MAXIM MAX6638 Technical data

General Description
The MAX6638 thermal-management sensor includes internal (local) and external (remote) digital temperature sensors and two independent SMBus™ serial ports. The remote temperature accuracy is ±1.0°C, and the local temperature accuracy is ±2°C. The MAX6638 also fea­tures extended temperature resolution data available in
The MAX6638 provides three system alarms: channel 1 alert (ALERT1), overtemperature (OVERT1), and chan­nel 2 alert (ALERT2) that contain programmable thresh­olds set independently by each of the SMBus serial ports (SMBus1 and SMBus2). Each alert output asserts when any of four temperature conditions is violated: local overtemperature, remote overtemperature, local undertemperature, or remote undertemperature. The overtemperature signal asserts when the temperature rises above the value in the overtemperature limit regis­ter. Use the OVERT1 output to activate a cooling fan or trigger a system shutdown.
Each of the 2-wire serial-interface ports accepts stan­dard System Management Bus (SMBus) write byte, read byte, send byte, and receive byte commands indepen­dently of one another with total collision avoidance han­dled by the MAX6638. Each SMBus can operate its own unique serial-data rate to access any register in the MAX6638 for data reads or data writes. The MAX6638 manages all dual-port data register access functions providing a seamless, conflict-free integration into a multimaster architecture for thermal management.
The MAX6638 performs measurements autonomously, at the programmed conversion rate, or in a single-con­version mode. Each SMBus port can set the conversion rate with the higher conversion and update rate domi­nating the average power-supply current. Single-con­version requests have a maximum delay of two conversion cycles with channel-conversion manage­ment and cycling regulated by the dual-port controller.
The MAX6638 operating temperature range is -40°C to +125°C and measures temperatures between 0°C and +145°C. The MAX6638 is available in a 16-pin, 4mm x 4mm TQFN with exposed paddle package.
Applications
Graphics Cards
Notebook Computers
Computer Motherboard Systems
Desktop Computers
Workstations
Features
Two Independent SMBus/I2C-Compatible
Interfaces with Collision Avoidance
High Accuracy
±1.0°C from +85°C to +100°C (Remote)
Remote and Local Temperature MeasurementsThree Programmable Output Alarms: ALERT1,
OVERT1, and ALERT2
Programmable Conversion Rates
11-Bit Low-Noise Integrating ADC
No Calibration Required
Autoscan Conversions
MAX6638
Temperature Monitor with
Dual Serial Interface
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-3895; Rev 1; 1/06
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
PART
TEMP
RANGE
PIN­PACKAGE
PKG
CODE
MAX6638ATE+
16 TQFN-EP* (4mm x 4mm)
T1644-4
SMBus is a trademark of Intel Corporation.
Typical Operating Circuit appears at end of data sheet.
15
16
14
13
6
5
7
DXP
8
V
CC
SCK1
N.C.
12 4
12 11 9
SDA2
SCK2
GND
N.C.
I.C.
N.C.
MAX6638
DXN SDA1
3
10
N.C.
TQFN-EP
TOP VIEW
OVERT1 ALERT1
ALERT2
+
Pin Configuration
*EP = Exposed paddle. +Denotes lead-free package.
-40°C to +125°C
MAX6638
Temperature Monitor with Dual Serial Interface
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC= 3.0V to 5.5V, TA= -40°C to +125°C, unless otherwise noted. Typical values are at VCC= 3.3V and TA= +85°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND, unless otherwise noted.) V
CC ....................................................................................
-0.3V to +6.0V
DXP.............................................................-0.3V to (V
CC
+ 0.3V)
DXN .......................................................................-0.3V to +0.8V
SCK1, SDA1, SCK2, SDA2, ALERT1,
OVERT1, ALERT2 .....................................................-0.3V to +6V
SDA1, SDA2, ALERT1, OVERT1, ALERT2 ..........-1mA to +50mA
DXN Current .......................................................................±1mA
Continuous Power Dissipation (T
A
= +70°C)
16-Pin TQFN (derate 16.9 mW/°C above +70°C) ....1349 mW
ESD Protection (all pins, Human Body Model) ................±2000V
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Supply Voltage V
Operating Current
Standby Supply Current SMBus1 and SMBus2 static 3 10 µA
TEMPERATURE MEASUREMENT
Remote Diode-Source Current I
Remote Temperature Error
Local Temperature Error
Supply Sensitivity of Temperature Error
POWER-ON RESET
Power-On-Reset Threshold VCC falling 1.9 V
POR Threshold Hysteresis 90 mV
Undervoltage-Lockout Threshold VCC falling 2.30 2.60 2.95 V
Undervoltage-Lockout Hysteresis 90 mV
ANALOG-TO-DIGITAL CONVERTER
Conversion Time
ALERT1, OVERT1, ALERT2, SDA1, SDA2
Output Low Voltage V
Leakage Current I
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CC
RJ
OL
LEAK
During conversion 600 950
ADC not converting 80
High level 80 100 120
Low level 8 10 12
VCC = 3.3V, TA = +85°C to +100°C, T
= +85°C to +145°C
RJ
VCC = 3.3V, TA = +25°C to +100°C, T
= +25°C to +145°C
RJ
= 3.3V, TA = +0°C to +125°C,
V
CC
T
= 0°C to +145°C
RJ
VCC = 3.3V, TA = +25°C to +85°C -2.0 +2.0
= 3.3V, TA = 0°C to +125°C -3.5 +3.5
V
CC
Nonoverlapping single conversion from stop bit to conversion complete
IOL = 6mA 0.6 V
VOH = 5.5V ±1 µA
3.0 5.5 V
-1.0 +1.0
-2.0 +2.0
-3.0 +3.0
±0.2 °C/V
23 32 39 ms
µA
µA
°C
°C
MAX6638
Temperature Monitor with
Dual Serial Interface
_______________________________________________________________________________________ 3
Note 1: All parameters are tested at a single temperature. Specifications over temperature are guaranteed by design. Note 2: Timing specifications are guaranteed by design. Note 3: Each serial interface resets when its SCK_ is low for more than t
TIMEOUT
.
