MAX9325
2:8 Differential LVPECL/LVECL/HSTL Clock and
Data Driver
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ferential input is configured for single-ended operation
by connecting the on-chip reference voltage, VBB, to an
unused complementary input as a reference. For example, the differential CLK0, CLK0 input is converted to a
noninverting, single-ended input by connecting VBBto
CLK0 and connecting the single-ended input to CLK0.
Similarly, an inverting input is obtained by connecting
VBBto CLK0 and connecting the single-ended input to
CLK0. With a differential input configured as singleended (using VBB), the single-ended input can be driven
to VCCor VEEor with a single-ended LVPECL/LVECL
signal.
When configuring a differential input as a single-ended
input, a user must ensure that the supply voltage (VCCVEE) is greater than 2.58V. This is because the input
high minimum level must be at (VEE+ 1.2V) or higher
for proper operation. The reference voltage VBBmust
be at least (VEE+ 1.2V) or higher for the same reason
because it becomes the high-level input when the other
single-ended input swings below it. The minimum V
BB
output for the MAX9325 is (VCC- 1.38V). Substituting
the minimum VBBoutput for (VBB= VEE+ 1.2V) results
in a minimum supply (V
CC
- VEE) of 2.58V. Rounding up
to standard supplies gives the single-ended operating
supply ranges (VCC- VEE) of 3.0V to 3.8V for the
MAX9325.
When using the V
BB
reference output, bypass it with a
0.01µF ceramic capacitor to V
CC
. If not used, leave it
open. The VBBreference can source or sink 0.5mA,
which is sufficient to drive two inputs.
Applications Information
Output Termination
Terminate the outputs through 50Ω to (VCC- 2V) or use
equivalent Thevenin terminations. Terminate each Q and
Q output with identical termination on each for low output
distortion. When a single-ended signal is taken from the
differential output, terminate both Q_ and Q_.
Ensure that output currents do not exceed the current
limits as specified in the Absolute Maximum Ratings
table. Under all operating conditions, the device’s total
thermal limits should be observed.
Supply Bypassing
Bypass each VCCto VEEwith high-frequency surfacemount ceramic 0.1µF and 0.01µF capacitors. Place the
capacitors as close to the device as possible with the
0.01µF capacitor closest to the device pins.
Use multiple vias when connecting the bypass capacitors to ground. When using the VBBreference output,
bypass it with a 0.01µF ceramic capacitor to VCC. If the
VBBreference is not used, it can be left open.
Traces
Circuit board trace layout is very important to maintain
the signal integrity of high-speed differential signals.
Maintaining integrity is accomplished in part by reducing signal reflections and skew, and increasing common-mode noise immunity.
Signal reflections are caused by discontinuities in the
50Ω characteristic impedance of the traces. Avoid discontinuities by maintaining the distance between differential traces, not using sharp corners or using vias.
Maintaining distance between the traces also increases
common-mode noise immunity. Reducing signal skew
is accomplished by matching the electrical length of
the differential traces.
Exposed-Pad Package
The 28-lead QFN package (MAX9325EGI) has the
exposed paddle on the bottom of the package that provides the primary heat removal path from the IC to the
PC board, as well as excellent electrical grounding to
the PC board. The MAX9325EGI’s exposed pad is
internally connected to VEE. Do not connect the
exposed pad to a separate circuit ground plane
unless VEEand the circuit ground are the same.
Chip Information
TRANSISTOR COUNT: 1030
PROCESS: Bipolar