The MAX1908/MAX8724/MAX8765/MAX8765A highly
integrated, multichemistry battery-charger control ICs
simplify the construction of accurate and efficient chargers. These devices use analog inputs to control charge
current and voltage, and can be programmed by the host
or hardwired. The MAX1908/MAX8724/MAX8765/
MAX8765A achieve high efficiency using a buck topology
with synchronous rectification.
The MAX1908/MAX8724/MAX8765/MAX8765A feature
input current limiting. This feature reduces battery
charge current when the input current limit is reached
to avoid overloading the AC adapter when supplying
the load and the battery charger simultaneously. The
MAX1908/MAX8724/MAX8765/MAX8765A provide outputs to monitor current drawn from the AC adapter (DC
input source), battery-charging current, and the presence of an AC adapter. The MAX1908’s conditioning
charge feature provides 300mA to safely charge deeply
discharged lithium-ion (Li+) battery packs.
The MAX1908 includes a conditioning charge feature
while the MAX8724/MAX8765/MAX8765A do not.
The MAX1908/MAX8724/MAX8765/MAX8765A charge two
to four series Li+ cells, providing more than 5A, and are
available in a space-saving, 28-pin, thin QFN package (5mm
× 5mm). An evaluation kit is available to speed designs.
Applications
Notebook and Subnotebook Computers
Personal Digital Assistants
Handheld Terminals
Features
o ±0.5% Output Voltage Accuracy Using Internal
Reference (±0.4% for MAX8765A, 2-/3-Cell Only)
o ±4% Accurate Input Current Limiting
o ±5% Accurate Charge Current
o Analog Inputs Control Charge Current and
Charge Voltage
o Outputs for Monitoring
Current Drawn from AC Adapter
Charging Current
AC Adapter Presence
= 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DCIN, CSSP, CSSN, ACOK to GND.......................-0.3V to +30V
BST to GND ............................................................-0.3V to +36V
BST to LX..................................................................-0.3V to +6V
DHI to LX...................................................-0.3V to (V
BST
+ 0.3V)
LX to GND .................................................................-6V to +30V
BATT, CSIP, CSIN to GND .....................................-0.3V to +20V
CSIP to CSIN or CSSP to CSSN or
PGND to GND ....................................................-0.3V to +0.3V
CCI, CCS, CCV, DLO, ICHG,
IINP, ACIN, REF to GND.......................-0.3V to (V
LDO
+ 0.3V)
DLOV, VCTL, ICTL, REFIN, CELLS, CLS,
LDO, SHDN to GND .............................................-0.3V to +6V
DLOV to LDO.........................................................-0.3V to +0.3V
DLO to PGND .........................................-0.3V to (V
1DCINCharging Voltage Input. Bypass DCIN with a 1µF capacitor to PGND.2LDOD evi ce P ow er S up p l y. Outp ut of the 5.4V l i near r eg ul ator sup p l i ed fr om D C IN . Byp ass w i th a 1µF cap aci tor to GN D .3CLSSource Current-Limit Input. Voltage input for setting the current limit of the input source.4REF4.096V Voltage Reference. Bypass REF with a 1µF capacitor to GND.5CCSInput-Current Regulation Loop-Compensation Point. Connect a 0.01µF capacitor to GND.6CCIOutput-Current Regulation Loop-Compensation Point. Connect a 0.01µF capacitor to GND.7CCVVoltage Regulation Loop-Compensation Point. Connect 1kΩ in series with a 0.1µF capacitor to GND.
8SHDN
9ICHG
10ACINAC Detect Input. Input to an uncommitted comparator. ACIN can be used to detect AC-adapter presence.11ACOKAC Detect Output. High-voltage open-drain output is high impedance when V12REFINReference Input. Allows the ICTL and VCTL inputs to have ratiometric ranges for increased accuracy.
