MAXIM MAX9390, MAX9391 Technical data

General Description
The MAX9390/MAX9391 dual 2 x 2 crosspoint switches perform high-speed, low-power, and low-noise signal distribution. The MAX9390/MAX9391 multiplex one of two differential input pairs to either or both low-voltage differ­ential signaling (LVDS) outputs for each channel. Independent enable inputs turn on or turn off each differ­ential output pair.
Four LVCMOS/LVTTL logic inputs (two per channel) con­trol the internal connections between inputs and outputs. This flexibility allows for the following configurations: 2 x 2 crosspoint switch, 2:1 mux, 1:2 splitter, or dual repeater. This makes the MAX9390/MAX9391 ideal for protection switching in fault-tolerant systems, loopback switching for diagnostics, fanout buffering for clock/data distribution, and signal regeneration.
Fail-safe circuitry forces the outputs to a differential low condition for undriven inputs or when the common­mode voltage exceeds the specified range. The MAX9390 provides high-level input fail-safe detection for LVDS, HSTL, and other GND-referenced differential inputs. The MAX9391 provides low-level input fail-safe detection for LVPECL, CML, and other VCC-referenced differential inputs.
Ultra-low 82ps
(P-P)
(max) pseudorandom bit sequence (PRBS) jitter ensures reliable communications in high­speed links that are highly sensitive to timing error, especially those incorporating clock-and-data recovery, or serializers and deserializers. The high-speed switch­ing performance guarantees 1.5GHz operation and less than 65ps (max) skew between channels.
LVDS inputs and outputs are compatible with the TIA/EIA-644 LVDS standard. The LVDS outputs drive 100loads. The MAX9390/MAX9391 are offered in a 32-pin TQFP and 5mm x 5mm thin QFN package with exposed paddle and operate over the extended tem­perature range (-40°C to +85°C).
Also refer to the MAX9392/MAX9393 with flow-through pinout.
Applications
High-Speed Telecom/Datacom Equipment
Central-Office Backplane Clock Distribution
DSLAM
Protection Switching
Fault-Tolerant Systems
Features
1.5GHz Operation with 250mV Differential Output
Swing
2ps
(RMS)
(max) Random Jitter
AC Specifications Guaranteed for 150mV
Differential Input
Signal Inputs Accept Any Differential Signaling
Standard
LVDS Outputs for Clock or High-Speed Data
High-Level Input Fail-Safe Detection (MAX9390)
Low-Level Input Fail-Safe Detection (MAX9391)
+3.0V to +3.6V Supply Voltage Range
LVCMOS/LVTTL Logic Inputs Control Signal
Routing
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
________________________________________________________________ Maxim Integrated Products 1
Pin Configurations
Ordering Information
19-2829; Rev 1; 7/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
*Future product—contact factory for availability.
Pin Configurations continued at end of data sheet.
Functional Diagram and Typical Operating Circuit appear at end of data sheet.
PART TEMP RANGE PIN-PACKAGE
MAX9390EHJ -40°C to +85°C 32 TQFP
MAX9390ETJ* -40°C to +85°C 32 Thin QFN
MAX9391EHJ -40°C to +85°C 32 TQFP
MAX9391ETJ* -40°C to +85°C 32 Thin QFN
TOP VIEW
INA1
INA1
INB0
VCCASEL0
293031
MAX9390 MAX9391
INB0
BSEL0
TQFP
INA0
INA0
GND
26
25
27
24 V
CC
OUTA0
23
OUTA0
22
ENA0
21
GND
20
OUTA1
19
OUTA1
18
ENA1
17
14
15
13
CC
V
INB1
INB1
1611 12
BSEL1
OUTB1
OUTB1
GND
ENB0
OUTB0
OUTB0
ASEL1
32 28
1ENB1
2
3
4
5
6
7
8V
CC
10
9
GND
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2 Crosspoint Switches
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC= +3.0V to +3.6V, RL= 100Ω±1%, EN_ _ = VCC, VCM= 0.05V to (VCC- 0.6V) (MAX9390), VCM= 0.6V to (VCC- 0.05V) (MAX9391) T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +3.3V, |VID| = 0.2V, VCM= +1.2V, TA= +25°C.)
