MAXIM MAX5898 Technical data

General Description
The MAX5898 programmable interpolating, modulating, 500Msps, dual digital-to-analog converter (DAC) offers superior dynamic performance and is optimized for high­performance wideband, single- and multicarrier transmit applications. The device integrates a selectable 2x/4x/8x interpolating filter, a digital quadrature modulator, and dual 16-bit, high-speed DACs on a single integrated cir­cuit. At 30MHz output frequency and 500Msps update rate, the in-band SFDR is 81dBc, while only consuming
1.2W. The device also delivers 71dB ACLR for four­carrier WCDMA at a 61.44MHz output frequency.
The selectable interpolating filters allow lower input data rates while taking advantage of the high DAC update rates. These linear-phase interpolation filters ease recon­struction filter requirements and enhance the passband dynamic performance. Each channel includes offset and gain programmability, allowing the user to calibrate out local oscillator (LO) feedthrough and sideband suppres­sion errors generated by analog quadrature modulators.
The MAX5898 features a f
IM
/ 4 digital image-reject modulator. This modulator generates a quadrature-mod­ulated IF signal that can be presented to an analog I/Q modulator to complete the upconversion process. A second digital modulation mode allows the signal to be frequency-translated with image pairs at fIM/ 2 or fIM/ 4.
The MAX5898 features a standard LVDS interface for low electromagnetic interference (EMI). Interleaved data is applied through a single 16-bit bus. A 3.3V SPI™ port is provided for mode configuration. The pro­grammable modes include the selection of 2x/4x/8x interpolating filters, fIM/ 2, fIM/ 4 or no digital quadra­ture modulation with image rejection, individual channel gain and offset adjustment, and offset binary or two’s­complement data interface.
Compatible versions with CMOS interfaces and 12-, 14-, and 16-bit resolutions are also available. Refer to the MAX5893 data sheet for 12-bit CMOS, MAX5894 for 14­bit CMOS, and the MAX5895 for 16-bit CMOS versions.
Applications
Base Stations: 3G Multicarrier UMTS, CDMA, and GSM
Broadband Wireless Transmitters
Broadband Cable Infrastructure
Instrumentation and Automatic Test Equipment (ATE)
Analog Quadrature Modulation Architectures
Features
o 71dB ACLR at f
OUT
= 61.44MHz (Four-Carrier
WCDMA)
o Meets Multicarrier UMTS, cdma2000
®
, GSM
Spectral Masks (f
OUT
= 122MHz)
o Noise Spectral Density = -160dBFS/Hz at
f
OUT
= 16MHz
o 90dBc SFDR at Low-IF Frequency (10MHz) o 88dBc SFDR at High-IF Frequency (50MHz) o Low Power: 831mW (f
CLK
= 250MHz)
o User Programmable
Selectable 2x, 4x, or 8x Interpolating Filters
< 0.01dB Passband Ripple
> 95dB Stopband Rejection Selectable Real or Complex Modulator Operation Selectable Modulator LO Frequency: OFF, fIM/ 2, or fIM/ 4 Selectable Output Filter: Lowpass or Highpass Per Channel Gain and Offset Adjustment
o EV Kit Available (Order the MAX5898EVKIT)
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
________________________________________________________________
Maxim Integrated Products
1
Selector Guide
Ordering Information
Simplified Diagram
19-3756; Rev 2; 8/10
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Pin Configuration appears at end of data sheet.
SPI is a trademark of Motorola, Inc. cdma2000 is a registered trademark of Telecommunications Industry Association.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
*
EP = Exposed paddle.
D = Dry pack
EVALUATION KIT
AVAILABLE
PART TEMP RANGE PIN-PACKAGE
M AX 5898E GK+ D -40°C to +85°C
M AX 5898E GK- D -40°C to +85°C
68 QFN-EP* (10mm x 10mm)
68 QFN-EP* (10mm x 10mm)
PART
MAX5893 12 500 CMOS
MAX5894 14 500 CMOS
MAX5895 16 500 CMOS
MAX5898 16 500 LVDS
RESOLUTION
(BITS)
DAC UPDATE
RATE (Msps)
FILTERS
INTERPOLATING
1x/2x/4x
DATA SYNCH
DATA PORT
DATACLK
AND DEMUX
MODULATOR
FILTERS
INTERPOLATING
DAC
2x
DAC
INPUT
LOGIC
OUTI
OUTQ
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, modulator off, 2x interpolation, DATACLK output mode, output is
50double-terminated, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C,
unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DV
DD1.8
, AV
DD1.8
to GND, DACREF ..................-0.3V to +2.16V
AV
DD3.3
, AV
CLK
, DV
DD3.3
to GND, DACREF........-0.3V to +3.9V
DATACLKP, DATACLKN, D0P–D15P,
D0N–D15N, SELIQP, SELIQN to GND,
DACREF ..........................................-0.3V to (DV
DD1.8
+ 0.3V)
CS, RESET, SCLK, DIN, DOUT to
GND, DACREF ................................-0.3V to (DV
DD3.3
+ 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
CLK
+ 0.3V)
REFIO, FSADJ to GND, DACREF ........-0.3V to (AV
DD3.3
+ 0.3V)
OUTIP, OUTIN, OUTQP,
OUTQN to GND, DACREF..................-1V to (AV
DD3.3
+ 0.3V)
DOUT, DATACLKP, DATACLKN Continuous Current ..........8mA
Continuous Power Dissipation (T
A
= +70°C) 68-Pin QFN (derate 41.7mW/°C above +70°C)
(Note 1) ...................................................................3333.3mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
STATIC PERFORMANCE
Resolution 16 Bits
Differential Nonlinearity DNL ±1 LSB
Integral Nonlinearity INL ±3 LSB
Offset Error OS -0.02 ±0.003 +0.02 %FS
Offset Drift ±0.03 ppm/°C
Gain Error GE
(Note 3) -4 ±0.06 +4 %FS
FS
Gain-Error Drift ±110 ppm/°C
Full-Scale Output Current I
OUTFS
(Note 3) 2 20 mA
Output Compliance -0.5 +1.1 V
Output Resistance R
Output Capacitance C
OUT
OUT
DYNAMIC PERFORMANCE
Maximum Clock Frequency f
Minimum Clock Frequency f
Maximum DAC Update Rate f
Minimum DAC Update Rate f
Maximum Data Clock Frequency f
Maximum Input Data Rate f
CLK
CLK
DAC
DAC
DATACLK
DATA
f
= f
DAC
CLK
f
= f
DAC
CLK
Interleaved data 250 MHz
Per channel 125 MWps
f
= 125Mwps,
DATA
= 16MHz, f
f
OUT
= 10MHz, -12dBFS
Noise Spectral Density
= 125Mwps,
f
DATA
f
= 16MHz, f
OUT
= 10MHz, 0dBFS
1M
5pF
500 MHz
or f
or f
DAC
DAC
= f
/ 2 500 Msps
CLK
= f
/ 2 10 Msps
CLK
No interpolation -156
OFFSET
2x interpolation -157
4x interpolation -157
OFFSET
4x interpolation -154
10 MHz
dBFS/
Hz
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, modulator off, 2x interpolation, DATACLK output mode, output is
50double-terminated, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
In-Band SFDR (DC to f
DATA
/ 2)
SFDR
Two-Tone IMD TTIMD
f
DATA
= 125Mwps,
interpolation off,
-0.1dBFS
f
= 125Mwps,
DATA
2x interpolation,
-0.1dBFS
f
= 125Mwps,
DATA
4x interpolation,
-0.1dBFS
f
= 125Mwps,
DATA
f
= 9MHz, f
OUT1
10MHz, -6.1dBFS
f
= 125Mwps,
DATA
= 79MHz,
f
OUT1
f
= 80MHz,
OUT2
-6.1dBFS
f
= 62.5Mwps,
DATA
= 9MHz, f
f
OUT1
10MHz, -6.1dBFS
OUT2
OUT2
f
= 10MHz 90
OUT
f
= 30MHz 84
OUT
f
= 50MHz 77
OUT
f
= 10MHz 79 89
OUT
f
= 30MHz 83
OUT
= 50MHz 92
f
OUT
f
= 10MHz 89
OUT
f
= 30MHz 83
OUT
f
= 50MHz 89
OUT
No interpolation -96
=
2x interpolation -99
4x interpolation -95
2x interpolation,
/ 4 complex
f
IM
modulation
4x interpolation, f
/ 4 complex
IM
modulation
=
8x interpolation -94
dBc
-81
-71
dBc
Four-Tone IMD FTIMD
ACLR for WCDMA (Note 4)
ACLR
f
= 62.5Mwps,
DATA
f
= 69MHz, f
OUT1
OUT2
= 70MHz, -6.1dBFS
f
= 62.5Mwps,
DATA
f
= 179MHz, f
OUT1
= 180MHz, -6.1dBFS
= 125Mwps, f
f
DATA
OUT2
spaced 1MHz
OUT
8x interpolation, f
/ 4 complex
IM
modulation
8x, highpass interpolation, f
/ 4 complex
IM
modulation
apart from 32MHz, -12dBFS, 2x interpolation
f
= 61.44Mwps,
DATA
= baseband
f
OUT
f
= 122.88Mwps,
DATA
= 61.44MHz
f
OUT
f
= 122.88Mwps,
DATA
f
= 122.88MHz
OUT
4x interpolation 79
8x interpolation 79
2x interpolation,
/ 4 complex
f
IM
modulation
4x interpolation, f
/ 4 complex
IM
modulation
-71
-71
-89 dBc
76
dB
68
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, modulator off, 2x interpolation, DATACLK output mode, output is
