General Description
The MAX9392/MAX9393 dual 2 x 2 crosspoint switches
perform high-speed, low-power, and low-noise signal
distribution. The MAX9392/MAX9393 multiplex one of two
differential input pairs to either or both low-voltage differential signaling (LVDS) outputs for each channel.
Independent enable inputs turn on or turn off each differential output pair.
Four LVCMOS/LVTTL logic inputs (two per channel) control the internal connections between inputs and outputs.
This flexibility allows for the following configurations: 2 x 2
crosspoint switch, 2:1 mux, 1:2 splitter, or dual repeater.
This makes the MAX9392/MAX9393 ideal for protection
switching in fault-tolerant systems, loopback switching for
diagnostics, fanout buffering for clock/data distribution,
and signal regeneration.
Fail-safe circuitry forces the outputs to a differential low
condition for undriven inputs or when the commonmode voltage exceeds the specified range. The
MAX9392 provides high-level input fail-safe detection
for LVDS, HSTL, and other GND-referenced differential
inputs. The MAX9393 provides low-level input fail-safe
detection for LVPECL, CML, and other V
CC
-referenced
differential inputs.
Ultra-low 98ps
(P-P)
(max) pseudorandom bit sequence
(PRBS) jitter ensures reliable communications in highspeed links that are highly sensitive to timing error,
especially those incorporating clock-and-data recovery,
or serializers and deserializers. The high-speed switching performance guarantees 1.5GHz operation and less
than 67ps (max) skew between channels.
LVDS inputs and outputs are compatible with the
TIA/EIA-644 LVDS standard. The LVDS outputs drive
100Ω loads. The MAX9392/MAX9393 are offered in
a 32-pin TQFP package and operate over the extended
temperature range (-40°C to +85°C).
Also see the MAX9390/MAX9391 for the crossflow version.
Applications
High-Speed Telecom/Datacom Equipment
Central-Office Backplane Clock Distribution
DSLAM
Protection Switching
Fault-Tolerant Systems
Features
♦ 1.5GHz Operation with 250mV Differential Output
Swing
♦ 2ps
RMS
(max) Random Jitter
♦ AC Specifications Guaranteed for 150mV
Differential Input
♦ Signal Inputs Accept Any Differential Signaling
Standard
♦ LVDS Outputs for Clock or High-Speed Data
♦ High-Level Input Fail-Safe Detection (MAX9392)
♦ Low-Level Input Fail-Safe Detection (MAX9393)
♦ 3.0V to 3.6V Supply Voltage Range
♦ LVCMOS/LVTTL Logic Inputs Control Signal
Routing
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
________________________________________________________________ Maxim Integrated Products 1
Pin Configurations
Ordering Information
19-2913; Rev 1; 5/07
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
+Denotes a lead-free package.
Functional Diagram and Typical Operating Circuit appear at
end of data sheet.
EVALUATION KIT
AVAILABLE
PART TEMP RANGE
MAX9392EHJ -40°C to +85°C 32 TQFP H32-1
MAX9392EHJ+ -40°C to +85°C 32 TQFP H32-1
MAX9393EHJ -40°C to +85°C 32 TQFP H32-1
MAX9393EHJ+ -40°C to +85°C 32 TQFP H32-1
PINPACKAGE
PKG
CODE
TOP VIEW
INA1
INA1
OUTB1
VCCASEL0
293031
MAX9392
MAX9393
GND
OUTB1
TQFP
13
ENB0
27
14
INA0
26
15
OUTB0
INA0
25
1611 12
OUTB0
GND
CC
V
24 V
23
22
21
20
19
18
17
CC
OUTA0
OUTA0
ENA0
GND
OUTA1
OUTA1
ENA1
INB0
INB0
BSEL0
V
INB1
INB1
ASEL1
32 28
+
1GND
2
3
4
5
CC
6
7
8BSEL1
10
9
ENB1
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC= 3.0V to 3.6V, RL= 100Ω±1%, EN_ _ = VCC, VCM= 0.05V to (VCC- 0.6V) (MAX9392), VCM= 0.6V to (VCC- 0.05V)
(MAX9393), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= 3.3V, |VID| = 0.2V, VCM= 1.2V, TA= +25°C,
unless otherwise noted.) (Notes 1, 2, and 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +4.1V
IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _,
_SEL_ to GND..........................................-0.3V to (V
CC
+ 0.3V)
IN_ _ to IN_ _ ..........................................................................±3V
Short-Circuit Duration (OUT_ _, OUT_ _) ...................Continuous
Continuous Power Dissipation (T
A
= +70°C)
32-Pin TQFP (derate 13.1mW/°C
above +70°C).............................................................1047mW
