MAXIM MAX9996 Technical data

General Description
The MAX9996 high-linearity downconversion mixer pro­vides 8.3dB gain, +26.5dBm IIP3, and 9.7dB NF for 1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS base-station receiver applications. With a 1900MHz to 2400MHz LO frequency range, this particular mixer is ideal for high-side LO injection receiver architectures. Low-side LO injection is supported by the MAX9994, which is pin-for-pin and functionally compatible with the MAX9996.
In addition to offering excellent linearity and noise per­formance, the MAX9996 also yields a high level of com­ponent integration. This device includes a double­balanced passive mixer core, an IF amplifier, a dual­input LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9996 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 240mA.
The MAX9994/MAX9996 are pin compatible with the MAX9984/MAX9986 815MHz to 995MHz mixers, mak­ing this entire family of downconverters ideal for appli­cations where a common PC board layout is used for both frequency bands. The MAX9996 is also functional­ly compatible with the MAX9993.
The MAX9996 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed paddle. Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
Applications
UMTS/WCDMA Base Stations
DCS1800/PCS1900 EDGE Base Stations
cdmaOne™ and cdma2000
®
Base Stations
PHS/PAS Base Stations
Predistortion Receivers
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Microwave Links
Digital and Spread-Spectrum Communication Systems
Features
1700MHz to 2200MHz RF Frequency Range1900MHz to 2400MHz LO Frequency Range
(MAX9996)
1400MHz to 2000MHz LO Frequency Range
(MAX9994)
40MHz to 350MHz IF Frequency Range8.3dB Conversion Gain+26.5dBm Input IP3+12.6dBm Input 1dB Compression Point9.7dB Noise Figure72dBc 2LO-2RF Spurious Rejection at
PRF= -10dBm
Integrated LO BufferIntegrated RF and LO Baluns for Single-Ended
Inputs
Low -3dBm to +3dBm LO DriveBuilt-In SPDT LO Switch with 43dB LO1 to LO2
Isolation and 50ns Switching Time
Pin Compatible with MAX9984/MAX9986 815MHz
to 995MHz Mixers
Functionally Compatible with MAX9993External Current-Setting Resistors Provide Option
for Operating Mixer in Reduced Power/Reduced Performance Mode
Lead-Free Package Available
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
________________________________________________________________ Maxim Integrated Products 1
Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet.
19-3531; Rev 0; 12/04
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
Ordering Information
*EP = Exposed paddle. + = Lead free. D = Dry pack. T = Tape-and-reel.
cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group.
PART TEMP RANGE PIN-PACKAGE
MAX9996ETP - 40° C to + 85° C
MAX9996ETP-T - 40° C to + 85° C
MAX9996ETP+D - 40° C to + 85° C
M AX 9996E TP + TD - 40° C to + 85° C
20 Thi n QFN - E P * 5m m × 5m m
20 Thi n QFN - E P * 5m m × 5m m
20 Thi n QFN - E P * 5m m × 5m m
20 Thi n QFN - E P * 5m m × 5m m
PKG
CODE
T2055- 3
T2055- 3
T2055- 3
T2055- 3
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC= +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCCthrough inductive chokes, R
1
= 806, R2= 549, TC= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +5V, TC=
+25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (V
CC
+ 0.3V)
TAP ........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
Continuous Power Dissipation (T
A
= +70°C)
20-Pin Thin QFN-EP (derate 26.3mW/°C above +70°C)...........2.1W
θ
JA
.................................................................................+38°C/W
θ
JC
.................................................................................+13°C/W
Operating Temperature Range (Note A) ....T
C
= -40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note A: T
C
is the temperature on the exposed paddle of the package.