50double-terminated, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output Propagation Delay t
Output Rise Time t
Output Fall Time t
PD
RISE
FALL
1x interpolation (Note 5) 2.9 ns
10% to 90% (Note 6) 0.75 ns
10% to 90% (Note 6) 1 ns
Output Settling Time To 0.5% (Note 6) 11 ns
Output Bandwidth -1dB bandwidth (Note 7) 240 MHz
Passband Width Ripple < -0.01dB
Stopband Rejection
0.604 x f
0.604 x f
0.604 x f
, 2x interpolation 100
DATA
, 4x interpolation 100
DATA
, 8x interpolation 100
DATA
0.4 x
f
DATA
1x interpolation 22
Data Latency
2x interpolation 70
4x interpolation 146
8x interpolation 311
DAC INTERCHANNEL MATCHING
Gain Match ∆Gain f
Gain-Match Tempco ∆Gain/°C I
Phase Match ∆Phase f
Phase-Match Tempco Phase/°C I
DC Gain Match I
Crosstalk f
= DC - 80MHz, I
OUT
= 20mA ±0.02 ppm/°C
OUTFS
= 60MHz, I
OUT
= 20mA ±0.006 Deg/°C
OUTFS
= 20mA (Note 3) -0.2 ±0.04 +0.2 dB
OUTFS
= 50MHz, f
OUT
OUTFS
DAC
= 20mA ±0.1 dB
OUTFS
= 20mA ±0.13 Deg
= 250MHz -95 dB
REFERENCE
Reference Input Range 0.12 1.32 V
Reference Output Voltage V
Reference Input Resistance R
REFIO
REFIO
Internal reference 1.14 1.2 1.28 V
10 k
Reference Voltage Drift ±50 ppm/°C
CMOS LOGIC INPUTS (SCLK, CS, RESET, DIN)
Input High Voltage V
Input Low Voltage V
Input Current I
Input Capacitance C
IH
IL
IN
IN
0.7 x
DV
DD3.3
0.3 x
DV
DD3.3
-10 ±0.1 +10 µA
3pF
CMOS LOGIC OUTPUT (DOUT)
Output High Voltage V
Output Low Voltage V
OH
OL
I
LOAD
I
SINK
= 200µA
= 200µA
DV
0.8 x
DD3.3
DV
0.2 x
DD3.3
Output Leakage Current Tri-state 1 µA
dB
Clock
Cycles
V
V
V
V
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, modulator off, 2x interpolation, DATACLK output mode, output is
50double-terminated, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Rise/Fall Time C
= 10pF, 20% to 80% 1.5 ns
LOAD
LVDS LOGIC INPUTS (D15P–D0P, D15N–D0N, SELIQP, SELIQN)
Differential Input Logic High V
Differential Input Logic Low V
Input Common-Mode Voltage V
Differential Input Resistance R
Input Capacitance C
IH
IL
ICM
IN
IN
100 mV
-100 mV
1.125 1.25 1.375 V
110
2.5 pF
LVDS CLOCK INPUT/OUTPUT (DATACLKP, DATACLKN)
Differential Input Amplitude High V
Differential Input Amplitude Low V
IH
IL
D i ffer enti al Outp ut Am p l i tud e H i g hVOHR
Differential Output Amplitude Low V
Output Common-Mode Voltage V
OL
OCM
Output Rise/Fall Time
= 100 d i ffer enti al ( N ote 3) 250 340 mV
LOAD
R
= 100 d i ffer enti al ( N ote 3) -340 -250 mV
LOAD
R
= 100 d i ffer enti al , C
LOAD
LOAD
= 8pF,
20% to 80%
250 mV
-250 mV
1.25 V
0.9 ns
CLOCK INPUTS (CLKP, CLKN) (Note 8)
Differential Input Voltage Swing V
DIFF
Sine-wave input > 1.5
Square-wave input > 0.5
Differential Input Slew Rate > 100 V/µs
AV
/
Common-Mode Voltage V
Differential Input Resistance R
Differential Input Capacitance C
COM
CLK
CLK
AC-coupled
CLK
2
5k
5pF
Minimum Clock Duty Cycle 45 %
Maximum Clock Duty Cycle 55 %
CLKP/CLKN, DATACLK TIMING (Figure 4) (Note 9)
CLK to DATACLK Delay t
Data Hold Time t
Data Setup Time t
D
DH
DS
DATACLK output mode 1.4 ns
1.65 ns
-0.65 ns
SERIAL-PORT INTERFACE TIMING (Figure 3) (Note 9)
SCLK Frequency f CS Setup Time t
Input Hold Time t
Input Setup Time t
Data Valid Duration t
SCLK
SS
SDH
SDS
SDV
2.5 ns
0ns
4.5 ns
6.5 16.5 ns
10 MHz
POWER SUPPLIES
Digital Supply Voltage DV
Digital I/O Supply Voltage DV
DD1.8
DD3.3
1.71 1.8 1.89 V
3.0 3.3 3.6 V
V
P-P
V
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, modulator off, 2x interpolation, DATACLK output mode, output is
50double-terminated, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C,
unless otherwise noted.) (Note 2)
Note 2: All specifications are 100% tested at T
A
+25°C. Specifications at TA< +25°C are guaranteed by design and characterization.
Note 3: Specification is 100% production tested at T
A
+25°C.
Note 4: 3.84MHz bandwidth, single carrier. Note 5: Excludes data latency. Note 6: Measured single-ended into a 50load. Note 7: Excludes sin(x)/x rolloff. Note 8: Differential voltage swing defined as
I
V
P
I+ I
V
N
I
.
Note 9: Guaranteed by design and characterization. Note 10:Parameter defined as the change in midscale output caused by a ±5% variation in the nominal supply voltage.
V(CLKN)
V(CLKP)
V
P
V
N
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Clock Supply Voltage AV
Analog Supply Voltage
AV
AV
I
AVDD3.3
Analog Supply Current
I
AVDD1.8
Digital Supply Current I
Digital I/O Supply Current I
Clock Supply Current I
DVDD1.8
DVDD3.3
AVCLK
Total Power Dissipation P
Power-Down Current
AV Ratio
Power-Supply Rejection
DD3.3
PSRR
CLK
DD3.3
DD1.8
TOTAL
3.135 3.3 3.465 V
3.135 3.3 3.465
1.71 1.8 1.89
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
f
= 10MHz
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
f
= 10MHz
OUT
AV
DD3.3
AV
DV
DV
AV
DD1.8
DD1.8
DD3.3
CLK
All I/O are static high or low, bit 2 to bit 4 of address 00h are set high
(Note 10) 0.125 %FS/V
A
111 130
27 32
229 250 mA
912mA
2.3 4 mA
831 mW
530
1
26
350
2
V
mA
µA
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
_______________________________________________________________________________________
7
Typical Operating Characteristics
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, DATACLK output mode, external reference, V
REFIO
= +1.25V,
R
LOAD
= 50double-terminated, I
OUTFS
= 20mA, TA= +25°C, unless otherwise noted.)
SFDR vs. OUTPUT FREQUENCY
= 125Mwps, NO INTERPOLATION
f
DATA
120
-0.1dBFS
100
80
60
SFDR (dBc)
40
20
0
060
10 20 30 40 50
OUTPUT FREQUENCY (MHz)
IN-BAND SFDR vs. OUTPUT FREQUENCY
= 125Mwps, 2x INTERPOLATION
f
DATA
90
80
70
60
50
40
SFDR (dBc)
30
20
10
0
62.5 112.5
-6dBFS
-12dBFS
UPPER SIDEBAND MODULATION SPURS MEASURED BETWEEN
62.5MHz AND 125MHz
OUTPUT FREQUENCY (MHz)
-12dBFS
-0.1dBFS
-6dBFS
-0.1dBFS
-0.1dBFS
102.592.582.572.5
IN-BAND SFDR vs. OUTPUT FREQUENCY
= 125Mwps, 2x INTERPOLATION
f
DATA
120
-0.1dBFS
100
MAX5898 toc01
80
60
SFDR (dBc)
40
20
-12dBFS
SPURS MEASURED BETWEEN 0MHz AND 62.5MHz
0
050
OUTPUT FREQUENCY (MHz)
-6dBFS
IN-BAND SFDR vs. OUTPUT FREQUENCY
= 125Mwps, 4x INTERPOLATION
f
DATA
MAX5898 toc04
120
100
SFDR (dBc)
-0.1dBFS
80
60
40
20
SPURS MEASURED BETWEEN 0MHz AND 62.5MHz
0
050
OUTPUT FREQUENCY (MHz)
-6dBFS
-12dBFS
0UT-OF-BAND SFDR vs. OUTPUT FREQUENCY
= 125Mwps, 2x INTERPOLATION
f
DATA
100
90
MAX5898 toc02
80
70
60
50
SFDR (dBc)
40
30
20
SPURS MEASURED BETWEEN
10
62.5MHz AND 125MHz
0
40302010
050
-6dBFS
-0.1dBFS
OUTPUT FREQUENCY (MHz)
OUT-OF-BAND SFDR vs. OUTPUT FREQUENCY
= 125Mwps, 4x INTERPOLATION
f
DATA
90
80
MAX5898 toc05
70
60
50
-12dBFS
40
SFDR (dBc)
30
20
SPURS MEASURED BETWEEN
10
62.5MHz AND 250MHz
0
40302010
050
OUTPUT FREQUENCY (MHz)
-0.1dBFS
-6dBFS
-12dBFS
MAX5898 toc03
40302010
MAX5898 toc06
40302010
IN-BAND SFDR vs. OUTPUT FREQUENCY
= 125Mwps, 4x INTERPOLATION
f
DATA
100
90
80
-6dBFS
70
60
50
SFDR (dBc)
40
30
20
LOWER SIDEBAND MODULATION SPURS MEASURED BETWEEN
10
62.5MHz AND 125MHz
0
70 120
OUTPUT FREQUENCY (MHz)
-0.1dBFS
-12dBFS
IN-BAND SFDR vs. OUTPUT FREQUENCY
= 125Mwps, 4x INTERPOLATION
f
DATA
100
-0.1dBFS
90
MAX5898 toc07
80
70
60
50
SFDR (dBc)
40
30
20
LOWER SIDEBAND MODULATION SPURS MEASURED BETWEEN
10
125MHz AND 187.5MHz
0
1101009080
70 120
-12dBFS
MAX5898 toc08
-6dBFS
1101009080
OUTPUT FREQUENCY (MHz)
TWO-TONE IMD vs. OUTPUT FREQUENCY
= 125Mwps, NO INTERPOLATION
f
DATA
0
1MHz CARRIER SPACING
-20
-40
-60
-80
TWO-TONE IMD (dBc)
-100
-120
-12dBFS
-9dBFS
10 40
15 20 25 30 35
CENTER FREQUENCY (MHz)
MAX5898 toc09
-6dBFS
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
8 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, DATACLK output mode, external reference, V
REFIO
= +1.25V,
R
LOAD
= 50double-terminated, I
OUTFS
= 20mA, TA= +25°C, unless otherwise noted.)
