The MAX5898 programmable interpolating, modulating,
500Msps, dual digital-to-analog converter (DAC) offers
superior dynamic performance and is optimized for highperformance wideband, single- and multicarrier transmit
applications. The device integrates a selectable 2x/4x/8x
interpolating filter, a digital quadrature modulator, and
dual 16-bit, high-speed DACs on a single integrated circuit. At 30MHz output frequency and 500Msps update
rate, the in-band SFDR is 81dBc, while only consuming
1.2W. The device also delivers 71dB ACLR for fourcarrier WCDMA at a 61.44MHz output frequency.
The selectable interpolating filters allow lower input data
rates while taking advantage of the high DAC update
rates. These linear-phase interpolation filters ease reconstruction filter requirements and enhance the passband
dynamic performance. Each channel includes offset and
gain programmability, allowing the user to calibrate out
local oscillator (LO) feedthrough and sideband suppression errors generated by analog quadrature modulators.
The MAX5898 features a f
IM
/ 4 digital image-reject
modulator. This modulator generates a quadrature-modulated IF signal that can be presented to an analog I/Q
modulator to complete the upconversion process. A
second digital modulation mode allows the signal to be
frequency-translated with image pairs at fIM/ 2 or fIM/ 4.
The MAX5898 features a standard LVDS interface for
low electromagnetic interference (EMI). Interleaved
data is applied through a single 16-bit bus. A 3.3V
SPI™ port is provided for mode configuration. The programmable modes include the selection of 2x/4x/8x
interpolating filters, fIM/ 2, fIM/ 4 or no digital quadrature modulation with image rejection, individual channel
gain and offset adjustment, and offset binary or two’scomplement data interface.
Compatible versions with CMOS interfaces and 12-, 14-,
and 16-bit resolutions are also available. Refer to the
MAX5893 data sheet for 12-bit CMOS, MAX5894 for 14bit CMOS, and the MAX5895 for 16-bit CMOS versions.
Applications
Base Stations: 3G Multicarrier UMTS, CDMA, and GSM
Broadband Wireless Transmitters
Broadband Cable Infrastructure
Instrumentation and Automatic Test Equipment (ATE)
Analog Quadrature Modulation Architectures
Features
o 71dB ACLR at f
OUT
= 61.44MHz (Four-Carrier
WCDMA)
o Meets Multicarrier UMTS, cdma2000
®
, GSM
Spectral Masks (f
OUT
= 122MHz)
o Noise Spectral Density = -160dBFS/Hz at
f
OUT
= 16MHz
o 90dBc SFDR at Low-IF Frequency (10MHz)
o 88dBc SFDR at High-IF Frequency (50MHz)
o Low Power: 831mW (f
CLK
= 250MHz)
o User Programmable
Selectable 2x, 4x, or 8x Interpolating Filters
< 0.01dB Passband Ripple
> 95dB Stopband Rejection
Selectable Real or Complex Modulator Operation
Selectable Modulator LO Frequency: OFF, fIM/ 2,
or fIM/ 4
Selectable Output Filter: Lowpass or Highpass
Per Channel Gain and Offset Adjustment
50Ω double-terminated, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C,
unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DV
DD1.8
, AV
DD1.8
to GND, DACREF ..................-0.3V to +2.16V
AV
DD3.3
, AV
CLK
, DV
DD3.3
to GND, DACREF........-0.3V to +3.9V
DATACLKP, DATACLKN, D0P–D15P,
D0N–D15N, SELIQP, SELIQN to GND,
DACREF ..........................................-0.3V to (DV
DD1.8
+ 0.3V)
CS, RESET, SCLK, DIN, DOUT to
GND, DACREF ................................-0.3V to (DV
DD3.3
+ 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
CLK
+ 0.3V)
REFIO, FSADJ to GND, DACREF ........-0.3V to (AV
DD3.3
+ 0.3V)
OUTIP, OUTIN, OUTQP,
OUTQN to GND, DACREF..................-1V to (AV
DD3.3
+ 0.3V)
DOUT, DATACLKP, DATACLKN Continuous Current ..........8mA
50Ω double-terminated, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C,
unless otherwise noted.) (Note 2)
Note 2: All specifications are 100% tested at T
A
≥ +25°C. Specifications at TA< +25°C are guaranteed by design and characterization.
Note 3: Specification is 100% production tested at T
A
≥ +25°C.
Note 4: 3.84MHz bandwidth, single carrier.
Note 5: Excludes data latency.
Note 6: Measured single-ended into a 50Ω load.
Note 7: Excludes sin(x)/x rolloff.
