Maxim Integrated DS80C390 User Manual

DS80C390

www.dalsemi.com

64-PIN QFP

PRELIMINARY

161910274360

68-PIN PLCC

Dual CAN High-Speed

Microprocessor

FEATURES

§ 80C52 compatible

− 8051 instruction-set compatible

− Four 8-bit I/O ports

− Three 16-bit timer/counters

− 256 bytes scratchpad RAM

§ High-Speed Architecture

− 4 clocks/machine cycle (8051=12)

− Runs DC to 40 MHz clock rates

− Frequency multiplier reduces EMI

− Single-cycle instruction in 100 ns

− 16/32-bit math coprocessor

§ 4 kB internal SRAM usable as

program/data/stack memory

§ Enhanced memory architecture

− Addresses up to 4 MB external

− Defaults to true 8051 memory compatibility

− User-enabled 22-bit program/data counter

− 16-Bit/22-bit paged/22-bit contiguous

modes

− User-selectable multiplexed / non-

multiplexed memory interface

− Optional 10 bit stack pointer

§ Two full-function CAN 2.0B controllers

− 15 message centers per controller

− Standard 11-bit or extended 29-bit

identification modes

− Supports DeviceNet, SDS, and higher layer

CAN protocols

− Disables transmitter during autobaud

− SIESTA low power mode

§ Two full-duplex hardware serial ports

§ Programmable IrDA clock

§ High integration controller includes

− Power-fail reset

− Early-warning power-fail interrupt

− Programmable watchdog timer

− Oscillator-fail detection

§ 16 total interrupt sources with 6 external

§ Available in 64-pin QFP, 68-pin PLCC

PIN ASSIGNMENT

48 33

49

64

32

DS80C390

17

161

DS80C390

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DESCRIPTION

The DS80C390 is a fast 8051-compatible microprocessor. The redesigned processor core executes 8051
instructions up to 3 times faster than the original for the same crystal speed. The DS80C390 supports a
maximum crystal speed of 40 MHz, resulting in apparent execution speeds of 100 MHz (approximately

2.5X). An optional internal frequency multiplier allows the microprocessor to operate at full speed with a
reduced crystal frequency, reducing EMI. A hardware math accelerator further increases the speed of 32
and 16 bit multiply and divide operations, as well as high-speed shift, normalization and accumulate
functions.

The DS80C390 features two full-function Controller Area Network (CAN) 2.0B controllers. Status and
control registers are distributed between SFRs and 512 bytes of internal MOVX memory for maximum
flexibility. In addition to standard 11-bit or 29-extended message identifiers, the device supports two
separate 8-bit media masks and media arbitration fields to support the use of higher-level CAN protocols
such as DeviceNet and SDS.

All of the standard 8051 resources such as three timer/counters, serial port, and four 8-bit I/O ports (plus
two 8-bit ports dedicated to memory interfacing) are included in the DS80C390. In addition it includes a
second hardware serial port, seven additional interrupts, programmable watchdog timer, brown-out
monitor, power-fail reset, and a programmable output clock that supports an IRDA interface. The device
provides dual data pointers with increment/decrement features to speed block data memory moves. It
also can adjust the speed of MOVX data memory access from two to twelve machine cycles for flexibility
in addressing external memory and peripherals.

The device incorporates a 4kB SRAM, which can be configured as various combinations of MOVX
memory, program memory, and optional stack memory. A 22-bit program counter supports access to a
maximum of 4 MB of external program memory and 4 MB of external data memory. A 10-bit stack
pointer addresses up to 1kB of MOVX memory for increased code efficiency.

A new Power Management Mode (PMM) is useful for portable or power-conscious applications. This
feature allows software to switch from the standard machine cycle rate of 4 clocks per cycle to 1024
clocks per cycle. For example, at 12 MHz standard operation has a machine cycle rate of 3 MHz. In
Power Management Mode at the same external clock speed, software can select 11.7 kHz machine cycle
rate. There is a corresponding reduction in power consumption when the processor runs slower.

The EMI reduction feature allows software to select a reduced electromagnetic interference (EMI) mode
by disabling the ALE signal when it is unneeded. The device also incorporates active current control on
the address and data buses, reducing EMI by minimizing transients when interfacing to external circuitry.

ORDERING INFORMATION

Part Number Package Max. Clock Speed Temperature Range

DS80C390-QCR 68-pin PLCC 40 MHz

DS80C390-FCR 64-pin LQFP 40 MHz

DS80C390-QNR 68-pin PLCC 40 MHz

DS80C390-FNR 64-pin LQFP 40 MHz

0°C to +70°C
0°C to +70°C

-40°C to +85°C

-40°C to +85°C

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DS80C390 BLOCK DIAGRAM Figure 1

DS80C390

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PIN DESCRIPTION Table 1

LQFP PLCC SIGNAL

NAME

8, 22,

40, 56

9, 25,

41, 57

46 57 ALE

17, 32,

51, 68

1, 18,

35, 52

V

CC

+5V

GND Digital Circuit Ground

Address Latch Enable - Output. When the MUX pin is low, this

pin outputs a clock to latch the external address LSB from the
multiplexed address/data bus on Port 0. This signal is commonly
connected to the latch enable of an external transparent latch. ALE
has a pulse width of 1.5 XTAL1 cycles and a period of four
XTAL1 cycles. When the MUX pin is high, the pin will toggle
continuously if the ALEOFF bit is cleared. ALE is forced high
when the device is in a Reset condition or if the ALEOFF bit is set
while the MUX pin is high.

45 56

PSEN

Program Store Enable - Output. This signal is the chip enable for
external ROM memory. PSEN provides an active low pulse and is

driven high when external ROM is not being accessed.

47 58

EA

External Access Enable - Input. This pin must be tied to GND for
proper operation.

26 36

MUX

Multiplex/Demultiplex Select - Input. This pin selects if the
address/data bus operates in multiplexed (MUX =0) or
demultiplexed ( MUX =1) mode.