13ICTL
14GNDAnalog Ground
15VCTL
16BATTBattery Voltage Input17CELLSCell Count Input. Tri-level input for setting number of cells. GND = 2 cells, open = 3 cells, REFIN = 4 cells.18CSINOutput Current-Sense Negative Input19CSIPOutput Current-Sense Positive Input. Connect a current-sense resistor from CSIP to CSIN.20PGNDPower Ground21DLOLow-Side Power MOSFET Driver Output. Connect to low-side nMOS gate.22DLOVLow-Side Driver Supply. Bypass DLOV with a 1µF capacitor to GND.23LXHigh-Side Power MOSFET Driver Power-Return Connection. Connect to the source of the high-side nMOS.24BSTHigh-Side Power MOSFET Driver Power-Supply Connection. Connect a 0.1µF capacitor from LX to BST.25DHIHigh-Side Power MOSFET Driver Output. Connect to high-side nMOS gate.26CSSNInput Current-Sense Negative Input27CSSPInput Current-Sense Positive Input. Connect a current-sense resistor from CSSP to CSSN.
28IINP
Shutdown Control Input. Drive SHDN logic low to shut down the MAX1908/MAX8724/MAX8765 MAX8765A.
Use with a thermistor to detect a hot battery and suspend charging.
Charge-Current Monitor Output. ICHG is a scaled-down replica of the charger output current. Use ICHG to
monitor the charging current and detect when the chip changes from constant-current mode to constantvoltage mode. The transconductance of (CSIP - CSIN) to ICHG is 3µA/mV.
Output Current-Limit Set Input. ICTL input voltage range is V
down if ICTL is forced below V
LDO, the set point for CSIP - CSIN is 45mV.
/100 while the MAX8765/MAX8765A does not. When ICTL is equal to
REFIN
REFIN
Output Voltage-Limit Set Input. VCTL input voltage range is 0 to V
point is (4.2 x CELLS)V.
is less than V
ACIN
/32 to V
REFIN
. The MAX1908/MAX8724 shut
REFIN
. When VCTL is equal to LDO, the set
REF
/2.
Input-Current Monitor Output. IINP is a scaled-down replica of the input current. IINP monitors the total
system current. The transconductance of (CSSP - CSSN) to IINP is 3µA/mV.
The MAX1908/MAX8724/MAX8765/MAX8765A include
all the functions necessary to charge Li+ batteries. A
high-efficiency synchronous-rectified step-down DC-DC
converter controls charging voltage and current. The
device also includes input-source current limiting and
analog inputs for setting the charge current and charge
voltage. Control charge current and voltage using the
ICTL and VCTL inputs, respectively. Both ICTL and
VCTL are ratiometric with respect to REFIN, allowing
compatibility with DACs or microcontrollers (µCs).
Ratiometric ICTL and VCTL improve the accuracy of the
charge current and voltage set point by matching V
RE-
FIN
to the reference of the host. For standard applications, internal set points for ICTL and VCTL provide 3A
charge current (with 0.015Ω sense resistor), and 4.2V
(per cell) charge voltage. Connect ICTL and VCTL to
LDO to select the internal set points. The MAX1908
safely conditions overdischarged cells with 300mA (with
0.015Ω sense resistor) until the battery-pack voltage
exceeds 3.1V × number of series-connected cells. The
SHDN input allows shutdown from a microcontroller or
thermistor.
The DC-DC converter uses external n-channel
MOSFETs as the buck switch and synchronous rectifier
to convert the input voltage to the required charging
current and voltage. The
Typical Application Circuit
shown in Figure 1 uses a µC to control charging current, while Figure 2 shows a typical application with
charging voltage and current fixed to specific values
for the application. The voltage at ICTL and the value of
RS2 set the charging current. The DC-DC converter
generates the control signals for the external MOSFETs
to regulate the voltage and the current set by the VCTL,
ICTL, and CELLS inputs.
The MAX1908/MAX8724/MAX8765/MAX8765A feature
a voltage regulation loop (CCV) and two current regulation loops (CCI and CCS). The CCV voltage regulation
loop monitors BATT to ensure that its voltage does not
exceed the voltage set by VCTL. The CCI battery current regulation loop monitors current delivered to BATT
to ensure that it does not exceed the current limit set by
ICTL. A third loop (CCS) takes control and reduces the
battery-charging current when the sum of the system
load and the battery-charging input current exceeds
the input current limit set by CLS.
Setting the Battery-Regulation Voltage
The MAX1908/MAX8724/MAX8765/MAX8765A use a
high-accuracy voltage regulator for charging voltage.
The VCTL input adjusts the charger output voltage.
VCTL control voltage can vary from 0 to V
REFIN
, provid-
ing a 10% adjustment range on the V
BATT
regulation
voltage. By limiting the adjust range to 10% of the regulation voltage, the external resistor mismatch error is
reduced from 1% to 0.05% of the regulation voltage.