(Notes 1, 2, and 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +4.1V
IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _,
_SEL_ to GND.........................................-0.3V to (V
CC
+ 0.3V)
IN_ _ to IN_ _ ..........................................................................±3V
Short-Circuit Duration (OUT_ _, OUT_ _) ...................Continuous
Continuous Power Dissipation (T
A
= +70°C) 32-Pin QFP (derate 13.1mW/°C
above +70°C).............................................................1047mW
32-Pin 5mm x 5mm Thin QFN (derate 21.3mW/°C
above +70°C).............................................................1702mW
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin QFP..............................................................+76.4°C/W
32-Pin 5mm x 5mm Thin QFN....................................+47°C/W
Junction-to-Case Thermal Resistance
32-Pin 5mm x 5mm Thin QFN......................................+2°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection (Human Body Model)
(IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _, SEL_ _) ................±2kV
Soldering Temperature (10s) ...........................................+300°C
LVCMOS/LVTTL INPUTS (EN_ _, _SEL_)
Input High Voltage V
Input Low Voltage V
Input High Current I
Input Low Current I
DIFFERENTIAL INPUTS (IN_ _, IIIINNNN____ ____)
Differential Input Voltage V
Input Common-Mode Range V
Input Current
LVDS OUTPUTS (OUT_ _, OOOOUUUUTTTT____ ____)
Differential Output Voltage V
Change in Magnitude of V Between Complementary Output States
Offset Common-Mode Voltage V
Change in Magnitude of V Between Complementary Output States
PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS
OD
OS
IH
IL
IH
IL
ID
CM
I
IN_ _
I
IN_ _ MAX9391 |V
OD
V
OD
OS
V
OS
VIN = +2.0V to V
VIN = 0 to +0.8V 0 10 µA
V
> 0 and V
ILD
MAX9390 0.05 VCC - 0.6
MAX9391 0.6 VCC - 0.05
MAX9390 |VID| < 3.0V -75 +10
,
RL = 100, Figure 2 250 350 450 mV
Figure 2 1.0 50 mV
Figure 2 1.125 1.25 1.375 V
Figure 2 1.0 50 mV
2.0 V
0 0.8 V
CC
< VCC, Figure 1 0.1 3.0 V
IHD
| < 3.0V -10 +100
ID
020µA
CC
V
V
µA
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 3
AC ELECTRICAL CHARACTERISTICS
(VCC= +3.0V to +3.6V, fIN< 1.34GHz, t
R_IN
= t
F_IN
= 125ps, RL= 100Ω±1%, |VID| > 150mV, VCM= +0.075V to (VCC- 0.6V)
(MAX9390 only), V
CM
= +0.6V to (VCC- 0.075V) (MAX9391 only), EN_ _ = VCC, TA= -40°C to +85°C, unless otherwise noted. Typical
values are at V
CC
= +3.3V, |VID| = 0.2V, VCM= +1.2V, fIN= 1.34GHz, TA= +25°C.) (Note 5)
Note 1: Measurements obtained with the device in thermal equilibrium. All voltages referenced to GND except V
ID
, VOD, and ∆VOD.
Note 2: Current into the device defined as positive. Current out of the device defined as negative. Note 3: DC parameters tested at T
A
= +25°C and guaranteed by design and characterization for TA= -40°C to +85°C.
Note 4: Current through either output. Note 5: Guaranteed by design and characterization. Limits set at ±6 sigma. Note 6: t
SKEW
is the magnitude difference of differential propagation delays for the same output over same conditions. t
SKEW
=
|t
PHL
- t
PLH
|.
Note 7: Measured between outputs of the same device at the signal crossing points for a same-edge transition, under the same
conditions.
Note 8: Device jitter added to the differential input signal.
