MAX9322
LVECL/LVPECL 1:15 Differential
Divide-by-1/Divide-by-2 Clock Driver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto VEE.............................................................................4.1V
Inputs and Outputs to V
EE
..........................-0.3V to (VCC+ 0.3V)
Differential Input Magnitude............Lower of (V
CC
- VEE) and 3V
Continuous Output Current .................................................50mA
Surge Output Current........................................................100mA
V
BB
Sink/Source Current ...............................................±0.65mA
Continuous Power Dissipation (T
A
= +70°C)
Single-Layer PC Board
52-Pin TQFP (derate 15.4mW/°C above +70°C).....1230.8mW
68-Lead QFN (derate 27.8mW/°C above +70°C) ...2222.2mW
Multilayer PC Board
52-Pin TQFP (derate 19.1mW/°C above +70°C).....1529.6mW
68-Lead QFN (derate 38.5mW/°C above +70°C) ...3076.9mW
Junction-to-Ambient Thermal Resistance in Still Air
Single-Layer PC Board
52-Pin TQFP...............................................................+65°C/W
68-Lead QFN .............................................................+36°C/W
Multilayer PC Board
52-Pin TQFP............................................................+52.3°C/W
68-Lead QFN .............................................................+26°C/W
Junction-to-Ambient Thermal Resistance with 500 LFPM Airflow
Single-Layer PC Board
52-Pin TQFP...............................................................+50°C/W
68-Lead QFN .............................................................+27°C/W
Multilayer PC Board
52-Pin TQFP...............................................................+40°C/W
68-Lead QFN .............................................................+20°C/W
Junction-to-Case Thermal Resistance
52-Pin TQFP............................................................+12.9°C/W
68-Lead QFN ...............................................................+2°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection
Human Body Model (Q_ _,
Q_ _, CLK_SEL,
FSEL_, CLK_, CLK_, MR, V
BB
) ............................................±2kV
Soldering Temperature (10s) ...........................................+300°C
DC ELECTRICAL CHARACTERISTICS
((VCC- VEE) = 2.375V to 3.8V, outputs loaded with 50Ω ±1% to VCC- 2V; CLK_SEL, FSEL_ = high or low; MR = low; |VID| = 0.095V to
the lower of (V
CC
- VEE) and 3V. Typical values are at (VCC- VEE) = 3.3V, V
IHD
= VCC- 1V, V
ILD
= VCC- 1.5V.) (Notes 1–4)