AC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC= +4.75V to +5.25V, RF and LO ports are driven from 50sources, PLO= -3dBm to +3dBm, P
RF
= -5dBm, fRF= 1700MHz to 2200MHz, fLO= 1900MHz to 2400MHz, fIF= 200MHz, fLO> fRF, TC= -40°C to +85°C,
unless otherwise noted. Typical values are at V
CC
= +5V, P
RF
= -5dBm, PLO= 0dBm, fRF= 1900MHz, fLO= 2100MHz, fIF= 200MHz,
T
C
= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
Supply Current I
LO_SEL Input-Logic Low V
LO_SEL Input-Logic High V
CC
CC
IL
IH
4.75 5.00 5.25 V
2V
206 240 mA
0.8 V
RF Frequency Range f
LO Frequency Range f
IF Frequency Range f
Conversion Gain G
Gain Variation Over Temperature TC = -40°C to +85°C ±0.75 dB
Input Compression Point P
Input Third-Order Intercept Point IIP3
Input IP3 Variation Over Temperature
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF
LO
IF
1dB
(Note 3) 1700 2200 MHz
(Note 3) 1900 2400
MAX9994 1400 2000
P
C
RF
(Note 4) 12.6 dBm
Two tones: f
RF1
P
= -5dBm/tone, fLO = 2200MHz,
RF
P
LO
= -40°C to +85°C ±0.5 dB
T
C
40 350 MHz
< +2dBm, TA = +25°C 7.0 8.3 9.0 dB
= 2000MHz, f
= 0dBm, TA = +25°C
= 2001MHz,
RF2
23.5 26.5 dBm
MHz
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 3
Note 1: Guaranteed by design and characterization. Note 2: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Note 3: Operation outside this range is possible, but with degraded performance of some parameters. Note 4: Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Note 5: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9996 Typical Application Circuit, VCC= +4.75V to +5.25V, RF and LO ports are driven from 50sources, PLO= -3dBm to +3dBm, P
RF
= -5dBm, fRF= 1700MHz to 2200MHz, fLO= 1900MHz to 2400MHz, fIF= 200MHz, fLO> fRF, TC= -40°C to +85°C,
unless otherwise noted. Typical values are at V
CC
= +5V, P
RF
= -5dBm, PLO= 0dBm, fRF= 1900MHz, fLO= 2100MHz, fIF= 200MHz,
T
C
= +25°C, unless otherwise noted.) (Notes 1, 2)
Noise Figure NF Single sideband 9.7 dB
Noise Figure Under-Blocking
LO Drive -3 +3 dBm
Spurious Response at IF
LO1 to LO2 Isolation
Maximum LO Leakage at RF Port P
Maximum LO Leakage at IF Port PLO = +3dBm -30 dBm
Minimum RF-to-IF Isolation 40 dB
LO Switching Time 50% of LOSEL to IF settled to within 2° 50 ns
RF Port Return Loss 15 dB
LO Port Return Loss
IF Port Return Loss
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
2 x 2 2LO-2RF
3 x 3 3LO-3RF
P
R F
= 2190M H z, f
f
L O
LO2 selected, 1900MHz < f
LO1 selected, 1900MHz < f
= +3dBm -20 dBm
LO
LO1/2 port selected, LO2/1 and IF terminated
LO1/2 port unselected, LO2/1 and IF terminated
LO driven at 0dBm, RF terminated into 50Ω, differential 200
= 5d Bm , f
= 2000M H z,
R F
B LOC K
= 2100M H z ( N ote 5)
PRF = -10dBm 72
= -5dBm 67
P
RF
PRF = -10dBm 87
P
= -5dBm 77
RF
< 2100MHz 49
LO
< 2100MHz 43
LO
19 dB
16
26
20 dB
dBc
dB
dB
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
4 _______________________________________________________________________________________
Typical Operating Characteristics
(MAX9996 Typical Application Circuit, VCC= +5.0V, PLO= 0dBm, PRF= -5dBm, fLO> fRF, fIF= 200MHz, unless otherwise noted.)
6
7
9
8
10
11
1500 1700 1900 2100 2300
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc01
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
TC = +85°C
TC = +25°C
TC = -25°C
6
7
9
8
10
11
1500 1700 1900 2100 2300
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc02
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
PLO = -3dBm, 0dBm, +3dBm
6
7
9
8
10
11
1500 1700 1900 2100 2300
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc03
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
VCC = 4.75V, 5.0V, 5.25V
21
23
22
25
24
27
26
28
1500 1700 1900 2100 2300
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc04
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
TC = +25°C
TC = -25°C
TC = +85°C
23
22
25
24
27
26
28
1500 1700 1900 2100 2300
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc05
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
PLO = -3dBm, 0dBm, +3dBm
23
22
25
24
27
26
28
1500 1700 1900 2100 2300
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc06
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
VCC = 5.25V
VCC = 4.75V, 5.0V
7
6
9
8
11
12
10
13
1500 1700 1900 2100 2300
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc07
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
TC = +85°C
TC = +25°C
TC = -25°C
7
8
10
11
9
12
1500 1700 1900 2100 2300
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc08
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
PLO = +3dBm
PLO = -3dBm
PLO = 0dBm
7
8
10
11
9
12
1500 1700 1900 2100 2300
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc09
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 5
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC= +5.0V, PLO= 0dBm, PRF= -5dBm, fLO> fRF, fIF= 200MHz, unless otherwise noted.)