Note 4: A transition must internally provide at least a hold time to bridge the unidentified region (300ns max) of SCK_’s falling edge.
ELECTRICAL CHARACTERISTICS (continued)
(VCC= 3.0V to 5.5V, TA= -40°C to +125°C, unless otherwise noted. Typical values are at VCC= 3.3V and TA= +85°C.) (Note 1)
SMBus INTERFACE (SCK1, SCK2, SDA1, SDA2)
Logic Input Low Voltage V
Logic Input High Voltage V
Input Leakage Current I
Input Capacitance C
SMBus-COMPATIBLE TIMING (Figure 5) (Note 2)
Serial-Clock Frequency f
Bus Free Time Between STOP and START Condition
START Condition Setup Time 4.7 µs
Rep eat S TART C ond i ti on S etup Ti m et
START Condition Hold Time t
STOP Condition Setup Time t
Clock Low Period t
Clock High Period t
Data Setup Time t
Data Hold Time t
SMBus Rise Time t
SMBus Fall Time t
SMBus Timeout t
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IL
IH
LEAK
IN
SCK
t
BUF
SU:STA
HD:STA
SU:STO
LOW
HIGH
SU:DAT
HD:DAT
R
F
TIMEOUT
2.1 V
VIN = GND or V
(Note 3) 100 kHz
90% of SCK_ to 90% of SDA_ 50 ns
10% of SDA_ to 90% of SCK_ 4 µs
90% of SCK_ to 90% of SDA_ 4 µs
10% to 10% 4.7 µs
90% to 90% 4.0 µs
(Note 4) 300 ns
SDA_ low period for interface reset 30 45 60 ms
CC
5pF
4.7 µs
250 ns
0.8 V
±1 µA
s
300 ns
MAX6638
Temperature Monitor with Dual Serial Interface
4 _______________________________________________________________________________________
Typical Operating Characteristics
(VCC= 3.3V, TA= +25°C, unless otherwise noted.)
STANDBY SUPPLY CURRENT
vs. SUPPLY VOLTAGE
7
6
5
4
3
SUPPLY CURRENT (µA)
2
1
0
TA = +85°C
3.0 5.5 SUPPLY VOLTAGE (V)
REMOTE TEMPERATURE ERROR
vs. REMOTE DIODE TEMPERATURE
0.8
0.6
0.4
0.2
0
-0.2
-0.4
REMOTE TEMPERATURE ERROR (°C)
-0.6
-0.8 0406020
REMOTE DIODE TEMPERATURE (°C)
TA = +25°C
TA = -40°C
100 120 140
80
AVERAGE SUPPLY CURRENT
vs. CONVERSION RATE
600
500
MAX6638 toc01
400
300
200
SUPPLY CURRENT (µA)
100
0
5.04.54.03.5
020
CONVERSION RATE (Hz)
15105
MAX6638 toc02
SUPPLY CURRENT (µA)
LOCAL TEMPERATURE ERROR
vs. DIE TEMPERATURE
0
MAX6638 toc04
-0.5
-1.0
-1.5
-2.0
LOCAL TEMPERATURE ERROR (°C)
-2.5
-3.0 0608020 40 100 120 140
DIE TEMPERATURE (°C)
MAX6638 toc05
OPERATING SUPPLY CURRENT
vs. SUPPLY VOLTAGE
700
TA = +85°C
650
600
550
500
450
400
3.0 5.5
TA = -40°C
SUPPLY VOLTAGE (V)
TA = +25°C
5.04.54.03.5
TEMPERATURE ERROR
vs. POWER-SUPPLY NOISE FREQUENCY
6
LOCAL
4
2
TEMPERATURE ERROR (°C)
0
-2
0.01 100.1 1 100 1,000 10,000 POWER-SUPPLY NOISE FREQUENCY (kHz)
REMOTE
MAX6638 toc03
MAX6638 toc06
LOCAL TEMPERATURE ERROR
vs. COMMON-MODE NOISE FREQUENCY
0
-1
-2
-3
-4
LOCAL TEMPERATURE ERROR (°C)
-5
-6
0.01 1 100.1 100 1,000 10,000
COMMON-MODE NOISE FREQUENCY (kHz)
MAX6638 toc07
REMOTE TEMPERATURE ERROR
vs. DXP-DXN CAPACITANCE
2
0
-2
-4
-6
REMOTE TEMPERATURE ERROR (°C)
-8
0.01 10.1 10 100 DXP-DXN CAPACITANCE (nF)
MAX6638 toc08
Detailed Description
The MAX6638 temperature monitor features dual-port SMBus access for use in thermal management of graphics processing unit (GPU) and CPU systems. Each of the two SMBus serial ports can be accessed independently by two thermal-monitoring systems with all dual-port collision-avoidance logic controlled by the MAX6638. Each SMBus thermal-monitoring channel (channels 1 and 2) has a corresponding over/under­temperature ALERT_ open-drain output with indepen­dently configurable limit registers. Channel 1 includes an overtemperature indicator (OVERT1) with an initial set-point limit that is always activated after a power-on reset (POR). The initial OVERT1 set point can be over­written after POR by SMBus1 serial programming. The overtemperature alarm OVERT1 asserts if the set-point limit is exceeded.
ADC and Multiplexer
The MAX6638 converts temperatures to digital data either at a programmed rate or in single conversions. Either SMBus controller can set the programmed rate with the higher rate setting taking precedence. The MAX6638 begins conversions at the maximum rate after POR to provide the OVERT1 output signal asser­tion for temperatures exceeding the set-point limit. The
temperature conversion results of the two temperature channels are in integer format. The MSBs of the tem­perature data are in 8-bit registers (addresses 00h and 01h; see Table 1) that represent the data as 8 bits with the full-scale reading to indicate a diode fault. The remaining 3 bits of temperature data are available in the extended data-registers format with the LSB equal to +0.125°C (addresses 11h and 10h; see Table 2).
The converted readings are stored in SMBus reading registers along with the limit-value registers and other control functions.
