MAXIM MAX9394, MAX9395 User Manual

General Description
The MAX9394/MAX9395 consist of a 2:1 multiplexer and a 1:2 demultiplexer with loopback. The multiplexer section (channel B) accepts two low-voltage differential signaling (LVDS) inputs and generates a single LVDS output. The demultiplexer section (channel A) accepts a single LVDS input and generates two parallel LVDS outputs. The MAX9394/MAX9395 feature a loopback mode that connects the input of channel A to the output of channel B and connects the selected input of chan­nel B to the outputs of channel A.
Three LVCMOS/LVTTL logic inputs control the internal connections between inputs and outputs, one for the multiplexer portion of channel B (BSEL), and the other two for loopback control of channels A and B (LB_SELA and LB_SELB). Independent enable inputs for each dif­ferential output pair provide additional flexibility.
Fail-safe circuitry forces the outputs to a differential low condition for undriven inputs or when the common­mode voltage exceeds the specified range. The MAX9394 provides high-level input fail-safe detection for HSTL, LVDS, and other GND-referenced differential inputs. The MAX9395 provides low-level fail-safe detec­tion for CML, LVPECL, and other VCC-referenced differ­ential inputs.
Ultra low 91ps
P-P
(max) pseudorandom bit sequence (PRBS) jitter ensures reliable communications in high­speed links that are highly sensitive to timing error, especially those incorporating clock-and-data recovery, or serializers and deserializers. The high-speed switch­ing performance guarantees 1.5GHz operation and less than 87ps (max) skew between channels.
LVDS inputs and outputs are compatible with the TIA/EIA-644 LVDS standard. The LVDS outputs drive 100Ω loads. The MAX9394/MAX9395 are offered in a 32-pin TQFP package and operate over the extended temperature range (-40°C to +85°C).
Applications
High-Speed Telecom/Datacom Equipment
Central Office Backplane Clock Distribution
DSLAM
Protection Switching
Fault-Tolerant Systems
Features
Guaranteed 1.5GHz Operation with 250mV
Differential Output Swing
Simultaneous Loopback Control
2ps
(RMS)
(max) Random Jitter
AC Specifications Guaranteed for 150mV
Differential Input
Signal Inputs Accept Any Differential Signaling
Standard
LVDS Outputs for Clock or High-Speed Data
High-Level Input Fail-Safe Detection (MAX9394)
Low-Level Input Fail-Safe Detection (MAX9395)
3.0V to 3.6V Supply Voltage Range
LVCMOS/LVTTL Logic Inputs
MAX9394/MAX9395
2:1 Multiplexers and 1:2 Demultiplexers with
Loopback
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
0.1μF 0.01μF
3.0V TO
3.6V
OUTA0
OUTA0
LVDS
RECEIVER
INA
INA
ENA0
ENA1
ENB
GNDGND GNDGND
OUTA1
OUTA1
OUTB
OUTB
LVCMOS/LVTTL LOGIC INPUTS
LB_SELA
LB_SELB
BSEL
INB0
INB0
100Ω
Z0 = 50Ω
Z0 = 50Ω
MAX9394 MAX9395
V
CC
INB1
INB1
Z0 = 50Ω
Z0 = 50Ω
100Ω
Z0 = 50Ω
Z0 = 50Ω
Z0 = 50Ω
Z0 = 50Ω
Typical Operating Circuit
19-2878; Rev 1; 5/07
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
PART TEMP RANGE
PIN­PACKAGE
PKG
CODE
MAX9394EHJ
32 TQFP
H32-1
MAX9394EHJ+
32 TQFP
H32-1
MAX9395EHJ
32 TQFP
H32-1
MAX9395EHJ+
32 TQFP
H32-1
Pin Configurations and Functional Diagram appear at end of data sheet.
+Denotes a lead-free package.
