24

Figure 6.1 Voltage Regulator Configuration ..................................................................................................... 26

Figure 11.1 Software Architecture ...................................................................................................................... 35

Figure 12.1 Tape Orientation ............................................................................................................................. 36

Figure 12.2 Tape Dimensions ............................................................................................................................ 37

Figure 12.3 Reel Dimensions ............................................................................................................................. 38

List of Tables

Table 3.1 Crystal Specification ......................................................................................................................... 18

Table 3.2 Sleep Clock Specification ................................................................................................................. 19

Table 4.1 Wake Options for Sleep Modes ........................................................................................................ 21

Table 5.1 Possible UART Settings ................................................................................................................... 22

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Table 5.2 SPI Master Serial Flash Memory Interface ....................................................................................... 23

Table 5.3 Instruction Cycle for a SPI Transaction ............................................................................................ 25

Table 6.1 Pin States on Reset .......................................................................................................................... 27

Table 6.2 Power-on Reset ................................................................................................................................ 27

Table 8.1 ESD Handling Ratings ...................................................................................................................... 32

Table 9.1 Current Consumption ....................................................................................................................... 33

CSR1010 QFN

Data Sheet

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1 Package Information

1.1 Pinout Diagram

Orientation from Top of Device

2526272829303132

9 101112 141516

CSR1010 QFN

Data Sheet

G-TW-0005350.5.2

Figure 1.1: Pinout Diagram

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1.2 Device Terminal Functions

Radio Lead Pad Type Supply Domain Description

(b)

(a)

Bluetooth transmitter / receiver.

Drive for crystal.

I²C data input / output or SPI serial flash data output (SF_DOUT). If connecting to SPI serial flash, connect this pin to SO on the serial flash. See Section 5.3.

RF 7 RF

(a)

The VDD_RADIO domain is generated from VDD_REG_IN, see Figure 6.1.

Synthesiser and Oscillator

XTAL_32K_OUT 2 Analogue VDD_BAT Drive for sleep clock crystal.

XTAL_32K_IN 3 Analogue VDD_BAT 32.768kHz sleep clock input.

XTAL_16M_OUT 9 Analogue

XTAL_16M_IN 10 Analogue VDD_ANA Reference clock input.

(b)

The VDD_ANA domain is generated from VDD_REG_IN, see Figure 6.1.

I²C Interface Lead Pad Type Supply Domain Description

I2C_SDA 29

Lead Pad Type Supply Domain Description

Bidirectional, tristate, with weak internal pull-up

VDD_RADIO

VDD_ANA

VDD_PADS

CSR1010 QFN

Data Sheet

I2C_SCL 28

PIO Port Lead Pad Type Supply Domain Description

PIO[11] 25

PIO[10] 24

PIO[9] 23

Input with weak internal pull-up

Bidirectional with programmable strength internal pullup/down

VDD_PADS

VDD_PADS Programmable I/O line.

I²C clock or SPI serial flash clock output (SF_CLK), see Section 5.3.

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PIO Port Lead Pad Type Supply Domain Description

PIO[8] / DEBUG_MISO

PIO[7] / DEBUG_MOSI

PIO[6] / DEBUG_CS#

PIO[5] / DEBUG_CLK

PIO[4] / SF_CS#

PIO[3] / SF_DIN

PIO[2] 27

Bidirectional with programmable strength internal pullup/down

Programmable I/O line or debug SPI MISO selected by SPI_PIO#.

Programmable I/O line or debug SPI MOSI selected by SPI_PIO#.

VDD_PADS

VDD_PADS Programmable I/O line or I²C power.

Programmable I/O line or debug SPI chip select (CS#) selected by SPI_PIO#.

Programmable I/O line or debug SPI CLK selected by SPI_PIO#.

Programmable I/O line or SPI serial flash chip select (SF_CS#), see Section 5.3.

Programmable I/O line or SPI serial flash data (SF_DIN) input. If connecting to SPI serial flash, this pin connects to SI on the serial flash. See Section 5.3.

CSR1010 QFN

Data Sheet

PIO[1] / UART_RX

PIO[0] / UART_TX

AIO[2] 11

AIO[0] 13

(c)

The VDD_AUX domain is generated from VDD_REG_IN, see Figure 6.1.

Test and Debug Lead Pad Type Supply Domain Description

SPI_PIO# 26

Bidirectional with programmable strength internal pullup/down

14 Programmable I/O line or UART TX.

Bidirectional analogue

Input with strong internal pull-down

VDD_PADS

VDD_AUX

VDD_PADS Selects SPI debug on PIO[8:5].

(c)

Programmable I/O line or UART RX.

Analogue programmable I/O line.AIO[1] 12

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Wake-up Lead Pad Type Supply Domain Description

Input has no internal

WAKE 4

pull-up or pull-down, use external pulldown.

VDD_BAT

Input to wake CSR1010 QFN from hibernate or dormant.

Power Supplies and Control

VDD_BAT 1 Battery input and regulator enable (active high).

VDD_BAT_SMPS 32 Input to high-voltage switch-mode regulator.

SMPS_LX 31 High-voltage switch-mode regulator output.

VDD_CORE 5, 30 Positive supply for digital domain.

VDD_PADS 21 Positive supply for all digital I/O ports PIO[11:0].

VDD_REG_IN 6

VDD_XTAL 8 Decouple with 470nF capacitor to ground.

VSS Exposed pad Ground connections.

Lead Description

Positive supply for Bluetooth radio and digital linear regulator.

CSR1010 QFN

Data Sheet

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