2 11 RST Reset - Input. The RST input pin contains a Schmitt voltage input

to recognize external active high Reset inputs. The pin also
employs an internal pulldown resistor to allow for a combination of
wired OR external Reset sources. An RC circuit is not required for
power-up, as the device provides this function internally.

3 12

RSTOL

Reset Output Low - Output. This active low signal will be
asserted:
When the processor has entered reset via the RST pin,
During crystal warm-up period following power-on or Stop mode,
During a watchdog timer reset (2 cycles duration),
During an oscillator failure (if OFDE=1),

23,

24

33,

34

XTAL2,

XTAL1

Whenever V
XTAL1, XTAL2 - Crystal oscillator pins support fundamental
mode, parallel resonant, AT cut crystals. XTAL1 is the input if an

CC

≤ V

external clock source is used in place of a crystal. XTAL2 is the
output of the crystal amplifier.

55
54
53
52
51
50
49
48

67
66
65
64
63
62
61
59

AD0 / D0
AD1 / D1
AD2 / D2
AD3 / D3
AD4 / D4
AD5 / D5
AD6 / D6
AD7 / D7

AD0-7 (Port 0) - I/O. When the MUX pin is tied low, Port 0 is the
multiplexed address/data bus. While ALE is high, the LSB of a
memory address is presented. While ALE falls, the port transitions
to a bi-directional data bus. When the MUX pin is tied high, Port 0
functions as the bi-directional data bus. Port 0 cannot be modified
by software. The reset condition of Port 0 pins is high. No pullup
resistors are needed.

DESCRIPTION

RST

DS80C390

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DS80C390

58-64,12-8, 10 P1.0-P1.7 Port 1 - I/O. Port 1 can function as an 8-bit bi-directional I/O port,

the non-multiplexed A0 - A7 signals (when the MUX pin =1), and
as an alternate interface for internal resources. Setting the SP1EC
bit relocates RXD1 and TXD1 to Port 5. The reset condition of Port
1 is all bits at logic 1 via a weak pullup. The logic 1 state also
serves as an input mode, since external circuits writing to the port
can overdrive the weak pullup. When software clears any port pin
to 0, a strong pulldown is activated that remains on until either a 1
is written to the port pin or a reset occurs. Writing a 1 after the port
has been at 0 will activate a strong transition driver, followed by a
weaker sustaining pullup. Once the momentary strong driver turns
off, the port once again becomes the output (and input) high state.

Port Alternate Function

58 2 A0 P1.0 T2 Exter nal I/O for Timer/Counter 2
59 3 A1 P1.1 T2EX Timer/Counter 2 Capture/Reload Trigger
60 4 A2 P1.2 RXD1 Serial Port 1 Input
61 5 A3 P1.3 TXD1 Serial Port 1 Output
62 6 A4 P1.4 INT2 External Interrupt 2 (Pos. Edge Detect)
63 7 A5 P1.5 INT3 External Interrupt 3 (Neg. Edge Detect)
64 8 A6 P1.6 INT4 External Interrupt 4 (Pos. Edge Detect)

1 10 A7

35
36
37
38
39
42
43
44

4-7,

10-13

46
47
48
49
50
53
54
55

13-16,

19-22

A10 (P2.2)
A11 (P2.3)
A12 (P2.4)
A13 (P2.5)
A14 (P2.6)
A15 (P2.7)

A8 (P2.0)
A9 (P2.1)

P3.0-P3.7 Port 3 - I/O. Port 3 functions as an 8-bit bi-directional I/O port,

P1.7

External Interrupt 5 (Neg. Edge Detect)

INT5

A15-A8 (Port 2) - Output. Port 2 serves as the MSB for external
addressing. The port automatically asserts the address MSB during
external ROM and RAM access. Although the Port 2 SFR exists,
the SFR value will never appear on the pins (due to memory
access). Therefore accessing the Port 2 SFR is only useful for
MOVX A, @Ri or MOVX @Ri, A instructions, which use the Port
2 SFR as the external address MSB.

and as an alternate interface for several resources found on the
traditional 8051. The reset condition of Port 1 is all bits at logic 1
via a weak pullup. The logic 1 state also serves as an input mode,
since external circuits writing to the port can overdrive the weak
pullup. When software clears any port pin to 0, the device activates
a strong pulldown that remains on until either a 1 is written to the
port pin or a reset occurs. Writing a 1 after the port has been at 0
will activate a strong transition driver, followed by a weaker
sustaining pullup. Once the momentary strong driver turns off, the
port once again becomes the output (and input) high state.

Port Alternate Function

4 13 P3.0 RXD0 Serial Port 0 Input
5 14 P3.1 TXD0 Serial Port 0 Output
6 15

7 16

P3.2 INT0 External Interrupt 0

P3.3 INT1 External Interrupt 1
10 19 P3.4 T0 Timer 0 External Input
11 20 P3.5 T1/XCLK Timer 1 External Input/External Clock Output
12 21

P3.6 WR External Data Memory Write Strobe

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13 22

34-27 45, 44,

42-37

P4.0-P4.7 Port 4 - I/O. Port 4 can function as an 8-bit bi-directional I/O port,

P3.7 RD External Data Memory Read Strobe

and as the source for external address and chip enable signals for

program and data memory. Port pins are configured as I/O or

memory signals via the P4CNT register. The reset condition of

Port 1 is all bits at logic 1 via a weak pullup. The logic 1 state also

serves as an input mode, since external circuits writing to the port

can overdrive the weak pullup. When software clears any port pin

to 0, the device activates a strong pulldown that remains on until

either a 1 is written to the port pin or a reset occurs. Writing a 1

after the port has been at 0 will activate a strong transition driver,

followed by a weaker sustaining pullup. Once the momentary

strong driver turns off, the port once again becomes the output (and

input) high state.