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
MAX9394/MAX9395
2:1 Multiplexers and 1:2 Demultiplexers with Loopback
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +4.1V
IN_ _,
IN_ _, OUT_ _, OUT_ _, EN_ _, _SEL, LB_SEL_
to GND........................................................-0.3V to (V
CC
+ 0.3V)
IN_ _ to IN_ _..........................................................................±3V
Short-Circuit Duration (OUT_ _, OUT_ _) ...................Continuous
Continuous Power Dissipation (T
A
= +70°C)
32-Pin TQFP (derate 13.1mW/°C above +70°C)........1047mW
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin TQFP............................................................+76.4°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection (Human Body Model)
(IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _, SEL_, LB_SEL_) ..±2kV
Soldering Temperature (10s) ...........................................+300°C
DC ELECTRICAL CHARACTERISTICS
(VCC= 3.0V to 3.6V, RL= 100Ω ±1%, EN_ _ = VCC, VCM= +0.05V to (VCC- 0.6V) (MAX9394), VCM= +0.06V to (VCC- 0.05V) (MAX9395), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= 3.3V, |VID| = 0.2V, VCM= 1.2V, TA= +25°C.)
(Notes 1, 2, and 3)
PARAMETER
CONDITIONS
UNITS
LVCMOS/LVTTL INPUTS (EN_ _, BSEL, LB_SEL_)
Input High Voltage V
IH
2.0
V
Input Low Voltage V
IL
0 0.8 V
Input High Current I
IH
VIN = 2.0V to V
CC
020µA
Input Low Current I
IL
VIN = 0V to 0.8V 0 10 µA
DIFFERENTIAL INPUTS (IN_ _, IN_ _)
Differential Input Voltage V
ID
V
ILD
>
0V and V
IHD
<
VCC, Figure 1 0.1 3.0 V
MAX9394
VCC -
0.6
Input Common-Mode Range V
CM
MAX9395 0.6
V
CC
-
V
MAX9394 |VID|
<
3.0V -75 10
Input Current
I
IN_ _
,
I
IN_ _ MAX9395 |V
ID
|
<
3.0V -10 100
µA
LVDS OUTPUTS (OUT_ _, OUT_ _)
Differential Output Voltage V
OD
RL = 100Ω, Figure 2 250
450 mV
Change in Magnitude of V
OD
Between Complementary Output States
ΔV
OD
Figure 2 1.0 50 mV
Offset Common-Mode Voltage V
OS
Figure 2
V
Change in Magnitude of V
OS
Between Complementary Output States
ΔV
OS
Figure 2 1.0 50 mV
SYM B O L
MIN TYP MAX
0.05
1.125 1.25 1.375
350
V
CC
0.05
MAX9394/MAX9395
2:1 Multiplexers and 1:2 Demultiplexers with
Loopback
_______________________________________________________________________________________ 3
PARAMETER
SYM B O L
CONDITIONS
MIN
TYP
MAX
UNITS
30 40
Output Short-Circuit Current (Output(s) Shorted to GND)
|I
OS
|
V
ID
= ±100mV
(Note 4)
V
OUT_ _
=
V
OUT_ _
= 0V
17 24
mA
Output Short-Circuit Current (Outputs Shorted Together)
|I
OSB
|
512mA
SUPPLY CURRENT
RL = 100Ω, EN_ _ = V
CC
53 65
Supply Current I
CC
RL = 100Ω, EN_ _ = VCC, switching at 670MHz (1.34Gbps)
53 65
mA
Note 1: Measurements obtained with the device in thermal equilibrium. All voltages referenced to GND except VID, VOD, and ΔVOD. Note 2: Current into the device defined as positive. Current out of the device defined as negative. Note 3: DC parameters production tested at T
A
= +25°C and guaranteed by design and characterization for TA= -40°C to +85°C.
Note 4: Current through either output. Note 5: Guaranteed by design and characterization. Limits set at ±6 sigma. Note 6: t
SKEW
is the magnitude difference of differential propagation delays for the same output over the same condtions. t
SKEW
=
|t
PHL
- t
PLH
|.
