A12
A16
27C1512T
512Kb (32K x 16-bit)
OTP EPROM MCM
A5
A9
X-Decoder
1024 x 512
Memory Matrix
FEATURES:
• 32K x 16 Bit OTP EPROM organization
•R
AD-PAK® radiation-hardened against natural space radia-
tion
• Total dose hardness:
- > 100 Krad (Si), depending upon space mission
• Excellent Single Event Effects:
- SEL
LET: > 80 MeV/mg/cm
TH
- SEUTH LET: > 80 Mev/mg/cm
• Package:
- 40 pin R
AD-PAK DIP
• Low power consumption:
- Active mode: 500 mW @ 10 MHz
- Standby mode: < 11 mW
• High speed page and word programming:
- Page programming time: 14 sec (typ)
• Programming power supply:
- V
= 12.5 V ± 0.3 V
PP
• One-time Programmable
• Pin Arrangement
- Flash memory and mask ROM compatible
2
2
I/O0
I/O7
PGM
CE
OE
V
CC
V
PP
V
SS
H
Input
Data
Control
: High Threshold Inverter
H
Y-Gating
Y-Decoder
A0-A4 A10-A11
Logic Diagram
DESCRIPTION:
Maxwell Technologies’ 27C1512T high density 512K OneTime
Programmable Electrically Programmable Read Only Memory
multi-chip module (MCM) features a greater than 100 krad (Si)
total dose tolerance, depending upon space mission. The
27C1512T features fast address times and low power dissipation. The 27C1512T offers high speed programming using
page programming mode. The 27C1512T is offered in
JEDEC-Standard Byte-Wide EPROM pinouts, which allows
socket replacement with flash memory and mask ROMs.
Maxwell Technologies' patented R
ogy incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing
the required radiation shielding for a lifetime in orbit or space
mission. In a GEO orbit, R
krad (Si) radiation dose tolerance. This product is available
with screening up to Class K.
AD-PAK® packaging technol-
AD-PAK provides greater than 100
Memory
1000569
(858) 503-3300- Fax: (858) 503-3301- www.maxwell.com
12.19.01 Rev 2
All data sheets are subject to change without notice
©2001 Maxwell Technologies
All rights reserved.
1
512Kb (32K x 16-bit) - OTP EPROM MCM
TABLE 1. 27C1512T PINOUT DESCRIPTION
PIN SYMBOL DESCRIPTION
21-29, 31-36 A0 - A14 Address
19-12, 10-3 I/O0 - I/O15 Input/Output
27C1512T
2
20
40 V
1V
30 V
39
CE Chip Enable
OE Output Enable
CC
PP
SS
Power Supply
Programming Supply
Ground
PGM Programming Enable
37, 38 NC No Connection
TABLE 2. 27C1512T ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL MIN MAX UNIT
Supply Voltage
Programming Voltage
All Input and Output Voltage
A9 Voltage
Operating Temperature Range T
Storage Temperature Range T
1
1
1,2
2
V
CC
V
PP
, V
V
IN
OUT
V
ID
OPR
STG
-0.6 7.0 V
-0.6 13.5 V
-0.6 7.0 V
-0.6 13.0 V
-55 +125 °C
-65 +150 °C
Memory
1. Relative to VSS.
2. VIN, V
, and VID min = -1.0V for pulse width < 20 ns.
OUT
TABLE 3. 27C1512T RECOMMENDED OPERATING CONDITIONS
PARAMETER SYMBOL MIN MAX UNITS
Supply Voltage V
Input Voltage V
Thermal Impedance
Operating Temperature Range T
1000569
12.19.01 Rev 2
CC
IL
V
IH
Θ
JC
OPR
All data sheets are subject to change without notice
4.5 5.5 V
-0.3 0.8 V
2.2 VCC +0.3 V
-- 1.23 °C/W
-55 +125
©2001 Maxwell Technologies.
All rights reserved.
°
C
2
512Kb (32K x 16-bit) - OTP EPROM MCM
27C1512T
TABLE 4. 27C1512T CAPACITANCE
ARAMETER SYMBOL MIN MAX UNIT
P
Input Capacitance C
Output Capacitance C
1. VIN = V
2. T
A
= 0V.