2LO-2RF RESPONSE vs. RF FREQUENCY
85
PRF = -5dBm
80
75
70
65
60
2LO-2RF RESPONSE (dBc)
55
50
45
TC = +85°C
1500 1700 1900 2100 2300
TC = +25°C
T
= -25°C
C
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
95
PRF = -5dBm
90
85
80
75
70
3LO-3RF RESPONSE (dBc)
65
60
55
1500 1700 1900 2100 2300
= -25°C
T
C
RF FREQUENCY (MHz)
TC = +85°C
TC = +25°C
MAX9996 toc10
MAX9996 toc13
2LO-2RF RESPONSE vs. RF FREQUENCY
85
PRF = -5dBm
80
75
70
65
60
2LO-2RF RESPONSE (dBc)
55
50
45
PLO = +3dBm
PLO = 0dBm
PLO = -3dBm
1500 1700 1900 2100 2300
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
95
PRF = -5dBm
90
85
80
75
70
3LO-3RF RESPONSE (dBc)
65
60
55
PLO = -3dBm, 0dBm, +3dBm
1500 1700 1900 2100 2300
RF FREQUENCY (MHz)
85
80
MAX9996 toc11
75
70
65
60
2LO-2RF RESPONSE (dBc)
55
50
45
1500 1700 1900 2100 2300
95
90
MAX9996 toc14
85
80
75
70
3LO-3RF RESPONSE (dBc)
65
60
55
1500 1700 1900 2100 2300
2LO-2RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm
= 5.0V
V
= 5.25V
V
CC
RF FREQUENCY (MHz)
CC
VCC = 4.75V
3LO-3RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
RF FREQUENCY (MHz)
MAX9996 toc12
MAX9996 toc15
INPUT P
15
14
13
(dBm)
1dB
12
INPUT P
TC = -25°C
11
10
1500 1700 1900 2100 2300
vs. RF FREQUENCY
1dB
TC = +85°C
TC = +25°C
RF FREQUENCY (MHz)
MAX9996 toc16
INPUT P
15
14
13
(dBm)
1dB
12
INPUT P
11
10
1500 1700 1900 2100 2300
vs. RF FREQUENCY
1dB
PLO = -3dBm, 0dBm, +3dBm
RF FREQUENCY (MHz)
MAX9996 toc17
INPUT P
15
14
13
(dBm)
1dB
12
INPUT P
VCC = 4.75V
11
10
1500 1700 1900 2100 2300
vs. RF FREQUENCY
1dB
VCC = 5.25V
VCC = 5.0V
RF FREQUENCY (MHz)
MAX9996 toc18
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC= +5.0V, PLO= 0dBm, PRF= -5dBm, fLO> fRF, fIF= 200MHz, unless otherwise noted.)
45
35
40
30
50
1700 1900 2100 2300 2500
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX9996 toc20
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
PLO = -3dBm, 0dBm, +3dBm
45
35
40
30
50
1700 1900 2100 2300 2500
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX9996 toc19
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
TC = -25°C
TC = +25°C
TC = +85°C
45
35
40
30
50
1700 1900 2100 2300 2500
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX9996 toc21
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
VCC = 4.75V, 5.0V, 5.25V
-30
-50
-40
-60
-20
-35
-55
-45
-25
1700 1900 2100 2300 2500
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX9996 toc22
LO FREQUENCY (MHz)
LO LEAKAGE (dBm)
TC = -25°C
TC = +85°C
T
C
= +25°C
-30
-50
-40
-60
-20
-35
-55
-45
-25
1700 1900 2100 2300 2500
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX9996 toc23
LO FREQUENCY (MHz)
LO LEAKAGE (dBm)
PLO = -3dBm
PLO = 0dBm
P
LO
= +3dBm
-30
-50
-40
-20
-35
-55
-45
-25
1700 1900 2100 2300 2500
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX9996 toc24
LO FREQUENCY (MHz)
LO LEAKAGE (dBm)
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
-20
-30
-10
-25
-15
1700 1900 2100 2300 2500
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX9996 toc25
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
TC = -25°C, +25°C, +85°C
-20
-30
-10
-25
-15
1700 21001900 2300 2500
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX9996 toc26
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
PLO = -3dBm, 0dBm, +3dBm
-20
-30
-10
-25
-15
1700 1900 2100 2300 2500
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX9996 toc27
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 7
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC= +5.0V, PLO= 0dBm, PRF= -5dBm, fLO> fRF, fIF= 200MHz, unless otherwise noted.)
