Infrared reflow oven MR10 2
Contents
1. GENERAL DESCRIPTION ..................................................................................................................................3
1.1. TECHNICAL DATA ..............................................................................................................................................3
2. INSTALLATION ....................................................................................................................................................4
3. CONTROL SYSTEM .............................................................................................................................................5
3.1. CONTROL PANEL................................................................................................................................................5
4. SOLDERING PARAMETERS SETUP ................................................................................................................8
4.1. MANUAL PROFILE SETUP ...................................................................................................................................8
4.1.1. Heater Profile Setup ..................................................................................................................................8
4.1.2. Time Setup .................................................................................................................................................9
4.2. AUTO PROFILING (MR10A ONLY)......................................................................................................................9
5. EXAMPLE FOR SOLDERING PROFILES SETUP........................................................................................11
6. MALFUNCTIONS / ERROR MESSAGES ........................................................................................................12
7. LIST OF SPARE PARTS .....................................................................................................................................13
8. ELECTRICAL DIAGRAM .................................................................................................................................14
Infrared reflow oven MR10
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pcb
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pcb transport
........................
power
..............
power supply
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...........
...
1. General Description
Mechatronika’s infrared reflow oven MR10 ca be used for hardening glue spots as well as for the
soldering process on surface mounted printed circuits boards. MR10 controls the process according to previously defined time/temperature profiles, after the PCB has been feeded into transport
frame.
The transport frame goes through 3 (4) processing sections:
• initial preheating area
• preheating area
• soldering area
• dwell area (for lead free process)
After pressing the START-key the transport frame brings the PCB into the initial preheating
area (soldering area), leaving it for TF seconds there while the PCB reaches it's preheating temperature TP1.Then the transport frame travels into preheating and stays at this temperature for TP
seconds. So the PCB can reach TP2 temperature, where the volatile components of solder paste
vaporise out. Then the transport frame travels into reflow area to melt the solder paste into solid
connections (reflow temperature TR for TR seconds). For lead free process transport frame travels
back to preheating for TD seconds to create plateau. The soldering process ends with cooling the
PCB down, the transport frame will run into its original position, while a optional fan is activated
for TC seconds. Separating the soldering process into four explicitly definable phases with microprocessor control and auto profiling system, the PID control and the precise stepper-motordriven transport system realise a highly accurate soldering process control.
1.1. Technical Data
size
170x270 mm
transport frame, moving back to feeding position after soldering process
heating elements ............... 0,7kW and 1,3kW far infrared heater
control............................... microprocessor, PID-control, 12 soldering profiles
consumption
2kW max, average cycle power 1,4kW
230V±10%; 50Hz
dimensions (l x w x h)
weight................................
900x520x350mm
45kg
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2. Installation
The reflow oven MR10 should be installed according to fig.2 and can be connected to used air
flue with fan, which is to be wired to one of the plugs in the rear panel of the machine. So the fan
is activated only in the cooling phase of the soldering process. The reflow oven doesn't need any
maintenance. If performance of heaters drops, check whether the fuses in the rear panel of the
machine are intact and change in case of damage.