DC ELECTRICAL CHARACTERISTICS (continued)
(VCC= +3.0V to +3.6V, RL= 100Ω±1%, EN_ _ = VCC, VCM= 0.05V to (VCC- 0.6V) (MAX9390), VCM= 0.6V to (VCC- 0.05V) (MAX9391) T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +3.3V, |VID| = 0.2V, VCM= +1.2V, TA= +25°C.)
(Notes 1, 2, and 3)
(
)
(
)
Output Short-Circuit Current (Either Output Shorted to GND)
Output Short-Circuit Current (Outputs Shorted Together)
SUPPLY CURRENT
Supply Current I
PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS
V
|I
|I
OS
OSB
CC
V
= ±100m V
ID
|
( N ote 4)
V
= ±100mV, V
ID
|
(Note 4)
RL = 100Ω, EN_ _ = V
OUT_ _
V
OUT_ _
OUT_ _
= V
CC
RL = 100Ω, EN_ _ = VCC, switching at 670MHz (1.34Gbps)
or V
= V
OUT_ _
= 0 30 40
OUT_ _
= 0 18 24
OUT_ _
mA
5.0 12 mA
68 98
68 98
mA
PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS
_SEL_ to Switched Output t
SWITCH
Disable, Time to Differential Output Low
Enable, Time to Differential Output High
Switching Frequency f
Low-to-High Propagation Delay t
High-to-Low Propagation Delay t
t
PHD
t
PDH
MAX
PLH
PHL
Figure 3 1.1 ns
Figure 4 1.7 ns
Figure 4 1.7 ns
VOD > 250mV 1.50 2.20 GHz
Figures 1, 5 294 409 565 ps
Figures 1, 5 286 402 530 ps
Pulse Skew |t
Output-to-Output Skew t
Output Low-to-High Transition Time (20% to 80%)
Output High-to-Low Transition Time (80% to 20%)
Added Random Jitter t
Added Deterministic Jitter t
PLH
- t
|t
PHL
SKEW
CCS
t
R
t
F
RJ
DJ
Figures 1, 5 (Note 6) 7 97 ps
Figures 5, 6 (Note 7) 10 65 ps
Figures 1, 5; fIN = 100MHz 112 153 185 ps
Figures 1, 5; fIN = 100MHz 112 153 185 ps
f
= 1.34GHz, clock pattern (Note 8) 2 ps
IN_ _
1.34Gbps, 223 - 1 PRBS (Note 8) 55 82 ps
RMS
P-P
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2 Crosspoint Switches
4 _______________________________________________________________________________________
Typical Operating Characteristics
(VCC= +3.3V, |VID| = 0.2V, VCM= +1.2V, fIN= 1.34GHz, TA= +25°C.)
SUPPLY CURRENT
vs. TEMPERATURE
MAX9390 toc01
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
603510-15
58
62
66
70
74
78
82
54
-40 85
VCC = +3.6V
VCC = +3.3V
VCC = +3V
OUTPUT AMPLITUDE
vs. FREQUENCY
MAX9390 toc02
FREQUENCY (GHz)
OUTPUT AMPLITUDE (mV)
2.22.00.2 0.4 0.6 1.0 1.2 1.4 1.60.8 1.8
50
100
150
200
250
300
350
400
0
02.4
OUTPUT RISE AND FALL TIMES
vs. TEMPERATURE
MAX9390 toc03
TEMPERATURE (°C)
RISE/FALL TIME (ps)
603510-15
130
140
150
160
170
180
120
-40 85
t
F
fIN = 100MHz
t
R
PROPAGATION DELAY
vs. TEMPERATURE
MAX9390 toc04
TEMPERATURE (°C)
PROPAGATION DELAY (ps)
603510-15
360
370
380
390
400
410
420
430
440
450
350
-40 85
MAX9390
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAx9390 toc05
TEMPERATURE (°C)
INPUT CURRENT (µA)
603510-15
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
-40 85
VIN = -0.1V
VIN = 3V
MAX9391
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9390 toc06
TEMPERATURE (°C)
INPUT CURRENT (µA)
603510-15
0
10
20
30
40
50
60
70
80
-10
-40 85
VIN = 3.2V
VIN = 0.3V
MAX9390 INPUT CURRENT vs. V
IHD
MAX9390 toc07
V
IHD
(V)
INPUT CURRENT (µA)
3.33.02.4 2.70.6 0.9 1.2 1.5 1.8 2.10.3
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
03.6
IN_ _ OR IN_ _ = GND
VCC = +3V
VCC = +3.6V
MAX9391
DIFFERENTIAL INPUT CURRENT vs. V
ILD
MAX9390 toc08
V
ILD
(V)
INPUT CURRENT (µA)
3.33.02.4 2.70.6 0.9 1.2 1.5 1.8 2.10.303.6
-10
10
0
40
30
20
50
60
70
80
VCC = +3.6V
VCC = +3V
IN_ _ OR IN_ _ = V
CC
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 5
Pin Description
PIN NAME FUNCTION
1 ENB1
2 OUTB1
3 OUTB1
4, 9,
20, 25
5 ENB0
6 OUTB0
7 OUTB0
8, 13,
24, 29
10 INB0
11 INB0
GND Ground
V
B1 Output Enable. Drive ENB1 high to enable the B1 LVDS outputs. An internal 435k resistor pulls ENB1 low when unconnected.
