Maxim MXD1000C-D100, MXD1000C-D125, MXD1000C-D150, MXD1000PD100, MXD1000PD125 Datasheet

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_______________General Description
The MXD1000 silicon delay line offers five equally spaced taps with delays ranging from 4ns to 500ns and a nominal accuracy of ±2ns or ±5%, whichever is greater. Relative to hybrid solutions, this device offers enhanced performance and higher reliability, and reduces overall cost. Each tap can drive up to ten 74LS loads.
The MXD1000 is available in multiple versions, each offering a different combination of delay times. It comes in the space-saving 8-pin µMAX package, as well as an 8-pin SO or DIP, allowing full compatibility with the DS1000 and other delay line products.
________________________Applications
Clock Synchronization Digital Systems
____________________________Features
Improved Second Source to DS1000Available in Space-Saving 8-Pin µMAX Package20mA Supply Current (vs. Dallas’ 35mA)Low CostDelay Tolerance of ±2ns or ±5%, whichever is
Greater
TTL/CMOS-Compatible LogicLeading- and Trailing-Edge AccuracyCustom Delays Available
MXD1000
5-Tap Silicon Delay Line
________________________________________________________________
Maxim Integrated Products
1
TAP3
TAP5GND
1 2
87V
CC
TAP1TAP2
TAP4
IN
DIP/SO/µMAX
TOP VIEW
3
4
6
5
MXD1000
14 13 12 11 10
9 8
1 2 3 4 5 6 7
V
CC
N.C. TAP1 N.C.TAP2
N.C.
N.C.
IN
MXD1000
TAP3 N.C. TAP5GND
TAP4
N.C.
DIP
16 15 14 13 12 11 10
9
1 2 3 4 5 6 7 8
IN V
CC
N.C. N.C. TAP1 N.C. TAP3 N.C. TAP5
MXD1000
SO
N.C. N.C.
TAP4
TAP2
N.C.
N.C.
GND
__________________________________________________________Pin Configurations
19-1310; Rev 0; 10/97
PART
MXD1000C/D__ MXD1000PA__ MXD1000PD__ -40°C to +85°C
-40°C to +85°C
0°C to +70°C
TEMP. RANGE PIN-PACKAGE
Dice* 8 Plastic DIP 14 Plastic DIP
______________Ordering Information
*
Dice are tested at TA= +25°C. Note: To complete the ordering information, fill in the blank with the part number extension from the Part Number and Delay Times table (located at the end of this data sheet) to indicate the desired delay per output.
Functional Diagram appears at end of data sheet.
MXD1000SA__ MXD1000SE__ MXD1000UA__ -40°C to +85°C
-40°C to +85°C
-40°C to +85°C 8 SO 16 Narrow SO 8 µMAX
MXD1000
5-Tap Silicon Delay Line
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC= +5.0V ±5%, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 2)
TIMING CHARACTERISTICS
(VCC= +5.0V ±5%, TA = +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Contact factory for ordering information. Note 2: Specifications to -40°C are guaranteed by design, not production tested. Note 3: All voltages referenced to GND. Note 4: Measured with output open. Note 5:
ICCis a function of frequency and TAP5 delay. Only an MXD1000_ _25 operating with a 40ns period and VCC= +5.25V will have an I
CC
= 75mA. For example, an MXD1000_ _100 will never exceed 30mA. See Supply Current vs. Input Frequency in
Typical
Operating Characteristics.
Note 6: Guaranteed by design. Note 7: Pulse width and/or period specifications may be exceeded, but accuracy is application sensitive (i.e., layout, decoupling,
etc.). The device will remain functional with pulse widths down to 20% of TAP5 delay, and input periods as short as 2(t
WI
).
Note 8: Typical initial tolerances are ± with respect to the nominal value at +25°C and VCC= 5V. Note 9: Typical temperature tolerance is ± with respect to the initial delay value over a temperature range of -40°C to +85°C. Note 10: The delay will also vary with supply voltage, typically by less than 4% over the supply range of V
CC
= +4.75V to +5.25V.