OUT
= 25 oC, f = 1 MHz.
OUT
1,2, 3
IN
-- 10 pF
-- 15 pF
3. Guaranteed by design.
TABLE 5. 27C1512T MODE SELECTION
ODE V
M
R
EAD V
OUTPUT DISABLE V
S
TANDBY V
P
ROGRAM V
PROGRAM VERIFY V
PAGE DATA LATCH V
PAGE PROGRAM V
P
ROGRAM INHIBIT V
I
DENTIFIER V
PP
CC
CC
CC
PP
PP
PP
PP
CC
V
PP
V
PP
V
PP
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
SS
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
CE OE PGM A
V
IL
V
IL
V
IH
V
IL
V
IL
V
IH
V
IH
V
IL
V
IL
V
IH
V
IH
V
IL
1,2
0
V
IL
V
IH
V
PP
V
IH
XD
X High-Z
X X X High-Z
V
IH
V
IL
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IL
V
IH
V
IH
V
IL
V
IL
V
IH
V
IL
V
IH
V
IH
XD
XD
XD
X High-Z
X High-Z
X High-Z
X High-Z
X High-Z
V
IH
I/O
OUT
Memory
IN
OUT
IN
ID
1. X = Don’t care.
2. 11.5V <
1000569
VIN < 12.5V.
12.19.01 Rev 2
All data sheets are subject to change without notice
©2001 Maxwell Technologies.
All rights reserved.
3
512Kb (32K x 16-bit) - OTP EPROM MCM
27C1512T
TABLE 6. 27C1512T DC ELECTRICAL CHARACTERISTICS FOR READ OPERATION
(VCC = 5V ±10%, VPP = VSS, TA = -55 TO +125°C, UNLESS OTHERWISE SPECIFIED)
P
ARAMETER TEST CONDITION SYMBOL MIN TYP MAX UNIT
Input Leakage Current VIN = 5.5V
V
@ 0V
IN
Output Leakage Current
High
Low
Standby V
Operating V
V
Current VPP = 5.5V I
PP
Current CE = V
CC
Current I
CC
V
= 5.5V
OUT
V
= 0.45V
OUT
IH
= 0 mA, CE = V
OUT
I
= 0 mA, f = 5 MHz I
OUT
I
= 0 mA, f = 10 MHz I
OUT
IL
Input Voltage V
Output Voltage I
= -800 µA V
OH
I
= 4.2 mA V
OL
TABLE 7. 27C1512T AC ELECTRICAL CHARACTERISTICS FOR READ OPERATION
(VCC = 5V + 10%, VPP = VSS, TA = -55 TO +125°C, UNLESS OTHERWISE SPECIFIED)
I
V
I
I
I
OH
I
I
CC1
CC2
CC3
PP1
LI
LI
-4
--
OL
SB
-4.0
-- -- 2 mA
--
--
--
2
--
µA
µA
µA
4
--
-- -- 60 mA
-- -- 60
-- -- 100
-- 1 40 µA
IH1
IL1
OH
OL
2.2----V
-- -- 0.8
2.4----V
-- -- 0.45
Memory
1
P
ARAMETER TEST CONDITION SYMBOL MIN MAX UNIT
Address Access Time CE = OE = V
Chip Enable Access Time OE
Output Enable Access TIme CE
Output Hold to Address Change CE
Output Disable to High-Z
2
= V
= V
= V
CE
= OE = V
IL
IL
IL
IL
IL
t
ACC
t
t
t
t
OH
CE
OE
DF
-- 200 ns
-- 200 ns
-- 70 ns
0--ns
050ns
1. Test conditions:
- Input pulse levels 0.45V/2.4V
- Input rise and fall times < 10 ns
- Output load 1 TTL gate + 100pF (including scope and jig)
- Referenced levels for measuring timing0.8V/2.0V
2. tDF is defined as the time at which the output becomes an open circuit and data is no longer driven.
1000569
12.19.01 Rev 2
All data sheets are subject to change without notice
4
©2001 Maxwell Technologies.
All rights reserved.