Note 7: Measured between outputs of the same device at the signal crossing points for a same-edge transition under the same con-
ditions. Does not apply to loopback mode.
Note 8: Device jitter added to the differential input signal.
DC ELECTRICAL CHARACTERISTICS (continued)
(VCC= 3.0V to 3.6V, RL= 100Ω ±1%, EN_ _ = VCC, VCM= 0.05V to (VCC- 0.6V) (MAX9394), VCM= 0.06V to (VCC- 0.05V) (MAX9395), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= 3.3V, |VID| = 0.2V, VCM= 1.2V, TA= +25°C.)
(Notes 1, 2, and 3)
AC ELECTRICAL CHARACTERISTICS
(VCC= 3.0V to 3.6V, fIN< 1.34GHz, t
R_IN
= t
F_IN
= 125ps, RL= 100Ω ±1%, |VID| 150mV, VCM= 0.075V to (VCC- 0.6V) (MAX9394
only), V
CM
= 0.6V to (VCC- 0.075V) (MAX9395 only), EN_ _ = VCC, TA= -40°C to +85°C, unless otherwise noted. Typical values are
at V
CC
= 3.3V, |VID| = 0.2V, VCM= 1.2V, fIN= 1.34GHz, TA= +25°C.) (Note 5)
PARAMETER
SYM B O L
CONDITIONS
MIN
TYP
MAX
UNITS
SEL to Switched Output
Figure 3 1.1 ns
Disable Time to Differential Output Low
t
PHD
Figure 4 1.7 ns
Enable Time to Differential Output High
t
PDH
Figure 4 1.7 ns
Switching Frequency f
MAX
VOD
>
250mV 1.5 2.2 GHz
Low-to-High Propagation Delay t
PLH
Figures 1, 5
ps
High-to-Low Propagation Delay t
PHL
Figures 1, 5
ps
Pulse Skew |t
PLH
– t
PHL
|t
SKEW
Figures 1, 5 (Note 6)
86 ps
Output Channel-to-Channel Skew
t
CCS
Figure 6 (Note 7) 16 87 ps
Output Low-to-High Transition Time (20% to 80%)
t
R
f
IN_ _
= 100MHz, Figures 1, 5
ps
Output High-to-Low Transition Time (80% to 20%)
t
F
f
IN_ _
= 100MHz, Figures 1, 5
ps
Added Random Jitter t
RJ
f
IN_ _
= 1.34GHz, clock pattern (Note 8) 2
ps
(RMS)
Added Deterministic Jitter t
DJ
1.34Gbps, 223 - 1 PRBS (Note 8) 60 91
ps
P-P
V
VID = ±100mV, V
OUT_ _
OUT_ _
= V
or V
OUT_ _
OUT_ _
(Note 4)
= 0V
t
SWITCH
340 567 720
340 562 720
112 154 187
112 152 187
12.4
MAX9394/MAX9395
2:1 Multiplexers and 1:2 Demultiplexers with Loopback
4 _______________________________________________________________________________________
Typical Operating Characteristics
(VCC= 3.3V, |VID| = 0.2V, VCM= +1.2V, TA= +25°C, fIN= 1.34GHz, Figure 5.)