Note 8: Differential voltage swing defined as
I
V
P
I+ I
V
N
I
.
Note 9: Guaranteed by design and characterization.
Note 10:Parameter defined as the change in midscale output caused by a ±5% variation in the nominal supply voltage.
V(CLKN)
V(CLKP)
V
P
V
N
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Clock Supply VoltageAV
Analog Supply Voltage
AV
AV
I
AVDD3.3
Analog Supply Current
I
AVDD1.8
Digital Supply CurrentI
Digital I/O Supply CurrentI
Clock Supply CurrentI
DVDD1.8
DVDD3.3
AVCLK
Total Power DissipationP
Power-Down Current
AV
Ratio
Power-Supply Rejection
DD3.3
PSRR
CLK
DD3.3
DD1.8
TOTAL
3.1353.33.465V
3.1353.33.465
1.711.81.89
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
= 10MHz
f
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
f
= 10MHz
OUT
f
= 250MHz, 2x interpolation, 0dBFS,
CLK
f
= 10MHz
OUT
AV
DD3.3
AV
DV
DV
AV
DD1.8
DD1.8
DD3.3
CLK
All I/O are static high or
low, bit 2 to bit 4 of
address 00h are set high
1CLKPNoninverting Differential Clock Input. Internally biased to AV
2CLKNInverting Differential Clock Input. Internally biased to AV
3N.C.Internally Connected. Do not connect.
4DATACLKPLVDS Data Clock Input/Output. External 100Ω termination to DATACLKN required.
5DATACLKNComplementary LVDS Data Clock Input/Output. External 100Ω termination to DATACLKP required.
6, 21, 30, 37DV
7SELIQN
DD1.8
Digital Power Supply. Accepts a 1.71V to 1.89V supply range. Bypass each pin to ground with a
0.1µF capacitor as close to the pin as possible.
Complementary LVDS Channel Select Input. Set SELIQN low and SELIQP high to direct data to
the channel. Set SELIQP low and SELIQN high to direct data to the channel. Internal 110Ω
termination to SELIQP.
CLK
CLK
/ 2.
/ 2.
8SELIQP
9D15NComplementary LVDS Data Bit 15 (MSB). Internal 110Ω termination to D15P.
10D15PLVDS Data Bit 15 (MSB). Internal 110Ω termination to D15N.
11D14NComplementary LVDS Data Bit 14. Internal 110Ω termination to D14P.
12D14PLVDS Data Bit 14. Internal 110Ω termination to D14N.
13D13NComplementary LVDS Data Bit 13. Internal 110Ω termination to D13P.
14D13PLVDS Data Bit 13. Internal 110Ω termination to D13N.
15D12NComplementary LVDS Data Bit 12. Internal 110Ω termination to D12P.
16D12PLVDS Data Bit 12. Internal 110Ω termination to D12N.
17D11NComplementary LVDS Data Bit 11. Internal 110Ω termination to D11P.
18D11PLVDS Data Bit 11. Internal 110Ω termination to D11N.
19D10NComplementary LVDS Data Bit 10. Internal 110Ω termination to D10P.
20D10PLVDS Data Bit 10. Internal 110Ω termination to D10N.
22D9NComplementary LVDS Data Bit 9. Internal 110Ω termination to D9P.
23D9PLVDS Data Bit 9. Internal 110Ω termination to D9N.
24D8NComplementary LVDS Data Bit 8. Internal 110Ω termination to D8P.
25D8PLVDS Data Bit 8. Internal 110Ω termination to D8N.
26D7NComplementary LVDS Data Bit 7. Internal 110Ω termination to D7P.
27D7PLVDS Data Bit 7. Internal 110Ω termination to D7N.
28D6NComplementary LVDS Data Bit 6. Internal 110Ω termination to D6P.
29D6PLVDS Data Bit 6. Internal 110Ω termination to D6N.
31D5NComplementary LVDS Data Bit 5. Internal 110Ω termination to D5P.
32D5PLVDS Data Bit 5. Internal 110Ω termination to D5N.
33D4NComplementary LVDS Data Bit 4. Internal 110Ω termination to D4P.
34D4PLVDS Data Bit 4. Internal 110Ω termination to D4N.
LVDS Channel Select Input. Set SELIQN low and SELIQP high to direct data to the channel. Set
SELIQP low and SELIQN high to direct data to the channel. Internal 110Ω termination to SELIQN.
35D3NComplementary LVDS Data Bit 3. Internal 110Ω termination to D3P.
36D3PLVDS Data Bit 3. Internal 110Ω termination to D3N.