MAX6638
Temperature Monitor with
Dual Serial Interface
_______________________________________________________________________________________ 5
Pin Description
Table 1. Temperature Data Format (RLTS1, RRTS1, RLTS2, RRTS2)
PIN NAME FUNCTION
1V
2 DXP
3DXN
4 OVERT1 Digital Open-Drain Output. OVERT1 indicates an overtemperature condition on channel 1.
5, 7, 12, 13 N.C. No Connection. Not connected internally.
6 I.C. Internally Connected. I.C. must be connected to GND.
8 GND Power-Supply Ground 9 ALERT1 Digital Open-Drain Output. ALERT1 indicates alert condition on channel 1.
10 SDA1 SMBus Data Channel 1. Open-drain output.
11 SCK1 SMBus Clock Channel 1 14 ALERT2 Digital Open-Drain Output. ALERT2 indicates alert condition on channel 2.
15 SDA2 SMBus Data Channel 2. Open-drain output.
16 SCK2 SMBus Clock Channel 2
EP GND Ground. Connect to ground.
CC
Supply Voltage. Bypass VCC to GND with a 0.1µF capacitor. A 47Ω series resistor is recommended for additional noise filtering, but not required.
Combined Current Source and ADC Positive Input for Remote Diode. If a remote-sensing junction is not used, connect DXP to DXN.
Combined Current Sink and ADC Negative Input for Remote Diode. DXN is internally biased to a diode voltage above ground.
TEMPERATURE
(°C)
+145 91 1001 0001
+130 82 1000 0010
+128 80 1000 0000
+25 19 0001 1001
0 00 0000 0000
< 0 00 0000 0000
Diode fault FF 1111 1111
DIGITAL OUTPUT
(hex)
DIGITAL OUTPUT
(bin)
MAX6638
Temperature Monitor with Dual Serial Interface
6 _______________________________________________________________________________________
Functional Diagram
V
CC
DXP DXN
ALERT1
OVERT1
ALERT2
S
Q
R
S
Q
R
S
Q
R
MAX6638
MUX
REMOTE
LOCAL
ADC
REGISTER BANK1
COMMAND BYTE
REMOTE TEMPERATURE
LOCAL TEMPERATURE
ALERT THRESHOLD
ALERT-RESPONSE ADDRESS
OVERT THRESHOLD
REGISTER BANK2
COMMAND BYTE
REMOTE TEMPERATURE
LOCAL TEMPERATURE
CONTROL
LOGIC
SMBus
8
READ
8
WRITE
7
ADDRESS
DECODER
SMBus
8
READ
8
WRITE
7
ADDRESS
DECODER
SDA1
SCK1
SDA2
SCK2
ALERT THRESHOLD
ALERT-RESPONSE ADDRESS
The averaging ADC integrates over a 16ms period (each channel, typical) with excellent noise rejection. The multiplexer automatically steers bias currents through the remote and local diodes. The ADC and associated circuitry measure each diode’s forward volt­age and compute the temperature based on this volt­age. Both temperature sensors automatically convert
once the conversion process starts, either in free-run­ning (RUN = 0) or single-shot mode. A BUSY status bit in the status byte indicates that the device is performing a new conversion. The results of the previous conver­sion are always available even when the ADC is busy. If one of the two temperature sensors is not used, the MAX6638 still performs both measurements and ignores the results of the unused channel. When not using the remote-diode temperature sensor, connect DXP to DXN. The DXP-DXN differential input voltage range is 0.25V to
0.95V. Excess resistance in series with the remote diode causes a +0.5°C (typ) error per ohm.
The MAX6638 initiates conversion cycling after POR, after exiting standby mode from either SMBus channel, and upon one-shot request from either SMBus channel. One conversion cycle consists of two ADC conversions (one for the local temperature, one for the remote tem­perature), a diagnostic check on the remote tempera­ture sensor, loading of data into the read registers, setting diagnostic flags, and setting ALERT1, ALERT2, and OVERT1, as required. Figure 1 shows the simplified timing sequence.
MAX6638
Temperature Monitor with
Dual Serial Interface
_______________________________________________________________________________________ 7
Table 2. Extended Temperature Data (RLET1, RRET1, RLET2, RRET2)
Figure 1. One Complete ADC Conversion Cycle
Figure 2. Repeating ADC Conversion Cycles for Various Conversion Rate Settings
FRACTIONAL
TEMPERATURE (°C)
0.000 000X XXXX
0.125 001X XXXX
0.250 010X XXXX
0.375 011X XXXX
0.500 100X XXXX
0.675 101X XXXX
0.750 110X XXXX
0.875 111X XXXX
DIGITAL OUTPUT (bin)
ONE CONVERSION CYCLE
ADC LOCAL TEMPERATURE ADC AND DIAGNOSTIC REMOTE TEMPERATURE
START CONVERSION UPDATE REGISTERS DATA AVAILABLE TIME
START
CRCn
CONVERSION
06h
05h
04h
03h
02h
250 500 750 1000 1250 1500 1750 2000
ONE CONVERSION CYCLE
TIME (ms)
MAX6638
The MAX6638 allows conversion rates that are 2x multi­ples of the minimum rate of 0.0625Hz. Figure 2 shows several different conversion rate settings.
The ADC converts at the higher rate of the two conver­sions set by SMBus1 and SMBus2 controllers. The con­troller that sets the higher rate receives a new conversion at the higher conversion-rate time. The con­troller that sets the lower rate receives the most recent conversion result at the lower conversion-rate timing. Figure 3 shows an example of this. SMBus1 initiates the ADC converter by selecting conversion rate 06h (4Hz) prior to SMBus2 initiating a conversion. Then SMBus2 initiates conversions of 05h (2Hz) independent of the process initiated by SMBus1. The controller accesses data at its programmed time set by the initiated conver­sion time. The data presented to SMBus2 is always ready at the anticipated time, but the data is actually the result of a previous conversion sequence driven by the higher conversion rate set by SMBus1.
