MAX9723
Stereo DirectDrive Headphone Amplifier
with BassMax, Volume Control, and I2C
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SGND to PGND .....................................................-0.3V to +0.3V
V
DD
to PGND............................................................-0.3V to +4V
PV
SS
to SVSS.........................................................-0.3V to +0.3V
C1P to PGND..............................................-0.3V to (V
DD
+ 0.3V)
C1N to PGND............................................(PV
SS
- 0.3V) to +0.3V
PV
SS
, SVSSto PGND ................................................+0.3V to -4V
IN_ to SGND ..................................(SV
SS
- 0.3V) to (VDD+ 0.3V)
SDA, SCL to PGND ..................................................-0.3V to +4V
SHDN to PGND ..........................................-0.3V to (VDD+ 0.3V)
OUT_ to SGND ............................................................-3V to +3V
BB_ to SGND...............................................................-2V to +2V
Duration of OUT_ Short Circuit to _GND ....................Continuous
Continuous Current Into/Out of:
V
DD
, C1P, PGND, C1N, PVSS, SVSS, or OUT_ ..............±0.85A
Any Other Pin.................................................................±20mA
Continuous Power Dissipation (T
A
= +70°C)
4 x 4 UCSP (derate 8.2mW/°C above +70°C) ...........659.2mW
16-Pin Thin QFN (derate 16.9mW/°C above +70°C) ....1349mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering)
Reflow ...........................................................................+230°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(VDD= SHDN = 3V, PGND = SGND = 0V, C1 = C2 = 1µF, BB_ = 0V. gain = 0dB, maximum volume, BassMax disabled. Load connect-
ed between OUT_ and SGND where specified. T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)