B1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the receiver inputs to ensure proper operation.
B1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the receiver inputs to ensure proper operation.
B0 Output Enable. Drive ENB0 high to enable the B0 LVDS outputs. An internal 435k resistor pulls ENB0 low when unconnected.
B0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the receiver inputs to ensure proper operation.
B0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the receiver inputs to ensure proper operation.
Power-Supply Input. Bypass each VCC to GND with 0. 1µF and 0.01µF ceramic capacitors. Install both
CC
bypass capacitors as close to the device as possible, with the 0.01µF capacitor closest to the device.
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to V the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to V pulls the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
pulls
CC
CC
12 BSEL0
14 INB1
15 INB1
16 BSEL1
Input Select for B0 Output. Selects the differential input to reproduce at the B0 differential outputs. Connect BSEL0 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL0 to V INB1 (INB1) set of inputs. An internal 435k resistor pulls BSEL0 low when unconnected.
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to V the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to V pulls the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
Input Select for B1 Output. Selects the differential input to reproduce at the B1 differential outputs. Connect BSEL1 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL1 to VCC to select the INB1 (INB1) set of inputs. An internal 435k resistor pulls BSEL1 low when unconnected.
to select the
CC
CC
pulls
CC
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2 Crosspoint Switches
6 _______________________________________________________________________________________
Pin Description (continued)
PIN NAME FUNCTION
17 ENA1
18 OUTA1
19 OUTA1
21 ENA0
22 OUTA0
23 OUTA0
26 INA0
27 INA0
28 ASEL0
A1 Output Enable. Drive ENA1 high to enable the A1 LVDS outputs. An internal 435k resistor pulls ENA1 low when unconnected.
A1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver inputs to ensure proper operation.
A1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver inputs to ensure proper operation.
A0 Output Enable. Drive ENA0 high to enable the A0 LVDS outputs. An internal 435k resistor pulls ENA0 low when unconnected.
A0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the receiver inputs to ensure proper operation.
A0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the receiver inputs to ensure proper operation.
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to V pulls the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to V the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
Input Select for A0 Output. Selects the differential input to reproduce at the A0 differential outputs. Connect ASEL0 to GND or leave open to select the INA0 (INA0) set of inputs. Connect ASEL0 to V INA1 (INA1) set of inputs. An internal 435k resistor pulls ASEL0 low when unconnected.
CC
pulls
CC
to select the
CC
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to V
30 INA1
31 INA1
32 ASEL1
EP Exposed Paddle (QFN Package Only). Connect to GND for optimal thermal and EMI characteristics.
pulls the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to V the input high when unconnected (MAX9390). An internal 68k resistor to GND pulls the input low when unconnected (MAX9391).
Input Select for A1 Output. Selects the differential input to reproduce at the A1 differential outputs. Connect ASEL1 to GND or leave open to select the INA0 (INA0) set of inputs. Connect ASEL1 to VCC to select the INA1 (INA1) set of inputs. An internal 435k resistor pulls ASEL1 low when unconnected.
