Maxim MXD1005C-D100, MXD1005C-D150, MXD1005C-D175, MXD1005C-D200, MXD1005C-D250 Datasheet

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TAP4
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_______________General Description
The MXD1005 silicon delay line offers five equally spaced taps with delays ranging from 12ns to 250ns and a nominal accuracy of ±2ns or ±3%, whichever is greater. Relative to hybrid solutions, this device offers enhanced performance and higher reliability, and reduces overall cost. Each tap can drive up to ten 74LS loads.
The MXD1005 is available in multiple versions, each offering a different combination of delay times. It comes in the space-saving 8-pin µMAX package, as well as an 8-pin SO or DIP, allowing full compatibility with the DS1005 and other delay line products.
________________________Applications
Clock Synchronization Digital Systems
____________________________Features
Improved Second Source to DS1005Available in Space-Saving 8-Pin µMAX Package17mA Supply Current vs. Dallas’ 40mALow CostDelay Tolerance of ±2ns or ±3%, whichever is
Greater
TTL/CMOS-Compatible LogicLeading- and Trailing-Edge AccuracyCustom Delays Available
MXD1005
5-Tap Silicon Delay Line
________________________________________________________________
Maxim Integrated Products
1
TAP3
TAP5GND
1 2
87V
CC
TAP1TAP2
TAP4
IN
DIP/SO/µMAX
TOP VIEW
3
4
6
5
MXD1005
14 13 12 11 10
9 8
1 2 3 4 5 6 7
V
CC
N.C. TAP1 N.C.TAP2
N.C.
N.C.
IN
MXD1005
TAP3 N.C. TAP5GND
TAP4
N.C.
DIP
_________________Pin Configurations
_____Part Number and Delay Times
19-1309; Rev 0; 10/97
PART
MXD1005C/D__ MXD1005PA__ MXD1005PD__ -40°C to +85°C
-40°C to +85°C
0°C to +70°C
TEMP. RANGE PIN-PACKAGE
Dice* 8 Plastic DIP 14 Plastic DIP
______________Ordering Information
*
Dice are tested at TA= +25°C. Note: To complete the ordering information, fill in the blank with the part number extension from the Part Number and Delay Times table to indicate the desired delay per output.
MXD1005SA__ MXD1005SE__ MXD1005UA__ -40°C to +85°C
-40°C to +85°C
-40°C to +85°C 8 SO 16 Narrow SO 8 µMAX
Pin Configurations continued at end of data sheet.
60 12
PART NUMBER
EXTENSION
(MXD1005_ _ __)
75 15
125
100 20
25
175
150 30
35
250
200 40
50
24 30 40 50 60 70 80
100
36 45 60 75
90 105 120 150
48 60
80 100 120 140 160 200
DELAY (t
PHL
, t
PLH
) PER OUTPUT (ns)
60
75 100 125 150 175 200 250
Note: Contact factory for characterization data. Functional Diagram appears at end of data sheet.
TAP1 TAP2 TAP3 TAP4 TAP5
MXD1005
5-Tap Silicon Delay Line
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC= +5.0V ±5%, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
TIMING CHARACTERISTICS
(VCC= +5.0V ±5%, TA= +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Specifications to -40°C are guaranteed by design, not production tested. Note 2: All voltages referenced to GND. Note 3: Measured with outputs open. Note 4: I
CC
is a function of frequency and TAP5 delay. Only an MXD1005_ _60 operating with a 40ns period and VCC= +5.25V will
have a maximum I
CC
of 70mA. For example, an MXD1005_ _100 will not exceed 30mA. See Supply Current vs. Input
Frequency graph in
Typical Operating Characteristics.
Note 5: Guaranteed by design. Note 6: Pulse width and/or period specifications may be exceeded, but accuracy is application sensitive (i.e., layout, decoupling, etc.). Note 7: VCC= +5V at +25°C. Typical delays are accurate on both rising and falling edges within ±2ns or ±3%. Note 8: See
Test Conditions
section.
Note 9: The combination of temperature variations from +25°C to 0°C or +25°C to +70°C and voltage variation from 5.0V to 4.75V
or 5.0V to 5.25V may produce an additional typical input-to-tap delay shift of ±1.5ns or ±4%, whichever is greater.
