MAXIM MAXQ610 User Manual

General Description

The MAXQ610 is a low-power, 16-bit MAXQ®micro­controller designed for low-power applications includ­ing universal remote controls, consumer electronics,
and white goods. The MAXQ610 combines a powerful
16-bit RISC microcontroller and integrated peripherals
including two USARTs and an SPI™ master/slave com­munications port, along with an IR module with carrier
frequency generation and flexible port I/O capable of
multiplexed keypad control.

The MAXQ610 includes 64KB of flash memory and 2KB
of data SRAM. Intellectual property (IP) protection is
provided by a secure MMU that supports multiple
application privilege levels and protects code against
copying and reverse engineering. Privilege levels
enable vendors to provide libraries and applications to
execute on the MAXQ610, while limiting access to only
data and code allowed by their privilege level.

For the ultimate in low-power battery-operated perfor­mance, the MAXQ610 includes an ultra-low-power stop
mode (0.2µA, typ). In this mode, the minimum amount
of circuitry is powered. Wake-up sources include exter­nal interrupts, the power-fail interrupt, and a timer inter­rupt. The microcontroller runs from a wide 1.70V to 3.6V
operating voltage.

Applications

Remote Controls

Battery-Powered Portable Equipment

Consumer Electronics

Home Appliances

White Goods

Features

♦ High-Performance, Low-Power 16-Bit RISC Core

♦ DC to 12MHz Operation Across Entire Operating

Range

♦ 1.70V to 3.6V Operating Voltage Range

♦ 33 Total Instructions for Simplified Programming

♦ Three Independent Data Pointers Accelerate Data

Movement with Automatic Increment/Decrement

♦ Dedicated Pointer for Direct Read from Code Space

♦ 16-Bit Instruction Word, 16-Bit Data Bus

♦ 16 x 16-Bit General-Purpose Working Registers

♦ Secure MMU for Application Partitioning and IP

Protection

♦ Memory Features

64KB Flash:

512 Byte Sectors

20,000 Erase/Write Cycles per Sector
Masked ROM Available
2KB Data SRAM

♦ Additional Peripherals

Power-Fail Warning
Power-On Reset/Brownout Reset
Automatic IR Carrier Frequency Generation and

Modulation

Two 16-Bit, Programmable Timers/Counters with

Prescaler and Capture/Compare
SPI and Two USART Communication Ports
Programmable Watchdog Timer
8kHz Nanopower Ring Oscillator Wake-Up Timer
Up to 24 (MAXQ610A) or 32 (MAXQ610B)

General-Purpose I/Os

♦ Low-Power Consumption

0.2µA (typ), 2.0µA (max) in Stop Mode

TA= +25°C, Power-Fail Monitor Disabled

3.75mA (typ) at 12MHz in Active Mode

MAXQ610

16-Bit Microcontroller with Infrared Module

________________________________________________________________

Maxim Integrated Products

1

Ordering Information

19-4715; Rev 6; 7/11

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be

simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata

.

EVALUATION KIT

AVAILABLE

Note: The 4-digit suffix “-0000” indicates a microcontroller in the

default state with the flash memory unprogrammed. Any value
other than 0000 indicates a device preprogrammed at Maxim
with proprietary customer-supplied software. For more information
on factory preprogramming of these devices, contact Maxim at

https://support.maxim-ic.com/micro

. Information on masked

ROM devices and tape and reel versions are also available.

+

Denotes a lead(Pb)-free/RoHS-compliant package.

*

Contact factory for ordering requirements.

†

EP = Exposed pad.

PART TEMP RANGE PIN-PACKAGE

MAXQ610A-0000+ 0°C to +70°C 32 TQFN-EP

†

MAXQ610B-0000+ 0°C to +70°C 40 TQFN-EP

†

MAXQ610J-0000+ 0°C to +70°C 44 TQFN-EP

†

MAXQ610X-0000+* 0°C to +70°C Bare die

Pin Configurations and Selector Guide appear at end of
data sheet.

MAXQ is a registered trademark of Maxim Integrated Products, Inc.

