The MAX6469–MAX6484 are low-dropout linear regulators with a fully integrated microprocessor reset circuit.
Each is available with preset output voltages from +1.5V
to +3.3V in 100mV increments and delivers up to 300mA
of load current. These devices consume only 82µA of
supply current. The low supply current, low dropout voltage, and integrated reset functionality make these
devices ideal for battery-powered portable equipment.
The MAX6469–MAX6484 include a reset output that indicates when the regulator output drops below standard
microprocessor supply tolerances (-7.5% or -12.5% of
nominal output voltage). This eliminates the need for an
external microprocessor supervisor, while ensuring that
supply voltages and clock oscillators have stabilized
before processor activity is enabled. Push-pull and opendrain active-low reset outputs are available, with reset
timeout periods of 2.5ms, 20ms, 150ms, or 1200ms (min).
The MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–
MAX6484 also have a shutdown feature that reduces the
supply current to 0.1µA (typ). The MAX6471–MAX6474/
MAX6479–MAX6482 offer a manual reset input to assert a
microprocessor reset while the regulator output is within
specification. The MAX6475/MAX6476/MAX6483/
MAX6484 feature a remote feedback sense pin for use
with an external NPN transistor for higher-current applications. The MAX6469–MAX6476 are available in 6-pin
SOT23 and 8-pin thin QFN packages. The MAX6477–
MAX6484 are available in a 3 × 3 chip-scale package
(UCSP™). All devices are specified for operation from
-40°C to +85°C.
Applications
Hand-Held Instruments (PDAs, Palmtops)
PCMCIA Cards/USB Devices
Cellular/Cordless Telephones
CD/DVD Drives
Notebook Computers
Digital Cameras
Bluetooth Modules/Wireless LAN
Features
♦ 3 ✕ 3 UCSP, 6-Pin SOT23, and 8-Pin QFN Packages
♦ Preset +1.5V to +3.3V Output (100mV Increments)
♦ SET Pin for Adjustable Output Voltage
♦ 75µV
RMS
LDO Output Voltage Noise
(MAX6477–MAX6484)
♦ ±2.0% Accuracy Over Temperature
♦ Guaranteed 300mA Output Current
♦ Low Dropout Voltage
55mV at 150mA
114mV at 300mA
♦ 82µA Supply Current, 0.1µA Shutdown Current
♦ Input Reverse Current, Thermal and Short-Circuit
Protection
♦ Microprocessor Reset with Four Timeout Options
♦ Push-Pull or Open-Drain RESET
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Note: The first “_ _”are placeholders for the output voltage levels
of the devices. Desired output voltages are set by the suffix found
in the Output Voltage Suffix Guide (Table 1). The third “_” is a
placeholder for the reset threshold accuracy. Desired reset
threshold accuracy is set by the suffix found in the Reset
Threshold Accuracy Guide (Table 2). The “_” following the D is a
placeholder for the reset timeout delay time. Desired reset timeout
delay time is set by the suffix found in the Reset Timeout Delay
Guide (Table 3). For example, the MAX6481BL30BD4-T has a
3.0V output voltage, 12.5% reset threshold tolerance, and a
1200ms (min) reset timeout delay. Sample stock is generally available on standard versions only (Table 4). Standard versions
require a minimum order increment of 2.5k units. Nonstandard
versions must be ordered in 10k-unit increments. Contact factory
for availability.
Ordering Information continued at end of data sheet.
Pin Configurations appear at end of data sheet.
Typical Operating Circuits appear at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
*Future product—contact factory for availability.
EVALUATION KIT
AVAILABLE
MAX6469UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6469TA_ _ _D_*-40°C to +85°C8 Thin QFN
MAX6470UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6470TA_ _ _D_*-40°C to +85°C8 Thin QFN
PARTTEMP RANGE
PINPACKAGE
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(VIN= (V
OUT
+ 0.5V) or +2.5V, whichever is greater, C
OUT
= 3.3µF, TA= -40°C to +85°C. Typical specifications are at TA= +25°C,
unless otherwise noted.) (Note 2)
Dual Mode is a trademark of Maxim Integrated Products, Inc.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: The MAX6477–MAX6484 are constructed using a unique set of packaging techniques that impose a limit on the thermal pro-
file the devices can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder
profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and
Convection reflow. Pre-heating is required. Hand or wave soldering is not allowed.