38D2NComplementary LVDS Data Bit 2. Internal 110Ω termination to D2P.
39D2PLVDS Data Bit 2. Internal 110Ω termination to D2N.
40D1NComplementary LVDS Data Bit 1. Internal 110Ω termination to D1P.
41D1PLVDS Data Bit 1. Internal 110Ω termination to D1N.
42D0NComplementary LVDS Data Bit 0 (LSB). Internal 110Ω termination to D0P.
43D0PLVDS Data Bit 0 (LSB). Internal 110Ω termination to D0N.
44DV
45DOUTSerial-Port Data Output
46DINSerial-Port Data Input
47SCLKSerial-Port Clock Input. Data on DIN is latched on the rising edge of SCLK.
48CSSerial-Port Interface Select. Drive CS low to enable serial-port interface.
49RESETReset Input. Hold RESET low during power-up.
50REFIOReference Input/Output. Bypass to ground with a 1µF capacitor as close to the pin as possible.
51DACREF
52FSADJ
53, 67AV
54, 56, 59, 61,
64, 66
55, 60, 65AV
57OUTQNInverting Differential DAC Current Output for Q Channel
58OUTQPNoninverting Differential DAC Current Output for Q Channel
62OUTINInverting Differential DAC Current Output for I Channel
63OUTIPNoninverting Differential DAC Current Output for I Channel
68AV
—EPExposed Paddle. Must be connected to GND through a low-impedance path.
DD3.3
DD1.8
GNDGround
DD3.3
CLK
I/O Power Supply. Accepts a 3.0V to 3.6V supply range. Bypass with a 0.1µF capacitor as close to
the pin as possible.
C ur r ent- S et Resi stor Retur n P ath. For a 20m A ful l - scal e outp ut cur r ent, use a 1.25V exter nal r efer ence
and connect a 2kΩ r esi stor b etw een FS AD J and D AC RE F. Inter nal l y connected to GN D . D O NO T U SE
A S AN EXT ER N A L GR O U N D C O N N EC T IO N .
Full-Scale Adjust Input. For a 20m A ful l - scal e outp ut cur r ent, use a 1.25V exter nal r efer ence and
connect a 2kΩ r esi stor b etw een FS AD J and D AC RE F.
Low Analog Power Supply. Accepts a 1.71V to 1.89V supply range. Bypass each pin to GND with
a 0.1µF capacitor as close to the pin as possible.
Analog Power Supply. Accepts a 3.135V to 3.465V supply range. Bypass each pin to GND with a
0.1µF capacitor as close to the pin as possible.
Clock Power Supply. Accepts a 3.135V to 3.465V supply range. Bypass to ground with a 0.1µF
capacitor as close to the pin as possible.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
The MAX5898 dual, 500Msps, high-speed, 16-bit, current-output DAC provides superior performance in communication systems requiring low-distortion analog-signal
reconstruction. The MAX5898 combines two DAC cores
with 8x/4x/2x programmable digital interpolation filters, a
digital quadrature modulator, an SPI-compatible serial
interface for programming the device, and an on-chip
1.2V reference. Individual DAC channel gain and offset
adjustments are available to compensate for downstream
signal-path imbalances. The full-scale output current
range is adjustable from 2mA to 20mA to optimize power
dissipation and gain control.
Each channel contains three selectable interpolating filters making the MAX5898 capable of 2x, 4x, 8x, or no
interpolation, which allows for low input data rates and
high DAC update rates. When operating in 8x interpolation mode, the interpolator increases the DAC conversion
rate by a factor of eight, providing an eight-fold increase
in separation between the reconstructed waveform spectrum and its first image. The MAX5898 accepts either
two’s complement or offset binary input data format on a
single interleaved LVDS input bus.
The MAX5898 includes modulation modes at fIM/ 2 and
fIM/ 4, where fIMis the data rate at the input of the modulator. If 2x interpolation is used, this data rate is 2x the
input data rate. If 4x or 8x interpolation is used, this data
rate is 4x the input data rate. Table 1 summarizes the
modulator operating data rates.
The power-down modes can be used to turn off each
DAC’s output current or the entire digital section.
Programming both DACs into power-down simultaneously powers down the digital interpolation filters. Note
that the SPI section is always active.
The analog and digital sections of the MAX5898 have
separate power-supply inputs (AV
other supply inputs operate from a typical 3.3V supply.