Therefore, an overall voltage accuracy of better than
0.7% is maintained while using 1% resistors. The percell battery termination voltage is a function of the battery chemistry. Consult the battery manufacturer to
determine this voltage. Connect VCTL to LDO to select
the internal default setting V
BATT
= 4.2V × number of
cells, or program the battery voltage with the following
equation:
CELLS is the programming input for selecting cell count.
Connect CELLS as shown in Table 2 to charge 2, 3, or 4
Li+ cells. When charging other cell chemistries, use
CELLS to select an output voltage range for the charger.
The internal error amplifier (GMV) maintains voltage
regulation (Figure 3). The voltage error amplifier is
compensated at CCV. The component values shown in
Figures 1 and 2 provide suitable performance for most
applications. Individual compensation of the voltage regulation and current regulation loops allows for optimal
compensation (see the
The ICTL input sets the maximum charging current. The
current is set by current-sense resistor RS2, connected
between CSIP and CSIN. The full-scale differential
voltage between CSIP and CSIN is 75mV; thus, for a
0.015Ω sense resistor, the maximum charging current
is 5A. Battery-charging current is programmed with
ICTL using the equation:
The input voltage range for ICTL is V
REFIN
/32 to V
REFIN
.
The MAX1908/MAX8724 shut down if ICTL is forced
below V
REFIN
/100 (min), while the MAX8765/MAX8765A
does not.
Connect ICTL to LDO to select the internal default fullscale, charge-current sense voltage of 45mV. The
charge current when ICTL = LDO is:
where RS2 is 0.015Ω, providing a charge-current set
point of 3A.
The current at the ICHG output is a scaled-down replica
of the battery output current being sensed across CSIP
and CSIN (see the
Current Measurement
section).
When choosing the current-sense resistor, note that the
voltage drop across this resistor causes further power
loss, reducing efficiency. However, adjusting ICTL to
reduce the voltage across the current-sense resistor
can degrade accuracy due to the smaller signal to the
input of the current-sense amplifier. The chargingcurrent-error amplifier (GMI) is compensated at CCI
(see the
Compensation
section).
Setting the Input Current Limit
The total input current (from an AC adapter or other DC
source) is a function of the system supply current and
the battery-charging current. The input current regulator
limits the input current by reducing the charging
current when the input current exceeds the input
current-limit set point. System current normally fluctuates as portions of the system are powered up or
down. Without input current regulation, the source must
be able to supply the maximum system current and the
maximum charger input current simultaneously. By using
the input current limiter, the current capability of the AC
adapter can be lowered, reducing system cost.
The MAX1908/MAX8724/MAX8765/MAX8765A limit the
battery charge current when the input current-limit
threshold is exceeded, ensuring the battery charger
does not load down the AC adapter voltage. An internal
amplifier compares the voltage between CSSP and
CSSN to the voltage at CLS. V
CLS
can be set by a
resistive divider between REF and GND. Connect CLS
to REF for the full-scale input current limit. The CLS voltage range for the MAX1908/MAX8724 is from 1.6V to
REF, while the MAX8765/MAX8765A CLS voltage is
from 1.1V to REF.
The input current is the sum of the device current, the
charger input current, and the load current. The device
current is minimal (3.8mA) in comparison to the charge
and load currents. Determine the actual input current
required as follows:
where η is the efficiency of the DC-DC converter.
V
CLS
determines the reference voltage of the GMS
error amplifier. Sense resistor RS1 and V
CLS
determine
the maximum allowable input current. Calculate the
input current limit as follows:
Once the input current limit is reached, the charging
current is reduced until the input current is at the
desired threshold.
When choosing the current-sense resistor, note that the
voltage drop across this resistor causes further power
loss, reducing efficiency. Choose the smallest value for
RS1 that achieves the accuracy requirement for the
input current-limit set point.
Conditioning Charge
The MAX1908 includes a battery-voltage comparator
that allows a conditioning charge of overdischarged Li+
battery packs. If the battery-pack voltage is less than
3.1V × number of cells programmed by CELLS, the
MAX1908 charges the battery with 300mA current when
using sense resistor RS2 = 0.015Ω. After the
battery voltage exceeds the conditioning charge threshold, the MAX1908 resumes full-charge mode, charging
to the programmed voltage and current limits. The
MAX8724/MAX8765/MAX8765A do not offer this feature.