Input Voltage RangeV
Input Undervoltage LockoutV
Supply Current (Ground Current)I
Shutdown Supply CurrentI
REGULATOR CIRCUIT
Output Current300mA
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6469–MAX6476
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6477–MAX6484
Adjustable Output Voltage RangeV
SET Reference VoltageV
SET Dual ModeTM Threshold185mV
SET Input Leakage CurrentI
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
IN
UVLO
Q
SHDN
SET
SET
VIN falling2.252.47V
I
= 082136
OUT
I
= 300mA96
OUT
TA = +25°C0.11µA
1mA ≤ I
OUT
1mA ≤ I
OUT
1mA ≤ I
OUT
2mA ≤ I
OUT
2mA ≤ I
OUT
2mA ≤ I
OUT
(Note 3)
V
= 0, +1.2V (Note 3)±20±100nA
SET
≤ 150mA, TA = +25°C-1.3+1.3
≤ 150mA, TA = -40°C to +85°C-2.3+2.3
≤ 300mA, TA = -40°C to +85°C-2.7+2.7
≤ 100mA, TA = +25°C-1.1+1.1
≤ 100mA, TA = -40°C to +85°C-2.0+2.0
11, 2A1INRegulator Input. Bypass IN to GND with a 0.1µF capacitor.
23A2GND
34A3 SHDN
45C3 RESET
56C2SET
67, 8C1OUT
NAMEFUNCTION
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
Active-Low Shutdown Input. Connect SHDN to V
operation.
Active-Low Reset Output. RESET remains low while V
reset threshold. RESET remains low for the duration of the reset timeout
period after the reset conditions are terminated. RESET is available in
open-drain and push-pull configurations.
Feedback Input for Externally Setting the Output Voltage. Connect SET
to GND to select the preset output voltage. Connect SET to an external
resistor-divider network for adjustable output operation.
Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
IN
PINBUMP
MAX6471/MAX6472MAX6479/MAX6480
SOT23QFNUCSP
11, 2A1INRegulator Input. Bypass IN to GND with a 0.1µF capacitor.
23A2GND
34A3MR
45C3 RESET
NAMEFUNCTION
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
Active-Low Manual Reset Input. The reset output is asserted while MR
is pulled low and remains asserted for the duration of the reset timeout
period after MR transitions from low to high. Leave MR unconnected or
connect to V
(typ) to V
Active-Low Reset Output. RESET remains low while V
reset threshold or while MR is held low. RESET remains low for the
duration of the reset timeout period after the reset conditions are
terminated. RESET is available in open-drain and push-pull
configurations.
if not used. MR has an internal pullup resistor of 40kΩ
OUT
.
OUT
for normal
is below the
OUT
is below the
OUT
56C2SET
67, 8C1OUT
Feedback Input for Externally Setting the Output Voltage. Connect SET
to GND to select the preset output voltage. Connect SET to an external
resistor-divider network for adjustable output operation.
Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
11, 2A1INRegulator Input. Bypass IN to GND with a 0.1µF capacitor.
23A2GND
34A3 SHDN
45C3 RESET
56C2MR
67, 8C1OUT
NAMEFUNCTION
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
Active-Low Shutdown Input. Connect SHDN to V
operation.
Active-Low Reset Output. RESET remains low while V
reset threshold or while MR is held low. RESET remains low for the
duration of the reset timeout period after the reset conditions are
terminated. RESET is available in open-drain and push-pull
configurations.
Active-Low Manual Reset Input. The reset output is asserted while MR
is pulled low and remains asserted for the duration of the reset timeout
period after MR transitions from low to high. Leave MR unconnected or
connect to V
(typ) to V
Regulator Output. Bypass OUT to GND with a minimum 3.3µF (min)
low-ESR capacitor.
if not used. MR has an internal pullup resistor of 40kΩ
OUT
.
