thermal resistance of the package chosen, and θCAis
the thermal resistance from the case through the PC
board, copper traces, and other materials to the surrounding air. Figure 5 shows the allowable power dissipation for typical PC boards at +25°C, +50°C, and
+70°C ambient temperatures.
The MAX8869 TSSOP-EP package features an
exposed thermal pad on its underside. This pad lowers
the package’s thermal resistance by providing a direct
thermal heat path from the die to the PC board.
Additionally, the ground pin (GND) also channels heat.
Connect the exposed thermal pad and GND to circuit
ground by using a large pad (1in2minimum recommended) or multiple vias to the ground plane.
Applications Information
Capacitor Selection and
Regulator Stability
Capacitors are required at the MAX8869 input and output. Connect 1µF or greater capacitors between IN and
GND (CIN) and OUT and GND (C
OUT
). Due to the
MAX8869’s relatively high bandwidth, use only surfacemount ceramic capacitors that have low equivalent
series resistance (ESR) and high self-resonant frequency (SRF). Make the input and output traces at least
2.5mm wide (the width of the four parallel pins), and
connect CINand C
OUT
within 6mm of the IC to minimize the impact of PC board trace inductance. The
width of the ground trace should be maximized underneath the IC to ensure a good connection between pin
10 (GND) and the ground side of the capacitors.
The output capacitor’s ESR and SRF can affect stability
and output noise. Use capacitors with greater than 5MHz
SRF and ESR of 60mΩ or less to ensure stability and
optimum transient response. This is particularly true in
applications with very low output voltage (<2V) and high
output current (>0.5A).
Since some capacitor dielectrics may vary over bias
voltage and temperature, consult the capacitor manufacturer specifications to ensure that the capacitors
meet these requirements over all voltage and temperature conditions used.
Soft-Start Capacitor Selection
A capacitor (CSS) connected from SS to GND causes
the MAX8869 output current to slowly rise during startup, reducing stress on the input supply. The rise time to
full current limit (tSS) is determined by:
tSS= 2.08 ✕10
-4
✕
C
SS
where CSSis in nF. Typical capacitor values between
10nF to 100nF, with a 5V rating, are sufficient.
Because this ramp is applied to the current-limit comparator, the actual time for the output voltage to ramp
up depends on the load current and output capacitor.
Leave SS open to disable soft-start.
Input-Output (Dropout) Voltage
A regulator’s minimum input-to-output voltage differential (dropout voltage) determines the lowest usable supply voltage. In battery-powered systems, this
determines the useful end-of-life battery voltage. Since
a 0.2Ω P-channel MOSFET is used as the pass device,
dropout voltage is the product of R
DS(ON
) and load
current (see Electrical Characteristics and Dropout
Voltage vs. Output Current in Typical Operating
Characteristics). The MAX8869 operating current
remains low in dropout.
Noise, PSRR, and Transient Response
The MAX8869 is designed to achieve low dropout voltage and low quiescent current in battery-powered systems while still maintaining good noise, transient
response, and AC rejection (see PSRR vs. Frequency
in the Typical Operating Characteristics). When operating from very noisy sources, supply noise rejection and
transient response can be improved by increasing the
values of the input and output capacitors and employing passive postfiltering. MAX8869 output noise is typically 150µV
RMS.
(see the Output Noise plot in the
Typical Operating Characteristics).
MAX8869
1A, MicroCap, Low-Dropout,
Linear Regulator
_______________________________________________________________________________________ 9
Figure 5. Power Operating Region: Maximum Output Current
vs. Input-Output Differential Voltage