SPI is a trademark of Motorola, Inc.

MAXQ610

16-Bit Microcontroller with Infrared Module

2 _______________________________________________________________________________________

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

SPI Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Stack Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Utility ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

IR Carrier Generation and Modulation Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Carrier Generation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

IR Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

IR Transmit—Independent External Carrier and Modulator Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

IR Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Carrier Burst-Count Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

16-Bit Timers/Counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

General-Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

On-Chip Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

ROM Loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Loading Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

In-Application Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

In-Circuit Debug and JTAG Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Power-Fail Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Applications Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Grounds and Bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Differences for ROM Versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Development and Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

TABLE OF CONTENTS

MAXQ610

16-Bit Microcontroller with Infrared Module

_______________________________________________________________________________________ 3

Table 1. Memory Areas and Associated Maximum Privilege Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Table 2. Watchdog Interrupt Timeout (Sysclk = 12MHz, CD[1:0] = 00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Table 3. USART Mode Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Table 4. Power-Fail Detection States During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Table 5. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . . .24

Table 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . .25

LIST OF TABLES

Figure 1. IR Transmit Frequency Shifting Example (IRCFME = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 2. IR Transmit Carrier Generation and Carrier Modulator Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 3. IR Transmission Waveform (IRCFME = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Figure 4. External IRTXM (Modulator) Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Figure 5. IR Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Figure 6. Receive Burst-Count Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Figure 7. SPI Master Communication Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Figure 8. SPI Slave Communication Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Figure 9. On-Chip Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Figure 10. In-Circuit Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Figure 11. Power-Fail Detection During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Figure 12. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . .24

Figure 13. Stop Mode Power-Fail Detection with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

LIST OF FIGURES

MAXQ610

16-Bit Microcontroller with Infrared Module

4 _______________________________________________________________________________________

RECOMMENDED DC OPERATING CONDITIONS

(VDD= V

RST

to 3.6V, TA= 0°C to +70°C.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

Voltage Range on VDDwith Respect to GND .......-0.3V to +3.6V

Voltage Range on Any Lead with Respect

to GND except V

DD ......................................

-0.3V to (VDD+ 0.5V)

Continuous Power Dissipation (Multilayer Board, TA= +70°C)

32 TQFN (derate 34.5mW/°C above +70°C) ...........2758.6mW

40 TQFN (derate 35.7mW/°C above +70°C) ..............2963mW

44 TQFN (derate 37mW/°C above +70°C) ..............2758.6mW

Operating Temperature Range...............................0°C to +70°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

ABSOLUTE MAXIMUM RATINGS

Supply Voltage V

1.8V Internal Regulator V

Power-Fail Warning Voltage for
Supply (Notes 2, 3)

Power-Fail Reset Voltage
(Note 4)

Power-On Reset Voltage V

RAM Data-Retention Voltage V

Active Current (Note 6) I

Stop-Mode Current

Current Consumption During
Power-Fail

Power Consumption During
Power-On Reset

Stop-Mode Resume Time t

Power-Fail Monitor Startup Time t

Power-Fail Warning Detection
Time

Input Low Voltage for IRTX,
IRRX, RESET, and All Port Pins

Input High Voltage for IRTX,
IRRX, RESET, and All Port Pins

Input Hysteres is (Schm itt) V

Input Low Voltage for HFXIN V

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

V

DD

REG18

V

PFW

V

RST

POR

DRV

DD_1

I

S1

I

S2

I

PFR

I

POR

ON

PRM_ON

t

PFW

V

V

IHYS

IL_HFXIN

1.62 1.8 1.98 V

Monitors VDD 1.75 1.8 1.85 V

Monitors VDD 1.64 1.67 1.70 V

Monitors VDD 1.0 1.42 V

(Note 5) 1.0 V

Syscl k = 12MHz 3.75 5.1 mA

Power-Fail Off

Power-Fail On

(Notes 5, 7)