Note 11: All tap delays tend to vary unidirectionally with temperature or voltage changes. For example, if TAP1 slows down, all other
taps will also slow down; i.e., TAP3 can never be faster than TAP2.
V
CC
to GND..............................................................-0.5V to +6V
All Other Pins..............................................-0.5V to (V
CC
+ 0.5V)
Short-Circuit Output Current (1sec)....................................50mA
Continuous Power Dissipation (T
A
= +70°C)
8-Pin Plastic DIP (derate 9.1mW/°C above +70°C) .......727mW
14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ...800mW
8-Pin SO (derate 5.9mW/°C above +70°C)....................471mW
16-Pin Narrow SO (derate 8.7mW/°C above +70°C).....696mW
8-Pin µMAX (derate 4.1mW/°C above +70°C)...............330mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +160°C
Lead Temperature (soldering, 10sec).............................+300°C
(Note 3)
(Note 3)
(Note 3)
TA= +25°C (Note 6)
0V VIN≤ V
CC
VCC= 5.25V, period = minimum (Notes 4, 5) VCC= 4.75V, VOH= 4.0V VCC= 4.75V, VOL= 0.5V
CONDITIONS
V0.8V
IL
Input Voltage Low
V2.2V
IH
V4.75 5.00 5.25V
CC
Supply Voltage Input Voltage High
pF5 10C
IN
Input Capacitance
µA-1 1I
L
Input Leakage Current
mA20 75I
CC
Active Current
mA-1I
OH
Output Current High
mA12I
OL
Output Current Low
UNITSMIN TYP MAXSYMBOLPARAMETER
(Notes 1, 8–12)
(Notes 1, 8–12)
(Note 7)
(Note 7)
CONDITIONS
ns
See
Part Number and
Delay Times
table
t
PHL
Input-to-Tap Delay (trailing edge)
ns
See
Part Number and
Delay Times
table
t
PLH
ns
40% of TAP5
t
PLH
t
WI
Input Pulse Width Input-to-Tap Delay
(leading edge)
ms100t
PU
Power-Up Time
ns4(tWI)Period
UNITSMIN TYP MAXSYMBOLPARAMETER
MXD1000
5-Tap Silicon Delay Line
_______________________________________________________________________________________
3
__________________________________________Typical Operating Characteristics
(VCC= +5V, TA= +25°C, unless otherwise noted.)
-2.0
-1.0
-1.5
0
-0.5
1.5
1.0
0.5
2.0
-40 0-20 20 40 60 80 100
MXD1000_ _75
PERCENT CHANGE IN DELAY
vs. TEMPERATURE
MXD1000 TOC01
TEMPERATURE (°C)
% CHANGE IN DELAY (TAP2)
t
PLH
RELATIVE TO NOMINAL (+25°C)
t
PHL
t
PHL
t
PLH
-2.0
-1.0
-1.5
0
-0.5
1.5
1.0
0.5
2.0
-40 0-20 20 40 60 80 100
MXD1000_ _100 TO MXD1000_ _200
PERCENT CHANGE IN DELAY
vs. TEMPERATURE
MXD1000 TOC2
TEMPERATURE (°C)
% CHANGE IN DELAY (TAP2)
t
PHL
RELATIVE TO NOMINAL (+25°C)
t
PHL
t
PLH
t
PLH
-2.0
-1.0
-1.5
0
-0.5
1.5
1.0
0.5
2.0
-40 0-20 20 40 60 80 100
MXD1000_ _250 TO MXD1000_ _500
PERCENT CHANGE IN DELAY
vs. TEMPERATURE
MXD1000 TOC03
TEMPERATURE (°C)
% CHANGE IN DELAY (TAP2)
t
PHL
RELATIVE TO NOMINAL (+25°C)
t
PLH
t
PLH
t
PHL
20
8
10
12
14
16
18
0.001 0.01 0.1 1 10 100
ACTIVE CURRENT
vs. FREQUENCY
MXD1000-04
FREQUENCY (MHz)
ACTIVE CURRENT (mA)
MXD1000_ _50
MXD1000_ _75
MXD1000_ _200
MXD1000_ _500
50% DUTY CYCLE
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