MAXIM MAX6581 User Manual

19-5260; Rev 0; 8/10
EVALUATION KIT
AVAILABLE
±1°C Accurate 8-Channel Temperature Sensor
General Description
Resistance cancellation is available for all channels and compensates for high series resistance in circuit-board traces and thermal diodes.
The 2-wire serial interface accepts SMBus™ protocols (write byte, read byte, send byte, and receive byte) for reading the temperature data and programming the alarm thresholds.
The MAX6581 is specified for an operating temperature range of -40NC to +125NC and is available in a 24-pin, 4mm x 4mm thin QFN package with an exposed pad.
Features
S Eight Channels to Measure Seven Remote and
One Local Temperature
S 11-Bit, 0.125NC Resolution
S High Accuracy of ±1NC (max) from +60NC to
+100NC (Remote Channels)
S -64NC to +150NC Remote Temperature Range
S Programmable Undertemperature/
Overtemperature Alerts
S SMBus/I S Two Open-Drain Alarm Outputs (ALERT and
2
C-Compatible Interface
OVERT)
S Resistance Cancellation on All Remote Channels
Applications
Desktop Computers
Notebook Computers
Workstations
Servers
Data Communications
MAX6581
Ordering Information/Selector Guide
PART SLAVE ADDRESS PIN-PACKAGE
MAX6581TG9A+ 0X9A 24 TQFN-EP* MAX6581TG9C+** 0X9C 24 TQFN-EP* MAX6581TG9E+** 0X9E 24 TQFN-EP* MAX6581TG98+** 0X98 24 TQFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. **Future product—contact factory for availability.
Note: These devices operate over the -40NC to +125NC operating temperature range.
Typical Application Circuit appears at end of data sheet.
SMBus is a trademark of Intel Corp.
OPERATING
TEMPERATURE RANGE
-40NC to +125NC -64NC to +150NC
-40NC to +125NC -64NC to +150NC
-40NC to +125NC -64NC to +150NC
-40NC to +125NC -64NC to +150NC
MEASURED
TEMPERATURE RANGE
_______________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
±1°C Accurate 8-Channel Temperature Sensor
ABSOLUTE MAXIMUM RATINGS
(All Voltages Referenced to GND) V
, SMBCLK, SMBDATA, ALERT,
CC
OVERT, STBY to GND .......................................... -0.3V to +4V
DXP_ to GND ............................................ -0.3V to (V
DXN_ to GND ........................................... -0.3V to (V
+ 0.3V)
CC
+ 0.3V)
CC
SMBDATA, ALERT, OVERT Current .................. -1mA to +50mA
DXN_ Current .................................................................... Q1mA
Continuous Power Dissipation (T
MAX6581
= +70NC)
A
24-Pin Thin QFN (derate 27.8mW/NC above +70NC) ..2222mW
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, TA = -40NC to +125NC, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V Standby Supply Current I
Operating Current
Temperature Resolution
3-Sigma Temperature Accuracy (Remote Channels 1–7)
3-Sigma Temperature Accuracy (Local)
6-Sigma Temperature Accuracy (Remote Channels 1–7)
6-Sigma Temperature Accuracy (Local)
Supply Sensitivity of Temperature Accuracy
I
CC1
I
CC2
CC
SS
SMBus static 4 15 During conversion, RC off 500 600 During conversion, RC on 550 650
= 3.3V
V
CC
V
= 3.3V
CC
V
= 3.3V
CC
V
= 3.3V
CC
Package Junction-to-Ambient Thermal Resistance (B
) (Note 1) ............................................................36.0NC/W
JA
Package Junction-to-Case Thermal Resistance (B
) (Note 1) ..............................................................3.0NC/W
JC
ESD Protection (all pins, Human Body Model) ...................Q2kV