RF-TO-IF ISOLATION
vs. RF FREQUENCY
60
55
50
45
40
RF-TO-IF ISOLATION (dB)
35
30
1500 1700 1900 2100 2300
TC = +85°C
TC = +25°C
TC = -25°C
RF FREQUENCY (MHz)
RF PORT RETURN LOSS
vs. RF FREQUENCY
0
5
10
15
20
25
30
RF PORT RETURN LOSS (dB)
35
40
PLO = -3dBm, 0dBm, +3dBm
1500 1700 1900 2100 2300 2500
RF FREQUENCY (MHz)
60
55
MAX9996 toc28
50
45
40
RF-TO-IF ISOLATION (dB)
35
30
1500 1700 1900 2100 2300
0
5
MAX9996 toc31
10
15
20
25
30
35
IF PORT RETURN LOSS (dB)
40
45
50
RF-TO-IF ISOLATION
vs. RF FREQUENCY
PLO = -3dBm, 0dBm, +3dBm
RF FREQUENCY (MHz)
IF PORT RETURN LOSS
vs. IF FREQUENCY
VCC = 4.75V, 5.0V, 5.25V
50 150 200100 250 300 350
IF FREQUENCY (MHz)
60
55
MAX9996 toc29
50
45
40
RF-TO-IF ISOLATION (dB)
35
30
1500 1700 1900 2100 2300
0
MAX9996 toc32
5
10
15
20
25
30
LO SELECTED RETURN LOSS (dB)
35
40
1500 1700 1900 2100 2300 2500
RF-TO-IF ISOLATION
vs. RF FREQUENCY
VCC = 4.75V, 5.0V, 5.25V
RF FREQUENCY (MHz)
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
PLO = +3dBm
PLO = -3dBm
PLO = 0dBm
LO FREQUENCY (MHz)
MAX9996 toc30
MAX9996 toc33
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
0
5
10
15
20
25
30
LO UNSELECTED RETURN LOSS (dB)
35
40
1500 1700 1900 2100 2300 2500
PLO = -3dBm, 0dBm, +3dBm
LO FREQUENCY (MHz)
MAX9996 toc34
230
220
210
200
190
SUPPLY CURRENT (mA)
180
170
-30 -10 10 30 50 70 90
SUPPLY CURRENT
vs. TEMPERATURE (T
VCC = 5.25V
VCC = 5.0V
TEMPERATURE (°C)
)
C
VCC = 4.75V
MAX9996 toc35
MAX9996
Detailed Description
The MAX9996 high-linearity downconversion mixer pro­vides 8.3dB of conversion gain and 26.5dBm of IIP3, with a typical 9.7dB noise figure. The integrated baluns and matching circuitry allow for 50single-ended inter­faces to the RF and the two LO ports. A single-pole, dou­ble-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 43dB of LO-to-LO isola­tion. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9996’s inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance.
Specifications are guaranteed over broad frequency ranges to allow for use in UMTS, cdma2000, and 2G/2.5G/3G DCS1800 and PCS1900 base stations. The MAX9996 is specified to operate over a 1700MHz to 2200MHz RF frequency range, a 1900MHz to 2400MHz LO frequency range, and a 40MHz to 350MHz IF fre­quency range. Operation beyond these ranges is pos­sible; see the Typical Operating Characteristics for additional details.
This device can operate in low-side LO injection appli­cations with an extended LO range, but performance degrades as fLOcontinues to decrease. The MAX9994—a variant of the MAX9996—provides better low-side performance since it is tuned for a lower LO range of 1400MHz to 2000MHz.
RF Input and Balun
The MAX9996 RF input is internally matched to 50Ω, requiring no external matching components. A DC­blocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. Input return loss is typically 15dB over the entire 1700MHz to 2200MHz RF frequency range.