Serial Interface
The SPI-compatible serial interface programs the
MAX5898 registers. The serial interface consists of CS,
DIN, SCLK, and DOUT. Data is shifted into DIN on the
rising edge of SCLK when CS is low. When CS is high,
data presented at DIN is ignored and DOUT is in highimpedance mode. Note: CS must transition highafter each read/write operation. DOUT is the serial
data output for reading registers to facilitate easy
debugging during development. DIN and DOUT can
be connected together to form a 3-wire serial interface
bus or remain separate and form a 4-wire SPI bus.
The serial interface supports two-byte transfer in a
communication cycle. The first byte is a control byte
written to the MAX5898 only. The second byte is a data
byte and can be written to or read from the MAX5898.
When writing to the MAX5898, data is shifted into DIN;
data is shifted out of DOUT in a read operation. Bits 0 to
3 of the control byte are the address bits. These bits set
the address of the register to be written to or read from.
Bits 4 to 6 of the control byte must always be set to 0.
Bit 7 is a read/write bit: 0 for write operation and 1 for
read operation. The most significant bit (MSB) is shifted
in first in default mode. If the serial port is set to LSB-first
mode, both the control byte and data byte are shifted LSB
first. Figures 1 and 2 show the SPI serial-interface operation in the default write and read mode, respectively.
Figure 3 is a timing diagram for the SPI serial interface.
Table 1. Quadrature Modulator Operating Data Rates (fIMis the Data Rate at the Input of
the Modulator)
Bit 7Logic 0 (default) adds the 10 bits offset cur-
rent to OUTIN. A logic 1 adds the 10 bits offset current to OUTIP.
Address 08h
Bits 7–0 These 8 bits define the binary number for
fine-gain adjustment of the QDAC full-scale
current (see the
Gain Adjustment
section). Bit
7 is the MSB. Default is all zeros.
Address 09h
Bits 3–0 These four bits define the binary number for
the coarse-gain adjustment of the QDAC fullscale current (see the
Gain Adjustment
sec-
tion). Bit 3 is the MSB. Default is all ones.
Address 0Ah, Bits 7–0; Address 0Bh, Bit 1 and Bit 0
These 10 bits represent a binary number that
defines the magnitude of the offset added to
the QDAC output (see the
Offset Adjustment
section). Default is all zeros.
Address 0Bh
Bit 7Logic 0 (default) adds the 10 bits offset to
OUTQN. A logic 1 adds the 10 bits offset to
OUTQP.
Offset Adjustment
Offset adjustment is achieved by adding a digital code to
the DAC inputs. The code OFFSET (see equation below),
as stored in the relevant control registers, has a range
from 0 to 1023 and a sign bit. The applied DAC offset
is four times the code stored in the register, providing an
offset adjustment range of ±4092 LSB codes. The resolution is 4 LSB.
Gain Trim
Gain adjustment is peformed by varying the full-scale
current according to the following formula:
where I
REF
is the reference current (see the
Reference
Input/Output
section). COARSE is the register content
of registers 05h and 09h for the I and Q channel,
respectively. FINE is the register content of register 04h
and 08h for the I and Q channel, respectively. The
range of COARSE is from 0 to 15, with 15 being the
default. The range for FINE is from 0 to 255 with 0
being the default. The gain can be adjusted in steps of
approximately 0.01dB.
Data Input Port
The MAX5898 captures input data on a single LVDS
port (D15P/N–D0P/N). The channel for the input data is
determined through the state of SELIQP/SELIQN. When
SELIQP is set to logic-high and SELIQN is set to logiclow the input data is presented to the I channel. Setting
SELIQP to logic-low and SELIQN to logic-high presents
the input data to the Q channel.
The MAX5898 control registers can be programmed to
allow either signed or unsigned binary format (bit 7,
address 02h) data. Table 3 shows the corresponding DAC
output levels when using signed or unsigned data modes.
Data Synchronization Modes
Data synchronization circuitry is provided to allow operation with an input data clock. The data clock must be
frequency locked to the DAC clock (f
DAC
), but can
have arbitrary phase with respect to the DAC clock.
The synchronization circuitry allows for phase jitter on
the input data clock of up to ±1 data clock cycles.
Synchronization is initially established when the reset
pin is asynchronously deasserted and the input data
clock has been running for at least four clock cycles.
Subsequently, the MAX5898 monitors the phase relationship and detects if the phase drifts more than ±1
data clock cycle. If this occurs, the synchronizer automatically re-establishes synchronization. However, during the resynchronization phase, up to 8 data words
may be lost or repeated.
Bit 2 of register 02h disables or enables (default) the
automatic data clock phase detection. Disabling the
data synchronization circuitry requires the data clock
and the DAC clock phase to be locked.