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin TQFP............................................................+76.4°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature (10s) ...........................................+300°C
LVCMOS/LVTTL INPUTS (EN_ _, _SEL_)
Input High Voltage V
Input Low Voltage V
Input High Current I
Input Low Current I
DIFFERENTIAL INPUTS (IN_ _, IIIINNNN____ ____)
Differential Input Voltage V
Input Common-Mode Range V
Input Current
LVDS OUTPUTS (OUT_ _, OOOOUUUUTTTT____ ____)
Differential Output Voltage V
Change in Magnitude of V
Between Complementary Output
States
Offset Common-Mode Voltage V
Change in Magnitude of V
Between Complementary Output
States
PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS
IH
IL
VIN = 2.0V to V
VIN = 0 to 0.8V 0 10 µA
V
ID
,
OD
OS
> 0 and V
ILD
MAX9392 0.05 VCC - 0.6
MAX9393 0.6 VCC - 0.05
MAX9392 |VID| < 3.0V -50 +10
RL = 100Ω, Figure 2 250 350 450 mV
Figure 2 1.0 50 mV
Figure 2 1.125 1.25 1.375 V
Figure 2 1.0 50 mV
OD
OS
IH
IL
CM
I
IN_ _
I
IN_ _ MAX9393 |V
OD
ΔV
OS
ΔV
2.0 V
0 0.8 V
CC
< VCC, Figure 1 0.1 3.0 V
IHD
| < 3.0V -10 +90
ID
020µA
CC
V
V
µA
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 3
AC ELECTRICAL CHARACTERISTICS
(VCC= 3.0V to 3.6V, fIN≤ 1.34GHz, t
R_IN
= t
F_IN
= 125ps, RL= 100Ω±1%, |VID| ≥ 150mV, VCM= 0.075V to (VCC- 0.6V) (MAX9392
only), V
CM
= 0.6V to (VCC- 0.075V) (MAX9393 only), EN_ _ = VCC, TA= -40°C to +85°C, unless otherwise noted. Typical values are
at V
CC
= 3.3V, |VID| = 0.2V, VCM= 1.2V, fIN= 1.34GHz, TA= +25°C, unless otherwise noted.) (Note 5)
Note 1: Measurements obtained with the device in thermal equilibrium. All voltages referenced to GND except V
ID
, VOD, and ΔVOD.
Note 2: Current into the device defined as positive. Current out of the device defined as negative.
Note 3: DC parameters tested at T
A
= +25°C and guaranteed by design and characterization for TA= -40°C to +85°C.
Note 4: Current through either output.
Note 5: Guaranteed by design and characterization. Limits set at ±6 sigma.
Note 6: t
SKEW
is the magnitude difference of differential propagation delays for the same output over same conditions. t
SKEW
=
|t
PHL
- t
PLH
|.
Note 7: Measured between outputs of the same device at the signal crossing points for a same-edge transition, under the same
conditions.
Note 8: Device jitter added to the differential input signal.
DC ELECTRICAL CHARACTERISTICS (continued)
(VCC= 3.0V to 3.6V, RL= 100Ω±1%, EN_ _ = VCC, VCM= 0.05V to (VCC- 0.6V) (MAX9392), VCM= 0.6V to (VCC- 0.05V)
(MAX9393), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= 3.3V, |VID| = 0.2V, VCM= 1.2V, TA= +25°C,
unless otherwise noted.) (Notes 1, 2, and 3)
Output Short-Circuit Current
(Either Output Shorted to GND)
Output Short-Circuit Current
(Outputs Shorted Together)
SUPPLY CURRENT
Supply Current I
PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS
V
|I
|I
OSB
OS
CC
V
= ±100m V
ID
|
( N ote 4)
= ±100mV, V
V
ID
|
(Note 4)
RL = 100Ω, EN_ _ = V
OUT_ _
V
OUT_ _
OUT_ _
CC
or V
= V
= V
OUT_ _
= 0 30 40
OUT_ _
= 0 18 24
OUT_ _
mA
5.0 12 mA
68 98 mA
PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS
_SEL_ to Switched Output t
Disable Time to Differential
Output Low
Enable Time to Differential
Output High
Switching Frequency f
Low-to-High Propagation Delay t
High-to-Low Propagation Delay t
SWITCH
t
PHD
t
PDH
MAX
PLH
PHL
Figure 3 1.1 ns
Figure 4 1.7 ns
Figure 4 1.7 ns
VOD > 250mV 1.5 2.2 GHz
Figures 1, 5 294 410 574 ps
Figures 1, 5 286 402 555 ps
Pulse Skew |t
Output-to-Output Skew t
Output Low-to-High Transition
Time (20% to 80%)
Output High-to-Low Transition
Time (80% to 20%)
Added Random Jitter t
Added Deterministic Jitter t
PLH
- t
|t
PHL
SKEW
CCS
t
R
t
F
RJ
DJ
Figures 1, 5 (Note 6) 17 104 ps
Figures 5, 6 (Note 7) 4 67 ps
Figures 1, 5; fIN = 100MHz 112 142 185 ps
Figures 1, 5; fIN = 100MHz 112 145 185 ps
f
= 1.34GHz, clock pattern (Note 8) 2 ps
IN_ _
1.34Gbps, 223 - 1 PRBS (Note 8) 60 98 ps
RMS
P-P
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
4 _______________________________________________________________________________________
Typical Operating Characteristics
(VCC= +3.3V, |VID| = 0.2V, VCM= +1.2V, fIN= 1.34GHz, TA= +25°C, unless otherwise noted.)