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range .......................... -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
3.0 3.6 V
11 Bits
0.125
T
= +30NC to +85NC,
A
T
= +60NC to +100NC
RJ
, TRJ = -40NC to +125NC
A
T
= +30NC to +85NC,
A
T
= +100NC to +150NC
RJ
= +30NC to +85NC
T
A
= -40NC to +125NC
A
T
= 0NC to +150NC
A
T
= +30NC to +85NC,
A
T
= +60NC to +100NC
RJ
, TRJ = -40NC to +125NC
A
T
= +30NC to +85NC,
A
T
= +100NC to +125NC
RJ
= +30NC to +85NC
T
A
= -40NC to +125NC
A
T
= 0NC to +150NC
A
-0.85 +0.85
-1.2 +1.2
-2.5 +2.5
-1 +1
-2 +2
-3 +3
-1 +1
-2 +2
-2.75 +2.75
-1.5 +1.5
-2.5 +2.5
-3.5 +3.5
Q0.2 NC/V
FA
FA
NC
NCT
NCT
NCT
NCT
2 ______________________________________________________________________________________
±1°C Accurate 8-Channel Temperature Sensor
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +3.6V, TA = -40NC to +125NC, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Resistance cancellation mode off 95 125 156
Conversion Time per Channel t
Remote-Diode Source Current I
CONV
RJ
Resistance cancellation mode on or beta compensation on
High level Low level 8 10 12
High level
Resistance cancellation mode off
Resistance cancellation
190 250 312
80 100 120
160 200 240
mode on or beta
Low level 16 20 24
DXP_ and DXN_ Leakage Current
Standby mode 100 nA
Undervoltage Lockout Threshold UVLO Falling edge of V
compensation on
disables ADC 2.25 2.80 2.95 V
CC
Undervoltage Lockout Hysteresis 90 mV
Power-On-Reset (POR) Threshold
falling edge 1.3 2.0 2.2 V
V
CC
POR Threshold Hysteresis 90 mV
ALERT and OVERT
I
= 1mA 0.01
Output Low Voltage V
Input Leakage Current I
OL
LEAK
SINK
= 6mA 0.3
I
SINK
-1 +1
SMBus INTERFACE, STBY
Logic Input Low Voltage V Logic Input High Voltage V
VCC = 3.6V 0.8 V
IL
VCC = 3.0V 2.2 V
IH
Input Leakage Current -1 +1
I
Output Low Voltage V Input Capacitance C
OL
IN
= 6mA 0.1 V
SINK
5 pF
SMBus-COMPATIBLE TIMING (Figures 3 and 4) (Note 3)
Serial-Clock Frequency f
Bus Free Time Between STOP and START Condition
SMBCLK
t
BUF
START Condition Setup Time f
Repeated START Condition Setup Time
START Condition Hold Time t
STOP Condition Setup Time t
Clock Low Period t Clock High Period t Data-In Hold Time t Data-In Setup Time t
t
SU:STA
HD:STA
SU:STO
LOW
HIGH
HD:DAT
SU:DAT
(Note 4) 400 kHz
f
SMBCLK
SMBCLK
90% of SMBCLK to 90% of SMBDATA, f
SMBCLK
10% of SMBDATA to 90% of SMBCLK, f
SMBCLK
90% of SMBCLK to 90% of SMBDATA, f
SMBCLK
10% to 10%, f
= 400kHz 1.6
= 400kHz 0.6
= 400kHz
= 400kHz
= 400kHz
SMBCLK
= 400kHz 1
50 ns
0.6
0.6
90% to 90% 0.6
0 0.9 us
(Note 5) 100 ns
ms
FA
V
FA
FA
Fs
Fs
Fs
Fs
Fs Fs
MAX6581
_______________________________________________________________________________________ 3
±1°C Accurate 8-Channel Temperature Sensor
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +3.6V, TA = -40NC to +125NC, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Receive SMBCLK/SMBDATA Rise Time
Receive SMBCLK/SMBDATA Fall Time
MAX6581
Data-Out Hold Time t Pulse Width of Spike Suppressed t SMBus Timeout t
Note 2: All parameters are tested at T Note 3: Timing specifications are guaranteed by design. Note 4: The serial interface resets when SMBCLK is low for more than t Note 5: A transition must internally provide at least a hold time to bridge the undefined region (300ns max) of SMBCLK’s falling
edge.