TWO-TONE IMD vs. OUTPUT FREQUENCY
= 125Mwps, 2x INTERPOLATION
f
DATA
0
1MHz CARRIER SPACING COMPLEX MODULATION FOR
-20
OUTPUT FREQUENCIES GREATER THAN 50MHz
-40
-60
-12dBFS
-80
TWO-TONE IMD (dBc)
-100
-6dBFS
-120 10 100
25 40 55 70 85
CENTER FREQUENCY (MHz)
-6dBFS
-9dBFS
TWO-TONE IMD vs. OUTPUT FREQUENCY
= 125Mwps, 4x INTERPOLATION
f
DATA
0
1MHz CARRIER SPACING COMPLEX MODULATION FOR
-20
MAX5898 toc10
OUTPUT FREQUENCIES GREATER THAN 50MHz
-40
-60
-12dBFS
-80
TWO-TONE IMD (dBc)
-100
-6dBFS
-120 10 160
35 60 85 110 135
-9dBFS
CENTER FREQUENCY (MHz)
-6dBFS
-12dBFS
0.100
MAX5898 toc11
0.075
0.050
GAIN MISMATCH (dB)
0.025
CHANNEL-TO-CHANNEL
GAIN MISMATCH vs. TEMPERATURE
= 125Mwps, 2x INTERPOLATION
f
DATA
f
= 22.7MHz
OUT
= -6dBFS
A
OUT
0
-40 85 TEMPERATURE (°C)
MAX5898 toc12
603510-15
EIGHT-TONE POWER RATIO PLOT
= 125Mwps, 2x INTERPOLATION
f
DATA
-20
-30
-40
-50
-60
-70
-80
-90
OUTPUT POWER (dBm)
-100
-110
-120 f
= 35.7MHz, 1MHz TONE SPACING
CENTER
SPAN = 12.5MHz, A
THROUGH A
OUT1
SUPPLY CURRENT vs. DAC UPDATE RATE
2x INTERPOLATION, f
500
450
400
350
300
250
200
150
SUPPLY CURRENT (mA)
100
50
0
100 300
f
DAC
OUT
1.8V TOTAL
3.3V TOTAL
(MHz)
= -18dBFS
OUT8
= 5MHz
250200150
3.0
2.5
MAX5898 toc13
2.0
1.5
1.0
DNL (LSB)
0.5
0
-0.5
-1.0
500
450
MAX5898 toc16
400
350
300
250
200
150
SUPPLY CURRENT (mA)
100
50
0
DIFFERENTIAL NONLINEARITY
vs. DIGITAL INPUT CODE
0 65,536
DIGITAL INPUT CODE
49,15232,76816,384
SUPPLY CURRENT vs. DAC UPDATE RATE
(MHz)
OUT
= 5MHz
400300200
4x INTERPOLATION, f
1.8V TOTAL
3.3V TOTAL
100 500
f
DAC
5.0
4.0
MAX5898 toc14
3.0
2.0
1.0
INL (LSB)
-1.0
-2.0
-3.0
-4.0
-5.0
500
450
MAX5898 toc17
400
350
300
250
200
150
SUPPLY CURRENT (mA)
100
50
INTEGRAL NONLINEARITY
vs. DIGITAL INPUT CODE
0
0 65,536
DIGITAL INPUT CODE
49,15232,76816,384
SUPPLY CURRENT vs. DAC UPDATE RATE
(MHz)
OUT
= 5MHz
400300200
8x INTERPOLATION, f
1.8V TOTAL
3.3V TOTAL
0
100 500
f
DAC
MAX5898 toc15
MAX5898 toc18
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
_______________________________________________________________________________________
9
Typical Operating Characteristics (continued)
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, DATACLK output mode, external reference, V
REFIO
= +1.25V,
R
LOAD
= 50double-terminated, I
OUTFS
= 20mA, TA= +25°C, unless otherwise noted.)
NOISE DENSITY vs. DAC UPDATE RATE
= 16MHz, A
f
OUT
-100
-110
-120
-130
4x INTERPOLATION
-140
-150
NOISE DENSITY (dBFS/Hz)
-160
2x INTERPOLATION
-170
-180
100 200 300 400 500
= -12dBFS, 10MHz OFFSET
OUT
8x INTERPOLATION
f
(MHz)
DAC
WCDMA ACLR SPECTRAL PLOT
= 61.44Mwps, 8x INTERPOLATION
f
DATA
-20
-30
-40
-50
-60
-70
-80
-90
OUTPUT POWER (dBm)
-100
-110
-120
ACLR2 = 78dB
ACLR1 = 77dB
f
CENTER
SPAN = 25.5MHz
= 61.44MHz
ACLR1 = 76dB
CARRIER = -11dBm
ACLR2 = 77dB
WCDMA ACLR vs. OUTPUT FREQUENCY
= 122.88Mwps, 4x INTERPOLATION
f
DATA
100
ONE-CARRIER ALTERNATE CHANNEL
90
MAX5898 toc19
80
70
ACLR (dB)
FOUR-CARRIER
60
ALTERNATE CHANNEL
50
40
0 30.72 61.44 92.16 122.88 153.60
ONE-CARRIER ADJACENT CHANNEL
FOUR-CARRIER ADJACENT CHANNEL
f
(MHz)
CENTER
FOUR-CARRIER WCDMA ACLR SPECTRAL PLOT
= 61.44Mwps, 8x INTERPOLATION
f
DATA
-20
-30
MAX5898 toc22
-40
-50
-60
-70
-80
-90
OUTPUT POWER (dBm)
-100
-110
-120
ACLR2 = 74dB
ACLR1 = 72dB
f
CENTER
CARRIER = -17dBm
= 61.44MHz
SPAN = 40.6MHz
MAX5898 toc20
MAX5898 toc23
ACLR2 = 71dB
ACLR1 = 71dB
WCDMA ACLR vs. OUTPUT FREQUENCY
= 76.8Mwps, 4x INTERPOLATION
f
DATA
100
ONE-CARRIER ALTERNATE CHANNEL
90
80
70
ACLR (dB)
FOUR-CARRIER
60
ALTERNATE CHANNEL
50
40
0 15.36 30.72 46.08 61.44 76.80 92.16 107.50
ONE-CARRIER ADJACENT CHANNEL
FOUR-CARRIER ADJACENT CHANNEL
f
(MHz)
CENTER
WCDMA ACLR SPECTRAL PLOT = 122.88Mwps, 4x INTERPOLATION
f
DATA
-20
-30
-40
-50
-60
-70
-80
-90
OUTPUT POWER (dBm)
-100
-110
-120
ACLR2 = 70dB
ACLR1 = 68dB
f
CENTER
SPAN = 25.5MHz
CARRIER = -12dBm
= 122.88MHz
ACLR2 = 70dB
ACLR1 = 68dB
MAX5898 toc21
MAX5898 toc24
FOUR-CARRIER WCDMA ACLR SPECTRAL PLOT
= 122.88Mwps, 4x INTERPOLATION
f
DATA
-20
-30
-40
-50
-60
-70
-80
-90
OUTPUT POWER (dBm)
-100
-110
-120
ACLR2 = 65dB
ACLR1 = 64dB
CARRIER = -20dBm
f
= 122.88MHz
CENTER
SPAN = 40.6MHz
MAX5898 toc25
ACLR2 = 63dB
ACLR1 = 63dB
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
10 ______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1 CLKP Noninverting Differential Clock Input. Internally biased to AV
2 CLKN Inverting Differential Clock Input. Internally biased to AV
3 N.C. Internally Connected. Do not connect. 4 DATACLKP LVDS Data Clock Input/Output. External 100 termination to DATACLKN required. 5 DATACLKN Complementary LVDS Data Clock Input/Output. External 100 termination to DATACLKP required.
6, 21, 30, 37 DV
7 SELIQN
DD1.8
Digital Power Supply. Accepts a 1.71V to 1.89V supply range. Bypass each pin to ground with a
0.1µF capacitor as close to the pin as possible.
Complementary LVDS Channel Select Input. Set SELIQN low and SELIQP high to direct data to the channel. Set SELIQP low and SELIQN high to direct data to the channel. Internal 110 termination to SELIQP.
CLK
CLK
/ 2.
/ 2.
8 SELIQP
9 D15N Complementary LVDS Data Bit 15 (MSB). Internal 110 termination to D15P. 10 D15P LVDS Data Bit 15 (MSB). Internal 110Ω termination to D15N. 11 D14N Complementary LVDS Data Bit 14. Internal 110 termination to D14P. 12 D14P LVDS Data Bit 14. Internal 110 termination to D14N. 13 D13N Complementary LVDS Data Bit 13. Internal 110 termination to D13P. 14 D13P LVDS Data Bit 13. Internal 110 termination to D13N. 15 D12N Complementary LVDS Data Bit 12. Internal 110 termination to D12P. 16 D12P LVDS Data Bit 12. Internal 110 termination to D12N. 17 D11N Complementary LVDS Data Bit 11. Internal 110 termination to D11P. 18 D11P LVDS Data Bit 11. Internal 110 termination to D11N. 19 D10N Complementary LVDS Data Bit 10. Internal 110 termination to D10P. 20 D10P LVDS Data Bit 10. Internal 110 termination to D10N. 22 D9N Complementary LVDS Data Bit 9. Internal 110 termination to D9P. 23 D9P LVDS Data Bit 9. Internal 110 termination to D9N. 24 D8N Complementary LVDS Data Bit 8. Internal 110 termination to D8P. 25 D8P LVDS Data Bit 8. Internal 110 termination to D8N. 26 D7N Complementary LVDS Data Bit 7. Internal 110 termination to D7P. 27 D7P LVDS Data Bit 7. Internal 110 termination to D7N. 28 D6N Complementary LVDS Data Bit 6. Internal 110 termination to D6P. 29 D6P LVDS Data Bit 6. Internal 110 termination to D6N. 31 D5N Complementary LVDS Data Bit 5. Internal 110 termination to D5P. 32 D5P LVDS Data Bit 5. Internal 110 termination to D5N. 33 D4N Complementary LVDS Data Bit 4. Internal 110 termination to D4P. 34 D4P LVDS Data Bit 4. Internal 110 termination to D4N.