Port Alternate Function

34 45
33 44
32 42
31 41

P4.0 CE0 Program Memory Chip Enable 0

P4.1 CE1 Program Memory Chip Enable 1

P4.2 CE2 Program Memory Chip Enable 2

P4.3 CE3 Program Memory Chip Enable 3
30 40 P4.4 A16 Program/Data Memory Address 16
29 39 P4.5 A17 Program/Data Memory Address 17
28 38 P4.6 A18 Program/Data Memory Address 18
27 37 P4.7 A19 Program/Data Memory Address 19

21-14 31-27,

25-23

P5.0-P5.7 Port 5 - I/O. Port 5 can function as an 8-bit bi-directional I/O port,

the CAN interface, or as peripheral enable signals. Setting the

SP1EC bit will relocate the RXD1 and TXD1 functions to P5.3-

P5.2 as described in the User’s Guide.

The reset condition of Port 1 is all bits at logic 1 via a weak pullup.

The logic 1 state also serves as an input mode, since external

circuits writing to the port can overdrive the weak pullup. When

software clears any port pin to 0, the device activates a strong

pulldown that remains on until either a 1 is written to the port pin or

a reset occurs. Writing a 1 after the port has been at 0 will activate

a strong transition driver, followed by a weaker sustaining pullup.

Once the momentary strong driver turns off, the port once again

becomes the output (and input) high state.

Port Alternate Function

21 31 P5.0 C0TX CAN0 Transmit Output
20 30 P5.1 C0RX CAN0 Receive Input
19 29 P5.2 C1RX CAN1 Receive Input (optional RXD1)
18 28 P5.3 C1TX CAN1 Transmit Output (optional TXD1)
17 27

16 25
15 24
14 23

9, 26,

43, 60

P5.4 PCE0 Peripheral Chip Enable 0

P5.5 PCE1 Peripheral Chip Enable 1

P5.6 PCE2 Peripheral Chip Enable 2

P5.7 PCE3 Peripheral Chip Enable 3

NC - Reserved. These pins are reserved for use with future

devices in this family and should not be connected.

DS80C390

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DS80C390

80C32 COMPATIBILITY

The DS80C390 is a CMOS 80C32-compatible microcontroller designed for high performance. Every
effort has been made to keep the core device familiar to 80C32 users while adding many new features.
Because the device runs the standard 8051 instruction set, in general software written for existing 80C32­based systems will work on the DS80C390. The primary exceptions are related to timing-critical issues,
since the high-performance core of the microcontroller executes instructions much faster than the
original. Memory interfacing is performed identically to the standard 80C32. The high-speed nature of
the DS80C390 core will slightly change the interface timing, and designers are advised to consult the
timing diagrams in this data sheet for more information.

The DS80C390 provides the same timer/counter resources, full duplex serial port, 256 bytes of scratchpad
RAM and I/O ports as the standard 80C32. Timers will default to a 12 clocks per machine cycle
operation to keep timing compatible with original 8051 systems, but can be programmed to run at the
faster 4 clocks per machine cycle if desired. New hardware functions are accessed using Special
Function Registers that do not overlap with standard 80C32 locations.

This data sheet provides only a summary and overview of the DS80C390. Detailed descriptions are
available in the corresponding user’s guide. This data sheet assumes a familiarity with the architecture of
the standard 80C32. In addition to the basic features of that device, the DS80C390 incorporates many
new features.

PERFORMANCE OVERVIEW

The DS80C390’s higher performance comes not just from increasing the clock frequency, but from a
more efficient design. This updated core removes the dummy memory cycles that are present in a
standard, 12 clocks per machine cycle 8051. In the DS80C390, the same machine cycle takes 4 clocks.
Thus the fastest instruction, 1 machine cycle, executes 3 times faster for the same crystal frequency. The
majority of instructions on the DS80C390 will see the full 3 to 1 speed improvement, while a few will
execute between 1.5 and 2.4 times faster. Regardless of specific performance improvements, all
instructions are faster than the original 8051.

Improvement of individual programs will depend on the actual mix of instructions used. Speed sensitive
applications should make the most use of instructions that are 3 times faster. However, the large number
of 3 to 1 improved opcodes makes dramatic speed improvements likely for any arbitrary combination of
instructions. These architecture improvements and the sub-micron CMOS design produce a peak
instruction cycle in 100 ns (10 MIPs). The Dual Data Pointer feature also allows the user to eliminate
wasted instructions when moving blocks of memory.

INSTRUCTION SET SUMMARY

All instructions perform exactly the same functions as their 8051 counterparts. Their effect on bits, flags,
and other status functions is identical. However, the timing of instructions is different, both in absolute
and relative number of clocks. The absolute timing of software loops can be calculated using a table in
the user’s guide. However, counter/timers default to run at the traditional 12 clocks per increment. In
this way, timer-based events occur at the standard intervals with software executing at higher speed.
Timers optionally can run at the faster 4 clocks per increment to take advantage of faster processor
operation.

The relative time of two DS80C390 instructions might differ from the traditional 8051. For example, in
the original architecture the “MOVX A, @DPTR” instruction and the “MOV direct, direct” instruction

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DS80C390

required the same amount of time: two machine cycles or 24 oscillator cycles. In the DS80C390, the
MOVX instruction takes as little as two machine cycles or 8 oscillator cycles but the “MOV direct,
direct” uses three machine cycles or 12 oscillator cycles. While both are faster than their original
counterparts, they now have different execution times. This is because the device usually uses one
instruction cycle for each instruction byte. Examine the timing of each instruction for familiarity with the
changes. Note that a machine cycle now requires just 4 clocks, and provides one ALE pulse per cycle.
Many instructions require only one cycle, but some require five. Refer to the user’s guide for details and
individual instruction timing.

SPECIAL FUNCTION REGISTERS

Special Function Registers (SFRs) control most special features of the microcontroller. This allows the
device to have many new features but use the same instruction set as the 8051. When writing software to
use a new feature, an equate statement defines the SFR to an assembler or compiler. This is the only
change needed to access the new function. The DS80C390 duplicates the SFRs contained in the standard
80C52. Table 2 shows the register addresses and bit locations. Many are standard 80C52 registers. The
user’s guide contains a full description of all SFRs.