CC
CC
pulls
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 7
Figure 1. Output Transition Time and Propagation Delay Timing Diagram
Figure 3. Input to Rising/Falling Edge Select and Mux Switch Timing Diagram
Figure 2. Test Circuit for VODand V
OS
V
OUT_ _
V
OUT_ _
V
V
IN_ _
IN_ _
= 0
V
ID
t
PLH
= 0
V
OD
80%
t
R
V
= V
ID
VOD = V
OD
IN_ _
OUT_ _
= 0
- V
- V
IN_ _
OUT_ _
50% V
20%
t
AND t
PLH
MEASURED FOR ANY COMBINATION OF _SEL0 AND _SEL1.
PHL
80%
50%
= 0
V
ID
t
PHL
V
OD
V
OD
t
F
= 0
= 0
20%
V
IHD
V
ILD
IN_0
IN_0
= 0
V
ID
1/4 MAX9390/MAX9391
IN_ _
IN_ _
EN_ _ = HIGH VID = V
IN_ _
- V
IN_ _
VOD = VOD - VOD*
= VOS - VOS*
V
OS
AND V
V
OD
V
OD
ARE MEASURED WITH VID = +100mV
OS
* AND VOS* ARE MEASURED WITH VID = -100mV
V
IHD
V
OUT_ _
V
OD
RL/2
V
OS
/2
R
L
OUT_ _
ILD
IN_1
= 0
V
ID
IN_1
1.5V
_SEL_
OUT_ _
V
IN_0 IN_0
= 0
OD
OUT_ _
t
SWITCH
EN_0 = EN_1 = HIGH V
= V
- V
ID
IN_ _
IN_ _
IN_1
1.5V
V
OD
V
IHD
V
ILD
V
IH
V
IL
= 0
t
SWITCH
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2 Crosspoint Switches
8 _______________________________________________________________________________________
Figure 4. Output Active-to-Disable and Disable-to-Active Test Circuit and Timing Diagram
Figure 5. Output Transition Time, Propagation Delay, and Output Channel-to-Channel Skew Test Circuit
IN_ _
IN_ _
1/4 MAX9390/MAX9391
PULSE
GENERATOR
50
RL = 100 ±1%
= 1.0pF
C
L
OUT_ _
C
L
RL/2
L
/2
+1.25V
OUT_ _
R
C
L
V
V
WHEN VID = +100mV
OUT_ _
V
WHEN VID = -100mV
OUT_ _
V
WHEN VID = -100mV
OUT_ _
V
WHEN VID = +100mV
OUT_ _
EN_ _
_SEL0
IN_0
0
1
PULSE
GENERATOR
IN_0
MAX9390 MAX9391
1.5V
t
t
PHD
PHD
50%
50%
VID = V
C
1.5V
t
PDH
t
PDH
- V
IN_ _
IN_ _
C
L
L
R
L
OUT_0
OUT_0
3V
0
50%
50%
50
50
IN_1
IN_1
EN_0 = EN_1 = HIGH 1 CHANNEL SHOWN
0
1
_SEL1
RL = 100 ±1% C
= 1.0pF
L
C
L
C
L
R
L
OUT_1
OUT_1
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 9
Detailed Description
The LVDS interface standard provides a signaling method for point-to-point communication over a con­trolled-impedance medium as defined by the ANSI TIA/EIA-644 standard. LVDS utilizes a lower voltage swing than other communication standards, achieving higher data rates with reduced power consumption, while reducing EMI emissions and system susceptibility to noise.
The MAX9390/MAX9391 1.5GHz dual 2 x 2 crosspoint switches optimize high-speed, low-power, point-to­point interfaces. The MAX9390 accepts LVDS and HSTL signals, while the MAX9391 accepts LVPECL and CML signals. Both devices route the input signals to either or both LVDS outputs.