The first SMBus channel that activates a conversion sequence always establishes the MAX6638 conversion cycling. The ADC conversion rates increase and decrease as set by each of the SMBus controllers with the higher conversion rate always dominating. Increasing the conversion rate with the ADC cycling increases the rate the MAX6638 performs cycles with­out losing sync of the previously established cycle tim­ing. A decrease in conversion rate reduces the ADC cycling to the lower rate without losing sync with the previously set cycle pattern. The ADC cycling pattern is only reset following a POR event or upon exiting the standby mode through one of the SMBus controllers’ initiation of cycling or single-shot conversion.
Low-Power Standby Mode
Standby mode reduces the supply current to 3µA (typ) by disabling the ADC and timing circuitry when both SMBus controller channels enable standby mode. Standby mode is enabled only when both SMBus con­trollers request standby mode. Set each of the RUN bits to 1 in each corresponding configuration register (see Tables 3 and 5) to enter standby mode. When one SMBus controller channel is set to standby mode, the other conversion rate is automatically set to the active channel’s conversion rate and mode. The MAX6638 retains all data in the registers and each SMBus inter­face is active and listening for SMBus commands. Standby mode is not a shutdown mode. With activity on either SMBus, the device draws more supply current (see the Typical Operating Characteristics). In standby mode, the MAX6638 performs an ADC conversion sequence through the one-shot command, regardless of either of the RUN bit statuses, upon receipt of a one­shot command from either SMBus controller.
If the device receives standby commands from both SMBus controllers during a conversion, the conversion cycle truncates, and the data from that conversion is not latched into a temperature register. The previous data does not change and remains available.
Supply current drawn during the 32ms conversion period is 800µA (typ). Slowing down the conversion rate reduces the average supply current (see the Typical Operating Characteristics). Between conversions, the conversion rate timer consumes 40µA (typ) of supply current.
SMBus Interface
From a software perspective, the MAX6638 appears as a set of byte-wide registers that contain temperature data,
Temperature Monitor with Dual Serial Interface
8 _______________________________________________________________________________________
Figure 3. An Example of ADC Cycling for Two Conversion Rates Set by Each Controllers on SMBus1 and SMBus2
SMBus1 START CONVERSION
SMBus1 CRC1 = 06h
SMBus2 CRC2 = 05h
ACTUAL DATA
READY FROM
ADC CONVERSIONS
ACTUAL DATA READ
BY SMBus2
CYCLE CYCLE CYCLE CYCLE CYCLE CYCLE CYCLE CYCLE CYCLE
250 500 750 1000 1250 1500 1750 2000
SMBus1 DATA AVAILABLE
CYCLE CYCLE CYCLE CYCLE
SMBus2 START CONVERSION
SHADED BOXES INDICATE EXPECTED ADC CONVERSION CYCLING AND DATA READINGS OF SMBus2 FROM START CONVERSION
TIME (ms)
threshold limit values, and control. A standard SMBus 2-wire serial interface is used to read temperature data, write control bits, and set threshold data. The MAX6638 employs four standard SMBus protocols: write byte, read byte, send byte, and receive byte (Figure 4).
Read the temperature data from the read internal tem­perature (00h) and read external temperature (01h) registers of each SMBus channel. The temperature data format for these registers is 8 bits for each temper­ature-sensor channel, with the LSB representing 1°C (Table 1). The temperature data transmits MSB first.
The external extended-temperature register (10h) pro­vides additional 3 bits, extending the data to 11 bits and the resolution to 0.125°C per LSB (Table 2).
The main temperature register and the extended temper­ature registers update simultaneously upon completion of a conversion. To ensure the registers contain the results of the same conversion of the main temperature data (MSBs) and the extended temperature data (LSBs), read the data before a new conversion completes.
Alarm-Threshold Registers
Four registers store ALERT threshold values: one high temperature (THIGH_) and one low temperature
(TLOW_) limit register each for the local and remote temperature sensors. If either measured temperature equals or exceeds the corresponding ALERT_ thresh­old value, the ALERT_ output asserts.
The MAX6638 local ALERT_ THIGH_ register POR state is 0101 0101, which corresponds to +85°C, while the remote ALERT_ THIGH_ register POR state is 0101 1111, which corresponds to +95°C. The POR state of the local and remote TLOW_ registers for all devices is 0000 0000, corresponding to 0°C.
Two additional registers store remote and local alarm threshold data corresponding to the OVERT1 output accessible only through SMBus1. The MAX6638 stores high-temperature thresholds in these registers. If either of the measured temperatures equals or exceeds the corresponding alarm threshold value, the OVERT1 out- put asserts. The MAX6638 local OVERT1 register POR state is 0101 0101, corresponding to +85°C, while the remote OVERT1 register POR state is 0111 1101, corre- sponding to +125°C.
Diode Fault
A continuity fault detector at DXP detects an open cir­cuit between DXP and DXN, or a DXP short to VCC,
MAX6638
Temperature Monitor with
Dual Serial Interface
_______________________________________________________________________________________ 9
Write Byte Format
Read Byte Format
Send Byte Format
Receive Byte Format
Slave Address: equiva­lent to chip-select line of a 3-wire interface
Command Byte: selects to which register you are writing
Data Byte: data goes into the register set by the command byte (to set thresholds, configuration masks, and sampling rate)
Slave Address: equiva­lent to chip-select line
Command Byte: selects from which register you are reading
Slave Address: repeated due to change in data­flow direction
Data Byte: reads from the register set by the command byte
Command Byte: sends com­mand with no data, usually used for one-shot command
Data Byte: reads data from the register commanded by the last read byte or write byte transmission; also used for SMBus alert response return address
S = Start condition Shaded = Slave transmission P = Stop condition /// = Not acknowledged
S ADDRESS WR ACK COMMAND
7 bits 8 bits
ACK DATA
8 bits
ACK P
1
S ADDRESS WR ACK COMMAND ACK S ADDRESS RD ACK DATA /// P
8 bits7 bits8 bits7 bits
S ADDRESS WR ACK COMMAND ACK P
7 bits 8 bits
S ADDRESS RD ACK DATA /// P
8 bits7 bits
Figure 4. SMBus Protocols
MAX6638
GND, or DXN. If an open or short exists, each of the external temperature registers contains 1111 1111. When an open-circuit fault occurs, bit 2 (OPEN) in the status byte sets to 1. If a fault is present upon power­up, the fault is not indicated until the end of the first conversion cycle.