LVDS Channel Select Input. Set SELIQN low and SELIQP high to direct data to the channel. Set SELIQP low and SELIQN high to direct data to the channel. Internal 110 termination to SELIQN.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 11
Pin Description (continued)
PIN NAME FUNCTION
35 D3N Complementary LVDS Data Bit 3. Internal 110 termination to D3P. 36 D3P LVDS Data Bit 3. Internal 110 termination to D3N. 38 D2N Complementary LVDS Data Bit 2. Internal 110 termination to D2P. 39 D2P LVDS Data Bit 2. Internal 110 termination to D2N. 40 D1N Complementary LVDS Data Bit 1. Internal 110 termination to D1P. 41 D1P LVDS Data Bit 1. Internal 110 termination to D1N. 42 D0N Complementary LVDS Data Bit 0 (LSB). Internal 110Ω termination to D0P. 43 D0P LVDS Data Bit 0 (LSB). Internal 110 termination to D0N.
44 DV
45 DOUT Serial-Port Data Output
46 DIN Serial-Port Data Input
47 SCLK Serial-Port Clock Input. Data on DIN is latched on the rising edge of SCLK. 48 CS Serial-Port Interface Select. Drive CS low to enable serial-port interface. 49 RESET Reset Input. Hold RESET low during power-up.
50 REFIO Reference Input/Output. Bypass to ground with a 1µF capacitor as close to the pin as possible.
51 DACREF
52 FSADJ
53, 67 AV
54, 56, 59, 61,
64, 66
55, 60, 65 AV
57 OUTQN Inverting Differential DAC Current Output for Q Channel
58 OUTQP Noninverting Differential DAC Current Output for Q Channel
62 OUTIN Inverting Differential DAC Current Output for I Channel
63 OUTIP Noninverting Differential DAC Current Output for I Channel
68 AV
EP Exposed Paddle. Must be connected to GND through a low-impedance path.
DD3.3
DD1.8
GND Ground
DD3.3
CLK
I/O Power Supply. Accepts a 3.0V to 3.6V supply range. Bypass with a 0.1µF capacitor as close to the pin as possible.
C ur r ent- S et Resi stor Retur n P ath. For a 20m A ful l - scal e outp ut cur r ent, use a 1.25V exter nal r efer ence and connect a 2kΩ r esi stor b etw een FS AD J and D AC RE F. Inter nal l y connected to GN D . D O NO T U SE
A S AN EXT ER N A L GR O U N D C O N N EC T IO N .
Full-Scale Adjust Input. For a 20m A ful l - scal e outp ut cur r ent, use a 1.25V exter nal r efer ence and connect a 2kΩ r esi stor b etw een FS AD J and D AC RE F.
Low Analog Power Supply. Accepts a 1.71V to 1.89V supply range. Bypass each pin to GND with a 0.1µF capacitor as close to the pin as possible.
Analog Power Supply. Accepts a 3.135V to 3.465V supply range. Bypass each pin to GND with a
0.1µF capacitor as close to the pin as possible.
Clock Power Supply. Accepts a 3.135V to 3.465V supply range. Bypass to ground with a 0.1µF capacitor as close to the pin as possible.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
12 ______________________________________________________________________________________
Detailed Description
The MAX5898 dual, 500Msps, high-speed, 16-bit, cur­rent-output DAC provides superior performance in com­munication systems requiring low-distortion analog-signal reconstruction. The MAX5898 combines two DAC cores with 8x/4x/2x programmable digital interpolation filters, a digital quadrature modulator, an SPI-compatible serial interface for programming the device, and an on-chip
1.2V reference. Individual DAC channel gain and offset adjustments are available to compensate for downstream signal-path imbalances. The full-scale output current range is adjustable from 2mA to 20mA to optimize power dissipation and gain control.
Each channel contains three selectable interpolating fil­ters making the MAX5898 capable of 2x, 4x, 8x, or no interpolation, which allows for low input data rates and high DAC update rates. When operating in 8x interpola­tion mode, the interpolator increases the DAC conversion
rate by a factor of eight, providing an eight-fold increase in separation between the reconstructed waveform spec­trum and its first image. The MAX5898 accepts either two’s complement or offset binary input data format on a single interleaved LVDS input bus.
The MAX5898 includes modulation modes at fIM/ 2 and fIM/ 4, where fIMis the data rate at the input of the mod­ulator. If 2x interpolation is used, this data rate is 2x the input data rate. If 4x or 8x interpolation is used, this data rate is 4x the input data rate. Table 1 summarizes the modulator operating data rates.
The power-down modes can be used to turn off each DAC’s output current or the entire digital section. Programming both DACs into power-down simultane­ously powers down the digital interpolation filters. Note that the SPI section is always active.
The analog and digital sections of the MAX5898 have separate power-supply inputs (AV
DD3.3
, AV
DD1.8
,
Functional Diagram
D0–D15
DATACLK
SELIQ
RESET
DATA SYNCH
AND DEMUX
MODULATOR
INTERPOLATING
FILTER
2x
INTERPOLATING
FILTER
2x
MUX
CONTROL REGISTERS
SERIAL INTERFACE
DOUT DIN CS SCLK DACREF FSADJ REFIO
FILTER
FILTER
MUX
INTERPOLATING
INTERPOLATING
2x
MUX
I
Q
f
/ 2, f
/ 4
IM
IM
I
MUX
2x
/2/2
Q
REFERENCE
DIGITAL
INTERPOLATING
FILTER
MUX
2x
MAX5898
INTERPOLATING
MUX
MUX
FILTER
2x
CLOCK BUFFERS
AND DIVIDERS
OFFSET
ADJUST
MUX
DIGITAL
OFFSET
ADJUST
MUX
MUX
/2/2
f
CLK
CLKPCLKN
IDAC
QDAC
DIGITAL GAIN ADJUST
OUTIP
OUTIN
f
DAC
DIGITAL GAIN ADJUST
OUTQP
OUTQN
f
DAC
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 13
AV
CLK
, DV
DD3.3
, and DV
DD1.8
), which minimize noise
coupling from one supply to the other. AV
DD1.8
and
DV
DD1.8
operate from a typical 1.8V supply, and all
other supply inputs operate from a typical 3.3V supply.
Serial Interface
The SPI-compatible serial interface programs the MAX5898 registers. The serial interface consists of CS, DIN, SCLK, and DOUT. Data is shifted into DIN on the rising edge of SCLK when CS is low. When CS is high, data presented at DIN is ignored and DOUT is in high­impedance mode. Note: CS must transition high after each read/write operation. DOUT is the serial data output for reading registers to facilitate easy debugging during development. DIN and DOUT can be connected together to form a 3-wire serial interface bus or remain separate and form a 4-wire SPI bus.
The serial interface supports two-byte transfer in a communication cycle. The first byte is a control byte written to the MAX5898 only. The second byte is a data byte and can be written to or read from the MAX5898. When writing to the MAX5898, data is shifted into DIN; data is shifted out of DOUT in a read operation. Bits 0 to 3 of the control byte are the address bits. These bits set the address of the register to be written to or read from. Bits 4 to 6 of the control byte must always be set to 0. Bit 7 is a read/write bit: 0 for write operation and 1 for read operation. The most significant bit (MSB) is shifted in first in default mode. If the serial port is set to LSB-first mode, both the control byte and data byte are shifted LSB first. Figures 1 and 2 show the SPI serial-interface opera­tion in the default write and read mode, respectively. Figure 3 is a timing diagram for the SPI serial interface.
Table 1. Quadrature Modulator Operating Data Rates (fIMis the Data Rate at the Input of the Modulator)
Figure 1. SPI Serial-Interface Write Cycle, MSB-First Mode
INTERPOLATION RATE MODULATION MODE (fLO)
1x
2x
4x
8x
fIM / 2 f
f
/ 4 f
IM
fIM / 2 f
f
/ 4 f
IM
fIM / 2 f
/ 4 f
f
IM
fIM / 2 f
/ 4 f
f
IM
MODULATION FREQUENCY
RELATIVE TO f
DAC
DAC
DAC
DAC
DAC
DAC
DAC
DAC
DAC
/ 2 f
/ 4 f
/ 2 f
/ 4 f
/ 2 2 x f
/ 4 f
/ 4 2 x f
/ 8 f
MODULATION FREQUENCY
RELATIVE TO f
DATA
DATA
DATA
DATA
/ 2
/ 4
DATA
/ 2
DATA
DATA
DATA
DATA
CS
SCLK
DIN
DOUT
0 0 0 0 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
HIGH IMPEDANCE
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
14 ______________________________________________________________________________________
Figure 2. SPI Serial-Interface Read Cycle, MSB-First Mode
Figure 3. SPI Serial-Interface Timing Diagram
CS
SCLK
DIN
DOUT
READ CYCLE N - 1
ADDRESS DATA
10003210
HIGH
IMPEDANCE
IGNORED
DATA N - 2
t
SS
CS
SCLK
t
SDS
DIN
READ CYCLE N
ADDRESS DATA
10003210
HIGH
IMPEDANCE
t
SDH
IGNORED
DATA N - 1
READ CYCLE N + 1
ADDRESS DATA
10003210
HIGH
IMPEDANCE
IGNORED
DATA N
t
SDV
DOUT
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 15
Programming Registers
Programming its registers with the SPI serial interface sets the MAX5898 operation modes. Table 2 shows all
of the registers. The following are descriptions of each register.