When configured as a 1:2 splitter, the outputs repeat the selected inputs. This configuration creates copies of signals for protection switching. When configured as a repeater, the device operates as a two-channel buffer. Repeating restores signal amplitude, allowing isolation of media segments or longer media drive. When configured as a 2:1 mux, select primary or back­up signals to provide a protection-switched, fault-toler­ant application.
Input Fail-Safe
The differential inputs of the MAX9390/MAX9391 pos­sess internal fail-safe protection. Fail-safe circuitry forces the outputs to a differential low condition for undriven inputs or when the common-mode voltage exceeds the specified range. The MAX9390 provides high-level input fail-safe detection for LVDS, HSTL, and other GND-referenced differential inputs. The MAX9391 provides low-level input fail-safe detection for LVPECL, CML, and other VCC-referenced differential inputs.
Select Function
The _SEL_ logic inputs control the input and output sig­nal connections. Two logic inputs control the signal rout­ing for each channel. _SEL0 and _SEL1 allow the devices to be configured as a differential crosspoint switch, 2:1 mux, dual repeater, or 1:2 splitter (Figure 7). See Table 1 for mode-selection settings (insert A or B for the _). Channels A and B possess separate select inputs, allowing different configurations for each channel.
Enable Function
The EN_ _ logic inputs enable and disable each set of differential outputs. Connect EN_ 0 to V
CC
to enable
the OUT_0/OUT_0 differential output pair. Connect EN_0 to GND to disable the OUT_0/OUT_0 differential output pair. The differential output pairs assert to a dif­ferential low condition when disabled.
Figure 6. Output Channel-to-Channel Skew
Figure 7. Programmable Configurations
V
OUT_0
VOD = 0
V
OUT_0
t
CCS
V
OUT_1
V
= 0 VOD = 0
OD
V
OUT_1
VOD = V
t
MEASURED WITH _SEL0 = _SEL1 = HIGH OR LOW
CCS
(1:2 SPLITTER CONFIGURATION).
OUT_ _
- V
OUT_ _
VOD = 0
t
CCS
IN_0
IN_1
2 x 2 CROSSPOINT
IN_0
IN_1
2:1 MUX
IN_0 OR IN_1
1:2 SPLITTER
IN_0
IN_1
DUAL REPEATER
OUT_0
OUT_1
OUT_0 OR OUT_1
OUT_0
OUT_1
OUT_0
OUT_1
MAX9390/MAX9391
Applications Information
Differential Inputs
The MAX9390/MAX9391 inputs accept any differential signaling standard within the specified common-mode voltage range. The fail-safe feature detects common­mode input signal levels and generates a differential output low condition for undriven inputs or when the common-mode voltage exceeds the specified range. Leave unused inputs unconnected or connect to V
CC
for the MAX9390 or to GND for the MAX9391.
Expanding the Number of LVDS Output
Ports
Cascade devices to make larger switches. Consider the total propagation delay and total jitter when deter­mining the maximum allowable switch size.
Power-Supply Bypassing
Bypass each VCCto GND with high-frequency surface­mount ceramic 0.1µF and 0.01µF capacitors in parallel as close to the device as possible. Install the 0.01µF capacitor closest to the device.
Differential Traces
Input and output trace characteristics affect the perfor­mance of the MAX9390/MAX9391. Connect each input and output to a 50characteristic impedance trace. Maintain the distance between differential traces and eliminate sharp corners to avoid discontinuities in dif­ferential impedance and maximize common-mode noise immunity. Minimize the number of vias on the dif­ferential input and output traces to prevent impedance discontinuities. Reduce reflections by maintaining the 50characteristic impedance through connectors and across cables. Minimize skew by matching the electri­cal length of the traces.
Output Termination
Terminate LVDS outputs with a 100resistor between the differential outputs at the receiver inputs. LVDS out­puts require 100termination for proper operation.
Ensure that the output currents do not exceed the cur­rent limits specified in the Absolute Maximum Ratings. Observe the total thermal limits of the MAX9390/ MAX9391 under all operating conditions.