SPECIAL FUNCTION REGISTER LOCATION Table 2

Register Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 ADDRESS

P4 P4.7 P4.6 P4.5 P4.4 P4.3 P4.2 P4.1 P4.0 80h

SP 81h

DPL 82h

DPH 83h

DPL1 84h

DPH1 85h

DPS ID1 ID0 TSL - - - - SEL 86h
PCON SMOD_0 SMOD0 OFDF OFDE GF1 GF0 STOP IDLE 87h
TCON TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 88h

TMOD GATE

TL0 8Ah

TL1 8Bh

TH0 8Ch

TH1 8Dh

CKCON WD1 WD0 T2M T1M T0M MD2 MD1 MD0 8Eh

P1 INT5/P1.7 INT4/P1.6 INT3/P1.5 INT2/P1.4

EXIF IE5 IE4 IE3 IE2 CKRY RGMD RGSL BGS 91h

P4CNT - SBCAN P4CNT.5 P4CNT.4 P4CNT.3 P4CNT.2 P4CNT.1 P4CNT.0 92h

DPX 93h

DPX1 95h
C0RMS0 96h
C0RMS1 97h

SCON0 SM0/FE_0 SM1_0 SM2_0 REN_0 TB8_0 RB8_0 TI_0 RI_0 98h

SBUF0 99h

ESP - - - - - - ESP.1 ESP.0 9Bh

AP 9Ch

ACON - - - - - SA AM1 AM0 9Dh
C0TMA0 9Eh
C0TMA1 9Fh

P2 P2.7 P2.6 P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 A0h
P5 P5.7 P5.6 P5.5 P5.4 P5.3 P5.2 P5.1 P5.0 A1h

P5CNT CAN1BA CAN0BA SP1EC C1_I/O C0_I/O P5CNT.2 P5CNT.1 P5CNT.0 A2h

C0C ERIE STIE PDE SIESTA CRST AUTOB ERCS SWINT A3h
C0S BSS EC96/128 WKS RXS TXS ER2 ER1 ER0 A4h

C/ T

M1 M0 GATE

TXD1/P1.3

C/ T

RXD1/P1.2 T2EX/P1.1 T2/P1.0 90h

M1 M0 89h

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DS80C390

C0IR INTIN7 INTIN6 INTIN5 INTIN4 INTIN3 INTIN2 INTIN1 INTIN0 A5h
C0TE A6h
C0RE A7h

IE EA ES1 ET2 ES0 ET1 EX1 ET0 EX0 A8h
SADDR0 A9h
SADDR1 AAh

C0M1C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP ABh
C0M2C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP ACh
C0M3C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP ADh
C0M4C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP AEh
C0M5C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP AFh

P3 P3.7 P3.6 T1 T0 INT1 INT0 TXD0 RXD0 B0h

C0M6C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP B3h
C0M7C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP B4h
C0M8C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP B5h
C0M9C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP B6h

C0M10C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP B7h

IP - PS1 PT2 PS0 PT1 PX1 PT0 PX0 B8h
SADEN0 B9h
SADEN1 BAh

C0M11C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP BBh
C0M12C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP BCh
C0M13C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP BDh
C0M14C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP BEh
C0M15C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP BFh

SCON1 SM0/FE_1 SM1_1 SM2_1 REN_1 TB8_1 RB8_1 TI_1 RI_1 C0h

SBUF1 C1h

PMR CD1 CD0 SWB CTM

STATUS PIP HIP LIP - SPTA1 SPRA1 SPTA0 SPRA0 C5h

MCON IDM1 IDM0 CMA - PDCE3 PDCE2 PDCE1 PDCE0 C6h

TA C7h

T2CON TF2 EXF2 RCLK TCLK EXEN2 TR2

T2MOD - - - D13T1 D13T2 - T2OE DCEN C9h

RCAP2L CAh

RCAP2H CBh

TL2 CCh

TH2 CDh
COR IRDACK C1BPR7 C1BPR6 C0BPR7 C0BPR6 COD1 COD0 CLKOE CEh
PSW CY AC F0 RS1 RS0 OV F1 P D0h

MCNT0
MCNT1 MST MOF - CLM - - - - D2h

MA D3h

MB D4h

MC D5h
C1RMS0 D6h
C1RMS1 D7h
WDCON SMOD_1 POR EPFI PFI WDIF WTRF EWT RWT D8h

C1TMA0 DEh
C1TMA1 DFh

ACC E0h

C1C ERIE STIE PDE SIESTA CRST AUTOB ERCS SWINT E3h
C1S BSS CECE WKS RXS TXS ER2 ER1 ER0 E4h

C1IR INTIN7 INTIN6 INTIN5 INTIN4 INTIN3 INTIN2 INTIN1 INTIN0 E5h
C1TE E6h
C1RE E7h

LSHIFT

CSE SCB MAS4 MAS3 MAS2 MAS1 MAS0 D1h

4X/ 2X

ALEOFF - - C4h

C/ T2 CP/ RL2

C8h

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DS80C390

EIE CANBIE C0IE C1IE EWDI EX5 EX4 EX3 EX2 E8h

MXAX EAh
C1M1C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP EBh
C1M2C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP ECh
C1M3C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP EDh
C1M4C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP EEh
C1M5C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP EFh

B F0h
C1M6C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP F3h
C1M7C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP F4h
C1M8C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP F5h
C1M9C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP F6h

C1M10C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP F7h

EIP CANBIP C0IP C1IP PWDI PX5 PX4 PX3 PX2 F8h
C1M11C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP FBh
C1M12C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP FCh
C1M13C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP FDh
C1M14C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP FEh
C1M15C MSRDY ETI ERI INTRQ EXTRQ MTRQ ROW/TIH DTUP FFh

*Shaded bits are Timed Access protected.

ON-CHIP ARITHMETIC ACCELERATOR

An on-chip math accelerator allows the microcontroller to perform 32- and 16-bit multiplication, division,
shifting, and normalization using dedicated hardware. Math operations are performed by sequentially
loading three special registers. The mathematical operation is determined by the sequence in which three
dedicated SFRs (MA, MB and MC) are accessed, eliminating the need for a special step to choose the
operation. The normalize function facilitates the conversion of 4-byte unsigned binary integers into
floating point format. The following table shows the operations supported by the math accelerator and
their time of execution.