OUT
for normal
IN
OUT
is below the
PINBUMP
MAX6475/MAX6476MAX6483/MAX6484
SOT23QFNUCSP
11, 2A1INRegulator Input. Bypass IN to GND with a 0.1µF capacitor.
23A2GND
34A3 SHDN
45C3 RESET
56C2FB
67, 8C1OUT
NAMEFUNCTION
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
Active-Low Shutdown Input. Connect SHDN to V
operation.
Active-Low Reset Output. RESET remains low while FB is below the
reset threshold. RESET remains low for the duration of the reset
timeout period after the reset conditions are terminated. RESET is
available in open-drain and push-pull configurations.
Feedback Input for Linear Regulator Controller or Remote Sense
Applications. Connect FB to the external load (VCC) to obtain the fixed
output voltage.
Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
The MAX6469–MAX6484 are ultra-low, quiescent current, low-dropout linear regulators with an integrated
microprocessor reset circuit. These devices guarantee
300mA (min) drive capabilities and are available with
preset output voltages in 100mV increments between
+1.5V and +3.3V. The internal reset circuit monitors the
regulator output voltage and asserts the reset output
when the regulator output is below the microprocessor
supply tolerance.
Regulator
The regulator core operates with +2.5V to +5.5V input
voltage range. The output voltage is offered in 100mV
increments between +1.5V and +3.3V (contact factory
for other output voltage options). The MAX6469–
MAX6472/MAX6477–MAX6480 offer an adjustable output voltage implemented with an external resistordivider network between OUT, SET, and GND (Figure
1). SET must be connected to either GND for fixed
V
OUT
or to an external divider for adjustable V
OUT
. The
MAX6469–MAX6472/MAX6477–MAX6480 automatically
determine the feedback path depending on the connection of SET. The Typical Operating Circuit shows a
typical connection for the MAX6469. OUT is an internally regulated low-dropout (LDO) linear regulator that
powers a microprocessor.
Reset Circuit
The reset supervisor circuit is fully integrated in the
MAX6469–MAX6484 and uses the same reference voltage as the regulator. Two supply tolerance reset
thresholds, -7.5% and -12.5%, are provided for each
type of device.
-7.5% Reset: Reset does not assert until the regulator
output voltage is at least -5% out of tolerance and
always asserts before the regulator output voltage is
-10% out of tolerance.
-12.5% Reset: Reset does not assert until the regulator
output voltage is at least -10% out of tolerance and
always asserts before the regulator output voltage is
-15% out of tolerance.
RESET
Output
A µP’s reset input starts the µP in a known state. The
MAX6469–MAX6484 µP supervisory circuits assert
RESET during power-up, power-down, and brownout
conditions. RESET asserts when the input voltage is
below the undervoltage lockout threshold. RESET
asserts when V
OUT
is below the reset threshold and
remains asserted for at least the minimum selected reset
timeout period (tRP, Table 3) after VINrises above the
undervoltage lockout threshold and V
OUT
rises above
the reset threshold. RESET asserts when MR is pulled
low (MAX6471–MAX6474/MAX6479–MAX6482). RESET
asserts when SHDN is pulled low (MAX6469/
MAX6470/MAX6473–MAX6478/MAX6481–MAX6484).
Shutdown
(MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–
MAX6484 only)
SHDN allows the regulator to shut down, thereby reducing the total I
IN
consumption of the device. SHDN pro-
vides a digitally controlled active-low shutdown. In
shutdown mode, the pass transistor, control circuit, and
reference turn off to reduce the supply current to below
0.1µA. Connect SHDN to IN for normal operation.
Manual Reset Input
(MAX6471–MAX6474/MAX6479–MAX6482 only)
Many µP-based products require manual reset capability, allowing the operator, a test technician, or external
logic circuitry to initiate a reset. A logic low on MR
asserts reset while the regulator output voltage is still
within tolerance.
Reset remains asserted while MR is low and for the
reset timeout period (tRP) after MR returns high. The
MR input has an internal pullup of 40kΩ (typ) to OUT.