SUPPLY CURRENT
vs. TEMPERATURE
MAX9392 toc01
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
603510-15
55
60
65
70
75
80
50
-40 85
VCC = 3.6V
VCC = 3.0V
VCC = 3.3V
0
150
100
50
200
250
350
300
400
0 0.4 0.60.2 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
OUTPUT AMPLITUDE vs. FREQUENCY
MAX9392 toc02
FREQUENCY (GHz)
OUTPUT AMPLITUDE (mV)
OUTPUT RISE AND FALL TIMES
vs. TEMPERATURE
MAX9392 toc03
TEMPERATURE (°C)
RISE/FALL TIME (ps)
603510-15
130
140
150
160
170
180
120
-40 85
fIN = 100MHz
t
F
t
R
350
380
370
360
390
400
410
420
430
440
450
-40 10-15 35 60 85
PROPAGATION DELAY
vs. TEMPERATURE
MAX9392 toc04
TEMPERATURE (°C)
PROPAGATION DELAY (ps)
MAX9392
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9392 toc05
TEMPERATURE (°C)
INPUT CURRENT (μA)
603510-15
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
-40 85
VIN = 3.0V
VIN = 0.1V
MAX9393
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9392 toc06
TEMPERATURE (°C)
INPUT CURRENT (μA)
603510-15
10
20
30
40
50
60
70
0
-40 85
VIN = 3.2V
VIN = 0.3V
MAX9392
INPUT CURRENT vs. V
IHD
MAX9392 toc07
V
IHD
(V)
INPUT CURRENT (μA)
3.33.02.4 2.70.6 0.9 1.2 1.5 1.8 2.10.3
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
0 3.6
VCC = 3V
IN_ _ OR IN_ _ = GND
VCC = 3.6V
MAX9393
INPUT CURRENT vs. V
ILD
MAX9392 toc08
V
ILD
(V)
INPUT CURRENT (μA)
3.33.02.4 2.70.6 0.9 1.2 1.5 1.8 2.10.3
0
10
20
30
40
50
60
70
80
-10
0 3.6
VCC = 3V
VCC = 3.6V
IN_ _ OR IN_ _ = V
CC
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 5
PIN NAME FUNCTION
1, 12,
20, 25
5, 16,
24, 29
GND Ground
2 INB0
3 INB0
4 BSEL0
V
CC
6 INB1
7 INB1
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Noninverting Input. An internal 128kΩ resistor to V
the input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Inverting Input. An internal 128kΩ resistor to V
input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
Input Select for B0 Output. Selects the differential input to reproduce at the B0 differential outputs. Connect
BSEL0 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL0 to VCC to select the INB1
(INB1) set of inputs. An internal 435kΩ resistor pulls BSEL0 low when unconnected.
Power-Supply Input. Bypass each VCC to GND with 0.1µF and 0.01µF ceramic capacitors. Install both bypass
capacitors as close to the device as possible, with the 0.01µF capacitor closest to the device.
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Noninverting Input. An internal 128kΩ resistor to V
the input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Inverting Input. An internal 128kΩ resistor to V
input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
pulls
CC
pulls the
CC
pulls
CC
pulls the
CC
8 BSEL1
9 ENB1
10 OUTB1
11 OUTB1
13 ENB0
14 OUTB0
15 OUTB0
Input Select for B1 Output. Selects the differential input to reproduce at the B1 differential outputs. Connect
BSEL1 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL1 to V
(INB1) set of inputs. An internal 435kΩ resistor pulls BSEL1 low when unconnected.
B1 Output Enable. Drive ENB1 high to enable the B1 LVDS outputs. An internal 435kΩ resistor pulls ENB1 low
when unconnected.
B1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the receiver
inputs to ensure proper operation.
B1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the receiver
inputs to ensure proper operation.
B0 Output Enable. Drive ENB0 high to enable the B0 LVDS outputs. An internal 435kΩ resistor pulls ENB0 low
when unconnected.
B0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the receiver
inputs to ensure proper operation.
B0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the receiver
inputs to ensure proper operation.
to select the INB1
CC