Cables and Connectors
Use matched differential impedance for transmission media. Use cables and connectors with matched differ­ential impedance to minimize impedance discontinu­ities. Avoid the use of unbalanced cables. Balanced cables such as twisted pair offer superior signal quality and tend to generate less EMI due to canceling effects.
Board Layout
Use a four-layer printed circuit (PC) board providing separate signal, power, and ground planes for high­speed signaling applications. Bypass VCCto GND as close to the device as possible. Install termination resistors as close to receiver inputs as possible. Match the electrical length of the differential traces to minimize signal skew.
Anything-to-LVDS Dual 2 x 2 Crosspoint Switches
10 ______________________________________________________________________________________
Table 1. Input/Output Function Table
_SEL0 _SEL1 OUT_0 / OUT_0 OUT_1 / OUT_1 MODE
0 0 IN_0 / IN_0 IN_0 / IN_0 1:2 splitter 0 1 IN_0 / IN_0 IN_1 / IN_1 Repeater 1 0 IN_1 / IN_1 IN_0 / IN_0 Switch 1 1 IN_1 / IN_1 IN_1 / IN_1 1:2 splitter
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
______________________________________________________________________________________ 11
Typical Operating Circuit
+3.0V TO +3.6V
0.1µF 0.01µF
Z0 = 50
= 50
Z
0
LVCMOS/LVTTL LOGIC INPUTS
100
INA0
INA0
INA1
INA1
INB0
INB0
INB1
INB1
ENA0
ENA1
ENB0
ENB1
ASEL0
ASEL1
BSEL0
BSEL1
V
CC
Z0 = 50
Z0 = 50
Z0 = 50
Z0 = 50
Z0 = 50
Z0 = 50
Z0 = 50
= 50
Z
0
100
LVDS
RECEIVER
MAX9173
MAX9390 MAX9391
OUTA0
OUTA0
OUTA1
OUTA1
OUTB0
OUTB0
OUTB1
OUTB1
GNDGND GNDGND
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2 Crosspoint Switches
12 ______________________________________________________________________________________
Chip Information
TRANSISTOR COUNT: 1565
PROCESS: Bipolar
Functional Diagram
Pin Configurations (continued)
INA0
INA0
INA1
INA1
OUTB0
OUTB0
ENB0
BSEL0
OUTB1
OUTB1
ENB1
BSEL1
0
1
1
0
0
1
1
0
MAX9390 MAX9391
OUTA0
OUTA0
ENA0
ASEL0
OUTA1
OUTA1 ENA1
ASEL1
INB0
INB0
INB1
INB1
TOP VIEW
INA1
INA1
VCCASEL0
293031
MAX9390 MAX9391
*EXPOSED PADDLE
INB0
INB0
BSEL0
INA0
INA0
GND
26
25
27
14
15
13
CC
V
INB1
1611 12
INB1
OUTB1
OUTB1
GND
ENB0
OUTB0
OUTB0
ASEL1
32 28
1ENB1
2
3
4
5
6
7
8V
CC
9
GND
10
THIN QFN
*CONNECT EXPOSED PADDLE TO GND.
24 V
23
22
21
20
19
18
17
BSEL1
CC
OUTA0
OUTA0
ENA0
GND
OUTA1
OUTA1
ENA1
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
______________________________________________________________________________________ 13
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages
.)
PIN # 1 I.D.
D
C
0.15 C A
D/2
0.15
C B
E/2
E
0.10
C
A
0.08 C
A3
A1
(NE-1) X e
DETAIL A
L
D2
C
k
e
(ND-1) X e
L
e e
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
APPROVAL
L
D2/2
b
0.10 M
E2/2
L
DOCUMENT CONTROL NO.
21-0140
C A B
PIN # 1 I.D.
0.35x45
C
E2
L
k
CC
QFN THIN.EPS
L
L
REV.
1
C
2
COMMON DIMENSIONS
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
EXPOSED PAD VARIATIONS
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE
16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
21-0140
REV.DOCUMENT CONTROL NO.APPROVAL
2
C
2
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2 Crosspoint Switches
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages
.)
32L TQFP, 5x5x01.0.EPS
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