MR can be driven with TTL/CMOS logic levels or with
open-drain/collector outputs. Connect a normally open
switch from MR to GND to create a manual reset function; external debounce circuitry is not required. If MR
is driven from long cables or the device is used in a
noisy environment, connect a 0.1µF capacitor from MR
to GND to provide additional noise immunity.
Feedback Input
(MAX6475/MAX6476/MAX6483/MAX6484 only)
The feedback input (FB) connects to an internal resistordivider network (Functional Diagram). FB is not internally
connected to V
OUT
, and as a result can be used to
Figure 1. Adjustable Output Voltage Configuration
2.5V TO 5.5V
IN
OUT
MAX6469–MAX6472
MAX6477–MAX6480
MANUAL
RESET
( ) ARE FOR MAX6471/MAX6472/MAX6479/MAX6480 ONLY
(MR)
SET
GND
R1
C
OUT
R2
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
remotely sense the output voltage of the device. Using
FB with an external NPN transistor, the current drive
capability can be increased according to the following
equation (Figure 2):
I
OUT(TOTAL)
= I
OUT
✕ (β+1)
The external NPN pass transistor must meet specifications for current gain, power dissipation, and collector
current. The beta influences the maximum output current the circuit can deliver. The largest guaranteed output current is given by I
LOAD
(max) = 300mA × beta
(min). The transistor’s rated power dissipation must
exceed the actual power dissipated in the transistor.
The power dissipated (PD) equals the maximum load
current (I
LOAD
(max)) times the maximum input-to-out-
put voltage differential: PD = I
LOAD
(max) × (V
IN
(max) -
V
OUT
). The rated transistor collector current must
exceed the maximum load current.
Reverse Leakage Protection
Reverse OUT to IN Current
An internal circuit monitors the MAX6469–MAX6484
input and output voltages. When the output voltage is
greater than the input voltage, the internal IN-to-OUT
pass transistor and parasitic diode turn off. An external
voltage applied to OUT does not reverse charge a battery or power source applied to IN (the leakage path
from OUT to IN is 0.01µA typ). When the output voltage
exceeds the input voltage, OUT powers the device and
shutdown must be logic high (greater than 0.7
✕
V
OUT
).
RESET asserts until IN exceeds OUT and OUT is above
the specified V
THOUT
threshold (based on the selected
or adjusted regulator OUT nominal voltage).
Reverse OUT to Ground Current
The MAX6469–MAX6484 maintain a low OUT-to-GND
reverse-current flow when the IN power source is
removed. When IN floats (input battery removed) and
SHDN is pulled up to V
OUT
(by an external diode), the
OUT-to-GND current through the LDO is 40µA (typ). The
regulator output can be held up with an external super
capacitor or backup battery at OUT until the IN battery is
replaced. The RESET output is asserted while the IN battery is removed to place the system in a low-power
mode. Volatile memory content is maintained until the
super capacitor or battery voltage drops below RAM
standby specifications. RESET deasserts when the IN
battery has been replaced and OUT exceeds the
desired reset threshold. For nonrechargeable backup
battery applications, place a reverse diode between
OUT and the backup battery (to prevent battery charging). The external diode does not affect the regulator’s
dropout voltage because it is not between the LDO output and the processor/memory Vcc supply. The diode
can be replaced with a current-limiting resistor for
rechargeable backup battery applications.
Current Limit
The MAX6469–MAX6484 include an internal currentlimit circuit that monitors and controls the pass transistor’s gate voltage, limiting the output current to 450mA
(min). The output can be shorted to ground indefinitely
without damaging the part.
Thermal Shutdown
When the junction temperature (TJ) exceeds +180°C
(typ), the thermal sensor signals the shutdown logic,
turning off the pass transistor and allowing the IC to
cool. The thermal sensor turns the pass transistor on
again after the IC’s junction temperature cools by 20°C,
resulting in a pulsed output during continuous thermal
overload conditions. Thermal overload protection is
designed to protect the MAX6469–MAX6484 in the
event of fault conditions. For continuous operation, do
not exceed the absolute maximum junction temperature
rating of T
JMAX
= +150°C.
