MAX9736
Mono/Stereo High-Power Class D Amplifier
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
PVDD
= 20V, VVS= 5V, V
AGND
= V
PGND
= 0V, V
MOD
= V
SHDN
= V
MUTE
= 5V, REGEN = MONO = AGND, C1 = 0.1μF, C2 = 1μF,
R
IN
_ = 20kΩ and R
FB_
= 20kΩ, RL= ∞, AC measurement bandwidth 22Hz to 22kHz, TA= T
MIN
to T
MAX
, unless otherwise noted.
Typical values are at T
A
= +25°C.) (Notes 4, 5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: VS cannot exceed PVDD + 0.3V. See the
Power Sequencing
section.
Note 2: Thermal performance of this device is highly dependant on PCB layout. See the
Applications Information
section for more details.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, visit www.maxim-ic.com/thermal-tutorial
.
PVDD to PGND.......................................................-0.3V to +30V
AGND to PGND .....................................................-0.3V to +0.3V
INL, INR, FBL, FBR, COM to AGND .........-0.3V to (V
REG
+ 0.3V)
MUTE, SHDN, MONO, MOD, REGEN to AGND.......-0.3V to +6V
REG to AGND ..............................................-0.3V to (VS + 0.3V)
VS to AGND (Note 1)................................................-0.3V to +6V
OUTL+, OUTL-, OUTR+,
OUTR-, to PGND...................................-0.3V to (PVDD + 0.3V)
C1N to PGND ..........................................-0.3V to (PVDD + 0.3V)
C1P to PGND ...........................(PVDD - 0.3V) to (V
BOOT
+ 0.3V)
BOOT to PGND ..............................(V
C1P
- 0.3V) to PVDD + 12V
OUTL+, OUTL-, OUTR+, OUTR-,
Short Circuit to PGND or PVDD...............................Continuous
Thermal Limits (Notes 2, 3)
Continuous Power Dissipation (T
A
= +70°C)
32-Pin TQFN 5mm x 5mm Multiple Layer PCB
(derate 34.5mW/°C above +70°C)..................................2.76W
θ
JA
.................................................................................29°C/W
θ
JC
...................................................................................2°C/W
Continuous Power Dissipation (T
A
= +70°C)
32-Pin TQFN 7mm x 7mm Multiple Layer PCB
(derate 37mW/°C above +70°C).....................................2.96W
θ
JA
.................................................................................27°C/W
θ
JC
...................................................................................1°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C