(Note 8) 100 nA

375 + 8192t

(Note 5) 150 μs

(Notes 5, 9) 10 μs

V

IL

IH

300 mV

V

3.6 V

RST

TA = +25°C 0.2 2.0

T

= 0°C to +70°C 0.2 12

A

TA = +25°C 22 29.5

T

= 0°C to +70°C 27.6 42

A

[(3 x I

) + ((PCI - 3) x

S2

(I

S1

GND

0.7 x
V

DD

GND

+ I

))]/PCI

NANO

μs

HFXIN

0.3 x
V

DD

VDD V

0.3 x
V

DD

μA

μA

V

V

MAXQ610

16-Bit Microcontroller with Infrared Module

_______________________________________________________________________________________ 5

RECOMMENDED DC OPERATING CONDITIONS (continued)

(VDD= V

RST

to 3.6V, TA= 0°C to +70°C.) (Note 1)

Input High Voltage for HFXIN V

IRRX Input Filter Pulse-Width
Reject

IRRX Input Filter Pulse-Width
Accept

Output Low Voltage for IRTX V

Output Low Voltage for RESET
and Al l Port Pins (Note 10)

Output High Voltage for IRTX and
All Port Pins

Input/Output Pin Capacitance for
All Port Pins

Input Leakage Current IL Internal pullup disabled -100 +100 nA
Input Pullup Resistor for RESET,

IRTX, IRRX, and All Port Pins

EXTERNAL CRYSTAL/RESONATOR

Crystal/Resonator f

Crystal/Resonator Period t

Crystal/Resonator Warmup Time t

Oscillator Feedback Resi stor R

EXTERNAL CLOCK INPUT

External Cloc k Frequenc y f

External Clock Period t

External Clock Duty Cycle t

System Clock Frequency f

System Clock Period tCK 1/fCK MHz

NANOPOWER RING OSCILLATOR

Nanopower Ring O scillator
Frequency

Nanopower Ring O scillator Duty
Cycle

Nanopower Ring O scillator
Current

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

IH_HFXIN

50 ns

t

IRRX_R

300 ns

t

IRRX_A

0.7 x
V

DD

VDD V

VDD = 3.6V, IOL = 25mA (Note 5) 1.0

OL_IRTX

VDD = 2.35V, IOL = 10mA (Note 5) 1.0

V

VDD = 1.85V, IOL = 4.5mA 1.0

VDD = 3.6V, IOL = 11mA (Note 5) 0.4 0.5

V

OL

VDD = 2.35V, IOL = 8mA (Note 5) 0.4 0.5

V

VDD = 1.85V, IOL = 4.5mA 0.4 0.5

V

-

V

IOH = -2mA

OH

C

(Note 5) 15 pF

IO

R

PU

HFXI N

HFXI N

XTAL_RDY

OSCF

XCLK

XCLK

XCLK_DUTY

CK

f

NANO

t

NANO

I

NANO

VDD = 3.0V, VOL = 0.4V (Note 5) 16 28 39

VDD = 2.0V, VOL = 0.4V 17 30 41

1 12 MHz

1/f

From initial oscillation 8192 x t

(Note 5) 0.5 1.0 1.5 M

DC 12 MHz

1/f

45 55 %

f

HFXOUT = GND f

TA = +25°C 3.0 8.0 20.0

TA = +25°C, VDD = POR vo ltage (Note 5) 1.7 2.4

(Note 5) 40 60 %

Typical at VDD = 1.64V, TA = +25°C
(Note 5)

DD

0.5

V

V

DD

k

ns

HFXIN

ms

HFXIN

ns

XCLK

HFIN

XCLK

MHz

kHz

40 400 nA

MAXQ610

16-Bit Microcontroller with Infrared Module

6 _______________________________________________________________________________________

RECOMMENDED DC OPERATING CONDITIONS (continued)

(VDD= V

RST

to 3.6V, TA= 0°C to +70°C.) (Note 1)

Note 1: Specifications to 0°C are guaranteed by design and are not production tested.
Note 2: It is not recommended to write to flash memory when the supply voltage drops below the power-fail warning levels as

there is uncertainty in the duration of continuous power supply. The user application should check the status of the power­fail warning flag before writing to flash to ensure complete write operations.

Note 3: The power-fail warning monitor and the power-fail reset monitor track each other with a minimum delta between the two of

0.11V.