LO Inputs, Buffer, and Balun
The MAX9996 can be used for either high-side or low­side injection applications with a 1900MHz to 2400MHz LO frequency range. For a device with a 1400MHz to 2000MHz LO frequency range, refer to the MAX9994 data sheet. As an added feature, the MAX9996 includes an internal LO SPDT switch that can be used for fre­quency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
8 _______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1, 6, 8, 14 V
2RF
3 TAP
4, 5, 10, 12,
13, 17
7 LOBIAS Bias Resistor for Internal LO Buffer. Connect a 549Ω ±1% resistor from LOBIAS to the power supply.
9 LOSEL Local Oscillator Select. Logic control input for selecting LO1 or LO2.
11 LO1 Local Oscillator Input 1. Drive LOSEL low to select LO1.
15 LO2 Local Oscillator Input 2. Drive LOSEL high to select LO2.
16 LEXT
18, 19 IF-, IF+
20 IFBIAS IF Bias Resistor Connection for IF Amplifier. Connect an 806 resistor from IFBIAS to GND.
EP GND Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
CC
GND Ground
Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit.
Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor.
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit.
External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor carries approximately 100mA DC current.
Differential IF Outputs. Each output requires external bias to V Typical Application Circuit).
through an RF choke (see the
CC
switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is con­trolled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. To avoid damage to the part, voltage must be applied to VCCbefore digital logic is applied to LOSEL. LO1 and LO2 inputs are internally matched to 50, requiring only a 22pF DC­blocking capacitor.
A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifica­tions are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF out­puts are integrated on-chip.
High-Linearity Mixer
The core of the MAX9996 is a double-balanced, high­performance passive mixer. Exceptional linearity is pro­vided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF ampli­fiers, the cascaded IIP3, 2LO-2RF rejection, and NF performance is typically 26.5dBm, 72dBc, and 9.7dB, respectively.
Differential IF Output Amplifier
The MAX9996 mixer has a 40MHz to 350MHz IF fre­quency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2LO-2RF rejection performance. Single­ended IF applications require a 4:1 balun to transform the 200differential output impedance to a 50single­ended output. After the balun, the IF return loss is bet­ter than 15dB.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω. No matching components are required. Return loss at the RF port is typically 15dB over the entire input range (1700MHz to 2200MHz) and return loss at the LO ports is typically better than 16dB (1900MHz to 2400MHz). RF and LO inputs require only DC-blocking capacitors for interfacing.
The IF output impedance is 200(differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50single­ended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of perfor­mance, contact the factory for details. If the ±1% bias resistor values are not readily available, substitute stan­dard ±5% values.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leak­age. The inductance value can be adjusted by the user to optimize the performance for a particular frequency band. Since approximately 100mA flows through this inductor, it is important to use a low-DCR wire-wound coil.
If the LO-to-IF and RF-to-IF leakage are not critical parameters, the inductor can be replaced by a short circuit to ground.
Layout Considerations
A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and induc­tance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that mul­tiple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/ther­mal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9996 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high­frequency circuit stability. Bypass each VCCpin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin.
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 9
MAX9996
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996’s 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9996 is mounted be designed to con­duct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST
be soldered to a ground plane on the PC board, either directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
10 ______________________________________________________________________________________
Table 1. Component List Referring to the Typical Application Circuit
Pin Configuration/Functional Diagram
MAX9996
1
2
3
4
5
15
14
13
12
11
6
7
8910
20
19
18
17
16
GND
LOSEL
LOBIAS
TAP
RF
V
CC
V
CC
V
CC
V
CC
GND
GND
LO2
GND
LEXT
IFBIAS
IF-
IF+
GND
LO1
GND
COMPONENT VALUE DESCRIPTION
L1, L2 470nH Wire-wound high-Q inductors (0805)
L3 10nH Wire-wound high-Q inductor (0603)
C1 4pF Microwave capacitor (0603)
C4 10pF Microwave capacitor (0603)
C2, C6, C7, C8, C10, C12 22pF Microwave capacitors (0603)
C3, C5, C9, C11 0.01µF Microwave capacitors (0603)
C13, C14 150pF Microwave capacitors (0603)
C15 150pF Microwave capacitor (0402)
R1 806Ω±1% resistor (0603)
R2 549Ω±1% resistor (0603)
R3 7.15Ω±1% resistor (1206)
T1 4:1 balun IF balun
U1 MAX9996 Maxim IC
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 11
Typical Application Circuit
C3
INPUT
V
CC
T1
LO2
V
GND
GND
LO1
CC
IF
OUTPUT
C12
C10
C11
LO2 INPUT
V
CC
LO1 INPUT
LEXT
326
1
L3
4
15
14
13
12
11
R3
L1
C13
C14
V
CC
C2
C1
RF
C5
C4
V
TAP
GND
GND
CC
1
RF
2
3
4
5
L2
R1
IFBIAS
IF+
19
20
C15
GND
IF­18
17 16
MAX9996
8
V
CC
C6 C7
7
6
CC
V
LOBIAS
R2
C8
C9
9
10
CC
V
LOSEL
V
CC
GND
LOSEL INPUT
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages
.)