ARITHMETIC ACCELERATOR EXECUTION TIMES Table 3

Operation Result Execution Time

32-bit/16-bit divide 32-bit quotient, 16-bit remainder 36 t
16-bit/16-bit divide 16-bit quotient, 16-bit remainder 24 t
16-bit/16-bit multiply 32-bit product 24 t
32-bit shift left/right 32-bit result 36 t
32-bit normalize 32-bit mantissa, 5 bit exponent 36 t

The following table demonstrates the procedure to perform mathematical operations using the hardware
math accelerator. The MA and MB registers must be loaded and read in the order shown for proper
operation, although accesses to any other registers can be performed between access to the MA or MB
registers. An access to the MA, MB, or MC registers out of sequence will corrupt the operation, requiring
the software to clear the MST bit to restart the math accelerator state machine. Consult the description of
the MCNT0 SFR for details of how the shift and normalize functions operate.

CLCL
CLCL
CLCL
CLCL
CLCL

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ARITHMETIC ACCELERATOR SEQUENCING

Divide (32/16 or 16/16) Multiply (16x16)

Load MA with dividend LSB.

Load MA with dividendLSB+1*
Load MA with dividend LSB+2*

Load MA with dividend MSB.
Load MB with divisor LSB.
Load MB with divisor MSB.
Poll the MST bit until cleared

(9 machine cycles).
Read MA to retrieve the quotient MSB.
Read MA to retrieve the quotient LSB+2.
Read MA to retrieve the quotient LSB+1.
Read MA to retrieve the quotient LSB.
Read MB to retrieve the remainder MSB.
Read MB to retrieve the remainder LSB.
*Not performed for 16 bit numerator.

Shift Right/Left Normalize

Load MA with data LSB.
Load MA with data LSB+1.
Load MA with data LSB+2.
Load MA with data MSB.
Configure MCNT0 register as required
Poll the MST bit until cleared.

(9 machine cycles)
Read MA for result MSB.
Read MA for result LSB+2.
Read MA for result LSB+1.
Read MA for result LSB.

Load MB with multiplier LSB.
Load MB with multiplier MSB.
Load MA with multiplicand LSB.
Load MA with multiplicand MSB.
Poll the MST bit until cleared

Read MA for product MSB.
Read MA for product LSB+2.
Read MA for product LSB+1.
Read MA for product LSB.

Load MA with data LSB.
Load MA with data LSB+1.
Load MA with data LSB+2.
Load MA with data MSB.
Configure MCNT0 register as required.
Poll the MST bit until cleared

Read MA for mantissa MSB.
Read MA for mantissa LSB+2.
Read MA for mantissa LSB+1.
Read MA for mantissa LSB.
Read MCNT0.4-MCNT0.0 for exponent.

DS80C390

(6 machine cycles).

(9 machine cycles).

40-BIT ACCUMULATOR

The accelerator also incorporates an automatic accumulator function, permitting the implementation of
multiply-and-accumulate and divide-and-accumulate functions without any additional delay. Each time
the accelerator is used for a multiply or divide operation, the result is transparently added to a 40-bit
accumulator. This can greatly increase speed of DSP and other high-level math operations.

The accumulator can be accessed any time the Multiply/Accumulate Status Flag (MCNT1;D2h) is
cleared. The accumulator is initialized by performing five writes to the Multiplier C Register (MC;D5h),
LSB first. The 40-bit accumulator can be read by performing five reads of the Multiplier C Register,
MSB first.

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MEMORY ADDRESSING

The DS80C390 incorporates three internal memory areas:

§ 256 bytes of scratchpad (or direct) RAM

§ 4 KB of SRAM configurable as various combinations of MOVX data memory, stack memory, and

MOVC program memory

§ 512 bytes of RAM reserved for the CAN message centers.

Up to 4 MB of external memory is addressed via a multiplexed or demultiplexed 20-bit address bus/8-bit
data bus and four chip enable (active during program memory access) or four peripheral enable (active
during data memory access) signals.

Three different addressing modes are supported, as selected by the AM1, AM0 bits in the ACON SFR.

16-bit address mode

16-bit address mode accesses memory similarly to the traditional 8051. It is opcode compatible with the
8051 microprocessor and identical to the byte and cycle count of the Dallas Semiconductor High-Speed
Microcontroller family. A device operating in this mode can access up to 64 KB of program and data
memory. The device defaults to this mode following any reset.

22-bit paged address mode

The 22-bit paged address mode retains binary code compatibility with the 8051 instruction set, but adds
one machine cycle to the ACALL, LCALL, RET and RETI instructions with respect to the Dallas
Semiconductor High-Speed Microcontroller family timing. This is transparent to standard 8051
compilers. Interrupt latency is also increased by one machine cycle. In this mode, interrupt vectors are
fetched from 0000xxh.

22-bit contiguous address mode

The 22-bit contiguous addressing mode uses a full 22-bit program counter, and all modified branching
instructions automatically save and restore the entire program counter. The 22-bit branching instructions
such as ACALL, AJMP, LCALL, LJMP, MOV DPTR, RET and RETI instructions require an assembler,
compiler and linker that specifically supports these features. The INC DPTR is lengthened by one cycle
but remains byte count compatible with the standard 8051 instruction set.

Internally, the device uses a 22-bit program counter. The lowest order 22 bits are used for memory
addressing, with a special 23rd bit used to map the 4KB SRAM above the 4 MB memory space in
bootstrap loader applications. Address bits 16-23 for the 22-bit addressing modes are generated via
additional SFRs dependent on the type of instruction as shown below.