Operating Region and Power Dissipation
The MAX6469–MAX6484’s maximum power dissipation
depends on the thermal resistance of the case and circuit board, the temperature difference between the die
junction and the ambient air, and the rate of airflow. The
power dissipation across the device is:
P = I
OUT(VIN
- V
OUT
)
The maximum power dissipation is:
P
MAX
= (TJ- TA) / (ØJB+ ØBA)
where TJ- TAis the temperature difference between the
die junction and the surrounding air, ØJB(or ØJC) is the
thermal resistance of the package, and ØBAis the thermal resistance through the PC board, copper traces,
and other materials to the surrounding air. The
MAX6469–MAX6476 QFN package ØJC= 41°C/W, and
the MAX6469–MAX6476 SOT package ØJC= 110°C/W.
The MAX6469–MAX6484’s ground pin (GND) performs
the dual function of providing an electrical connection
to the system ground and channeling heat away.
Connect GND to the system ground using a large pad
or ground plane. For continuous operation, do not
exceed the absolute maximum junction temperature
rating of T
JMAX
= +150°C.
Applications Information
Output Voltage Selection
The MAX6469–MAX6484 feature dual-mode operation:
they operate in either a preset output voltage mode
or an adjustable mode. In preset voltage mode, internal
feedback resistors set the MAX6469–MAX6484’s output
from +1.5V to +3.3V (Table 1). Select this mode by connecting SET to ground (MAX6469–MAX6472/
MAX6477–MAX6480). In adjustable mode, select an
output between 1.25V and 5.5V using two external
resistors connected as a voltage-divider to SET (Figure
1). The output voltage is set by the following equation:
V
OUT
= V
SET
(1 + R1 / R2)
where V
SET
= 1.23V. To simplify resistor selection:
R1 = R2(V
OUT
/ V
SET
- 1)
Choose R2 = 50kΩ to maintain stability, accuracy and
high-frequency power-supply rejection. Avoid selecting
resistor values greater than 100kΩ. In preset voltage
mode, the impedance between SET and ground should
always be less than 50kΩ. In most applications, connect SET directly to ground.
Low-Noise UCSP Output
MAX6477–MAX6484 UCSP products include internal filtering to yield low output noise without an additional
external bypass capacitor. The devices yield 75µV
RMS
(typ) output noise (for V
OUT
= 3.0V) and 150µV
RMS
(for
V
OUT
= 3.3V). This low-noise feature makes the
MAX6477–MAX6484 ideal for audio applications.
Capacitor Selection and Regulator
Stability
For stable operation over the full temperature range
and with load currents up to 300mA, use a 3.3µF (min)
ceramic output capacitor with an ESR <0.2Ω. To
reduce noise and improve load transient response, stability, and power-supply rejection, use large output
capacitor values such as 10µF.
Note that some ceramic capacitors exhibit large capacitance and ESR variation with temperature. With capacitor dielectrics such as Z5U and Y5V, use 4.7µF or more
to ensure stability over temperature. With X7R or X5R
capacitor dielectrics, 3.3µF should be sufficient at all
operating temperatures. Higher ESR capacitors require
more capacitance to maintain stability. A graph of the
Region of Stable ESR vs. Load Current is shown in the
Typical Operating Characteristics.
To improve power-supply rejection and transient
response, use a 1µF capacitor between IN and GND.
The MAX6469–MAX6484 remain stable with purely
resistive loads or current loads up to 300mA.