Table 2. MAX5898 Programmable Registers
Conditions in bold are power-up defaults.
ADD BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
00h Unused
Interpolation Rate (Bit 7, Bit 6) 00 = No interpolation
01h
01 = 2x interpolation 10 = 4x interpolation
11 = 8x interpolation
0 = Two’s­complement input data
02h
1 = Offset binary input data
03h Unused
04h 8-Bit IDAC Fine-Gain Adjustment (see the Gain Adjustment section). Bit 7 is MSB and bit 0 is LSB. Default: 00h
05h Unused
10-Bit IDAC Offset Adjustment (see the Offset Adjustment section). Bits 7 to 0 of the 06h register are the MSB bits. Bit 1 and bit 0 are the LSB
06h
bits in the 07h register. Default: 000h
IDAC IOFFSET Direction
0 = Current on
07h
OUTIN
1 = Current on OUTIP
08h 8-Bit QDAC Fine-Gain Adjustment (see the Gain Adjustment section). Bit 7 is MSB and bit 0 is LSB. Default: 00h
09h Unused
10-Bit QDAC Offset Adjustment (see the Offset Adjustment section). Bits 7 to 0 of the 0Ah register are the MSB bits. Bit 1 and bit 0 are the
0Ah
LSB bits in the 0Bh register. Default: 000h
QDAC IOFFSET Direction
0 = Current on
0Bh
OUTQN
1 = Current on OUTQP
0Ch Reserved, do not write to these bits.
0Dh Reserved, do not write to these bits.
0Eh Reserved, do not write to these bits.
0 = MSB first
1 = LSB first
Unused Unused
Unused
Unused
Software Reset
0 = Normal
1 = Reset all registers
Third Interpolation Filter Configuration
0 = Lowpass
1 = Highpass
Interpolator Power-Down
0 = Normal
1 = Power-down
Modulation Mode (Bit 4, Bit 3) 00 = Modulation off 01 = f
/ 2
IM
/ 4
10 = f
IM
11 = f
/ 4
IM
0 = Input data latched on rising clock edge
1 = Input data latched on falling clock edge
IDAC Power­Down
0 = Normal
1 = Power-down
0 = Data clock output disabled
1 = Data clock output enabled
4-Bit IDAC Coarse-Gain Adjustment (see the Gain Adjustment section). Bit 3 is MSB and bit 0 is LSB. Default: Fh
4-Bit QDAC Coarse-Gain Adjustment (see the Gain Adjustment section). Bit 3 is MSB and bit 0 is LSB. Default: Fh
QDAC Power­Down
0 = Normal
1 = Power-down
Mixer Modulation Mode 0 = Complex
1 = Real
Data Synchronizer Disable
0 = Enabled
1 = Disabled
Unused
Modulation Sign
-jω
0 = e
+jω
1 = e
Unused
IDAC Offset Adjustment Bit 1 (see the 06h register)
QDAC Offset Adjustment Bit 1 (see the 0Ah register)
Unused
IDAC Offset Adjustment Bit 0 (see the 06h register)
QDAC Offset Adjustment Bit 0 (see the 0Ah register)
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
16 ______________________________________________________________________________________
Address 00h
Bit 6 Logic 0 (default) causes the serial port to use
MSB first address/data format. When set to a logic 1, the serial port uses LSB first address/ data format.
Bit 5 When set to a logic 1 (default = 0), all registers
reset to their default state (this bit included).
Bit 4 Logic 1 (default = 0) stops the clock to the
digital interpolators. DAC outputs hold last value prior to interpolator power-down.
Bit 3 IDAC power-down mode. A logic 1 (default = 0)
to this bit shuts down the output current from the IDAC.
Bit 2 QDAC power-down mode. A logic 1 (default = 0)
to this bit shuts down the output current from the QDAC.
Note: If both bit 2 and bit 3 are 1, the MAX5898 is in full-power-down mode, leaving only the serial interface active.
Address 01h
Bits 7, 6 Configure the interpolation filters according
to the following:
00 1x (no interpolation)
01 2x
10 4x
11 8x (default)
Bit 5 Logic 0 configures FIR3 as a lowpass digital
filter (default). A logic 1 configures FIR3 as a highpass digital filter.
Bits 4, 3 Configure the modulation frequency accord-
ing to the following:
00 No modulation
01 fIM/ 2 modulation
10 fIM/ 4 modulation (default)
11 fIM/ 4 modulation
where fIMis the data rate at the input of the modulator.
Bit 2 Configures the modulation mode for either
real or complex (image reject) modulation. Logic 1 sets the modulator to the real mode (default). Complex modulation is only avail­able for f
IM
/ 4 modulation.
Bit 1 Quadrature modulator sign inversion. With I-
channel data leading Q-channel data by 90°, logic 0 sets the complex modulation to be e
-jw
(default), cancelling the upper image. A logic 1 sets the complex modulation to be e
+jw
, cancelling the lower image.
Address 02h
Bit 7 Logic 0 (default) configures the data port for
two’s complement. A logic 1 configures the data ports for offset binary.
Bit 4 Logic 0 (default) sets the internal latches to
latch the data on the rising edge of DATACLK. A logic 1 sets the internal latches to latch the data on the falling edge of DATACLK.
Bit 3 Logic 0 (default) configures the DATACLK
pin (pin 4 or pin 5) to be an input. A logic 1 configures the DATACLK pin to be an output.
Bit 2 Logic 0 (default) enables the data synchro-
nizer circuitry. A logic 1 disables the data synchronizer circuitry.
Address 04h
Bits 7–0 These 8 bits define the binary number for
fine-gain adjustment of the IDAC full-scale current (see the
Gain Adjustment
section). Bit
7 is the MSB. Default is all zeros.
Address 05h
Bits 3–0 These four bits define the binary number for
the coarse-gain adjustment of the IDAC full­scale current (see the
Gain Adjustment
sec-
tion). Bit 3 is the MSB. Default is all ones.
Address 06h, Bits 7–0; Address 07h, Bit 1 and Bit 0
These 10 bits represent a binary number that defines the magnitude of the offset added to the IDAC output (see the
Offset Adjustment
section). Default is all zeros.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 17
Address 07h
Bit 7 Logic 0 (default) adds the 10 bits offset cur-
rent to OUTIN. A logic 1 adds the 10 bits off­set current to OUTIP.
Address 08h
Bits 7–0 These 8 bits define the binary number for
fine-gain adjustment of the QDAC full-scale current (see the
Gain Adjustment
section). Bit
7 is the MSB. Default is all zeros.
Address 09h
Bits 3–0 These four bits define the binary number for
the coarse-gain adjustment of the QDAC full­scale current (see the
Gain Adjustment
sec-
tion). Bit 3 is the MSB. Default is all ones.
Address 0Ah, Bits 7–0; Address 0Bh, Bit 1 and Bit 0
These 10 bits represent a binary number that defines the magnitude of the offset added to the QDAC output (see the
Offset Adjustment
section). Default is all zeros.
Address 0Bh
Bit 7 Logic 0 (default) adds the 10 bits offset to
OUTQN. A logic 1 adds the 10 bits offset to OUTQP.
Offset Adjustment
Offset adjustment is achieved by adding a digital code to the DAC inputs. The code OFFSET (see equation below), as stored in the relevant control registers, has a range from 0 to 1023 and a sign bit. The applied DAC offset is four times the code stored in the register, providing an offset adjustment range of ±4092 LSB codes. The resolu­tion is 4 LSB.
Gain Trim
Gain adjustment is peformed by varying the full-scale current according to the following formula:
where I
REF
is the reference current (see the
Reference
Input/Output
section). COARSE is the register content of registers 05h and 09h for the I and Q channel, respectively. FINE is the register content of register 04h and 08h for the I and Q channel, respectively. The range of COARSE is from 0 to 15, with 15 being the
default. The range for FINE is from 0 to 255 with 0 being the default. The gain can be adjusted in steps of approximately 0.01dB.
Data Input Port
The MAX5898 captures input data on a single LVDS port (D15P/N–D0P/N). The channel for the input data is determined through the state of SELIQP/SELIQN. When SELIQP is set to logic-high and SELIQN is set to logic­low the input data is presented to the I channel. Setting SELIQP to logic-low and SELIQN to logic-high presents the input data to the Q channel.
The MAX5898 control registers can be programmed to allow either signed or unsigned binary format (bit 7, address 02h) data. Table 3 shows the corresponding DAC output levels when using signed or unsigned data modes.
Data Synchronization Modes
Data synchronization circuitry is provided to allow oper­ation with an input data clock. The data clock must be frequency locked to the DAC clock (f
DAC
), but can have arbitrary phase with respect to the DAC clock. The synchronization circuitry allows for phase jitter on the input data clock of up to ±1 data clock cycles. Synchronization is initially established when the reset pin is asynchronously deasserted and the input data clock has been running for at least four clock cycles. Subsequently, the MAX5898 monitors the phase rela­tionship and detects if the phase drifts more than ±1 data clock cycle. If this occurs, the synchronizer auto­matically re-establishes synchronization. However, dur­ing the resynchronization phase, up to 8 data words may be lost or repeated.
Bit 2 of register 02h disables or enables (default) the automatic data clock phase detection. Disabling the data synchronization circuitry requires the data clock and the DAC clock phase to be locked.