Typical Operating Characteristics
(VCC = +3.3V, V
= VCC, TA = +25NC, unless otherwise noted.)
STBY
t
R
t
F
DH
SP
TIMEOUT
= +85NC. Specifications over temperature are guaranteed by design.
A
SMBDATA low period for interface reset 25 37 45 ms
TIMEOUT
.
50 ns
0 50 ns
300 ns
300 ns
STANDBY SUPPLY CURRENT
vs. SUPPLY VOLTAGE
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
STANDBY SUPPLY CURRENT (µA)
HARDWARE OR SOFTWARE
0.5 STANDBY SUPPLY CURRENT
0
3.0 3.6 SUPPLY VOLTAGE (V)
AVERAGE OPERATING SUPPLY CURRENT
vs. SUPPLY VOLTAGE
400
RESISTANCE
395
MAX6581 toc01
3.53.43.33.23.1
CANCELLATION OFF
390
385
380
375
370
365
AVERAGE OPERATING SUPPLY CURRENT (µA)
360
3.0 3.6 SUPPLY VOLTAGE (V)
MAX6581 toc02
3.53.43.1 3.2 3.3
REMOTE-DIODE TEMPERATURE ERROR
vs. REMODE-DIODE TEMPERATURE
10
9 8 7 6 5 4 3 2 1 0
-1
-2
-3
-4
-5
-6
-7
REMOTE-DIODE TEMPERATURE ERROR (°C)
-8
-9
-10
-10 130 REMOTE-DIODE TEMPERATURE (°C)
MAX6581 toc03
1109050 703010
4 ______________________________________________________________________________________
±1°C Accurate 8-Channel Temperature Sensor
Typical Operating Characteristics (continued)
(VCC = +3.3V, V
= VCC, TA = +25NC, unless otherwise noted.)
STBY
MAX6581
LOCAL TEMPERATURE ERROR
vs. DIE TEMPERATURE
5
4
3
2
1
0
-1
-2
-3
LOCAL TEMPERATURE ERROR (°C)
-4
-5
-10 100 DIE TEMPERATURE (°C)
LOCAL TEMPERATURE ERROR
vs. POWER-SUPPLY NOISE FREQUENCY
5
4
3
2
1
0
-1
-2
-3
LOCAL TEMPERATURE ERROR (°C)
-4
-5
0.001 10 POWER-SUPPLY NOISE FREQUENCY (MHz)
100mV
10.10.01
REMOTE-DIODE TEMPERATURE ERROR vs. POWER-SUPPLY NOISE FREQUENCY
5
4
MAX6581 toc04
908060 7010 20 30 40 500
3
2
1
0
-1
-2
-3
-4
REMOTE-DIODE TEMPERATURE ERROR (°C)
-5
0.001 10 POWER-SUPPLY NOISE FREQUENCY (MHz)
100mV
P-P
TRJ = +85°C
10.10.01
MAX6581 toc05
REMOTE-DIODE TEMPERATURE ERROR
vs. CAPACITANCE
P-P
MAX6581 toc06
5
4
3
2
1
0
-1
-2
-3
-4
REMOTE-DIODE TEMPERATURE ERROR (°C)
-5 1 100
CAPACITANCE (nF)
100mV
P-P
TRJ = +85°C
10
MAX6581 toc07
REMOTE-DIODE TEMPERATURE ERROR
vs. RESISTANCE
50
TRJ = +85°C
45
40
35
30
RESISTANCE
25
CANCELLATION OFF
20
15
10
5
REMOTE-DIODE TEMPERATURE ERROR (°C)
0
-5 0 100
RESISTANCE CANCELLATION ON
RESISTANCE (I)
MAX6581 toc08
908060 7020 30 40 5010
_______________________________________________________________________________________ 5
±1°C Accurate 8-Channel Temperature Sensor
Pin Configuration
MAX6581
TOP VIEW
SMBDATA
SMBCLK
GND
N.C.
DXP1
DXN1
19
20
21
22
23
24
CC
V
ALERT
1718 16 14 13
OVERT
I.C.