Table 3. DAC Output Code Table
I
OFFSETOUTFS
=
××4
16
2
I
OFFSET
⎡
⎢
⎣
I
OUTFS
I
×
3
⎛
⎜
⎝
⎞
COARSE
⎛
REFREF
⎜
⎟
⎝
⎠
4
16
+
1
⎞
⎟
⎠
3
⎛
−
⎜
⎝
×
I
32256
⎞
⎟
⎠
FINE
⎛
⎜
⎝
⎤
1024
⎛
⎞
=
⎜
⎟
⎥
⎝
⎠
24
⎦
⎞
⎟
⎠
D IG IT A L IN PU T C O D E
O F F SET
B IN A R Y
( U N SI G N ED )
0000 0000 0000 0000 1000 0000 0000 00000I
0111 1111 1111 1111 0000 0000 0000 0000
1111 1111 1111 1111 0111 1111 1111 1111 I
T WO ' S
C O M PL EM EN T
( SI G N ED )
O U T _ PO U T _ N
OU T FS
I
/2I
OU T FS
OU T FS
OU T FS
2
0
/
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
The MAX5898 employs a differential LVDS DATACLK
located at pins 4 and 5. The DATACLK can be configured as either an input or as an output (bit 3, address
02h). If DATACLK is configured as an output, it is frequency-divided from the CLKP/CLKN input, depending
on the operating mode, see Table 4.
The MAX5898 can be configured to latch the input
data on either the rising edge or falling edge of the
DATACLK signal (bit 4, address 02h). Figure 4 shows
the timing requirements between the DATACLK signal
and the input data bus with latching on the rising edge.
The MAX5898 features three cascaded FIR half-band
filters. The interpolating filters are enabled or disabled
in combinations to support 1x (no interpolation), 2x, 4x,
or 8x interpolation. Bits 7 and 6 of register 01h set the
interpolation rate (see Table 2). The last interpolation fil-
ter is located after the modulator. In the 8x interpolation
mode, the last filter (FIR3) can be configured as lowpass or highpass (bit 5, address 01h) to select the
lower or upper sideband from the modulation output.
The frequency responses of these three filters are plotted in Figures 5–8.
Figure 5. Interpolation Filter Frequency Response, 2x
Interpolation Mode
Figure 6. Interpolation Filter Frequency Response, 4x
Interpolation Mode
The programmable interpolation filters multiply the
MAX5898 input data rate by a factor of 2x, 4x, or 8x to
separate the reconstructed waveform spectrum and the
DAC image. The original spectral images, appearing at
around multiples of the input data rate, are attenuated
by the internal digital filters. This feature provides three
benefits:
1) Image separation reduces complexity of analog
reconstruction filters.
2) Lower input data rates eliminate board-level highspeed data transmission.
3) Sin(x)/x rolloff is reduced over the effective bandwidth.
Figure 9 illustrates a practical example of the benefits
when using the MAX5898 in 2x, 4x, and 8x interpolation
modes with the third filter configured as a lowpass filter.
With no interpolation filter, the first image signal appears
in the second Nyquist zone between fS/ 2 and fS. The first
interpolating filter removes this image. In fact, all of the
Figure 9. Spectral Representation of Interpolating Filter Responses (Output Frequencies are Relative to the Data Input Frequency, fS)
images at odd numbers of fSare filtered. At the output of
the first filter, the images are at 2fS, 4fS, etc. This signal is
then passed to the second interpolating filter, which is
similar to the first filter and removes the images at 2fS, 6fS,
10fS, etc. Finally, the third filter removes images at 4fS,
12fS, 20fS, etc. Figures 10, 11, and 12 similarly illustrate
the spectral responses when using the interpolating filters
combined with the digital modulator.