Table 3. DAC Output Code Table
I
OFFSET OUTFS
=
××4
16
2
I
OFFSET
⎡ ⎢ ⎣
I
OUTFS
I
×
3
⎛ ⎜
COARSE
REF REF
4
16
+
1
⎞ ⎟
3
⎜ ⎝
×
I
32 256
⎞ ⎟
FINE
⎛ ⎜
1024
=
24
⎞ ⎟
D IG IT A L IN PU T C O D E
O F F SET B IN A R Y
( U N SI G N ED )
0000 0000 0000 0000 1000 0000 0000 0000 0 I
0111 1111 1111 1111 0000 0000 0000 0000
1111 1111 1111 1111 0111 1111 1111 1111 I
T WO ' S
C O M PL EM EN T
( SI G N ED )
O U T _ PO U T _ N
OU T FS
I
/2I
OU T FS
OU T FS
OU T FS
2
0
/
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
18 ______________________________________________________________________________________
DATACLK Modes
The MAX5898 employs a differential LVDS DATACLK located at pins 4 and 5. The DATACLK can be config­ured as either an input or as an output (bit 3, address 02h). If DATACLK is configured as an output, it is fre­quency-divided from the CLKP/CLKN input, depending on the operating mode, see Table 4.
The MAX5898 can be configured to latch the input data on either the rising edge or falling edge of the DATACLK signal (bit 4, address 02h). Figure 4 shows the timing requirements between the DATACLK signal and the input data bus with latching on the rising edge.
Table 4. Clock Frequency Ratios in Various Modes
Figure 4. Data-Input Timing Diagram
t
D
t
DS
CLKP–CLKN
DATACLKP–DATACLKN
SELIQ
D0–D15
t
DH
INTERPOLATION
RATE
1x 1:1 1:2
2x 1:1 1:1
4x 1:2 1:1
8x 1:4 1:1
f
DATA:fCLK
f
DAC:fCLK
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 19
Interpolating Filter
The MAX5898 features three cascaded FIR half-band filters. The interpolating filters are enabled or disabled in combinations to support 1x (no interpolation), 2x, 4x, or 8x interpolation. Bits 7 and 6 of register 01h set the interpolation rate (see Table 2). The last interpolation fil-
ter is located after the modulator. In the 8x interpolation mode, the last filter (FIR3) can be configured as low­pass or highpass (bit 5, address 01h) to select the lower or upper sideband from the modulation output. The frequency responses of these three filters are plot­ted in Figures 5–8.
Figure 5. Interpolation Filter Frequency Response, 2x Interpolation Mode
Figure 6. Interpolation Filter Frequency Response, 4x Interpolation Mode
Figure 7. Interpolation Filter Frequency Response, 8x Interpolation Mode (FIR3 Lowpass Mode)
0
0234
f
OUT
- NORMALIZED TO INPUT DATA RATE
5678
-20
-40
-60
-80
-100
GAIN (dBFS)
-120 1
0
0.1
0.2
0.3
0.4
-0.0004
-0.0002
0
PASSBAND DETAIL
Figure 8. Interpolation Filter Frequency Response, 8x Interpolation Mode (FIR3 Highpass Mode)
0
-20
-40
-60
-0.0002
-0.0004
GAIN (dBFS)
-80
-100
-120
0.2
0 0.4 0.6 0.8
f
- NORMALIZED TO INPUT DATA RATE
OUT
PASSBAND DETAIL
0
0.3
0.2
0.1
0
1.0 1.2 1.4 1.6 1.8 2.0
0.4
0
-20
-40
-60
-0.0002
-0.0004
GAIN (dBFS)
-80
-100
-120
0.5
0 1.0 1.5 2.0
- NORMALIZED TO INPUT DATA RATE
f
OUT
PASSBAND DETAIL
0
0.4
0.3
0
0.2
0.1
2.5 3.0 3.5 4.0
0
-20
-40
-60
GAIN (dBFS)
-0.0002
-0.0004
PASSBAND DETAIL
0
3.6 3.8 4.0 4.2 4.4
-80
-100
-120 1
0234
f
- NORMALIZED TO INPUT DATA RATE
OUT
5678
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
20 ______________________________________________________________________________________
The programmable interpolation filters multiply the MAX5898 input data rate by a factor of 2x, 4x, or 8x to separate the reconstructed waveform spectrum and the DAC image. The original spectral images, appearing at around multiples of the input data rate, are attenuated by the internal digital filters. This feature provides three benefits:
1) Image separation reduces complexity of analog reconstruction filters.
2) Lower input data rates eliminate board-level high­speed data transmission.
3) Sin(x)/x rolloff is reduced over the effective bandwidth.
Figure 9 illustrates a practical example of the benefits when using the MAX5898 in 2x, 4x, and 8x interpolation modes with the third filter configured as a lowpass filter. With no interpolation filter, the first image signal appears in the second Nyquist zone between fS/ 2 and fS. The first interpolating filter removes this image. In fact, all of the
Figure 9. Spectral Representation of Interpolating Filter Responses (Output Frequencies are Relative to the Data Input Frequency, fS)
FILTER
IMAGE
IMAGE
RESPONSE
3f
S
3f
S
3f
S
INPUT SPECTRUM AND FIRST FILTER RESPONSE
OUTPUT SPECTRUM OF THE FIRST FILTER
INPUT SPECTRUM AND SECOND FILTER RESPONSE
SIGNAL
SIGNAL
SIGNAL
IMAGE
f
S
f
S
f
S
2f
S
2f
S
2f
S
NO INTERPOLATION
4f
S
4f
S
4f
S
5f
S
5f
S
5f
S
FILTER RESPONSE
6f
S
6f
S
6f
S
7f
S
7f
S
7f
S
8f
S
2x INTERPOLATION
8f
S
8f
S
OUTPUT SPECTRUM OF THE SECOND FILTER
INPUT SPECTRUM AND THIRD FILTER RESPONSE
OUTPUT SPECTRUM OF THE THIRD FILTER
SIGNAL
SIGNAL
SIGNAL
IMAGE
f
S
f
S
f
S
2f
S
2f
S
2f
S
FILTER RESPONSE
3f
S
3f
S
3f
S
4f
S
4f
S
4f
S
IMAGE
5f
S
5f
S
5f
S
6f
S
6f
S
6f
S
7f
S
7f
S
IMAGE
7f
S
4x INTERPOLATION
8f
S
8f
S
8x INTERPOLATION
8f
S
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 21
images at odd numbers of fSare filtered. At the output of the first filter, the images are at 2fS, 4fS, etc. This signal is then passed to the second interpolating filter, which is similar to the first filter and removes the images at 2fS, 6fS,
10fS, etc. Finally, the third filter removes images at 4fS, 12fS, 20fS, etc. Figures 10, 11, and 12 similarly illustrate the spectral responses when using the interpolating filters combined with the digital modulator.
Figure 10. Spectral Representation of 4x Interpolation Filter with fIM/ 4 Modulation (Output Frequencies are Relative to the Data Input Frequency, f
S
)
INPUT SPECTRUM AND FIRST FILTER RESPONSE
OUTPUT SPECTRUM OF THE FIRST FILTER
INPUT SPECTRUM AND SECOND FILTER RESPONSE
SIGNAL
SIGNAL
SIGNAL
f
f
f
IMAGE
S
S
FILTER RESPONSE
S
FILTER
RESPONSE
2f
S
IMAGE
2f
S
IMAGE
2f
S
3f
S
3f
S
3f
S
NO INTERPOLATION
4f
S
2x INTERPOLATION
4f
S
4f
S
OUTPUT SPECTRUM OF THE SECOND FILTER
OUTPUT SPECTRUM OF THE MODULATOR
SIGNAL
f
S
SIGNAL
LOWER
SIDEBAND
FOR COMPLEX MODULATION THE MODULATION SIGN (BIT 1, ADDRESS 01h) SELECTS UPPER OR LOWER SIDEBAND
UPPER SIDEBAND
f
S
2f
S
2f
S
3f
S
IMAGE
3f
S
IMAGE
4x INTERPOLATION
4f
S
4f
S
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
22 ______________________________________________________________________________________
Figure 11. Spectral Representation of 8x Interpolation Filter with fIM/ 4 Modulation and Lowpass Mode Enabled (Output Frequencies are Relative to the Data Input Frequency, f
S
)
INPUT
SIGNAL
SPECTRUM AND FIRST FILTER RESPONSE
OUTPUT SPECTRUM OF THE FIRST FILTER
INPUT SPECTRUM
SIGNAL
AND SECOND FILTER RESPONSE
OUTPUT
SIGNAL
SPECTRUM OF THE SECOND FILTER
SIGNAL
FILTER
IMAGE
f
S
2f
S
RESPONSE
3f
S
4f
S
5f
S
6f
S
7f
S
IMAGE
f
S
2f
S
3f
S
4f
S
5f
S
6f
S
7f
S
NO INTERPOLATION
8f
S
2x INTERPOLATION
8f
S
FILTER
4f
S
4f
S
RESPONSE
IMAGE
5f
S
6f
S
7f
S
8f
S
4x INTERPOLATION
5f
S
6f
S
7f
S
8f
S
IMAGE
f
S
f
S
2f
S
2f
S
3f
S
3f
S
SIGNAL
OUTPUT
LOWER
SIDEBAND
UPPER SIDEBAND
IMAGE
SPECTRUM OF THE MODULATOR
f
S
2f
S
3f
S
4f
S
5f
S
6f
S
7f
S
8f
S
FOR COMPLEX MODULATION THE MODULATION SIGN (BIT 1, ADDRESS 01h) SELECTS UPPER OR LOWER SIDEBAND
FILTER RESPONSE
IMAGE
INPUT SPECTRUM
SIGNAL
AND THIRD FILTER RESPONSE
OUTPUT SPECTRUM
f
S
SIGNAL
2f
S
3f
S
4f
S
5f
S
6f
S
IMAGE
7f
S
8f
S
8x INTERPOLATION
OF THE THIRD FILTER
f
S
2f
S
3f
S
4f
S
5f
S
6f
S
7f
S
8f
S
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 23
Figure 12. Spectral Representation of 8x Interpolation Filter with fIM/ 4 Modulation and Highpass Mode Enabled (Output Frequencies are Relative to the Data Input Frequency, f
S
)
INPUT SPECTRUM AND FIRST FILTER RESPONSE
SIGNAL
FILTER
IMAGE
f
S
2f
S
RESPONSE
3f
S
4f
S
5f
S
6f
S
7f
S
NO INTERPOLATION
8f
S
OUTPUT SPECTRUM OF THE FIRST FILTER
INPUT SPECTRUM AND SECOND FILTER RESPONSE
OUTPUT SPECTRUM OF THE SECOND FILTER
OUTPUT SPECTRUM OF THE MODULATOR
SIGNAL
SIGNAL
SIGNAL
f
S
f
S
f
S
IMAGE
2f
S
3f
S
4f
S
IMAGE
2f
S
3f
S
4f
S
IMAGE
2f
S
3f
S
4f
S
SIGNAL
LOWER
SIDEBAND
f
S
UPPER SIDEBAND
IMAGE
2f
S
3f
S
4f
S
MODULATION SIGN (BIT 1, ADDRESS 01h) SELECTS UPPER OR LOWER SIDEBAND
5f
5f
5f
5f
S
S
S
S
FILTER RESPONSE
2x INTERPOLATION
6f
S
6f
S
7f
S
7f
S
8f
S
8f
S
4x INTERPOLATION
6f
S
6f
S
7f
S
7f
S
8f
S
8f
S
INPUT SPECTRUM
SIGNAL
IMAGE
FILTER RESPONSE
AND THIRD FILTER RESPONSE
OUTPUT SPECTRUM
f
S
2f
S
3f
S
SIGNAL
4f
S
5f
S
IMAGE
6f
S
7f
S
8f
S
8x INTERPOLATION
OF THE THIRD FILTER
f
S
2f
S
3f
S
4f
S
5f
S
6f
S
7f
S
8f
S
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
24 ______________________________________________________________________________________
Digital Modulator
The MAX5898 features digital modulation at frequencies of fIM/ 2 and fIM/ 4, where fIMis the data rate at the input to the modulator. fIMequals f
DAC
in 1x, 2x, and 4x
interpolation modes. In 8x interpolation mode, f
IM
equals
f
DAC
/ 2. The output rate of the modulator is always the
same as the input data rate to the modulator, f
IM
.