STBY
15
MAX6581
*EP
1 2
DXP2
DXN2
*EP = EXPOSED PAD, CONNECT TO GND
3
DXP3
4 5 6
DXP4
DXN3
DXP7
N.C.
12
DXN7
DXP6
11
DXN6
10
9
DXN5
DXP5
8
DXN4
7
Pin Description
PIN NAME FUNCTION
Combined Current Source and ADC Positive Input for Channel 2 Remote Diode. Connect DXP2 to
1 DXP2
the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP2 unconnected or connect to DXN2 if a remote diode is not used. Connect a 100pF capacitor between DXP2 and DXN2 for noise filtering.
Cathode Input for Channel 2 Remote Diode. Connect the cathode of the channel 2 remote-diode-
2 DXN2
connected transistor to DXN2. If the channel 2 remote transistor is a substrate pnp (e.g., on a CPU die), connect the base of the pnp to DXN2. Leave DXN2 unconnected or connect to DXP2 if a remote diode is not used. Connect a 100pF capacitor between DXP2 and DXN2 for noise filtering.
Combined Current Source and ADC Positive Input for Channel 3 Remote Diode. Connect DXP3 to
3 DXP3
the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP3 unconnected or connect to DXN3 if a remote diode is not used. Connect a 100pF capacitor between DXP3 and DXN3 for noise filtering.
Cathode Input for Channel 3 Remote Diode. Connect the cathode of the channel 3 remote-diode-
4 DXN3
connected transistor to DXN3. If the channel 3 remote transistor is a substrate pnp (e.g., on a CPU die), connect the base of the pnp to DXN3. Leave DXN3 unconnected or connect to DXP3 if a remote diode is not used. Connect a 100pF capacitor between DXP3 and DXN3 for noise filtering.
Combined Current Source and ADC Positive Input for Channel 4 Remote Diode. Connect DXP4 to
5 DXP4
the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP4 unconnected or connect to DXN4 if a remote diode is not used. Connect a 100pF capacitor between DXP4 and DXN4 for noise filtering.
6, 22 N.C. No Connection. Connect to other N.C. or leave unconnected.
6 ______________________________________________________________________________________
±1°C Accurate 8-Channel Temperature Sensor
Pin Description (continued)
PIN NAME FUNCTION
Cathode Input for Channel 4 Remote Diode. Connect the cathode of the channel 4 remote-diode-
7 DXN4
8 DXP5
9 DXN5
10 DXN6
11 DXP6
connected transistor to DXN4. If the channel 4 remote transistor is a substrate pnp (e.g., on a CPU die), connect the base of the pnp to DXN4. Leave DXN4 unconnected or connect to DXP4 if a remote diode is not used. Connect a 100pF capacitor between DXP4 and DXN4 for noise filtering.
Combined Current Source and ADC Positive Input for Channel 5 Remote Diode. Connect DXP5 to the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP5 unconnected or connect to DXN5 if a remote diode is not used. Connect a 100pF capacitor between DXP5 and DXN5 for noise filtering.
Cathode Input for Channel 5 Remote Diode. Connect the cathode of the channel 5 remote-diode­connected transistor to DXN5. If the channel 5 remote transistor is a substrate pnp (e.g., on a CPU die), connect the base of the pnp to DXN5. Leave DXN5 unconnected or connect to DXP5 if a remote diode is not used. Connect a 100pF capacitor between DXP5 and DXN5 for noise filtering.
Cathode Input for Channel 6 Remote Diode. Connect the cathode of the channel 6 remote-diode­connected transistor to DXN6. If the channel 6 remote transistor is a substrate pnp (e.g., on a CPU die), connect the base of the pnp to DXN6. Leave DXN6 unconnected or connect to DXP6 if a remote diode is not used. Connect a 100pF capacitor between DXP6 and DXN6 for noise filtering.
Combined Current Source and ADC Positive Input for Channel 6 Remote Diode. Connect DXP6 to the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP6 unconnected or connect to DXN6 if a remote diode is not used. Connect a 100pF capacitor between DXP6 and DXN6 for noise filtering.