EXTENDED ADDRESS GENERATION: Table 2

Address bits 23-16 Address bits 15-8 Address bits 7-0

MOVX instructions using DPTR DPX;93h DPH;83h DPL;82h
MOVX instructions using DPTR1 DPX1;95h DPH1;85h DPL1;84h
MOVX instructions using @Ri MXAX;EAh P2;A0h Ri
Addressing program memory in
22-bit paged mode
10-bit stack pointer mode -- ESP;9Bh SP;81h

AP;9Ch -- --

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DS80C390

INTERNAL MOVX SRAM

The DS80C390 contains 4kB of SRAM that can be configured as user accessible MOVX memory,
program memory, or optional stack memory. The specific configuration and locations are governed by the
Internal Data Memory Configuration bits (IDM1, IDM0) in the Memory Control Register (MCON;C6h).
Note that when the SA bit (ACON.2) is set, the first 1kB of the MOVX data memory is reserved for use
by the 10-bit expanded stack. Internal memory accesses will not generate WR , RD , or PSEN strobes.

The DS80C390 can configure its 4kB of internal SRAM as combined program and data memory. This
allows the application software to execute self-modifiable code. The technique loads the 4kB SRAM
with bootstrap loader software, and then modifies the IDM1 and IDM0 bits to map the 4kB starting at
memory location 40000h. This allows the system to run the bootstrap loader without disturbing the 4 MB
external memory bus, making the device in-system reprogrammable for Flash or NV RAM.

INTERNAL MOVX SRAM CONFIGURATION Table 4

IDM1 IDM0 CMA MOVX Data Memory CAN Message

Memory

0 0 0 00F000h-00FFFFh 00EE00h-00EFFFh - ­0 0 1 00F000h-00FFFFh 401000h-4011FFh - ­0 1 0 000000h-000FFFh 00EE00h-00EFFFh - ­0 1 1 000000h-000FFFh 401000h-4011FFh - ­1 0 0 400000h-400FFFh 00EE00h-00EFFFh - ­1 0 1 400000h-400FFFh 401000h-4011FFh - ­1 1 0 - - 00EE00h-00EFFFh 400000h-400FFFh*
1 1 1 - - 401000h-4011FFh 400000h-400FFFh*

*10-bit expanded stack not available in Shared Program /Data Memory mode.

Shared Program /Data

Memory

EXTERNAL MEMORY ADDRESSING

The enabling and mapping of the chip enable signals is done via the Port 4 Control Register (P4CNT;92h)
and Memory Control Register (MCON; 96h); The Extended Address and Chip Enable Generation Table
shows which chip enable and address line signals are active on Port 4. Following reset, the device will be

configured with P4.7-P4.4 as address lines and P4.3-P4.0 configured as 0-CE3 , with the first program
fetch being performed from 00000h with CE0 active. The following tables illustrate which memory

ranges are controlled by each chip enable as a function of which address lines are enabled.

EXTERNAL MEMORY ADDRESSING PIN ASSIGNMENTS Table 5

Address/Data Bus

CE3 -CE0 PCE3 - PCE0

Multiplexed P4.3-P4.0 P5.7-P5.4 P4.7-P4.4 P2 P0 P0

Demultiplexed P4.3-P4.0 P5.7-P5.4 P4.7-P4.4 P2 P1 P0

Addr 19-16 Addr 15-8 Addr 7-0 Data Bus

EXTENDED ADDRESS AND CHIP ENABLE GENERATION Table 6

Port 4 Pin Function Port 4 Pin Function

P4CNT.5-3 P4.7 P4.6 P4.5 P4.4 P4CNT.2-0 P4.3 P4.2 P4.1 P4.0

000 I/O I/O I/O I/O 000 I/O I/O I/O I/O
100 I/O I/O I/O A16 100 I/O I/O I/O
101 I/O I/O A17 A16 101 I/O I/O
110 I/O A18 A17 A16 110 I/O

111(default) A19 A18 A17 A16 111(default)

CE3 CE2 CE1 CE0

CE2 CE1 CE0

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CE1 CE0

CE0

DS80C390

PROGRAM MEMORY CHIP ENABLE BOUNDARIES Table 7

P4CNT.5-3

000 0h-7FFFh 8000h-FFFFh 10000h-17FFFh 18000h-1FFFFh
100 0h-1FFFFh 20000h-3FFFFh 40000h-5FFFFh 60000h-7FFFFh
101 0h-3FFFFh 40000h-7FFFFh 80000h-BFFFFh C0000h-FFFFFh
110 0h-7FFFFh 80000h-FFFFFh 100000h-17FFFFh 180000h-1FFFFFh

111(default) 0-FFFFFh 100000h-1FFFFFh 200000h-2FFFFFh 300000h-3FFFFFh

The DS80C390 incorporates a feature allowing PCE and CE signals to be combined. This is useful when
incorporating modifiable code memory as part of a bootstrap loader or for in-system reprogrammability.

Setting the 0PDCE3 − (MCON.3-0) bits causes the corresponding chip enable signal to function for both
MOVC and MOVX operations. Write access to combined program and data memory blocks is controlled
by the WR signal, and read access is controlled by the PSEN signal. This feature is especially useful if
the design achieves in-system reprogrammability via external Flash memory, in which a single device is
accessed via both MOVC instructions (program fetch) and MOVX Write operations (updates to code
memory). In this case, the internal SRAM is placed in the program/data configuration and loaded with a
small bootstrap loader program stored in the external Flash memory. The device then executes the
internal bootstrap loader routine to modify/update the program memory located in the external Flash
memory.

CE0 CE1 CE2 CE3

STRETCH MEMORY CYCLES

The DS80C390 allows user application software to select the number of machine cycles it takes to
execute a MOVX instruction, allowing access to both fast and slow off-chip data memory and/or
peripherals without glue logic. High-speed systems often include memory-mapped peripherals such as
LCDs or UARTs with slow access times, so it may not be necessary or desirable to access external
devices at full speed. The microprocessor can perform a MOVX instruction in as little as two machine
cycles or as many as twelve machine cycles. Accesses to internal MOVX SRAM always use two cycles.
Note that stretch cycle settings affect external MOVX memory operations only and that there is no way to
slow the accesses to program memory other than to use a slower crystal (or external clock).