D
D/2
MARKING
PIN # 1 I.D.
-DRAWING NOT TO SCALE-
PKG.
SYMBOL
A
A1
A3
b
D
E
e
k L
L1
N ND
NE
JEDEC
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3 AND T2855-6.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
-DRAWING NOT TO SCALE-
XXXXX
C
COMMON DIMENSIONS
16L 5x5
MIN. MAX.NOM.
0.70 0.800.75
0.05
0.02
0.20 REF.
0.25
0.350.30
4.90
5.10
5.00
4.90
5.105.00
0.80 BSC.
0.250--
0.30 0.500.40
---
16
4 4
WHHB
0.70
0.25
4.90
4.90
0.25
0.45
MIN.
0
---
20L 5x5
NOM.
0.75
0.02
0.20 REF.
0.30
5.00
5.00
0.65 BSC.
0.55
20
5 5
WHHC
MAX.
0.80
0.05
0.35
5.10
5.10
0.65
E/2
E
e
L1
0.10 C
A
0.08 C
A3
A1
28L 5x5
NOM.
MIN.
0.70
0
0.20 REF.
0.20
4.90
4.90
0.50 BSC.
--
0.25
0.45
---
WHHD-1
0.75
0.02
0.25
5.00
5.00
0.55
28
7 7
MAX.
MIN.
0.80
0.70
0.05
0.20 0.25 0.30
0.30
5.10
4.90
5.10
4.90
--
0.25
0.65
0.30
32L 5x5
0
0.20 REF.
0.50 BSC.
---
WHHD-2
NOM.
0.75
0.02
5.00
5.00
0.40
32
(NE-1) X e
DETAIL A
L
MAX.
0.80
0.05
5.10
5.10
--
0.50
8 8
D2
b
C
L
D2/2
k
e
(ND-1) X e
L
e e
PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm
DETAIL B
21-0140
EXPOSED PAD VARIATIONS
PKG. CODES
T1655-1
T2855-1 3.25 3.353.15 3.25 T2855-2 2.60 2.602.80 2.70 2.80
T2855-3 3.15 3.25 3.35 3.15 3.25 3.35
T2855-4 2.60 2.70 2.80 2.60 2.70 2.80
T2855-5 2.60 2.70 2.80 2.60 2.70 2.80 T2855-6 3.15 3.25 3.35 3.15 3.25 3.35 T2855-7 2.60 2.70
T3255-2
D2
MAX.
NOM.MIN.
MIN.E2NOM. MAX.
3.203.00 3.10 3.00 3.10 3.20
3.203.00T1655-2 3.10 3.00 3.10 3.20 YES
3.20
3.00T2055-2 3.10
3.353.15T2055-5 3.25 3.15 3.25 3.35
3.353.15
2.70
2.80
3.35
3.15T2855-8 3.25 3.15 3.25 3.35
3.35
3.15T2855N-1 3.25 3.15 3.25 3.35
3.20
3.00
3.10
3.203.00 3.10T3255-3 3.203.00 3.10
3.203.00 3.10T3255-4 3.203.00 3.10
3.203.10T3255N-1 3.00
PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm
3.203.00 3.10
3.103.00 3.203.103.00 3.20T2055-4
2.60 2.70 2.80
3.00 3.10 3.20
3.203.103.00
SEE COMMON DIMENSIONS TABLE
**
21-0140
0.10 M C A B
L
E2/2
C
L
PIN # 1 I.D.
0.35x45
QFN THIN.EPS
E2
CC L
LL
1
G
2
DOWN
L
BONDS
±0.15
ALLOWED
NO
**
**
NO3.203.103.003.10T1655N-1 3.00 3.20
** **
NO
YES3.103.00 3.203.103.00 3.20T2055-3
**
NO
**
Y
0.40
NO
**
NO
**
YES
**
YES
**
NO
**
NO
**
YES
**
Y
0.40 N
**
NO
**
YES
**
NO
**
NO
**
2
G
2
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