AC Adapter Detection
Connect the AC adapter voltage through a resistive
divider to ACIN to detect when AC power is available,
as shown in Figure 1. ACIN voltage rising trip point is
V
REF
/2 with 20mV hysteresis. ACOK is an open-drain
output and is high impedance when ACIN is less than
can drive a p-channel MOSFET directly at the charger
input, providing a lower dropout voltage than a
Schottky diode (Figure 2). In the MAX1908/MAX8724
the ACOK comparator is enabled after REFIN is ready.
In the MAX8765/MAX8765A, the ACOK comparator is
independent of REFIN.
Current Measurement
Use ICHG to monitor the battery-charging current being
sensed across CSIP and CSIN. The ICHG voltage is
proportional to the output current by the equation:
V
ICHG
= ICHG x RS2 x G
ICHG
x R9
where I
CHG
is the battery-charging current, G
ICHG
is
the transconductance of ICHG (3µA/mV typ), and R9 is
the resistor connected between ICHG and ground.
Leave ICHG unconnected if not used.
Use IINP to monitor the system input current being
sensed across CSSP and CSSN. The voltage of IINP is
proportional to the input current by the equation:
V
IINP
= I
INPUT
x RS1 x G
IINP
x R10
where I
INPUT
is the DC current being supplied by the AC
adapter power, G
IINP
is the transconductance of IINP
(3µA/mV typ), and R10 is the resistor connected between
IINP and ground. ICHG and IINP have a 0 to 3.5V output
voltage range. Leave IINP unconnected if not used.
LDO Regulator
LDO provides a 5.4V supply derived from DCIN and
can deliver up to 10mA of load current. The MOSFET
drivers are powered by DLOV and BST, which must be
connected to LDO as shown in Figure 1. LDO supplies
the 4.096V reference (REF) and most of the control circuitry. Bypass LDO with a 1µF capacitor to GND.
Shutdown
The MAX1908/MAX8724/MAX8765/MAX8765A feature
a low-power shutdown mode. Driving SHDN low shuts
down the MAX1908/MAX8724/MAX8765/MAX8765A. In
shutdown, the DC-DC converter is disabled and CCI,
CCS, and CCV are pulled to ground. The IINP and
ACOK outputs continue to function.
SHDN can be driven by a thermistor to allow automatic
shutdown of the MAX1908/MAX8724/MAX8765/
MAX8765A when the battery pack is hot. The shutdown
falling threshold is 23.5% (typ) of V
REFIN
with 1%
V
REFIN
hysteresis to provide smooth shutdown when
driven by a thermistor.
DC-DC Converter
The MAX1908/MAX8724/MAX8765/MAX8765A employ
a buck regulator with a bootstrapped nMOS high-side
switch and a low-side nMOS synchronous rectifier.
CCV, CCI, CCS, and LVC Control Blocks
The MAX1908/MAX8724/MAX8765/MAX8765A control
input current (CCS control loop), charge current (CCI
control loop), or charge voltage (CCV control loop),
depending on the operating condition.
The three control loops, CCV, CCI, and CCS are brought
together internally at the LVC amplifier (lowest voltage
clamp). The output of the LVC amplifier is the feedback
control signal for the DC-DC controller. The output of the
GMamplifier that is the lowest sets the output of the LVC
amplifier and also clamps the other two control loops to
within 0.3V above the control point. Clamping the other
two control loops close to the lowest control loop ensures
fast transition with minimal overshoot when switching
between different control loops.
DC-DC Controller
The MAX1908/MAX8724/MAX8765/MAX8765A feature a
variable off-time, cycle-by-cycle current-mode control
scheme. Depending upon the conditions, the MAX1908/
MAX8724/MAX8765/MAX8765A work in continuous or
discontinuous-conduction mode.
Continuous-Conduction Mode
With sufficient charger loading, the MAX1908/MAX8724/
MAX8765/MAX8765A operate in continuous-conduction
mode (inductor current never reaches zero) switching at
400kHz if the BATT voltage is within the following range:
3.1V x (number of cells) < V
BATT
< (0.88 x V
DCIN
)
The operation of the DC-DC controller is controlled by
the following four comparators as shown in Figure 4:
• IMIN—Compares the control point (LVC) against
0.15V (typ). If IMIN output is low, then a new cycle
cannot begin.