ALERT_
Interrupts
The ALERT_ interrupt occurs when the internal or exter- nal temperature reading exceeds a high- or low-tem­perature limit (programmed). The ALERT_ output signal latches and can only clear by either reading the status register or by successfully responding to an alert­response address. In both cases, the alert clears if the temperature fault condition no longer exists. Asserting ALERT_ does not halt automatic conversion. The open-
drain ALERT_ outputs allow multiple devices to share a common interrupt line.
The MAX6638 responds to the SMBus alert-response address, an interrupt pointer return-address feature. Prior to taking corrective action, always check to ensure that an interrupt is valid by reading the current temperature.
Alert Fault-Queue Register
In some systems, it is desirable to ignore a single tem­perature measurement that falls outside the ALERT_ limits. Bits 1 and 2 of the fault queue register (address 22h) determine the number of consecutive temperature faults necessary to set ALERT_.
Alert-Response Address
The SMBus alert-response interrupt pointer provides quick fault identification for simple slave devices that
Temperature Monitor with Dual Serial Interface
10 ______________________________________________________________________________________
Figure 5. SMBus Write Timing Diagram
Figure 6. SMBus Read Timing Diagram
AB CDEFG
t
LOW
SMBCLK
SMBDATA
t
SU:STAtHD:STA
A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE
AB CDEFG HIJ
t
SMBCLK
SMBDATA
t
t
HD:STA
SU:STA
A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE E = SLAVE PULLS SMBDATA LINE LOW
t
HIGH
LOWtHIGH
t
SU:DAT
E = SLAVE PULLS SMBDATA LINE LOW F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO SLAVE H = LSB OF DATA CLOCKED INTO SLAVE
t
SU:DAT
F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO MASTER H = LSB OF DATA CLOCKED INTO MASTER I = MASTER PULLS DATA LINE LOW
t
HD:DAT
HIJ
I = MASTER PULLS DATA LINE LOW J = ACKNOWLEDGE CLOCKED INTO SLAVE K = ACKNOWLEDGE CLOCK PULSE L = STOP CONDITION M = NEW START CONDITION
K
J = ACKNOWLEDGE CLOCKED INTO SLAVE K = ACKNOWLEDGE CLOCK PULSE L = STOP CONDITION M = NEW START CONDITION
t
SU:STOtBUF
L
t
SU:STO
LMK
M
t
BUF
lack the complex logic needed to be a bus master. Upon receiving an ALERT_ interrupt signal, the host master can broadcast a receive-byte transmission to the alert-response slave address (0001 100). Following such a broadcast, any slave device generating an interrupt attempts to identify itself by putting its own address on the bus.
The alert response can activate several different slave devices simultaneously. If more than one slave attempts to respond, bus arbitration rules apply, and the device with the lower address code wins. The los­ing device does not generate an acknowledge response and continues to hold the ALERT_ line low until cleared. Successful completion of the read alert­response protocol clears the interrupt latch, provided the condition that caused the alert no longer exists.
Overtemperature Limit Output
OVERT1 asserts when the temperature rises to a value stored in one of the OVERT1 limit registers (19h and 20h). It deasserts when the temperature drops below the stored limit, minus hysteresis. OVERT1 can be used to activate a cooling fan, send a warning, invoke clock throttling, or trigger a system shutdown to prevent com­ponent damage.
Command-Byte Functions
The 8-bit command-byte register (Table 3) is the mas­ter index that points to the various other registers within the MAX6638. The register’s POR state is 0000 0000, so a receive-byte transmission (a protocol that lacks the command byte) that occurs immediately after POR returns the current local-temperature data.
One-Shot Conversion Cycle
The one-shot command immediately forces a new con­version cycle to begin. If the MAX6638 receives a one­shot command while the MAX6638 is in standby mode (RUN = 1), a new conversion begins, after which the device returns to standby mode. If during a conversion the MAX6638 receives a one-shot command, the MAX6638 ignores the command; however, the results of the conversion in progress update the data registers accordingly.
Configuration-Byte Functions
The configuration-byte register (Tables 3 and 5) is a read-write register with several functions. Bit 7 masks interrupts. Bit 6 puts the MAX6638 into a standby (STOP) mode or autonomous (RUN) mode. The MAX6638 enters standby mode when both SMBus controllers set the cor­responding configuration bits.
Status-Byte Functions
The status-byte register (Tables 3 and 4) indicates when any temperature threshold is exceeded. This byte also indicates whether the ADC is converting and if there is a fault detected in the external sense diode. After POR, the state of the flag bits are zero, assuming no alarm conditions are present. The status byte clears with any successful read of the status byte, after com­pletion of a conversion and if the fault condition no longer exists. Note that the ALERT_ interrupt latch does not automatically clear when the status-flag bit indicat­ing the ALERT_ clears.
Registers
The internal registers of the MAX6638 are all 8-bit data word width and are all accessible through SMBus by read and write operations.
MAX6638
Temperature Monitor with
Dual Serial Interface
______________________________________________________________________________________ 11
MAX6638
Temperature Monitor with Dual Serial Interface
12 ______________________________________________________________________________________
Table 3. SMBus1 Registers and Command-Byte Bit Assignments
R EG .
