Maxim MAX9995 User Manual

Page 1
General Description
The MAX9995 evaluation kit (EV kit) simplifies the evalu­ation of the MAX9995 dual high-linearity mixer. It is fully assembled and tested at the factory. Standard 50 SMA connectors are included on the EV kit for the input and output to allow quick and easy evaluation on the test bench.
Contact MaximDirect sales and availability of these kits.
Features
Fully Assembled and Tested
1700MHz to 2200MHz RF Frequency Range
1400MHz to 2000MHz LO Frequency Range
(MAX9995)
1900MHz to 2400MHz LO Frequency Range
(Contact Factory)
40MHz to 350MHz IF Frequency Range
6.1dB Conversion Gain
+25.6dBm Input IP3
9.8dB Noise Figure
66dBc 2RF to 2LO Spurious Rejection at
PRF= -10dBm
Dual Channels Ideal for Diversity Receiver
Applications
Integrated LO Buffer
Integrated RF and LO Baluns for Single-Ended
Inputs
Low -3dBm to +3dBm LO Drive
Built-In SPDT LO Switch with 50dB LO1 to LO2
Isolation and 50ns Switching Time
44dB Channel-to-Channel Isolation
Evaluates: MAX9995
MAX9995 Evaluation Kit
________________________________________________________________ Maxim Integrated Products 1
19-3390; Rev 0; 8/04
Component List
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Ordering Information
PART TEMP RANGE IC PACKAGE
MAX9995EVKIT
36 Thin QFN-EP*
*EP = Exposed paddle.
**T
C
= Case temperature.
Note: When contacting these suppliers, indicate that you are using the MAX9995.
Component Suppliers
SUPPLIER
PHONE WEBSITE
Coilcraft
www.coilcraft.com
Digi-Key
www.digikey.com
Johnson
www.johnsoncomponents.com
Mini-Circuits
www.minicircuits.com
Murata
www.murata.com
800-322-2645
800-344-4539
507-833-8822
718-934-4500
770-436-1300
DESIGNATION QTY DESCRIPTION
4pF ±0.25pF, 50V C0G ceramic
C1, C8 2
C2, C7 2
C3, C6 2
C4, C5, C14,
C16
capacitors (0402) Murata GRP1555C1H4R0C
10pF ±5%, 50V C0G ceramic capacitors (0402) Murata GRP1555C1H100J
0.033µF ±10%, 25V X7R ceramic capacitors (0603) Murata GRM188R71E333K
22pF ±5%, 50V C0G ceramic
4
capacitors (0402) Murata GRP1555C1H220J
TC = -40°C to +85°C**
DESIGNATION QTY DESCRIPTION
C9, C13, C15,
C17, C18
C10, C11, C12,
C19, C20, C21
J1–J6 6
L1, L2, L4, L5 4
5
6
0.01µF ±10%, 25V X7R ceramic capacitors (0402) Murata GRP155R71E103K
150pF ±5%, 50V C0G ceramic capacitors (0603) Murata GRM1885C1H151J
PC board edge-mount SMA RF connectors (flat-tab launch) Johnson 142-0741-856
330nH ±5% wire-wound inductors (0805) Coilcraft 0805CS-331XJBC
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MAX9995 Evaluation Kit
2 _______________________________________________________________________________________
Quick Start
The MAX9995 EV kit is fully assembled and factory test­ed. Follow the instructions in the Connections and Setup section for proper device evaluation.
Test Equipment Required
Connections and Setup
This section provides a step-by-step guide to testing the basic functionality of the EV kit. As a general pre­caution to prevent damaging the outputs by driving high-VSWR loads, do not turn on DC power or RF
signal generators until all connections are made:
1) Calibrate the power meter for 1900MHz. For safety margin, use a power sensor rated to at least +20dBm, or use padding to protect the power head as necessary.
2) Connect 3dB pads to the DUT ends of each of the three RF signal generators’ SMA cables. This padding improves VSWR, and reduces the errors due to mismatch.
