The MAX9996 high-linearity downconversion mixer provides 8.3dB gain, +26.5dBm IIP3, and 9.7dB NF for
1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS
base-station receiver applications. With a 1900MHz to
2400MHz LO frequency range, this particular mixer is
ideal for high-side LO injection receiver architectures.
Low-side LO injection is supported by the MAX9994,
which is pin-for-pin and functionally compatible with the
MAX9996.
In addition to offering excellent linearity and noise performance, the MAX9996 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, an IF amplifier, a dualinput LO selectable switch, and an LO buffer. On-chip
baluns are also integrated to allow for single-ended RF
and LO inputs. The MAX9996 requires a nominal LO
drive of 0dBm, and supply current is guaranteed to be
below 240mA.
The MAX9994/MAX9996 are pin compatible with the
MAX9984/MAX9986 815MHz to 995MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for
both frequency bands. The MAX9996 is also functionally compatible with the MAX9993.
The MAX9996 is available in a compact, 20-pin, thin
QFN package (5mm x 5mm) with an exposed paddle.
Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
Applications
UMTS/WCDMA Base Stations
DCS1800/PCS1900 EDGE Base Stations
cdmaOne™ and cdma2000
®
Base Stations
PHS/PAS Base Stations
Predistortion Receivers
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Microwave Links
Digital and Spread-Spectrum Communication
Systems
Features
♦ 1700MHz to 2200MHz RF Frequency Range
♦ 1900MHz to 2400MHz LO Frequency Range
(MAX9996)
♦ 1400MHz to 2000MHz LO Frequency Range
(MAX9994)
♦ 40MHz to 350MHz IF Frequency Range
♦ 8.3dB Conversion Gain
♦ +26.5dBm Input IP3
♦ +12.6dBm Input 1dB Compression Point
♦ 9.7dB Noise Figure
♦ 72dBc 2LO-2RF Spurious Rejection at
PRF= -10dBm
♦ Integrated LO Buffer
♦ Integrated RF and LO Baluns for Single-Ended
Inputs
♦ Low -3dBm to +3dBm LO Drive
♦ Built-In SPDT LO Switch with 43dB LO1 to LO2
Isolation and 50ns Switching Time
♦ Pin Compatible with MAX9984/MAX9986 815MHz
to 995MHz Mixers
♦ Functionally Compatible with MAX9993
♦ External Current-Setting Resistors Provide Option
for Operating Mixer in Reduced Power/Reduced
Performance Mode
(MAX9996 Typical Application Circuit, VCC= +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCCthrough
inductive chokes, R
1
= 806Ω, R2= 549Ω, TC= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +5V, TC=
+25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (V
CC
+ 0.3V)
TAP ........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
Note 1: Guaranteed by design and characterization.
Note 2: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit.
Note 3: Operation outside this range is possible, but with degraded performance of some parameters.
Note 4: Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm.
Note 5: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9996 Typical Application Circuit, VCC= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, PLO= -3dBm to
+3dBm, P
RF
= -5dBm, fRF= 1700MHz to 2200MHz, fLO= 1900MHz to 2400MHz, fIF= 200MHz, fLO> fRF, TC= -40°C to +85°C,
The MAX9996 high-linearity downconversion mixer provides 8.3dB of conversion gain and 26.5dBm of IIP3,
with a typical 9.7dB noise figure. The integrated baluns
and matching circuitry allow for 50Ω single-ended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time
between the two LO inputs with 43dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a
high drive level to the mixer core, reducing the LO drive
required at the MAX9996’s inputs to a -3dBm to +3dBm
range. The IF port incorporates a differential output,
which is ideal for providing enhanced IIP2 performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in UMTS, cdma2000, and
2G/2.5G/3G DCS1800 and PCS1900 base stations. The
MAX9996 is specified to operate over a 1700MHz to
2200MHz RF frequency range, a 1900MHz to 2400MHz
LO frequency range, and a 40MHz to 350MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for
additional details.