SUPPLY CURRENT vs. TEMPERATURE
MAX9394/95 toc01
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
6035-15 10
35
40
45
50
55
60
65
70
30
-40 85
VCC = 3.3V
VCC = 3.6V
VCC = 3.0V
OUTPUT AMPLITUDE vs. FREQUENCY
MAX9394/95 toc02
FREQUENCY (GHz)
OUTPUT AMPLITUDE (mV)
2.00.4 1.2 1.60.8
50
100
150
200
250
300
350
400
0
0 2.4
OUTPUT RISE/FALL TIME
vs. TEMPERATURE
MAX9394/95 toc03
TEMPERATURE (°C)
RISE/FALL TIME (ps)
603510-15
130
140
150
160
170
180
120
-40 85
t
R
t
F
fIN = 100MHz
PROPAGATION DELAY
vs. TEMPERATURE
MAX9394/95 toc04
TEMPERATURE (°C)
PROPAGATION DELAY (ps)
603510-15
510
520
530
540
550
560
570
580
590
600
500
-40 85
MAX9394 DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9394/95 toc05
TEMPERATURE (°C)
INPUT CURRENT (μA)
603510-15
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
-40 85
V
IN_ _
= 3.0V
V
IN_ _
= 0.1V
V
IN_ _
= 0V
MAX9395 DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9394/95 toc06
TEMPERATURE (°C)
INPUT CURRENT (μA)
6035-15 10
10
20
30
40
50
60
70
80
0
-40 85
V
IN_ _
= V
CC
V
IN_ _
= (VCC - 0.1V)
V
IN_ _
= (VCC - 3.0V)
MAX9394
DIFFERENTIAL INPUT CURRENT vs. V
IHD
MAX9394/95 toc07
V
IHD
(V)
INPUT CURRENT (μA)
3.02.40.6 1.2 1.8
-35
-30
-25
-20
-15
-10
-5
0
5
-40 0 3.6
IN_ _ OR IN_ _ = GND
VCC = 3V
VCC = 3.6V
MAX9395
DIFFERENTIAL INPUT CURRENT vs. V
ILD
MAX9394/95 toc08
V
ILD
(V)
INPUT CURRENT (μA)
3.02.40.6 1.2 1.8
0
10
20
30
40
50
60
70
80
-10 0 3.6
IN_ _ OR IN_ _ = V
CC
VCC = 3.6V
VCC = 3V
MAX9394/MAX9395
2:1 Multiplexers and 1:2 Demultiplexers with
Loopback
_______________________________________________________________________________________ 5
Pin Description
PIN NAME FUNCTION
1, 2, 3, 30,
31, 32
N.C. No Connection. Not internally connected.
4, 9, 20, 25
GND Ground
5 ENB
Channel B Output Enable. Drive ENB high to enable the LVDS outputs for channel B. An internal 435kΩ resistor to GND pulls ENB low when unconnected.
6 OUTB
Channel B LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB and OUTB at the receiver inputs to ensure proper operation.
7 OUTB
Channel B LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB and OUTB at the receiver inputs to ensure proper operation.
8, 13, 24,
29
V
CC
Power-Supply Input. Bypass each VCC to GND with a 0.1µF and 0.01µF ceramic capacitor. Install both bypass capacitors as close to the device as possible, with the 0.01µF capacitor closest to the device.
10 INB0
LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Inverting Input. An internal 128kΩ pullup resistor to V
CC
pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input
low when unconnected (MAX9395).
11 INB0
LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Noninverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395).
12
Loopback Select for Channel B Output. Connect LB_SELB to GND or leave unconnected to reproduce the INB_ (INB_) differential inputs at OUTB (OUTB). Connect LB_SELB to V
CC
to loop back the INA (INA)
differential inputs to OUTB (OUTB). An internal 435kΩ resistor to GND pulls LB_SELB low when unconnected.
14 INB1
LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Inverting Input. An internal 128kΩ pullup resistor to V
CC
pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input
low when unconnected (MAX9395).
15 INB1
LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Noninverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395).
16 BSEL
Channel B Multiplexer Control Input. Selects the differential input to reproduce at the B channel differential output. Connect BSEL to GND or leave unconnected to select the INB0 (INB0) set of inputs. Connect BSEL to V
CC
to select the INB1 (INB1) set of inputs. An internal 435kΩ resistor to GND pulls
BSEL low when unconnected.
17 ENA1
Channel A1 Output Enable. Drive ENA1 high to enable the A1 LVDS outputs. An internal 435kΩ resistor to GND pulls the ENA1 low when unconnected.
18
Channel A1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver inputs to ensure proper operation.
19
Channel A1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver inputs to ensure proper operation.
LB_SELB
OUTA1
OUTA1
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