A D D R ESS
00h Read Local Tem p S ensor RLTS 1 7 6 5 4 3 2 1 0 00h
01h Read Rem ote Tem p S ensor RRTS 1 7 6 5 4 3 2 1 0 00h
02h Read S tatus Byte RS 1BU S Y LH IGH LLO WRH IGH RLO WFAU LT E OT IOT 00h 03h Read C onfi g ur ati on Byte RC 1M AS K RUN RFU RFU RFU RFU RFU RFU 00h
04h Read C onver si on- Rate Byte RC R17654321000h 05h Read Local ALE RT1 H i g h Li m i tRLAH 1 7 6 5 4 3 2 1 0 55h 06h Read Local ALE RT1 Low Li m i t RLAL1 7 6 5 4 3 2 1 0 00h 07h Read Rem ote ALERT1 H ig h Li m i t RRAH 1 7 6 5 4 3 2 1 0 55h 08h Read Rem ote ALERT1 Low Lim i t RRAL1 7 6 5 4 3 2 1 0 00h
09h Wr i te C onfi g ur ati on Byte WC 1 7 6 5 4 3 2 1 0 00h
0Ah Wr i te C onver si on- Rate Byte WC R17654321008h
0Bh Wr i te Local Al er t- H i g h Li m i tWLAH 1 7 6 5 4 3 2 1 0 55h
0C hWr i te Local Al er t- Low Li m i t WLAL1 7 6 5 4 3 2 1 0 00h
0D hWr i te Rem ote Al er t- H i g h Li m i tWRAH 1 7 6 5 4 3 2 1 0 5Fh
0E hWr i te Rem ote Al er t- Low Li m i tWRAL17654321000
0Fh One- S hot C onver si on OS C 17 6 5 4 3 2 1 0 —
10h Read Local - E xtend ed Tem p RLE T1 7 6 5 4 3 2 1 0 00h
11h Read Rem ote- E xtend ed Tem p RRE T1 7 6 5 4 3 2 1 0 00h 19h Read/Wri te Rem ote OVERT1 Limi tRWRO1765432107D h 20h Read /Wr i te Local OVE RT1 Li m i tRWLO17654321055h
21h Over tem p er atur e H yster esi sH Y S 17 6 5 4 3 2 1 00Ah
22h Wr i te Faul t Queue WFQ 1 7 6 5 4 3 2 1 0 80h
FE hRead M anufactur er ID RM ID 765432104D h
FFh Read D evi ce ID RD ID 7654321078h
R EG IST ER NA M EA B B R .
7 6 5 4 3 2 1 0
B IT
PO R
VA L U E
MAX6638
Temperature Monitor with
Dual Serial Interface
______________________________________________________________________________________ 13
Table 4. Read Status-Byte (RS1) Bit Assignments (02h)
Table 5. Read Configuration-Byte (RC1) Bit Assignments (03h)
Table 6. Conversion-Rate Control-Byte (RCR1 and WCR1) Bit Assignments (04h and 0Ah)
BIT NAME POR STATE FUNCTION
7 BUSY 0 ADC is busy converting when 1.
6 LHIGH 0
5 LLOW 0
4 RHIGH 0
3 RLOW 0
2 OPEN 0
1 EOT 0 A 1 indicates the remote temperature exceeds the external OVERT1 threshold. 0 IOT 0 A 1 indicates the local temperature exceeds the external OVERT1 threshold.
Local High-Temperature Alarm. A 1 indicates a local high-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
Local Low-Temperature Alarm. A 1 indicates a local low-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
Remote High-Temperature Alarm. A 1 indicates a remote high-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
Remote Low-Temperature Alarm. A 1 indicates a remote low-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
A 1 indicates DXN and DXP are open. Clears with a POR or readout of the status byte if the open condition no longer exists.
BIT NAME POR STATE FUNCTION
7 MASK 0 Masks ALERT1 interrupts when set to 1.
6 RUN 0
5–0 RFU 0 Reserved for future use.
Standby-Mode Control Bit. If set to 1, standby mode enables and enters if the standby-mode control bit (RUN) for channel 2 is also set.
BIT DATA CONVERSION RATE (Hz)
7–0 00h 0.0625
7–0 01h 0.125
7–0 02h 0.25
7–0 03h 0.5
7–0 04h 1
7–0 05h 2
7–0 06h 4
7–0 07h 8
7–0 08h 16
7–0 09–FFh Reserved
MAX6638
Temperature Monitor with Dual Serial Interface
14 ______________________________________________________________________________________
Table 7. SMBus2 Registers and Command-Byte Bit Assignments
R EG .
A D D R ESS
00h Read Local Tem p S ensor RLTS 2 7 6 5 4 3 2 1 0 00h
01h Read Rem ote Tem p S ensor RRTS 2 7 6 5 4 3 2 1 0 00h
02h Read S tatus Byte RS 2BU S Y LH IGH LLO WRH IGH RLO WFAU LT RFU RFU 00h 03h Read C onfi g ur ati on Byte RC 2M AS K RUN RFU RFU RFU RFU RFU RFU 00h
04h Read C onver si on- Rate Byte RC R27654321000h 05h Read Local ALE RT1 H i g h Li m i tRLAH 2 7 6 5 4 3 2 1 0 55h 06h Read Local ALE RT1 Low Li m i t RLAL2 7 6 5 4 3 2 1 0 00h 07h Read Rem ote ALERT1 H ig h Li m i t RRAH 2 7 6 5 4 3 2 1 0 5Fh 08h Read Rem ote ALERT1 Low Lim i t RRAL2 7 6 5 4 3 2 1 0 00h
09h Wr i te C onfi g ur ati on Byte WC 2 7 6 5 4 3 2 1 0 00h
0Ah Wr i te C onver si on Rate Byte WC R27654321008h
0Bh Wr i te Local Al er t- H i g h Li m i tWLAH 2 7 6 5 4 3 2 1 0 55h
0C hWr i te Local Al er t- Low Li m i t WLAL2 7 6 5 4 3 2 1 0 00h
0D hWr i te Rem ote Al er t- H i g h Li m i tWRAH 2 7 6 5 4 3 2 1 0 5Fh
0E hWr i te Rem ote Al er t- Low Li m i t WRAL2 7 6 5 4 3 2 1 0 00h
0Fh One- S hot C onver si on OS C 27 6 5 4 3 2 1 0 —
10h Read Local - E xtend ed Tem p RLE T2 7 6 5 4 3 2 1 0 00h
11h Read Rem ote- E xtend ed Tem p RRE T2 7 6 5 4 3 2 1 0 00h 19h Read/Wri te Rem ote OVERT1 Limi tRWRO2765432107D h 20h Read /Wr i te Local OVE RT1 Li m i tRWLO27654321055h
21h Over tem p er atur e H yster esi sH Y S 27 6 5 4 3 2 1 00Ah
22h Wr i te Faul t Queue WFQ 2 7 6 5 4 3 2 1 0 80h
FE hRead M anufactur er ID RM ID 765432104D h
FFh Read D evi ce ID RD ID 7654321078h
R EG IST ER NA M EA B B R .