Note 10: All taps and outputs delays tend to vary unilaterally with temperature or supply variations. For example, if TAP1 slows
down, all other taps will also slow down; TAP3 cannot be faster than TAP2.
V
CC
to GND..............................................................-0.5V to +6V
All Other Pins..............................................-0.5V to (V
CC
+ 0.5V)
Short-Circuit Output Current (1sec)....................................50mA
Continuous Power Dissipation (T
A
= +70°C)
8-Pin Plastic DIP (derate 9.1mW/°C above +70°C) ......727mW
14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ..800mW
8-Pin SO (derate 5.9mW/°C above +70°C)..................471mW
16-Pin Narrow SO (derate 8.7mW/°C above +70°C)....696mW
8-Pin µMAX (derate 4.1mW/°C above +70°C).............330mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +160°C
Lead Temperature (soldering, 10sec).............................+300°C
(Note 2)
(Note 2)
(Note 2)
TA= +25°C (Note 5)
0V VIN≤ V
CC
VCC= 5.25V, period = minimum (Notes 3, 4) VCC= 4.75V, VOH= 4.0V VCC= 4.75V, VOL= 0.5V
CONDITIONS
V0.8V
IL
Input Voltage Low
V2.2V
IH
V4.75 5.00 5.25V
CC
Supply Voltage Input Voltage High
pF5 10C
IN
Input Capacitance
µA-1 1I
L
Input Leakage Current
mA17 70I
CC
Active Current
mA-1I
OH
Output Current High
mA12I
OL
Output Current Low
UNITSMIN TYP MAXSYMBOLPARAMETER
(Notes 7–10)
(Notes 7–10)
(Note 6)
(Note 6)
CONDITIONS
ns
See
Part Number and
Delay Times
table
t
PHL
Input-to-Tap Delay (trailing edge)
ns
See
Part Number and
Delay Times
table
t
PLH
ns
40% of TAP5
t
PLH
t
WI
Input Pulse Width Input-to-Tap Delay
(leading edge)
ms100t
PU
Power-Up Time
ns4(tWI)Period
UNITSMIN TYP MAXSYMBOLPARAMETER
MXD1005
5-Tap Silicon Delay Line
_______________________________________________________________________________________
3
__________________________________________Typical Operating Characteristics
(VCC= +5V, TA= +25°C, unless otherwise noted.)
-2.0
-1.0
-1.5
0
-0.5
1.5
1.0
0.5
2.0
-40 0-20 20 40 60 80 100
MXD1005_ _75
PERCENT CHANGE IN DELAY
vs. TEMPERATURE
MXD1005 TOC1
TEMPERATURE (°C)
% CHANGE IN DELAY (TAP2)
t
PLH
RELATIVE TO NOMINAL (+25°C)
t
PHL
t
PHL
t
PLH
-2.0
-1.0
-1.5
0
-0.5
1.5
1.0
0.5
2.0
-40 0-20 20 40 60 80 100
MXD1005_ _100 TO MXD1005_ _200
PERCENT CHANGE IN DELAY
vs. TEMPERATURE
MXD1005 TOC2
TEMPERATURE (°C)
% CHANGE IN DELAY (TAP2)
t
PHL
RELATIVE TO NOMINAL (+25°C)
t
PHL
t
PLH
t
PLH
-2.0
-1.0
-1.5
0
-0.5
1.5
1.0
0.5
2.0
-40 0-20 20 40 60 80 100
MXD1005_ _250
PERCENT CHANGE IN DELAY
vs. TEMPERATURE
MXD1005 TOC3
TEMPERATURE (°C)
% CHANGE IN DELAY (TAP2)
t
PHL
RELATIVE TO NOMINAL (+25°C)
t
PLH
t
PLH
t
PHL
18
10
11
12
13
14
15
16
17
0.001 0.1 10.01 10
ACTIVE CURRENT
vs. FREQUENCY
MXD1005 TOC4
FREQUENCY (MHz)
ACTIVE CURRENT (mA)
50% DUTY CYCLE
MXD1005_ _75
MXD1005_ _200
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