External MOVX timing is governed by the selection of 0 to 7 Stretch cycles, controlled by the MD2-MD0
SFR bits in the Clock Control Register (CKCON.2-0). A Stretch of zero will result in a two-machine
cycle MOVX instruction. A Stretch of seven will result in a MOVX of twelve machine cycles. Software
can dynamically change the Stretch value depending on the particular memory or peripheral being
accessed. The default of one Stretch cycle allows the use of commonly available SRAMs without
dramatically lengthening the memory access times.

Stretch cycle settings affect external MOVX timing in three gradations. Changing the Stretch value from
0 to 1 adds an additional clock cycle each to the data setup and hold times. When a Stretch value of 4 or
above is selected, the interface timing changes dramatically to allow for very slow peripherals. First, the
ALE signal is lengthened by 1 machine cycle. This increases the address setup time into the peripheral
by this amount. Next, the address is held on the bus for one additional machine cycle increasing the

address hold time by this amount. The WR and RD signals are then lengthened by a machine cycle.
Finally, during a MOVX write the data is held on the bus for one additional machine cycle, thereby
increasing the data hold time by this amount. For every Stretch value greater than 4, the setup and hold
times remain constant, and only the width of the read or write signal is increased. These three gradations
are reflected in the AC Electrical characteristics, where the eight MOVX timing specifications are
represented by only three timing diagrams.

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DS80C390

The reset default of one Stretch cycle results in a three cycle MOVX for any external access. Therefore,
the default off-chip RAM access is not at full speed. This is a convenience to existing designs that utilize
slower RAM. When maximum speed is desired, software should select a Stretch value of zero. When
using very slow RAM or peripherals, the application software can select a larger Stretch value.

The specific timing of MOVX instructions as a function of Stretch settings is provided in the Electrical
Specifications section of this data sheet. As an example, Table 8 shows the read and write strobe widths
corresponding to each Stretch value.

DATA MEMORY CYCLE STRETCH VALUES Table 8

MD2 MD1 MD0 Stretch

Cycle

Count

0 0 0 0* 2 0.5 t
0 0 1 1** 3 t
0 1 0 2 4 2 t
0 1 1 3 5 3 t
1 0 0 4 9 4 t
1 0 1 5 10 5 t
1 1 0 6 11 6 t
1 1 1 7 12 7 t

*All internal MOVX operations execute at the 0 Stretch setting.
** Default Stretch setting for external MOVX operations following reset.

MOVX

Machine

Cycles

RD, WR Pulse Width (in oscillator clocks)

t

MCS

(4X/ 2X = 1

CD1:0 = 00)

CLCL

CLCL

CLCL
CLCL
CLCL
CLCL
CLCL
CLCL

t

MCS

(4X/ 2X = 0

CD1:0 = 00)

1 t

CLCL

2 t

CLCL

4 t

CLCL

6 t

CLCL

8 t

CLCL

10 t

CLCL

12 t

CLCL

14 t

CLCL

t

MCS

(4X/ 2X = X

CD1:0 = 10)

2 t

CLCL

4 t

CLCL

8 t

CLCL

12 t

CLCL

16 t

CLCL

20 t

CLCL

24 t

CLCL

28 t

CLCL

t

MCS

(4X/ 2X = X

CD1:0 = 11)

2048 t

CLCL

4096 t

CLCL

8192 t

CLCL

12288 t
16384 t
20480 t
24576 t
28672 t

CLCL
CLCL
CLCL
CLCL
CLCL

EXTENDED STACK POINTER

The DS80C390 supports both the traditional 8-bit and an extended 10-bit stack pointer that improves the
performance of large programs written in high-level languages such as C. The 10-bit stack pointer
feature is enabled by setting the Stack Address Mode bit, SA (ACON.2). The bit is cleared following a
reset, forcing the device to use an 8-bit stack located in the Scratchpad RAM area. When the SA bit is
set, the device will address up to 1kB of stack memory in the first 1kB of the internal MOVX memory.
The 10-bit stack pointer address is generated by concatenating the lower two bits of the Extended Stack
Pointer (ESP;9Bh) and the traditional 8051 Stack Pointer (SP;81h). The 10-bit stack pointer cannot be
enabled when the 4kB of SRAM is mapped as both program and data memory.

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DS80C390

ENHANCED DUAL DATA POINTERS

The DS80C390 contains two data pointers, DPTR0 and DPTR1, designed to improve performance in
applications that require high data throughput. Incorporating a second data pointer allows the software to
greatly speed up block data (MOVX) moves by using one data pointer as a source register and the other
as the destination register.

DPTR0 is located at the same address as the original 8051 data pointer, allowing the DS80C390 to
execute standard 8051 code with no modifications. The second data pointer, DPTR1, is split between the
DPH1 and DPL1 SFRs, similar to the DPTR0 configuration. The active data pointer is selected with the
data pointer select bit SEL (DPS.0). Any instructions that reference the DPTR (i.e., MOVX A, @DPTR),
will select DPTR0 if SEL=0, and DPTR1 if SEL=1. Because the bits adjacent to SEL are not
implemented, the state of SEL (and thus the active data pointer) can be quickly toggled by the INC DPS
instruction without disturbing other bits in the DPS register.

Unlike the standard 8051, the DS80C390 has the ability to decrement as well as increment the data
pointers without additional instructions. When the INC DPTR instruction is executed, the active DPTR
increments or decrements according to the ID1, ID0 (DPS.7-6), and SEL (DPS.0) bits as shown. The
inactive DPTR is not affected.

DATA POINTER AUTOINCREMENT/DECREMENT CONFIGURATION Table 9

ID1 ID0 SEL Result of INC DPTR

X 0 0 Increment DPTR0
X 1 0 Decrement DPTR0

0 X 1 Increment DPTR1
1 X 1 Decrement DPTR1

Another useful feature of the device is its ability to automatically switch the active data pointer after a
DPTR-based instruction is executed. This feature can greatly reduce the software overhead associated
with data memory block moves, which toggle between the source and destination registers. When the
Toggle Select bit (TSL;DPS.5) is set to 1, the SEL bit (DPS.0) is automatically toggled every time one of
the following DPTR related instructions is executed.