7 6 5 4 3 2 1 0
B IT
PO R
VA L U E
MAX6638
Temperature Monitor with
Dual Serial Interface
______________________________________________________________________________________ 15
Table 8. Read Status-Byte (RS2) Bit Assignments (02h)
Table 9. Read Configuration-Byte (RC2) Bit Assignments (03h)
Table 11. Slave Addresses
Table 10. Conversion-Rate Control-Byte (RCR2 and WCR2) Bit Assignments (04h and 0Ah)
BIT NAME POR STATE FUNCTION
7 BUSY 0 ADC is busy converting when 1.
6 LHIGH 0
5 LLOW 0
4 RHIGH 0
3 RLOW 0
2 OPEN 0
1 RFU 0 Reserved for future use.
0 RFU 0 Reserved for future use.
Local High-Temperature Alarm. A 1 indicates a local high-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
Local Low-Temperature Alarm. A 1 indicates a local low-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
Remote High-Temperature Alarm. A 1 indicates a remote high-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
Remote Low-Temperature Alarm. A 1 indicates a remote low-temperature fault. Clears with a POR or readout of the status byte if the fault condition no longer exists.
A 1 indicates DXN and DXP are open. Clears with a POR or a read of the status byte if the open condition no longer exists.
BIT NAME POR STATE FUNCTION
7 MASK 0 Masks ALERT2 interrupts when set to 1.
6 RUN 0
5–0 RFU 0 Reserved for future use.
Standby-Mode Control Bit. If set to 1, standby mode is enabled and is entered if or when the standby-mode control bit (RUN) for channel 1 is also set.
BIT DATA CONVERSION RATE (Hz)
7–0 00h 0.0625
7–0 01h 0.125
7–0 02h 0.25
7–0 03h 0.5
7–0 04h 1
7–0 05h 2
7–0 06h 4
7–0 07h 8
7–0 08h 16
7–0 09–FFh Reserved
PART SMBus CHANNEL SLAVE ADDRESS
MAX6638ATC
1 1001 101
2 1001 101
MAX6638
Temperature Monitor with Dual Serial Interface
16 ______________________________________________________________________________________
Applications Information
Remote-Diode Selection
The MAX6638 can directly measure the die tempera­ture of CPUs and other ICs that have on-board temper­ature-sensing diodes (see the Typical Operating Circuit), or it can measure the temperature of a discrete diode-connected transistor.
Effect of Ideality Factor
The accuracy of the remote temperature measurements depends on the ideality factor (n) of the remote diode (which is actually a transistor). The MAX6638 is opti­mized for n = 1.008. If a sense transistor with a different ideality factor is used, the output data is different. Fortunately, the difference is predictable.
Assume a remote-diode sensor designed for a nominal ideality factor n
NOMINAL
is used to measure the tem-
perature of a diode with a different ideality factor n
1
.
The measured temperature TMcan be corrected using:
where temperature is measured in Kelvin.
The following example uses the MAX6638 with a CPU that has an ideality factor of 1.002. If the diode has negligible series resistance, the measured data is relat­ed to the real temperature as follows:
For a real temperature of +85°C (358.15K), the convert­ed and quantized temperature data is +82.875°C (356.03K), which is an error of -2.12°C. Using the cor­rection formula above, the corrected temperature data is +85.0°C (358.16K).
Effect of Series Resistance
Series resistance (RS) in a sense diode contributes addi­tional errors. For nominal diode currents of 10µA and 100µA, the change in the measured voltage due to RSis:
VM= RS(100µA - 10µA) = 90µA x RS.
A 1°C corresponds to 198.6µV, series resistance con­tributes a temperature offset of:
Assume that the diode measured has a 3series resis­tance. The series resistance contributes an offset of:
The effects of the ideality factor and series resistance are additive. If the diode has a 1.002 ideality factor and 3series resistance the total offset can be calculated by adding error due to series resistance with error due to ideality factor:
1.36°C - 2.12°C = -0.77°C
for a diode temperature of +85°C.
In this example, the effects of series resistance and ideality factor partially cancel each other.
Discrete Remote Diodes
When the remote-sensing diode is a discrete transistor, short the collector to the base. Table 12 lists examples of discrete transistors that are appropriate for use with the MAX6638. Avoid violating the A/D input voltage range by using a small-signal transistor with a relatively high forward voltage. The forward voltage at the highest expected temperature must be greater than 0.25V at 10µA, and the forward voltage at the lowest expected temperature must be less than 0.95V at 100µA. Do not use large power transistors. Ensure that the base resis­tance is less than 100. Tight specifications for forward current gain (50 < ß < 150, for example) indicate that the manufacturer has good process controls and that the device has consistent VBE characteristics.
ADC Noise Filtering
The ADC is an integrating type with inherently good noise rejection, especially of low-frequency signals, such as 60Hz/120Hz power-supply hum. Micropower opera­tion places constraints on high-frequency noise rejection;
3 0 453 1 36Ω×
°
..
C
C
90
198 6
0 453
µµV
V
C
.
.=
°
TT
n
n
TT
ACTUAL M
NOMINAL
MM
=
⎛ ⎝
⎞ ⎠
=
⎛ ⎝
⎞ ⎠
=
()
1
1 008
1 002
1 00599
.
.
.
TT
n
n
M ACTUAL
NOMINAL
=
⎛ ⎝
⎞ ⎠
1
Table 12. Remote-Sensor Transistor Manufacturers
Note: Discrete transistors must be diode connected (base shorted to collector).
MANUFACTURER MODEL
Central Semiconductor (USA) CMPT3906
Rohm Semiconductor (USA) SST3906
Samsung (Korea) KST3906-TF
Siemens (Germany) SMBT3906
Zetex (England) FMMT3906CT-ND
therefore, careful PC board layout and proper external noise filtering are required for high-accuracy remote measurements in electrically noisy environments.