Figure 10. Spectral Representation of 4x Interpolation Filter with fIM/ 4 Modulation (Output Frequencies are Relative to the Data Input
Frequency, f
S
)
INPUT
SPECTRUM
AND FIRST
FILTER
RESPONSE
OUTPUT
SPECTRUM
OF THE
FIRST
FILTER
INPUT
SPECTRUM
AND
SECOND
FILTER
RESPONSE
SIGNAL
SIGNAL
SIGNAL
f
f
f
IMAGE
S
S
FILTER
RESPONSE
S
FILTER
RESPONSE
2f
S
IMAGE
2f
S
IMAGE
2f
S
3f
S
3f
S
3f
S
NO INTERPOLATION
4f
S
2x INTERPOLATION
4f
S
4f
S
OUTPUT
SPECTRUM
OF THE
SECOND
FILTER
OUTPUT
SPECTRUM
OF THE
MODULATOR
SIGNAL
f
S
SIGNAL
LOWER
SIDEBAND
FOR COMPLEX MODULATION THE MODULATION SIGN (BIT 1, ADDRESS 01h) SELECTS UPPER OR LOWER SIDEBAND
UPPER
SIDEBAND
f
S
2f
S
2f
S
3f
S
IMAGE
3f
S
IMAGE
4x INTERPOLATION
4f
S
4f
S
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
Figure 11. Spectral Representation of 8x Interpolation Filter with fIM/ 4 Modulation and Lowpass Mode Enabled (Output Frequencies
are Relative to the Data Input Frequency, f
S
)
INPUT
SIGNAL
SPECTRUM
AND FIRST
FILTER
RESPONSE
OUTPUT
SPECTRUM
OF THE
FIRST
FILTER
INPUT
SPECTRUM
SIGNAL
AND
SECOND
FILTER
RESPONSE
OUTPUT
SIGNAL
SPECTRUM
OF THE
SECOND
FILTER
SIGNAL
FILTER
IMAGE
f
S
2f
S
RESPONSE
3f
S
4f
S
5f
S
6f
S
7f
S
IMAGE
f
S
2f
S
3f
S
4f
S
5f
S
6f
S
7f
S
NO INTERPOLATION
8f
S
2x INTERPOLATION
8f
S
FILTER
4f
S
4f
S
RESPONSE
IMAGE
5f
S
6f
S
7f
S
8f
S
4x INTERPOLATION
5f
S
6f
S
7f
S
8f
S
IMAGE
f
S
f
S
2f
S
2f
S
3f
S
3f
S
SIGNAL
OUTPUT
LOWER
SIDEBAND
UPPER
SIDEBAND
IMAGE
SPECTRUM
OF THE
MODULATOR
f
S
2f
S
3f
S
4f
S
5f
S
6f
S
7f
S
8f
S
FOR COMPLEX MODULATION THE MODULATION SIGN (BIT 1, ADDRESS 01h) SELECTS UPPER OR LOWER SIDEBAND
Figure 12. Spectral Representation of 8x Interpolation Filter with fIM/ 4 Modulation and Highpass Mode Enabled (Output Frequencies
are Relative to the Data Input Frequency, f
The MAX5898 features digital modulation at frequencies
of fIM/ 2 and fIM/ 4, where fIMis the data rate at the
input to the modulator. fIMequals f
DAC
in 1x, 2x, and 4x
interpolation modes. In 8x interpolation mode, f
IM
equals
f
DAC
/ 2. The output rate of the modulator is always the
same as the input data rate to the modulator, f
IM
.
In complex modulation mode, data from the second
interpolation filter is frequency-mixed with the on-chip
in-phase and quadrature (I/Q) local oscillator (LO).
Complex modulation provides the benefit of image
sideband rejection.
In the fLO= fIM/ 4 mode, real or complex modulation
can be used. The modulator multiplies successive input
data samples by the sequence [1, 0, -1, 0] for a cos(ωt).
The modulator modulates the input signal up to f
IM
/ 4,
creating upper and lower images around fIM/ 4. The
quadrature LO sin(ωt) is realized by delaying the cos(ωt)
sequence by one clock cycle. Using complex modulation, complex IF is generated. The complex IF combined
with an external quadrature modulator provides image
rejection. The sign of the LO can be changed to allow
the user to select whether the upper or the lower image
should be rejected (bit 1 of register 01h).
When fIM/ 2 is chosen as the LO frequency, the input
signal is multiplied by [-1, 1] on both channels. This produces images around fIM/ 2. The complex image-reject
modulation mode is not available for this LO frequency.
The outputs of the modulator can be expressed as:
in complex modulation, e
+jwt
in complex modulation, e
-jwt
For real modulation, the outputs of the modulator can
be expressed as:
where ω = 2 x π x fLO.
If more than one MAX5898 is used, their LO phases
can be synchronized by simultaneously releasing
RESET. This sets the MAX5898 to its predefined initial
phase.
Device Reset
The MAX5898 can be reset by holding the RESET pin
low for 10ns. This will program the control registers to
their default values in Table 2. During power-on, RESET
must be held low until all power supplies have stabilized. Alternately, programming bit 5 of address 00h to
a logic-high also resets the MAX5898.
Figure 13. (a) Modulator in Complex Modulation Mode; (b) Modulator in Real Modulation Mode
The MAX5898 features three power-saving modes.