INC DPTR
MOV DPTR, #data16
MOVC A, @A+DPTR
MOVX A, @DPTR
MOVX @DPTR, A

As a brief example, if TSL is set to 1, then both data pointers can be updated with two INC DPTR
instructions. Assume that SEL=0, making DPTR the active data pointer. The first INC DPTR increments
DPTR and toggles SEL to 1. The second instruction increments DPTR1 and toggles SEL back to 0.

INC DPTR
INC DPTR

CLOCK CONTROL AND POWER MANAGEMENT

The DS80C390 includes a number of unique features that allow flexibility in selecting system clock
sources and operating frequencies. To support the use of inexpensive crystals while allowing full speed
operation, a clock multiplier is included in the processor’s clock circuit. Also, in addition to the standard

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80C32 Idle and power down (Stop) modes, the DS80C390 provides a new Power Management Mode.
This mode allows the processor to continue instruction execution, yet at a very low speed to significantly
reduce power consumption (below even Idle mode). The DS80C390 also features several enhancements
to Stop mode that make this extremely low power mode more useful. Each of these features is discussed
in detail below.

SYSTEM CLOCK CONTROL

As mentioned previously, the microcontroller contains special clock control circuitry that simultaneously
provides maximum timing flexibility and maximum availability and economy in crystal selection. The
logical operation of the system clock divide control function is shown in Figure 2. A 3:1 multiplexer,
controlled by CD1, CD0 (PMR.7-6), selects one of three sources for the internal system clock:

§ Crystal oscillator or external clock source

§ (Crystal oscillator or external clock source) divided by 256

§ (Crystal oscillator or external clock source) frequency multiplied by 2 or 4 times.

SYSTEM CLOCK CONTROL DIAGRAM Figure 2

The system clock control circuitry generates two clock signals that are used by the microcontroller. The
internal system clock provides the timebase for timers and internal peripherals. The system clock is run
through a divide by 4 circuit to generate the machine cycle clock that provides the timebase for CPU
operations. All instructions execute in one to five machine cycles. It is important to note the distinction
between these two clock signals, as they are sometimes confused, creating errors in timing calculations.

Setting CD1, CD0 to 0 enables the frequency multiplier, either doubling or quadrupling the frequency of
the crystal oscillator or external clock source. The 2X4X/ bit controls the multiplying factor, selecting

twice or four times the frequency when set to 0 or 1, respectively. Enabling the frequency multiplier
results in apparent instruction execution speeds of 2 or 1 clocks. Regardless of the configuration of the
frequency multiplier, the system clock of the microcontroller can never be operated faster than 40 MHz.
This means that the maximum crystal oscillator or external clock source is 10 MHz when using the 4X
setting, and 20 MHz when using the 2X setting.

The primary advantage of the clock multiplier is that it allows the microcontroller to use slower crystals
to achieve the same performance level. This reduces EMI and cost, as slower crystals are generally more
available and thus less expensive.

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DS80C390

SYSTEM CLOCK CONFIGURATION Table 10

CD1 CD0

0 0 0 Frequency Multiplier (2X) 2 20 MHz
0 0 1 Frequency Multiplier (4X) 1 10 MHz
0 1 N/A Reserved
1 0 N/A Divide-by-four (Default) 4 40 MHz
1 1 N/A Power Management Mode 1024 40 MHz

The system clock and machine cycle rate changes one machine cycle after the instruction changing the
control bits. Note that the change will affect all aspects of system operation, including timers and baud
rates. The use of the switchback feature, described later, can eliminate many of the problems associated
with the Power Management Mode.

Changing the system clock/machine cycle clock frequency

The microcontroller incorporates a special locking sequence to ensure “glitch-free” switching of the
internal clock signals. All changes to the CD1, CD0 bits must pass through the 10 (divide-by-four) state.
For example, to change from 00 (frequency multiplier) to 11 (PMM), the software must change the bits in
the following sequence: 00 -> 10 -> 11. Attempts to switch between invalid states will fail, leaving the
CD1, CD0 bits unchanged.
The following sequence must be followed when switching to the frequency multiplier as the internal time
source. This sequence can only be performed when the device is in divide-by-four operation. The steps
must be followed in this order, although it is possible to have other instructions between them. Any
deviation from this order will cause the CD1, CD0 bits to remain unchanged. Switching from frequency
multiplier to non-multiplier mode requires no steps other than the changing of the CD1, CD0 bits.

2X4X/

Name Clocks/MC Max. External Frequency

1. Ensure that the CD1, CD0 bits are set to 10, and the RGMD (EXIF.2) bit = 0.

2. Clear the CTM (Crystal Multiplier Enable) bit.

3. Set the 2X4X/ bit to the appropriate state.

4. Set the CTM (Crystal Multiplier Enable) bit.

5. Poll the CKRDY bit (EXIF.4), waiting until it is set to 1. This will take approximately 65536 cycles

of the external crystal or clock source.

6. Set CD1, CD0 to 00. The frequency multiplier will be engaged on the machine cycle following the

write to these bits.

OSCILLATOR FAIL DETECT

The microprocessor contains a safety mechanism called an on-chip Oscillator Fail Detect circuit. When
enabled, this circuit causes the processor to be held in reset if the oscillator frequency falls below TBD
kHz. In operation, this circuit complements the Watchdog timer. Normally, the watchdog timer is
initialized so that it will time-out and will cause a processor reset in the event that the processor loses
control. In the event of a crystal or external oscillator failure, however, the watchdog timer will not
function and there is the potential for the processor to fail in an uncontrolled state. The use of the
oscillator fail detect circuit forces the processor to a known state (i.e., reset) even if the oscillator stops.

The oscillator fail detect circuitry is enabled when software sets the enable bit OFDE (PCON.4) to a 1.
Please note that software must use a “Timed Access” procedure (described later) to write this bit. The
OFDF (PCON.5) bit will also be set to a 1 when the circuitry detects an oscillator failure, and the
processor is forced into a reset state. This bit can only be cleared to a 0 by a power fail reset or by
software. The oscillator fail detect circuitry will not be activated when the oscillator is stopped due to the
processor entering Stop mode.

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