MAX6581
Cathode Input for Channel 7 Remote Diode. Connect the cathode of the channel 7 remote-diode-
12 DXN7
13 DXP7
14
15 I.C. Internally Connected. I.C. is internally connected to V
16
17 V
18
19 SMBDATA SMBus Serial-Data Input/Output. Connect SMBDATA to a pullup resistor. 20 SMBCLK SMBus Serial-Clock Input. Connect SMBCLK to a pullup resistor.
STBY
OVERT
CC
ALERT
connected transistor to DXN7. If the channel 7 remote transistor is a substrate pnp (e.g., on a CPU die), connect the base of the pnp to DXN7. Leave DXN7 unconnected or connect to DXP7 if a remote diode is not used. Connect a 100pF capacitor between DXP7 and DXN7 for noise filtering.
Combined Current Source and ADC Positive Input for Channel 7 Remote Diode. Connect DXP7 to the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP7 unconnected or connect to DXN7 if a remote diode is not used. Place a 100pF capacitor between DXP7 and DXN7 for noise filtering.
Active-Low Standby Input. Drive STBY logic-low to place the MAX6581 in standby mode, or logic­high for normal mode. Temperature and threshold data are retained in standby mode.
. Connect I.C. to VCC or leave unconnected.
CC
Overtemperature Active-Low, Open-Drain Output. OVERT asserts low when the temperature of any remote channel exceeds the programmed threshold limit.
Supply Voltage Input. Bypass to GND with a 0.1FF capacitor. SMBus Alert (Interrupt), Active-Low, Open-Drain Output. ALERT asserts low when the temperature of
any channel crosses a programmed ALERT high or low threshold.
_______________________________________________________________________________________ 7
±1°C Accurate 8-Channel Temperature Sensor
Pin Description (continued)
PIN NAME FUNCTION
21 GND Ground
Combined Current Source and ADC Positive Input for Channel 1 Remote Diode. Connect DXP1 to
23 DXP1
MAX6581
24 DXN1
EP Exposed Pad. Connect EP to GND.
the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP1 unconnected or connect to DXN1 if a remote diode is not used. Connect a 100pF capacitor between DXP1 and DXN1 for noise filtering.
Cathode Input for Channel 1 Remote Diode. Connect the cathode of the channel 1 remote-diode­connected transistor to DXN1. If the channel 1 remote transistor is a substrate pnp (e.g., on a CPU die), connect the base of the pnp to DXN1. Leave DXN1 unconnected or connect to DXP1 if a remote diode is not used. Connect a 100pF capacitor between DXP1 and DXN1 for noise filtering.
Detailed Description
ADC Conversion Sequence
Low-Power Standby Mode
Enter software-standby mode by setting the STOP bit to 1 in the Configuration register. Enter hardware­standby by pulling STBY low. Software-standby mode disables the ADC and reduces the supply current to approximately 4FA. During either software or hardware standby, data is retained in memory. During hardware standby, the SMBus interface is inactive. During software
standby, the SMBus interface is active and listening for commands. The timeout is enabled if a START condition is recognized on SMBus. Activity on the SMBus causes the supply current to increase. If a standby command is received while a conversion is in progress, the conver­sion cycle is interrupted, and the temperature registers are not updated. The previous data is not changed and remains available.
Operating-Current Calculation
The MAX6581 operates at different operating-current levels depending on how many external channels are in use and how many of those are in resistance cancella­tion (RC) mode. The average operating current is:
N 1 2 N
+ ×
I I I
= + ×
AV CC1 CC2
where:
N
= the number of remote channels that are operating
N
in normal mode.
NR = the number of remote channels that are in RC mode.
IAV = the average operating power-supply current over a complete series of conversions.
I
= the average operating power-supply current
CC1
during a conversion in normal mode.
I
= the average operating power-supply current
CC2
during a conversion in RC mode.
N R
N 2 N 1 N 2 N 1
+ × + + × +
N R N R
8 ______________________________________________________________________________________
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