3) Use the power meter to set the RF signal generators according to the following:
• RF signal source: -5dBm into DUT at 1900MHz
• LO1 signal source: 0dBm into DUT at 1700MHz
(fIF= 200MHz)
• LO2 signal source: 0dBm into DUT at 1701MHz (f
IF
= 199MHz)
4) Disable all three signal sources. Connect the LO1 and LO2 signal sources to the EV kit LO inputs.
5) Connect the signal sources to the appropriate SMA inputs. The RF input can be connected to either the RFMAIN or RFDIV inputs, depending on test.
6) Measure loss in 3dB pad and cable that is connect­ed to IFMAIN/IFDIV. Losses are frequency depen­dent, so test this at 200MHz (the IF frequency). Use this loss as an offset in all output power/gain calculations.
7) Connect this 3dB pad to the EV kit’s appropriate IFMAIN/IFDIV connector, and connect a cable from the pad to the spectrum analyzer.
8) Set the DC supply to +5.0V and set a current limit around 500mA, if possible. Connect supplies to the EV kit through the ammeter. Turn on the supply. Readjust the supply to get +5.0V at the EV kit. There will be a voltage drop across the ammeter when the mixer is drawing current.
9) Select LO2 by grounding LOSEL.
10) Enable the LO and the RF sources.
Testing the Mixer
Adjust the center and span of the spectrum analyzer to observe the IF output tone at 199MHz. The level should be about -2dBm (6dB conversion gain, 3dB pad loss). The spectrum analyzer’s absolute magnitude accuracy is typically no better than ±1dB. Use the power meter to
Component List (continued)
DESIGNATION
QTY
DESCRIPTION
L3, L6 2
10nH ±5% wire-wound inductors (0603) Coilcraft 0603CS-10NXJBC
R1, R4 2 1.21k ±1% resistors (0402)
R2, R5 2 392Ω ±1% resistors (0402)
R3, R6 2 10Ω ±1% resistors (1206)
R7 1 47kΩ ±5% resistor (0603)
T1, T2 2
4:1 transformers ( 200:50 ) Mini Circuits TC4-1W-7A
TP1 1
Large test point for 0.062in PC board (red) Mouser 151-107 or equivalent
TP2 1
Large test point for 0.062in PC board (black) Mouser 151-103 or equivalent
DESIGNATION QTY DESCRIPTION
Large test point for 0.062in PC board
TP3 1
U1 1
(white) Mouser 151-101 or equivalent
Active dual mixer IC (6mm x 6mm thin QFN, exposed paddle) Maxim: MAX9995ETX
NOTE: U1 HAS AN EXPOSED PADDLE CONDUCTOR THAT REQUIRES IT TO BE SOLDER ATTACHED TO A GROUNDED PAD ON THE CIRCUIT BOARD TO ENSURE PROPER ELECTRICAL/THERMAL DESIGN.
Page 3
get an accurate output power measurement.
Disconnect the GND connection to LOSEL. It will be pulled high by a pullup resistor on the board. This selects LO1. Observe the new IF output at 200MHz.
Reconfigure the test setup using a combiner or hybrid to sum the two RF inputs to do a two-tone IP3 measure­ment, if desired. Terminate the unused LO input in 50Ω.
Detailed Description
The MAX9995 is a highly integrated dual downconvert­er; RF and LO baluns are integrated on-chip, as well as two double-balanced mixers, two IF amplifiers, an LO buffer, and a single-pole/double throw (SPDT) LO input select switch. The EV kit circuit consists mostly of sup­ply decoupling capacitors and DC-blocking capacitors, making for a simple design-in.
DC-Blocking Capacitors
The MAX9995 has internal baluns on the RFMAIN, RFDIV, LO1, and LO2 inputs. These inputs have almost 0resistance at DC, so DC-blocking capacitors C1, C8, C14, and C16 are used to prevent any external bias from being shunted directly to ground. Capacitors C10, C11, C19, and C20 are used to keep DC current from flowing into the transformer, as well as providing the flexibility for matching.