This device can operate in low-side LO injection applications with an extended LO range, but performance
degrades as fLOcontinues to decrease. The
MAX9994—a variant of the MAX9996—provides better
low-side performance since it is tuned for a lower LO
range of 1400MHz to 2000MHz.
RF Input and Balun
The MAX9996 RF input is internally matched to 50Ω,
requiring no external matching components. A DCblocking capacitor is required because the input is
internally DC shorted to ground through the on-chip
balun. Input return loss is typically 15dB over the entire
1700MHz to 2200MHz RF frequency range.
LO Inputs, Buffer, and Balun
The MAX9996 can be used for either high-side or lowside injection applications with a 1900MHz to 2400MHz
LO frequency range. For a device with a 1400MHz to
2000MHz LO frequency range, refer to the MAX9994
data sheet. As an added feature, the MAX9996 includes
an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of
the two single-ended LO ports, allowing the external
oscillator to settle on a particular frequency before it is
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
7LOBIASBias Resistor for Internal LO Buffer. Connect a 549Ω ±1% resistor from LOBIAS to the power supply.
9LOSELLocal Oscillator Select. Logic control input for selecting LO1 or LO2.
11LO1Local Oscillator Input 1. Drive LOSEL low to select LO1.
15LO2Local Oscillator Input 2. Drive LOSEL high to select LO2.
16LEXT
18, 19IF-, IF+
20IFBIASIF Bias Resistor Connection for IF Amplifier. Connect an 806Ω resistor from IFBIAS to GND.
EPGNDExposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
CC
GNDGround
Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the TypicalApplication Circuit.
Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor
carries approximately 100mA DC current.
Differential IF Outputs. Each output requires external bias to V
Typical Application Circuit).
through an RF choke (see the
CC
switched in. LO switching time is typically less than
50ns, which is more than adequate for virtually all GSM
applications. If frequency hopping is not employed, set
the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects
LO2, logic-low selects LO1. To avoid damage to the
part, voltage must be applied to VCCbefore digital logic
is applied to LOSEL. LO1 and LO2 inputs are internally
matched to 50Ω, requiring only a 22pF DCblocking capacitor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF outputs are integrated on-chip.
High-Linearity Mixer
The core of the MAX9996 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2LO-2RF rejection, and NF
performance is typically 26.5dBm, 72dBc, and 9.7dB,
respectively.
Differential IF Output Amplifier
The MAX9996 mixer has a 40MHz to 350MHz IF frequency range. The differential, open-collector IF output
ports require external pullup inductors to VCC. Note that
these differential outputs are ideal for providing
enhanced 2LO-2RF rejection performance. Singleended IF applications require a 4:1 balun to transform
the 200Ω differential output impedance to a 50Ω singleended output. After the balun, the IF return loss is better than 15dB.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. Return loss at
the RF port is typically 15dB over the entire input range
(1700MHz to 2200MHz) and return loss at the LO ports
is typically better than 16dB (1900MHz to 2400MHz).
RF and LO inputs require only DC-blocking capacitors
for interfacing.
The IF output impedance is 200Ω (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ω singleended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning resistors R1 and R2. If
reduced current is required at the expense of performance, contact the factory for details. If the ±1% bias
resistor values are not readily available, substitute standard ±5% values.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to
optimize the performance for a particular frequency
band. Since approximately 100mA flows through this
inductor, it is important to use a low-DCR wire-wound coil.
If the LO-to-IF and RF-to-IF leakage are not critical
parameters, the inductor can be replaced by a short
circuit to ground.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9996 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCCpin and
TAP with the capacitors shown in the Typical ApplicationCircuit; see Table 1. Place the TAP bypass capacitor to
ground within 100 mils of the TAP pin.
The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages
.)
D
D/2
MARKING
PIN # 1
I.D.
-DRAWING NOT TO SCALE-
PKG.
SYMBOL
A
A1
A3
b
D
E
e
k
L
L1
N
ND
NE
JEDEC
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1,
T2855-3 AND T2855-6.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.