In complex modulation mode, data from the second interpolation filter is frequency-mixed with the on-chip in-phase and quadrature (I/Q) local oscillator (LO). Complex modulation provides the benefit of image sideband rejection.
In the fLO= fIM/ 4 mode, real or complex modulation can be used. The modulator multiplies successive input data samples by the sequence [1, 0, -1, 0] for a cos(ωt). The modulator modulates the input signal up to f
IM
/ 4,
creating upper and lower images around fIM/ 4. The quadrature LO sin(ωt) is realized by delaying the cos(ωt) sequence by one clock cycle. Using complex modula­tion, complex IF is generated. The complex IF combined with an external quadrature modulator provides image rejection. The sign of the LO can be changed to allow the user to select whether the upper or the lower image should be rejected (bit 1 of register 01h).
When fIM/ 2 is chosen as the LO frequency, the input signal is multiplied by [-1, 1] on both channels. This pro­duces images around fIM/ 2. The complex image-reject modulation mode is not available for this LO frequency.
The outputs of the modulator can be expressed as:
in complex modulation, e
+jwt
in complex modulation, e
-jwt
For real modulation, the outputs of the modulator can be expressed as:
where ω = 2 x π x fLO.
If more than one MAX5898 is used, their LO phases can be synchronized by simultaneously releasing RESET. This sets the MAX5898 to its predefined initial phase.
Device Reset
The MAX5898 can be reset by holding the RESET pin low for 10ns. This will program the control registers to their default values in Table 2. During power-on, RESET must be held low until all power supplies have stabi­lized. Alternately, programming bit 5 of address 00h to a logic-high also resets the MAX5898.
Figure 13. (a) Modulator in Complex Modulation Mode; (b) Modulator in Real Modulation Mode
II Q
tt t t t
()=()×() ()×()
OD ID ID
QI Q
=
tt t t t
()
OD ID ID
sin cos
()×()+()×()
II Q
tt t t t
()=()×()+()×()
OD ID ID
QI Q
()
OD ID ID
cos sin
=
tt t t t
sin cos
()×()+()×()
cos sin
ωω
ωω
ωω
ωω
II
tt t
()=()×()
OD ID
QQ
()
OD ID
cos
=
tt t
cosωω
()×()
I-CHANNEL INPUT DATA
cos(ωt)
sin(ωt)
sin(ωt)
Q-CHANNEL INPUT DATA
cos(ωt)
(a)
I-CHANNEL OUTPUT DATA
TO FIR3
Q-CHANNEL OUTPUT DATA
I-CHANNEL INPUT DATA
Q-CHANNEL INPUT DATA
cos(ωt)
sin(ωt)
sin(ωt)
cos(ωt)
I-CHANNEL
OUTPUT DATA
TO FIR3
Q-CHANNEL
OUTPUT DATA
(b)
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 25
Power-Down Mode
The MAX5898 features three power-saving modes. Each DAC can be individually powered down through bits 2 and 3 of address 00h. The interpolation filters can also be powered down through bit 4 of address 00h, preserving the output level of each DAC (the DACs remain powered). Powering down both DACs automati­cally puts the MAX5898 into full power-down, including the interpolation filters.
Applications Information
Frequency Planning
System designers need to take the DAC into account during frequency-planning for high-performance appli­cations. Proper frequency planning can ensure that optimal system performance is achieved. The MAX5898 is designed to deliver excellent dynamic per­formance across wide bandwidths, as required for communication systems. As with all DACs, some com­binations of output frequency and update rate produce better performance than others.
Harmonics are often folded down into the band of inter­est. Specifically, if the DAC outputs a frequency close to fS/ N, the Mth harmonic of the output signal will be aliased down to:
Thus, if N (M + 1), the Mth harmonic will be close to the output frequency. SFDR performance of a current­steering DAC is often dominated by 3rd-order harmonic distortion. If this is a concern, placing the output signal at a frequency other than fS/ 4 should be considered.
Common to interpolating DACs are images near the divided clocks. In a DAC configured for 4x interpolation, this applies to images around fS/ 4 and fS/ 2. In a DAC configured for 8x interpolation, this applies to images around fS/ 8, fS/ 4, and fS/ 2. Most of these images are not part of the in-band (0 to f
DATA
/ 2) SFDR specifi­cation, though they are a consideration for out-of-band (f
DATA
/ 2 to f
DAC
/ 2) SFDR and may depend on the relationship of the DATACLK to DAC update clock (see the
Data Clock
section). When specifying the output reconstruction filter for other than baseband signals, these images should not be ignored.
Data Clock
The MAX5898 features synchronizers that allow for arbi­trary phase alignment between DATACLK and CLKP/CLKN. The DATACLK causes internal switching in the MAX5898 and the phase between DATACLK (input mode) to CLKP/CLKN influences the images at DATACLK. Figure 14 shows the image level near DATACLK as a function of the DATACLK (input mode) to CLKP/CLKN phase at 500Msps, 4x interpolation for a 10MHz, -6dBFS output signal.
Clock Interface
The MAX5898 features a flexible differential clock input (CLKP, CLKN) with a separate supply (AV
CLK
) to achieve optimum jitter performance. Use an ultra-low jitter clock to achieve the required noise density. Clock jitter must be less than 0.5ps
RMS
to meet the specified noise density. For that reason, the CLKP/CLKN input source must be designed carefully. The differential clock (CLKN and CLKP) input can be driven from a sin­gle-ended or a differential clock source. Differential clock drive is required to achieve the best dynamic performance from the DAC. For single-ended opera­tion, drive CLKP with a low noise source and bypass CLKN to GND with a 0.1µF capacitor.
The CLKP and CLKN pins are internally biased to AV
CLK
/ 2. This allows the user to AC-couple clock
Figure 14. Effect of CLKP/CLKN to DATACLK Phase on fS/ 4 Images
NM
ff Mf f
=×=
S OUT S
N
fS / 4 IMAGES vs. CLKP/CLKN to DATACLK DELAY
= 125Mwps, 4x INTERPOLATION
f
DATA
-70 f
= 10MHz
OUT
= -6dBFS
A
OUT
-75
-80
fS / 4 + f
OUT
-85
-90
IMAGE LEVEL (dBc)
fS / 4 - f
OUT
-95
-100 08
CLKP/CLKN DELAY (s)
fS / 4 - f
fS / 4 + f
OUT
OUT
642
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
26 ______________________________________________________________________________________
sources directly to the device without external resistors to define the DC level. The input resistance of CLKP and CLKN is 5kΩ.
A convenient way to apply a differential signal is with a balun transformer as shown in Figure 15. Alternatively, these inputs may be driven from a CMOS-compatible clock source, however it is recommended to use sine-
wave or AC-coupled differential ECL/PECL drive for best dynamic performance.
Output Interface (OUTI, OUTQ)
The MAX5898 outputs complementary currents (OUTIP, OUTIN, OUTQP, and OUTQN) that can be utilized in a differential configuration. Load resistors convert these two output currents into a differential output voltage.
The differential output between OUTIP (OUTQP) and OUTIN (OUTQN) can be converted to a single-ended output using a transformer or a differential amplifier. Figure 16 shows a typical transformer-based applica­tion circuit for generation of IF output signals. In this configuration, the MAX5898 operates in differential mode, which reduces even-order harmonics, and increases the available output power. Pay close atten­tion to the transformer core saturation characteristics when selecting a transformer. Transformer core satura­tion can introduce strong second harmonic distortion, especially at low output frequencies and high signal amplitudes. It is recommended to connect the trans­former center tap to ground.
Figure 15. Single-Ended-to-Differential Clock Conversion Using a Balun Transformer
Figure 16. Differential-to-Single-Ended Conversion Using Wideband RF Transformers
MINI-CIRCUITS
SINGLE-ENDED
IINPUT
ADTL1-12
1:1 RATIO
24.9
24.9
100nF
CLKP
MAX5898
100nF
CLKN
OUTIP
50
V
, SINGLE-ENDED
IOUT
1:1
IDAC
16
OUTIN
MAX5898
OUTQP
QDAC
16
OUTQN
100
50
50
100
50
1:1
1:1
1:1
, SINGLE-ENDED
V
QOUT
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 27
If a transformer is not used, the outputs must have a resistive termination to ground. Figure 17 shows the MAX5898 output configured for differential DC-coupled mode. The DC-coupled configuration can be used to eliminate waveform distortion due to highpass filter effects. Applications include communication systems employing analog quadrature upconverters and requir­ing a high-speed DAC for baseband I/Q synthesis.