LO Buffer and IF Amplifier Bias
Bias currents for the integrated LO buffers and the IF output amplifiers are set with resistors R2, R5, and R1, R4, respectively. These values were carefully chosen for best linearity and lowest supply current through test­ing at the factory. Changing these values, or using lower tolerance resistors, degrades performance. If lower currents are desired, consult the factory for opti­mum resistor settings.
Current-Limiting Resistors
Resistors R3 and R6 are used for current limiting at the supply. These resistors typically dissipate 50mW each.
TAP Network
The network at TAP formed by C2, C3, C6, and C7 helps to terminate the second-order intermodulation products at the RF inputs.
IND_EXT
The 10nH wire-wound inductors L3 and L6 improve LO­to-IF and RF-to-IF isolation. If isolation is not critical, then the corresponding pins can be grounded.
IF Outputs
The MAX9995 employs a differential IF output to offer increased IP2 system performance. For convenience, the EV kit uses a 4:1 balun to transform the 200differ­ential output impedance to a 50single-ended output. Inductive pullups provide DC bias to the IF output amplifiers. Series capacitors C10, C11, C19, and C20 work in conjunction with the inductors and the 4:1 balun transformers (T1 and T2) to match the IF outputs for 200MHz operation.
As the differential IF outputs are relatively high imped­ance (200), they are more susceptible to component parasitics. It is often good practice to relieve the ground plane directly underneath large components to reduce associated shunt-C parasitics (see Figure 6).
LOSEL
The EV kit includes a 47kpullup resistor for easy selection of the LO port. Providing a ground at TP3 selects LO2, and leaving TP3 open selects LO1. To drive TP3 from an external source, follow the limits called out in the MAX9995 device data sheet. Do not apply logic voltages to TP3 without the +5V supply applied. Doing so can cause the on-chip ESD diodes to conduct and could damage the part.
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MAX9995 Evaluation Kit
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EQUIPMENT
QTY
DESCRIPTION
HP E3631A 1 DC power supply
Fluke 75 Series II 1 Digital multimeter (ammeter)
HP/Agilent 8648B 3 RF signal generators
HP 437B 1 RF power meter
HP 8561 1 Spectrum analyzer
HP 8482A 1
High-power sensor (power head)
3dB pad 4 3dB attenuators
50 termination 1 50 (1W) termination
Table 1. Test Equipment
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MAX9995 Evaluation Kit
4 _______________________________________________________________________________________
-+ -+
POWER SUPPLY
3-OUT, HPIB (AG E3631A)
RF SIGNAL GENERATOR
(HP 8648B)
RF POWER METER
(GIGA 80701A,
HP 437B)
RF HIGH-
POWER SENSOR
(AMMETER)
3dB
3dB
3dB
3dB
LO2
RFMAIN/RFDIV
LO1
IFMAIN/IFDIV
+5V
GND
MAX9995EVKIT
RF SIGNAL GENERATOR
(HP 8648B)
RF SIGNAL GENERATOR
(HP 8648B)
1900.000MHz
1700.000MHz
1701.000MHz
5.0V (MAX)
RF SPECTRUM ANALYZER
(HP 8561x)
BENCH
MULTIMETER HPIB
(HP 34401A)
LOSEL
GND
OPEN
Figure 1. Test Setup Diagram
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MAX9995 Evaluation Kit
_______________________________________________________________________________________ 5
Layout Considerations
The MAX9995 evaluation board can be a guide for your board layout. Pay close attention to thermal design and close placement of parts to the IC. The package’s exposed paddle (EP) conducts heat from the part and provides a low-impedance electrical connection. The EP MUST be attached to the PC board ground plane with a low thermal and electrical impedance contact. Ideally, this can be achieved by soldering the backside package contact directly to a top metal ground plane on the PC board. Alternatively, the EP can be connect­ed to a ground plane using an array of plated vias directly below the EP. The EV kit uses nine evenly spaced, 0.016in-diameter, plated through holes to con­nect the EP to the lower ground planes.