Reset Transient Immunity
The reset circuit is relatively immune to short-duration,
falling V
OUT
transients. The Typical OperatingCharacteristics section shows a graph of the Maximum
Transient Duration vs. Reset Threshold Overdrive for
which reset is not asserted. The graph was produced
using falling V
OUT
transients starting at V
OUT
and ending below the reset threshold by the magnitude indicated (reset threshold overdrive). The graph shows the
maximum pulse width that a falling V
OUT
transient can
typically have without triggering a reset pulse. As the
amplitude of the transient increases (i.e., goes further
below the reset threshold), the maximum allowable
pulse width decreases. Typically, a V
OUT
transient that
goes only 10mV below the reset threshold and lasts for
75µs does not trigger a reset pulse.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
For the SOT23 package, any pin except the SET pin
can be used as a heatsink. If the SET pin is used as a
heatsink, excessive parasitic capacitance can affect
stability. For the QFN package, the exposed metal pad
on the back side of a package connects to GND of the
chip. This metal pad can be used as a heatsink.
UCSP Consideration
For general UCSP package information and PC layout
considerations, refer to Maxim Application Note: Wafer-Level Chip-Scale Package.
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that might not perform equally to
a packaged product through traditional mechanical
reliability tests. CSP reliability is integrally linked to the
user’s assembly methods, circuit-board material, and
usage environment. The user should closely review
these areas when considering a CSP package.
Performance through operating life test and moisture
resistance remains uncompromised, because it is primarily determined by the wafer-fabrication process.
Mechanical stress performance is a greater consideration for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, forgoing
the inherent stress relief of a packaged product’s lead
frame. Solder-joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
recommendations are detailed in the UCSP application
note on Maxim’s website at www.maxim-ic.com.
Table 1. Output Voltage Suffix Guide
Note: Factory-trimmed custom output voltages may be available; contact factory for availability.
Sample stock is generally available on standard versions only.
Standard versions require a minimum order increment of 2.5k
units. Nonstandard versions must be ordered in 10k-unit increments. Contact factory for availability.
are placeholders for the output voltage levels
of the devices. Desired output voltages are set by the suffix found
in the Output Voltage Suffix Guide (Table 1). The third “_” is a
placeholder for the reset threshold accuracy. Desired reset
threshold accuracy is set by the suffix found in the Reset
Threshold Accuracy Guide (Table 2). The “_” following the D is a
placeholder for the reset timeout delay time. Desired reset timeout
delay time is set by the suffix found in the Reset Timeout Delay
Guide (Table 3). For example, the MAX6481BL30BD4-T has a
3.0V output voltage, 12.5% reset threshold tolerance, and a
1200ms (min) reset timeout delay. Sample stock is generally available on standard versions only (Table 4). Standard versions
require a minimum order increment of 2.5k units. Nonstandard
versions must be ordered in 10k-unit increments. Contact factory
for availability.
*Future product—contact factory for availability.
PARTTEMP RANGE
MAX6471UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6471TA_ _ _D_*-40°C to +85°C8 Thin QFN
MAX6472UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6472TA_ _ _D_*-40°C to +85°C8 Thin QFN
MAX6473UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6473TA_ _ _D_*-40°C to +85°C8 Thin QFN
MAX6474UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6474TA_ _ _D_*-40°C to +85°C8 Thin QFN
MAX6475UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6475TA_ _ _D_*-40°C to +85°C8 Thin QFN
MAX6476UT_ _ _D_-T-40°C to +85°C6 SOT23-6
MAX6476TA_ _ _D_*-40°C to +85°C8 Thin QFN
MAX6477BL_ _ _D_-T-40°C to +85°C6 UCSP
MAX6478BL_ _ _D_-T-40°C to +85°C6 UCSP
MAX6479BL_ _ _D_-T-40°C to +85°C6 UCSP
MAX6480BL_ _ _D_-T-40°C to +85°C6 UCSP
MAX6481BL_ _ _D_-T-40°C to +85°C6 UCSP
MAX6482BL_ _ _D_-T-40°C to +85°C6 UCSP
MAX6483BL_ _ _D_-T-40°C to +85°C6 UCSP
MAX6484BL_ _ _D_-T-40°C to +85°C6 UCSP
PINPACKAGE
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages
.)
6LSOT.EPS
PACKAGE OUTLINE, SOT-23, 6L
21-0058
1
F
1
9LUCSP, 3x3.EPS
PACKAGE OUTLINE, 3x3 UCSP
21-0093
1
I
1
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages
.)
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600