If a single-ended DC-coupled unipolar output is desir­able, OUTIP (OUTQP) should be selected as the out­put, and connect OUTIN (OUTQN) to ground. Using the MAX5898 output single-ended is not recommended because it introduces additional noise and distortion.
The distortion performance of the DAC also depends on the load impedance. The MAX5898 is optimized for a 50double termination. It can be used with a trans­former output as shown in Figure 16 or just one 25 resistor from each output to ground and one 50resis­tor between the outputs (Figure 17). Higher output ter­mination resistors can be used, as long as each output voltage does not exceed +1V with respect to GND, but at the cost of degraded distortion performance and increased output noise voltage.
Reference Input/Output
The MAX5898 supports operation with the on-chip 1.2V bandgap reference or an external reference voltage source. REFIO serves as the input for an external, low­impedance reference source, and as the output if the DAC is operating with the internal reference.
For stable operation with the internal reference, REFIO should be decoupled to GND with a 1µF capacitor.
REFIO must be buffered with an external amplifier, if heavy loading is required, due to its 10koutput resistance.
Alternatively, apply a temperature-stable external refer­ence to REFIO (Figure 18). The internal reference is over­driven by the external reference. For improved accuracy and drift performance, choose a fixed output voltage ref­erence such as the MAX6520 bandgap reference.
The MAX5898’s reference circuit (Figure 19) employs a control amplifier, designed to regulate the full-scale current I
OUT
for the differential current outputs of the
DAC. The output current can be calculated as:
I
OUTFS
= 32 x I
REF
x 65,535 / 65,536
where I
REF
is the reference output current (I
REF
= V
REFIO
/
R
SET
) and I
OUTFS
is the full-scale output current of the
DAC. Located between FSADJ and DACREF, R
SET
is the reference resistor, which determines the amplifier’s output current for the DAC. See Table 5 for a matrix of different I
OUTFS
and R
SET
selections.
Power Supplies, Bypassing,
Decoupling, and Layout
Grounding and power-supply decoupling strongly influ­ence the MAX5898 performance. Unwanted digital crosstalk can couple through the input, reference, power-supply, and ground connections, which can affect dynamic specifications like signal-to-noise ratio or spurious-free dynamic range. In addition, electro­magnetic interference (EMI) can either couple into or be generated by the MAX5898. Observe the grounding and power-supply decoupling guidelines for high­speed, high-frequency applications. Follow the power­supply and filter configuration guidelines to achieve optimum dynamic performance.
Using a multilayer printed-circuit board (PCB) with sep­arate ground and power-supply planes, run high-speed signals on lines directly above the ground plane. Since the MAX5898 has separate analog and digital sections, the PCB should include separate analog and digital
Figure 17. DC-Coupled Differential Output Configuration
25
OUTIP
IDAC
16
OUTIN
MAX5898
OUTQP
QDAC
16
OUTQN
50
25
25
50
25
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
28 ______________________________________________________________________________________
ground sections with only one point connecting the three planes at the exposed paddle under the MAX5898. Run digital signals above the digital ground plane and analog/clock signals above the analog/clock ground plane. Keep digital signals as far away from sensitive analog inputs, reference lines, and clock inputs as practical. Use a symmetric design of clock input and the analog output lines to minimize 2nd-order harmonic distortion components, thus optimizing the dynamic performance of the DAC. Keep digital signal paths short and run lengths matched to avoid propaga­tion delay and data skew mismatches.
The MAX5898 requires five separate power-supply inputs for the analog (AV
DD1.8
and AV
DD3.3
), digital
(DV
DD1.8
and DV
DD3.3
), and clock (AV
CLK
) circuitry.
Decouple each voltage supply pin with a separate
0.1µF capacitor as close to the device as possible and with the shortest possible connection to the appropriate ground plane. Minimize the analog and digital load capacitances for optimized operation. Decouple all power-supply voltages at the point they enter the PCB with tantalum or electrolytic capacitors. Ferrite beads with additional decoupling capacitors forming a pi-net­work could also improve performance.
The exposed paddle MUST be soldered to the ground.
Use multiple vias, an array of at least 4 x 4 vias, directly under the EP to provide a low thermal and electrical impedance path for the IC.
Figure 18. Typical External Reference Circuit
Figure 19. Internal Reference Architecture
Table 5. I
OUTFS
and R
SET
Selection Matrix Based on a Typical 1.20V Reference Voltage
*
Terminated into a 50Ωload.
1.2V
REFERENCE
EXTERNAL
1.25V
REFERENCE
REFIO
1µF
FSADJ
I
REF
R
SET
DACREF
FULL-SCALE
CURRENT
I
OUTFS
2 62.50 19.2 19.1 100
5 156.26 7.68 7.5 250
10 312.50 3.84 3.83 500
15 468.75 2.56 2.55 750
20 625.00 1.92 1.91 1000
(mA)
REFERENCE
CURRENT
I
REF
1.2V
REFERENCE
10k
MAX5898
CURRENT-
SOURCE
ARRAY DAC
1µF
10k
REFIO
FSADJ
I
REF
R
SET
DACREF
MAX5898
CURRENT-
SOURCE
ARRAY DAC
R
(k)
(µA)
SET
CALCULATED 1% EIA STD
OUTPUT VOLTAGE
V
IOUTP/N
* (mV
P-P
)
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 29
Static Performance Parameter
Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an actual transfer function from either a best-straight-line fit (closest approximation to the actual transfer curve) or a line drawn between the end points of the transfer function, once offset and gain errors have been nulli­fied. For a DAC, the deviations are measured at every individual step.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an actual step height and the ideal value of 1 LSB. A DNL error specification greater than -1 LSB guarantees a monotonic transfer function.
Offset Error
The offset error is the difference between the ideal and the actual offset current. For a DAC, the offset point is the average value at the output for the two midscale digital input codes with respect to the full scale of the DAC. This error affects all codes by the same amount.
Gain Error
A gain error is the difference between the ideal and the actual full-scale output voltage on the transfer curve, after nullifying the offset error. This error alters the slope of the transfer function and corresponds to the same percentage error in each step.
Dynamic Performance
Parameter Definitions
Settling Time
The settling time is the amount of time required from the start of a transition until the DAC output settles its new output value to within the specified accuracy.
Noise Spectral Density
The DAC output noise is the sum of the quantization noise and thermal noise. Noise spectral density is the noise power in a 1Hz bandwidth, specified in dBFS/Hz.
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital samples, the theoretical maximum SNR is the ratio of the full-scale analog output (RMS value) to the RMS quantization error (residual error). The ideal, theoretical maximum SNR can be derived from the DAC’s resolu­tion (N bits):
SNR
dB
= 6.02dBx N + 1.76
dB
However, noise sources such as thermal noise, refer­ence noise, clock jitter, etc., affect the ideal reading. Therefore, SNR is computed by taking the ratio of the RMS signal to the RMS noise, which includes all spec­tral components minus the fundamental, the first four harmonics, and the DC offset.
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio of the RMS amplitude of the carrier frequency (maximum signal components) to the RMS value of their next largest distortion component. SFDR is usually measured in dBc with respect to the carrier frequency amplitude or in dBFS with respect to the DAC’s full-scale range. Depending on its test condition, SFDR is observed within a predefined window or to Nyquist.
Two-/Four-Tone Intermodulation
Distortion (IMD)
The two-/four-tone IMD is the ratio expressed in dBc (or dBFS) of the worst 3rd-order (or higher) IMD products to any output tone.
Adjacent Channel Leakage
Power Ratio (ACLR)
Commonly used in combination with WCDMA, ACLR reflects the leakage power ratio in dB between the measured powers within a channel relative to its adja­cent channel. ACLR provides a quantifiable method of determining out-of-band spectral energy and its influ­ence on an adjacent channel when a bandwidth-limited RF signal passes through a nonlinear device.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
30 ______________________________________________________________________________________
Pin Configuration
TOP VIEW
CLKP
CLKN
N.C.
DATACLKP
DATACLKN
D
VDD1.8
SELIQN
SELIQP
D15N
D15P
D14N
D14P
D13N
D13P
D12N
D12P
D11N 17
DD1.8
AV
D10N
GND
656667
D10P
DD3.3
GND
AV
OUTIP
64
2322212019 2726252418 2928 323130
D9P
D9N
DD1.8
DV
CLK
AV
68
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
EXPOSED PADDLE
D11P
OUTIN
GND
MAX5898
D8P
D8N
QFN
DD3.3
AV
D7N
GND
D7P
OUTQP
5859606162 5455565763
D6N
OUTQN
D6P
GND
DD1.8
DV
DD3.3
AV
D5N
GND
D5P
DD1.8
AV
D4N
5253
3433
FSADJ
D4P
51
50
49
48 CS
47
46
45
44
43
42
41
40
39
38
37
36
35
DACREF
REFIO
RESET
SCLK
DIN
DOUT
DV
DD3.3
D0P
D0N
D1P
D1N
D2P
D2N
DV
DD1.8
D3P
D3N
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
______________________________________________________________________________________ 31
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE OUTLINE NO.
LAND
PATTERN NO.
68 QFN (10mm x 10mm) G6800+4
21-0122
MAX5898
16-Bit, 500Msps, Interpolating and Modulating Dual DAC with Interleaved LVDS Inputs
32 ______________________________________________________________________________________
Package Information (continued)
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
33
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
0 8/05 Initial release
1 7/07 Add note to EC Table, style edits
2 8/10 Update Absolute Maximum Ratings 1, 2, 32
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
1, 2, 4, 5, 27,
28, 31
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