Depending on the RF ground-plane spacing, large sur­face-mount pads in the RF path may need the ground plane relieved under them to reduce shunt capacitance.
Modifying the EV Kit
The RF and LO inputs are broadband matched, so there is no need to modify the circuit for use anywhere in the 1700MHz to 2200MHz RF range (1400MHz to 2000MHz LO range).
Retuning for a different IF frequency is as simple as scaling the values of the IF pullup inductors up or down with frequency. The IF output looks like 200Ω differen- tial in parallel with a capacitor. The capacitance is due to the combination of the IC, PC board, and external IF components. The capacitance from the IC is approxi­mately 2pF to ground (1pF differential), while that from the PC board and external components is approxi­mately 3.5pF to ground. The total 5.5pF of capacitance is resonated out at the frequency of interest by the bias inductors. To determine the inductor value, use the fol­lowing equation:
The IF output is tuned for operation at approximately 200MHz, so a 330nH inductor is used. For lower IF fre­quencies (i.e., larger component values), maintain the component’s Q value at the cost of larger case size, unless it is unavoidable.
f
LxC
IF
=
1
2π
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MAX9995 Evaluation Kit
6 _______________________________________________________________________________________
C2 10pF
C3
0.033µF
C1
4pF
C17
0.01µF
C18
0.01µF
R1
1.21k
VCC
L2 330nH
L1 330nH
R3
10
C20
150pF
C19
150pF
J2
SMA
IF MAIN OUTPUT
T1
R2
392
L3
10nH
4:1
4:1
VCC
VCC
VCC
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27
LO2
V
CC
GND
V
CC
GND
GND
TAPDIV
TAPMAIN
RFMAIN
RFDIV
EXPOSED
PADDLE
IFD_SET
GND
IND_EXTD
LO_ADJ_D
N.C.
V
CC
V
CC
N.C.
LO_ADJ_M
V
CC
IND_EXTM
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO1
LOSEL
GND
GND
GND
GND
GND
V
CC
MAX9995
C4
22pF
C7 10pF
VCC
VCC
VCC
VCC
T2
VCC
TP1 +5V
TP2 GND
C21
150pF
J1
SMA
RF MAIN INPUT
C5
22pF
C6
0.033µF
J6
SMA
RF DIV INPUT
C8
4pF
C9
0.01µF
R4
1.21k L6
10nH
R5
392
C13
0.01µF
R6
10
C11
150pF
L5 330nH
C12
150pF
C10
150pF
L4 330nH
J5
SMA
IF DIV OUTPUT
C14
22pF
C15
0.01µF
J4 SMA LO1
C16 22pF
J3
SMA
LO2
R7 47k
TP3 LOSEL
VCC
U1
Figure 2. MAX9995 EV Kit Schematic
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MAX9995 Evaluation Kit
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Figure 3. MAX9995 EV Kit PC Board Layout—Top Silkscreen
1.0"
Figure 4. MAX9995 EV Kit PC Board Layout—Top Soldermask
1.0"
Figure 5. MAX9995 EV Kit PC Board Layout—Top Layer Metal
1.0"
Figure 6. MAX9995 EV Kit PC Board Layout—Inner Layer 2 (GND)
1.0"
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Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Evaluates: MAX9995
MAX9995 Evaluation Kit
Figure 7. MAX9995 EV Kit PC Board Layout—Inner Layer 3 (Routes)
1.0"
Figure 8. MAX9995 EV Kit PC Board Layout—Bottom Layer Metal
1.0"
Figure 9. MAX9995 EV Kit PC Board Layout—Bottom Soldermask
1.0"
Figure 10. MAX9995 EV Kit PC Board Layout—Bottom Silkscreen
1.0"
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