Each DAC can be individually powered down through
bits 2 and 3 of address 00h. The interpolation filters can
also be powered down through bit 4 of address 00h,
preserving the output level of each DAC (the DACs
remain powered). Powering down both DACs automatically puts the MAX5898 into full power-down, including
the interpolation filters.
Applications Information
Frequency Planning
System designers need to take the DAC into account
during frequency-planning for high-performance applications. Proper frequency planning can ensure that
optimal system performance is achieved. The
MAX5898 is designed to deliver excellent dynamic performance across wide bandwidths, as required for
communication systems. As with all DACs, some combinations of output frequency and update rate produce
better performance than others.
Harmonics are often folded down into the band of interest. Specifically, if the DAC outputs a frequency close
to fS/ N, the Mth harmonic of the output signal will be
aliased down to:
Thus, if N ≈ (M + 1), the Mth harmonic will be close to
the output frequency. SFDR performance of a currentsteering DAC is often dominated by 3rd-order harmonic
distortion. If this is a concern, placing the output signal
at a frequency other than fS/ 4 should be considered.
Common to interpolating DACs are images near the
divided clocks. In a DAC configured for 4x interpolation,
this applies to images around fS/ 4 and fS/ 2. In a DAC
configured for 8x interpolation, this applies to images
around fS/ 8, fS/ 4, and fS/ 2. Most of these images
are not part of the in-band (0 to f
DATA
/ 2) SFDR specification, though they are a consideration for out-of-band
(f
DATA
/ 2 to f
DAC
/ 2) SFDR and may depend on the
relationship of the DATACLK to DAC update clock (see
the
Data Clock
section). When specifying the output
reconstruction filter for other than baseband signals,
these images should not be ignored.
Data Clock
The MAX5898 features synchronizers that allow for arbitrary phase alignment between DATACLK and
CLKP/CLKN. The DATACLK causes internal switching in
the MAX5898 and the phase between DATACLK (input
mode) to CLKP/CLKN influences the images at DATACLK.
Figure 14 shows the image level near DATACLK as a
function of the DATACLK (input mode) to CLKP/CLKN
phase at 500Msps, 4x interpolation for a 10MHz, -6dBFS
output signal.
Clock Interface
The MAX5898 features a flexible differential clock input
(CLKP, CLKN) with a separate supply (AV
CLK
) to
achieve optimum jitter performance. Use an ultra-low
jitter clock to achieve the required noise density. Clock
jitter must be less than 0.5ps
RMS
to meet the specified
noise density. For that reason, the CLKP/CLKN input
source must be designed carefully. The differential
clock (CLKN and CLKP) input can be driven from a single-ended or a differential clock source. Differential
clock drive is required to achieve the best dynamic
performance from the DAC. For single-ended operation, drive CLKP with a low noise source and bypass
CLKN to GND with a 0.1µF capacitor.
The CLKP and CLKN pins are internally biased to
AV
CLK
/ 2. This allows the user to AC-couple clock
Figure 14. Effect of CLKP/CLKN to DATACLK Phase on fS/ 4
Images
−
NM
⎡
ff Mff
=×=
−
SOUTS
⎤
⎢
⎥
N
⎣
⎦
fS / 4 IMAGES vs. CLKP/CLKN to DATACLK DELAY
= 125Mwps, 4x INTERPOLATION
f
DATA
-70
f
= 10MHz
OUT
= -6dBFS
A
OUT
-75
-80
fS / 4 + f
OUT
-85
-90
IMAGE LEVEL (dBc)
fS / 4 - f
OUT
-95
-100
08
CLKP/CLKN DELAY (s)
fS / 4 - f
fS / 4 + f
OUT
OUT
642
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
sources directly to the device without external resistors
to define the DC level. The input resistance of CLKP
and CLKN is 5kΩ.
A convenient way to apply a differential signal is with a
balun transformer as shown in Figure 15. Alternatively,
these inputs may be driven from a CMOS-compatible
clock source, however it is recommended to use sine-
wave or AC-coupled differential ECL/PECL drive for best
dynamic performance.
Output Interface (OUTI, OUTQ)
The MAX5898 outputs complementary currents (OUTIP,
OUTIN, OUTQP, and OUTQN) that can be utilized in a
differential configuration. Load resistors convert these
two output currents into a differential output voltage.
The differential output between OUTIP (OUTQP) and
OUTIN (OUTQN) can be converted to a single-ended
output using a transformer or a differential amplifier.
Figure 16 shows a typical transformer-based application circuit for generation of IF output signals. In this
configuration, the MAX5898 operates in differential
mode, which reduces even-order harmonics, and
increases the available output power. Pay close attention to the transformer core saturation characteristics
when selecting a transformer. Transformer core saturation can introduce strong second harmonic distortion,
especially at low output frequencies and high signal
amplitudes. It is recommended to connect the transformer center tap to ground.