• CCMP—Compares the control point (LVC) against the
charging current (CSI). The high-side MOSFET ontime is terminated if the CCMP output is high.
• IMAX—Compares the charging current (CSI) to 6A
(RS2 = 0.015Ω). The high-side MOSFET on-time is
terminated if the IMAX output is high and a new cycle
cannot begin until IMAX goes low.
• ZCMP—Compares the charging current (CSI) to
333mA (RS2 = 0.015Ω). If ZCMP output is high, then
In normal operation, the controller starts a new cycle by
turning on the high-side n-channel MOSFET and
turning off the low-side n-channel MOSFET. When the
charge current is greater than the control point (LVC),
CCMP goes high and the off-time is started. The
off-time turns off the high-side n-channel MOSFET and
turns on the low-side n-channel MOSFET. The operational frequency is governed by the off-time and is
dependent upon V
DCIN
and V
BATT
. The off-time is set
by the following equations:
where:
These equations result in fixed-frequency operation
over the most common operating conditions.
At the end of the fixed off-time, another cycle begins if
the control point (LVC) is greater than 0.15V, IMIN =
high, and the peak charge current is less than 6A (RS2
= 0.015Ω), IMAX = high. If the charge current exceeds
IMAX, the on-time is terminated by the IMAX comparator. IMAX governs the maximum cycle-by-cycle current
limit and is internally set to 6A (RS2 = 0.015Ω). IMAX
protects against sudden overcurrent faults.
If, during the off-time, the inductor current goes to zero,
ZCMP = high, both the high- and low-side MOSFETs
are turned off until another cycle is ready to begin.
There is a minimum 0.3µs off-time when the (V
DCIN
-
V
BATT
) differential becomes too small. If V
BATT
≥ 0.88 ×
V
DCIN
, then the threshold for minimum off-time is
reached and the t
OFF
is fixed at 0.3µs. A maximum ontime of 5ms allows the controller to achieve > 99% duty
cycle in continuous-conduction mode. The switching
frequency in this mode varies according to the equation:
Discontinuous Conduction
The MAX1908/MAX8724/MAX8765/MAX8765A enter discontinuous-conduction mode when the output of the LVC
control point falls below 0.15V. For RS2 = 0.015Ω, this
corresponds to 0.5A:
for RS2 = 0.015Ω.
In discontinuous mode, a new cycle is not started until
the LVC voltage rises above 0.15V. Discontinuousmode operation can occur during conditioning charge
of overdischarged battery packs, when the charge current has been reduced sufficiently by the CCS control
loop, or when the battery pack is near full charge (constant-voltage-charging mode).
MOSFET Drivers
The low-side driver output DLO switches between
PGND and DLOV. DLOV is usually connected through
a filter to LDO. The high-side driver output DHI is bootstrapped off LX and switches between VLXand V
BST
.
When the low-side driver turns on, BST rises to one
diode voltage below DLOV.
Filter DLOV with a lowpass filter whose cutoff frequency
is approximately 5kHz (Figure 1):
Dropout Operation
The MAX1908/MAX8724/MAX8765/MAX8765A have 99%
duty-cycle capability with a 5ms (max) on-time and 0.3µs
(min) off-time. This allows the charger to achieve dropout
performance limited only by resistive losses in the DC-DC
converter components (D1, N1, RS1, and RS2, Figure 1).
Replacing diode D1 with a p-channel MOSFET driven by
ACOK improves dropout performance (Figure 2). The
dropout voltage is set by the difference between DCIN
and CSIN. When the dropout voltage falls below 100mV,
the charger is disabled; 200mV hysteresis ensures that
the charger does not turn back on until the dropout voltage rises to 300mV.
Compensation
Each of the three regulation loops—input current limit,
charging current limit, and charging voltage limit—are
compensated separately using CCS, CCI, and CCV,
respectively.
Compensation of the CCV loop depends on the parameters and components shown in Figure 5. CCVand
RCVare the CCV loop compensation capacitor and
series resistor. R
ESR
is the equivalent series resistance
(ESR) of the charger output capacitor (C
OUT
). RLis the
equivalent charger output load, where RL= V
BATT
/
I
CHG
. The equivalent output impedance of the GMV
amplifier, R
OGMV
≥ 10MΩ . The voltage amplifier
transconductance, GMV = 0.125µA/mV. The DC-DC
converter transconductance, GM
OUT
= 3.33A/V:
where A
CSI
= 20, and RS2 is the charging current-
sense resistor in the
Typical Application Circuits
.