Note 4: The power-fail reset and power-on-reset (POR) detectors operate in tandem to ensure that one or both signals are active

at all times when V

DD

< V

RST

. Doing so ensures the device maintains the reset state until the minimum operating voltage is

achieved.

Note 5: Guaranteed by design and not production tested.
Note 6: Measured on the V

DD

pin and the part not in reset. All inputs are connected to GND or VDD. Outputs do not source/sink

any current. Part is executing code from flash memory.

Note 7: The power-check interval (PCI) can be set to always on, 1024, 2048, or 4096 nanopower ring oscillator clock cycles.
Note 8: Current consumption during POR when powering up while V

DD

< V

POR

.

Note 9: The minimum amount of time that V

DD

must be below V

PFW

before a power-fail event is detected.

Note 10: The maximum total current, I

OH

(max) and IOL(max), for all listed outputs combined should not exceed 32mA to satisfy

the maximum specified voltage drop. This does not include the IRTX output.

Note 11: Programming time does not include overhead associated with utility ROM interface.

WAKE-UP TIMER

Wake-Up Timer Interval t

FLASH M EMORY

System Clock During Flash
Programm ing/Erase

Flash Erase Time

Flash Programming Time per
Word

Write/Erase Cycles 20,000 Cycles

Data Retention TA = +25°C 100 Years

IR

Carrier Frequency fIR (Note 5) fCK/2 Hz

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

WAKEUP

f

FPSYSCLK

1/f

6 MHz

tME Mas s erase 20 40

t

Page erase 20 40

ERAS E

t

(Note 11) 20 100 μs

PROG

NANO

65,535/

f

NANO

s

ms

MAXQ610

16-Bit Microcontroller with Infrared Module

_______________________________________________________________________________________ 7

SPI ELECTRICAL CHARACTERISTICS

(VDD= V

RST

to 3.6V, TA= 0°C to +70°C. AC electrical specifications are guaranteed by design and are not production tested.)

SPI Master Operating Frequency 1/t

SPI Slave Operating Frequency 1/t

SPI I/O Rise/Fall T ime t

SCLK Output Pulse-Width
High/Low

MOSI Output Ho ld T ime After
SCLK Sample Edge

MOSI Output Valid to Sample
Edge

MISO Input Valid to SCLK
Sample Edge Rise/Fall Setup

MISO Input to SCLK Sample
Edge Rise/Fall Ho ld

SCLK Inactive to MOSI Inactive t

SCLK Input Pulse-Width
High/Low

SSEL Active to First Shift Edge t

MOSI Input to SCLK Sample
Edge Rise/Fall Setup

MOSI Input from SCLK Sample
Edge Transit ion Hold

MISO Output Valid After SCLK
Shift Edge Transition

SSEL Inactive t

SCLK Inactive to SSEL Rising tSD t

MISO Output Di sabled After
SSEL Edge Rise

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

fCK/2 MHz

MCK

fCK/4 MHz

SCK

CL = 15pF, pullup = 560 8.3 23.6 ns

SPI_RF

t

, t

MCH

MCL

t

MOH

t

MOV

t

25 ns

MIS

0 ns

t

MIH

MLH

, t

t

SCH

t

SCL

t

SSE

t

t

SIS

t

t

SIH

2t

t

SOV

SSH

t

SLH

t

/2 -

MCK

t

SPI_RF

t

MCK

t

SPI_RF

t

MCK

t

SPI_RF

t

MCK

t

SPI_RF

SPI_RF

SPI_RF

SPI_RF

tCK +

t

SPI_RF

SPI_RF

/2 -

/2 -

/2 -

ns

ns

ns

ns

/2 ns

SCK

ns

ns

ns

SPI_RF

ns

ns

2t

CK

2t

SPI_RF

ns

+

ns

MAXQ610

16-Bit Microcontroller with Infrared Module

8 _______________________________________________________________________________________

Pin Description

PIN

32 TQFN 40 TQFN 44 TQFN

POWER PINS

15, 29 18, 38 19, 41 V

13, 22, 30 —

14 17 18 REGOUT

— — — EP

RESET PINS

28 37 40 RESET

CLOCK PINS

18 21 23 HFXIN

19 22 24 HFXOUT

IR FUNCTION PINS

31 39 43 IRTX

32 40 44 IRRX

17, 20,

28, 42

NAME FUNCTION

Supply Voltage

DD

Ground. These pins must be directly connected to the ground plane. The 40-pin

GND

TQFN package does not have any ground pin s and connect s to ground through
the exposed pad.