Filter high-frequency EMI at DXP and DXN with an external 2200pF capacitor. This value can be increased to approximately 3300pF (max), including cable capac­itance. Capacitance > 3300pF introduces errors due to the rise time of the switched current source. Typically noise sources cause the ADC measurements to be higher than the actual temperature, approximately by +1°C to +10°C, depending on the frequency and amplitude.
PC Board Layout
Follow these guidelines to reduce the measurement error of the temperature sensor:
1) Place the MAX6638 as close as is practical to the remote diode. In noisy environments, such as a computer motherboard, this distance can be 4in to 8in (typ). This length can be increased if the worst noise sources are avoided. Noise sources include CRTs, clock generators, memory buses, and ISA/PCI buses.
2) Do not route the DXP-DXN lines next to the deflec­tion coils of a CRT. Also, do not route the traces across fast digital signals, which can easily intro­duce a 30°C error, even with good filtering.
3) Route the DXP and DXN traces in parallel and in close proximity to each other, away from any higher voltage traces, such as 12V DC. Leakage currents from PC board contamination must be dealt with carefully since a 20Mleakage path from DXP to ground causes approximately a 1°C error. If high-voltage traces are unavoidable, connect guard traces to GND on either side of the DXP-DXN traces (Figure 4).
4) Route through as few vias and crossunders as pos­sible to minimize copper/solder thermocouple effects.
5) When introducing a thermocouple, make sure that both the DXP and the DXN paths have matching thermocouples. A copper-solder thermocouple exhibits 3µV/°C, and takes approximately 200µV of voltage error at DXP-DXN to cause a 1°C measure­ment error. Adding a few thermocouples causes a negligible error.
6) Use wide traces. Narrow traces are more inductive and tend to pick up radiated noise. The 10-mil with­stand spacing recommended in Figure 4 is not absolutely necessary, as it offers only a minor improvement in leakage and noise over narrow
traces. Use wider traces when practical.
7) Add a 200resistor in series with VCCfor best
noise filtering (see the Typical Operating Circuit).
8) Copper cannot be used as an EMI shield; only fer­rous materials such as steel work well. Placing a copper ground plane between the DXP-DXN traces and traces carrying high-frequency noise signals does not help reduce EMI.
PC Board Layout Checklist
Place the MAX6638 close to the remote-sense junction.
Keep traces away from high voltages (+12V bus).
Keep traces away from fast data buses and CRTs.
Use recommended trace widths and spacings.
Place a ground plane under the traces.
Use guard traces flanking DXP and DXN and con­necting to GND.
Add a 47resistor in series with VCCfor best noise filtering (see the Typical Operating Circuit).
Place the noise filter and a 0.1µF VCCbypass capacitor close to the MAX6638.
Twisted-Pair and Shielded Cables
Use a twisted-pair cable to connect the remote sensor for remote-sensor distance longer than 8in, or in very noisy environments. Twisted-pair cable lengths can be between 6ft and 12ft before noise introduces excessive errors. For longer distances, the best solution is a shielded twisted pair like that used for audio micro­phones. For example, Belden 8451 works well for dis­tances up to 100ft in a noisy environment. At the device, connect the twisted pair to DXP and DXN and the shield to GND. Leave the shield unconnected at the remote sensor.
For very long cable runs, the cable’s parasitic capaci­tance often provides noise filtering, so the 2200pF capacitor can often be removed or reduced in value. Cable resistance also affects remote-sensor accuracy. For every 1of series resistance, the error is approxi­mately 0.5°C.
Thermal Mass and Self-Heating
When sensing local temperature, these devices are intended to measure the temperature of the PC board to which the devices are soldered. The leads provide a good thermal path between the PC board traces and the die. Thermal conductivity between the die and the ambient air is poor by comparison, making air tempera­ture measurements impractical. Because the thermal mass of the PC board is far greater than that of the
MAX6638
Temperature Monitor with
Dual Serial Interface
______________________________________________________________________________________ 17
MAX6638
MAX6638, the device follows temperature changes on the PC board with little or no perceivable delay.
When measuring the temperature of a CPU or another IC with an on-chip sense junction, thermal mass has virtual­ly no effect; the measured temperature of the junction tracks the actual temperature within a conversion cycle. When measuring temperature with discrete remote sen­sors, smaller packages, such as SC70s or SOT23s, yield the best thermal response times. Take care to account for thermal gradients between the heat source and the sensor, and ensure that stray air currents across the sen­sor package do not interfere with measurement accura­cy. Self-heating does not significantly affect measurement accuracy. Remote-sensor self-heating due to the diode current source is negligible. For the local
diode, the worst-case error occurs when autoconverting at the fastest rate and simultaneously sinking maximum current at the ALERT1 output. For example, with V
CC
5.5V, at a 16Hz conversion rate and with ALERT1 sinking 1mA, the typical power dissipation is:
5.5V x 800µA + 0.4V x 1.0mA = 4.8mW
θ
J-A
for the 16-pin, 4mm x 4mm TQFN package is
59.3°C/W, so assuming no copper PC board heat sink­ing, the resulting temperature rise is:
T = 4.8mW x 59.3°C/W = +0.283°C.
Even under nearly worst-case conditions, it is difficult to introduce a significant self-heating error.
Temperature Monitor with Dual Serial Interface
18 ______________________________________________________________________________________
Typical Operating Circuit
Chip Information
PROCESS: BiCMOS
3.3V
47
10k
SDA1
SCK1
2200pF
0.1µF
DXP
DXN
V
CC
10k
10k
10k
10k
10k
10k
DATA FROM/TO µP1
CLOCK FROM µP1
INTERRUPT TO µP1
TO FAN DRIVER OR SYSTEM SHUTDOWN
DATA FROM/TO µP2
CLOCK FROM µP2
INTERRUPT TO µP2
GND
ALERT1
OVERT1
SDA2
SCK2
ALERT2
µ
P
MAX6638
MAX6638
Temperature Monitor with
Dual Serial Interface
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 19
© 2006 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages
.)
Springer
24L QFN THIN.EPS
PACKAGE OUTLINE, 12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
21-0139
1
E
2
PACKAGE OUTLINE, 12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
21-0139
2
E
2
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