The compensation pole is given by:
The compensation zero is given by:
The output pole is given by:
where R
L
varies with load according to RL= V
BATT/ICHG.
Output zero due to output capacitor ESR:
The loop transfer function is given by:
Assuming the compensation pole is a very low
frequency, and the output zero is a much higher frequency, the crossover frequency is given by:
To calculate R
CV
and CCVvalues of the circuit of Figure 2:
Cells = 4
C
OUT
= 22µF
V
BATT
= 16.8V
I
CHG
= 2.5A
GMV = 0.125µA/mV
GM
OUT
= 3.33A/V
R
OGMV
= 10MΩ
f = 400kHz
Choose crossover frequency to be 1/5th the
MAX1908’s 400kHz switching frequency:
Solving yields RCV= 26kΩ.
Conservatively set RCV= 1kΩ, which sets the crossover
frequency at:
f
CO_CV
= 3kHz
Choose the output-capacitor ESR so the output-capacitor
zero is 10 times the crossover frequency:
to be 1/5th the
MAX1908/MAX8724/MAX8765/MAX8765A switching
frequency:
Solving for CCS, CCS= 2nF.
To be conservative, set C
CS
= 10nF, which sets the
crossover frequency at:
The compensation pole, f
P_CS
is set at:
Component Selection
Table 3 lists the recommended components and refers
to the circuit of Figure 2. The following sections
describe how to select these components.
Inductor Selection
Inductor L1 provides power to the battery while it is
being charged. It must have a saturation current of at
least the charge current (I
CHG
), plus 1/2 the current rip-
ple I
RIPPLE
:
I
SAT
= I
CHG
+ (1/2) I
RIPPLE
Ripple current varies according to the equation:
I
RIPPLE
= (V
BATT
) × t
OFF
/L
where:
t
OFF
= 2.5µs × (V
DCIN
– V
BATT
)/V
DCIN
V
BATT
< 0.88 × V
DCIN
or:
t
OFF
= 0.3µs
V
BATT
> 0.88 × V
DCIN
Figure 11 illustrates the variation of ripple current vs.
battery voltage when charging at 3A with a fixed 19V
input voltage.
Higher inductor values decrease the ripple current.
Smaller inductor values require higher saturation current capabilities and degrade efficiency. Designs for
ripple current, I
RIPPLE
= 0.3 × I
CHG
usually result in a
good balance between inductor size and efficiency.
Input Capacitor
Input capacitor C1 must be able to handle the input
ripple current. At high charging currents, the DC-DC
converter operates in continuous conduction. In this
case, the ripple current of the input capacitor can be
approximated by the following equation:
where:
I
C1
= input capacitor ripple current.
D = DC-DC converter duty ratio.
I
CHG
= battery-charging current.
Input capacitor C1 must be sized to handle the maximum ripple current that occurs during continuous conduction. The maximum input ripple current occurs at
50% duty cycle; thus, the worst-case input ripple current is 0.5 × I
CHG
. If the input-to-output voltage ratio is
such that the DC-DC converter does not operate at a
50% duty cycle, then the worst-case capacitor current
occurs where the duty cycle is nearest 50%.
The input capacitor ESR times the input ripple current
sets the ripple voltage at the input, and should not
exceed 0.5V ripple. Choose the ESR of C1 according to:
The input capacitor size should allow minimal output
voltage sag at the highest switching frequency:
where dV is the maximum voltage sag of 0.5V while
delivering energy to the inductor during the high-side
MOSFET on-time, and dt is the period at highest operating frequency (400kHz):
Both tantalum and ceramic capacitors are suitable in
most applications. For equivalent size and voltage
rating, tantalum capacitors have higher capacitance,
but also higher ESR than ceramic capacitors. This
makes it more critical to consider ripple current and
power-dissipation ratings when using tantalum capacitors. A single ceramic capacitor often can replace two
tantalum capacitors in parallel.