Fig.2: Installation of MR10
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3. Control system
Fig.3 shows the functional blocks of MR10’s control system:
Fig.3: MR10 control systems
3.1. Control Panel
Control panel contains the following functional elements:
· Main switch
· LCD display
· Keyboard
· Temperature probe plug
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Fig.4: MR10 control panel
The following information are shown on LCD-display:
· soldering profile number
· soldering parameters belonging to this profile
· actual soldering phase
· with auto profiling system: actual soldering temperature on pcb
The keyboard has the following functions:
PROFILE................... chooses number of soldering profile
TIME ......................... time setup for all soldering phases (F/P/R/D/C)
TEMP......................... temperature setup for all soldering phases (P/R)
(-) ............................... reduces value of parameter on display
(+) ............................... increases value of parameter on display
ENTER....................... stores parameter on display to memory
if pressed during soldering process: stops actual process and starts next
one
START........................starts soldering process
STOP.......................... stops actual sequence of soldering process and moves
transport frame to feeding position
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if pressed during parameter setup process: display shows the actual temperature of heaters
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Tp
Tr
t tt t
t
F
P R D
C
Process
process
P1
P2
T
T
4. Soldering parameters setup
The following parameters can be defined for the different soldering profiles:
Process time:
F ..... initial preheating time
P ..... preheating time
R..... reflow time
D .....dwell time
C..... cooling time
Process temperatures:
P ..... preheating heater temperature
R..... reflow heater temperature
Fig.5: soldering profile
4.1. Manual Profile Setup
For manual setup of soldering process the temperatures of both heater areas and the times, the
pcb will stay in them, have to be defined as follows:
4.1.1. Heater Profile Setup
For heater temperature setup proceed as follows:
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Action, Key
Action, key
display
System answer
→ press PROFILE key until number of profile to be altered is shown
→ press TEMP key
LCD shows actual temperature setup for P-
area
→ press (+) or (-) key until right value is
shown on display
→ press ENTER key
previously defined setup parameters are
stored to memory
→ press TEMP key
LCD display proceeds to temperature setup
for R-area
→ adjust display value with (+) and (-) key
→ press ENTER key
4.1.2. Time Setup
For time setup proceed as follows:
System answer
→ press PROFILE key until LCD-
shows the number of the profile to be altered
→ press TIME key
LCD display shows actual time setup (first
for phase F)
→ press (+) or (-) key until right value is
shown on display
→ press ENTER key
previously defined setup parameters are
stored to memory
→ press TIME key
LCD display shows actual time setup for
next phase (P)
...procedure continues as before for all soldering phases.
4.2. Auto Profiling (MR10A only)
Auto profiling mode measures the actual temperature on PCB and compares it with the desired
value, thus determining, how long the PCB has to stay in the single heating areas. The actual
temperature is measured with means of an temperature probe plugged into the control panel of
MR10A, whose active end is fixed to the PCB while running through soldering process.
Before auto profiling mode both heater area temperatures have to be defined according to 4.1.1.
Then proceed as follows:
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Action, key
LCD shows actual temperature setup for Tpl
System answer
→ press PROFILE key to reach desired
number of the profile
→ press ENTER key for several seconds
desired profile number
profile setup
→ press TEMP key
(starting temperature for heating proc-
ess)
→ adjust right value by pressing (-) or (+)
key
→ press ENTER key
stores adjusted value to memory
...procedure continues as before for defining the other profile temperatures TP2 (end of heating
process), TR (reflow temperature) and TC (cooling temperature).
→ press START
The transport frame goes into the heating
areas; control system displays actual time
and measured temperature on the PCB. On
the end control system displays 4 measured
times.
→ press ENTER for memorise measured
time intervals or STOP to skip them
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5. Example for soldering profiles setup
The following setup parameters should only be the starting point for further tests to reach solid
soldering joints:
Standard solder paste
temperature
TP=180°C tF=15s
TR=420°C
Lead free solder paste
temperature
TP=190°C tF=0s
TR=430°C
time
tP=180s
tR=25s
tD=0s
tC=30s
time
tP=150 -180s
tR=30s
tD=20s
tC=30s
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6. Malfunctions / error messages
6.1 Malfunctions
Machine does not start after switch-on
– Check power connection
– Check fuses on the rear side of the oven
NOT READY message on the display after pressing START key
– The heaters didn't reach programmed temperatures; press STOP key to terminate Start com-
mand or wait for readiness of the heaters
– If NOT READY message displays longer than 1 hour check the fuses; if fuses are good con-
tact with service
6.2 Error messages on the display
Message
POSITIONING ERROR
INITIALIZATION ERROR
OPEN TERMOCOUPLE
ERROR EEPROM
Meaning
Stepper motor miss the position during positioning; if message displays several times
contact with service for cleaning positioning system
Transport frame didn't reach Home position in programmed time; if motor didn't
start check fuses; if transport frame starts,
but moves badly contact with service for
cleaning positioning system
Contact with service for thermocouple
changing
Eeprom content corrupted; contact with
service for advice
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7. List of spare parts
1. Thermocouple for heaters MR10.100
2. Thermocouple for auto profiling MR10.105
3. Heater for preheating area MR10.110
4. Heater for soldering (reflow) area MR10.120
5. Control board MR10.200
6. Contactor (relay) MR10.210
7. Keyboard / display assembly MR10.220
8. Motor assembly MR10.230
9. Fan MR10.240
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8. Electrical diagram
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