Regulator Capacitor. This pin must be connected to ground through a 1.0μF
external ceramic-chip capacitor. The capac itor must be placed as close to this
pin as possible. No devices other than the capacitor should be connected to
this pin.

Exposed Pad. For the 32-pin TQFN package, leave unconnected.
For the 40-pin TQFN package, the exposed pad is internally connected to GND.
Connect to the ground plane.
For the 44-pin TQFN package, the EP has no internal connection to the device.
Leave unconnected. Not intended as an electrical connection point.

Digital, Active-Low, Reset Input/Output. The CPU is held in reset when this pin
is low and begins executing from the reset vector when released. The pin
includes pullup current source and should be driven by an open-drain, external
source capable of sinking in excess of 4mA. This pin is driven low as an output
when an internal reset condition occurs.

High-Frequency Cr ystal Input. Connect external crystal or resonator between
HFXIN and HFXOUT as the high-frequency system clock. Alternatively, HFXIN is
the input for an external, high-frequency c lock source when HFXOUT is
unconnected.

IR Transmit Output. IR transmit pin capab le of s in king 25mA. Thi s pin defaults
to high-impedance input with the weak pullup disabled during al l forms of reset.
Software must configure thi s pin after release from reset to remove the h igh­impedance input condition.

IR Re ceive Input. IR recei ve pin. This pin defaults to high-impedance input with
the wea k pullup disabled during all forms of reset. Software must configure thi s
pin after relea se from reset to remove the high-impedance input condition.

MAXQ610

16-Bit Microcontroller with Infrared Module

_______________________________________________________________________________________ 9

Pin Description (continued)

PIN

32 TQFN 40 TQFN 44 TQFN

1–8 1, 3, 5–10

9–12, 16,

17, 20, 21

11–14,
19, 20,

23, 24

1, 3,

5–10

11–14,
21, 22,

25, 26

NAME FUNCTION

GENERAL-PURPOSE I/O AND SPECIAL FUNCTION PINS

General-Purpose, Digital, I/O, Type-C Port. These port pins function as

bidirectional I/O pins. All port pins default to high-impedance mode after a reset.
Software must configure these p in s after release from reset to remove the high-

P0.0–

P0.7;

IRTXM,
RX0, TX0,
RX1, TX1,

TBA0/
TBA1,
TBB0/

TBB1

P1.0–

P1.7;

INT0–

INT7

impedance input condition. A ll alternate functions must be enabled from
software.

32 TQFN 40 TQFN 44 TQFN PORT SPECIAL FUNCTION

1 1 1 P0.0 IRTXM

2 3 3 P0.1 RX0

3 5 5 P0.2 TX0

4 6 6 P0.3 RX1

5 7 7 P0.4 TX1

6 8 8 P0.5 TBA0/TB A1

7 9 9 P0.6 TBB0

8 10 10 P0.7 TBB1

General-Purpose, Digital, I/O, Type-D Port; External Edge-Selectable Interrupt.

These port pins function as bidirectional I/O pins or as interrupts. All port pins
default to high-impedance mode after a reset. Software must configure these
pins after release from reset to remove the high-impedance input condition. A ll
interrupt functions must be enabled from software.

32 TQFN 40 TQFN 44 TQFN PORT SPECIAL FUNCTION

9 11 11 P1.0 INT0

10 12 12 P1.1 INT1

11 13 13 P1.2 INT2

12 14 14 P1.3 INT3

16 19 21 P1.4 INT4

17 20 22 P1.5 INT5

20 23 25 P1.6 INT6

21 24 26 P1.7 INT7