Output Capacitor
The output capacitor absorbs the inductor ripple current. The output capacitor impedance must be significantly less than that of the battery to ensure that it
absorbs the ripple current. Both the capacitance and
ESR rating of the capacitor are important for its effectiveness as a filter and to ensure stability of the DC-DC
converter (see the
Compensation
section). Either tantalum or ceramic capacitors can be used for the output
filter capacitor.
MOSFETs and Diodes
Schottky diode D1 provides power to the load when the
AC adapter is inserted. This diode must be able to
deliver the maximum current as set by RS1. For
reduced power dissipation and improved dropout performance, replace D1 with a p-channel MOSFET (P1)
as shown in Figure 2. Take caution not to exceed the
maximum VGSof P1. Choose resistors R11 and R12 to
limit the VGS.
The n-channel MOSFETs (N1a, N1b) are the switching
devices for the buck controller. High-side switch N1a
should have a current rating of at least the maximum
charge current plus one-half the ripple current and
have an on-resistance (R
DS(ON)
) that meets the power
dissipation requirements of the MOSFET. The driver for
N1a is powered by BST. The gate-drive requirement for
N1a should be less than 10mA. Select a MOSFET with a
low total gate charge (Q
GATE
) and determine the
required drive current by I
GATE
= Q
GATE
× f (where f is
the DC-DC converter’s maximum switching frequency).
The low-side switch (N1b) has the same current rating
and power dissipation requirements as N1a, and
should have a total gate charge less than 10nC. N2 is
used to provide the starting charge to the BST capacitor
(C15). During the dead time (50ns, typ) between N1a
and N1b, the current is carried by the body diode of
the MOSFET. Choose N1b with either an internal
Schottky diode or body diode capable of carrying the
maximum charging current during the dead time. The
Schottky diode D3 provides the supply current to the
high-side MOSFET driver.
Layout and Bypassing
Bypass DCIN with a 1µF capacitor to power ground
(Figure 1). D2 protects the MAX1908/MAX8724/
MAX8765/MAX8765A when the DC power source input
is reversed. A signal diode for D2 is adequate because
DCIN only powers the internal circuitry. Bypass LDO,
REF, CCV, CCI, CCS, ICHG, and IINP to analog
ground. Bypass DLOV to power ground.
Good PC board layout is required to achieve specified
noise, efficiency, and stable performance. The PC
board layout artist must be given explicit instructions—
preferably, a pencil sketch showing the placement of
the power-switching components and high-current routing. Refer to the PC board layout in the MAX1908 evaluation kit for examples. Separate analog and power
grounds are essential for optimum performance.
Use the following step-by-step guide:
1) Place the high-power connections first, with their
grounds adjacent:
a) Minimize the current-sense resistor trace lengths,
and ensure accurate current sensing with Kelvin
connections.
b) Minimize ground trace lengths in the high-current
paths.
c) Minimize other trace lengths in the high-current
paths.
d) Use > 5mm wide traces.
e) Connect C1 to high-side MOSFET (10mm max
length).
f) LX node (MOSFETs, inductor (15mm max
length)).
Ideally, surface-mount power components are flush
against one another with their ground terminals
almost touching. These high-current grounds are
then connected to each other with a wide, filled zone
of top-layer copper, so they do not go through vias.
The resulting top-layer power ground plane is
connected to the normal ground plane at the
MAX1908/MAX8724/MAX8765/MAX8765As’ backside exposed pad. Other high-current paths should
also be minimized, but focusing primarily on short
ground and current-sense connections eliminates
most PC board layout problems.
2) Place the IC and signal components. Keep the
main switching node (LX node) away from sensitive
analog components (current-sense traces and REF
capacitor). Important: The IC must be no further
than 10mm from the current-sense resistors.
Keep the gate-drive traces (DHI, DLO, and BST)
shorter than 20mm, and route them away from the
current-sense lines and REF. Place ceramic
bypass capacitors close to the IC. The bulk capacitors can be placed further away.
3) Use a single-point star ground placed directly
below the part at the backside exposed pad of the
MAX1908/MAX8724/MAX8765/MAX8765A.
Connect the power ground and normal ground to
this node.
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
. Note that a "+", "#", or "-" in
the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPEPACKAGE CODEDOCUMENT NO.
28 TQFN-EPT2855-6
21-0140
1bios.ru
MAX1908/MAX8724/MAX8765/MAX8765A
Low-Cost Multichemistry Battery Chargers
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
30
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600