Figure 15. Single-Ended-to-Differential Clock Conversion Using
a Balun Transformer
Figure 16. Differential-to-Single-Ended Conversion Using Wideband RF Transformers
If a transformer is not used, the outputs must have a
resistive termination to ground. Figure 17 shows the
MAX5898 output configured for differential DC-coupled
mode. The DC-coupled configuration can be used to
eliminate waveform distortion due to highpass filter
effects. Applications include communication systems
employing analog quadrature upconverters and requiring a high-speed DAC for baseband I/Q synthesis.
If a single-ended DC-coupled unipolar output is desirable, OUTIP (OUTQP) should be selected as the output, and connect OUTIN (OUTQN) to ground. Using
the MAX5898 output single-ended is not recommended
because it introduces additional noise and distortion.
The distortion performance of the DAC also depends
on the load impedance. The MAX5898 is optimized for
a 50Ω double termination. It can be used with a transformer output as shown in Figure 16 or just one 25Ω
resistor from each output to ground and one 50Ω resistor between the outputs (Figure 17). Higher output termination resistors can be used, as long as each output
voltage does not exceed +1V with respect to GND, but
at the cost of degraded distortion performance and
increased output noise voltage.
Reference Input/Output
The MAX5898 supports operation with the on-chip 1.2V
bandgap reference or an external reference voltage
source. REFIO serves as the input for an external, lowimpedance reference source, and as the output if the
DAC is operating with the internal reference.
For stable operation with the internal reference, REFIO
should be decoupled to GND with a 1µF capacitor.
REFIO must be buffered with an external amplifier,
if heavy loading is required, due to its 10kΩ output
resistance.
Alternatively, apply a temperature-stable external reference to REFIO (Figure 18). The internal reference is overdriven by the external reference. For improved accuracy
and drift performance, choose a fixed output voltage reference such as the MAX6520 bandgap reference.
The MAX5898’s reference circuit (Figure 19) employs a
control amplifier, designed to regulate the full-scale
current I
OUT
for the differential current outputs of the
DAC. The output current can be calculated as:
I
OUTFS
= 32 x I
REF
x 65,535 / 65,536
where I
REF
is the reference output current (I
REF
= V
REFIO
/
R
SET
) and I
OUTFS
is the full-scale output current of the
DAC. Located between FSADJ and DACREF, R
SET
is the
reference resistor, which determines the amplifier’s output
current for the DAC. See Table 5 for a matrix of different
I
OUTFS
and R
SET
selections.
Power Supplies, Bypassing,
Decoupling, and Layout
Grounding and power-supply decoupling strongly influence the MAX5898 performance. Unwanted digital
crosstalk can couple through the input, reference,
power-supply, and ground connections, which can
affect dynamic specifications like signal-to-noise ratio
or spurious-free dynamic range. In addition, electromagnetic interference (EMI) can either couple into or
be generated by the MAX5898. Observe the grounding
and power-supply decoupling guidelines for highspeed, high-frequency applications. Follow the powersupply and filter configuration guidelines to achieve
optimum dynamic performance.
Using a multilayer printed-circuit board (PCB) with separate ground and power-supply planes, run high-speed
signals on lines directly above the ground plane. Since
the MAX5898 has separate analog and digital sections,
the PCB should include separate analog and digital
ground sections with only one point connecting the
three planes at the exposed paddle under the
MAX5898. Run digital signals above the digital ground
plane and analog/clock signals above the analog/clock
ground plane. Keep digital signals as far away from
sensitive analog inputs, reference lines, and clock
inputs as practical. Use a symmetric design of clock
input and the analog output lines to minimize 2nd-order
harmonic distortion components, thus optimizing the
dynamic performance of the DAC. Keep digital signal
paths short and run lengths matched to avoid propagation delay and data skew mismatches.
The MAX5898 requires five separate power-supply
inputs for the analog (AV
DD1.8
and AV
DD3.3
), digital
(DV
DD1.8
and DV
DD3.3
), and clock (AV
CLK
) circuitry.
Decouple each voltage supply pin with a separate
0.1µF capacitor as close to the device as possible and
with the shortest possible connection to the appropriate
ground plane. Minimize the analog and digital load
capacitances for optimized operation. Decouple all
power-supply voltages at the point they enter the PCB
with tantalum or electrolytic capacitors. Ferrite beads
with additional decoupling capacitors forming a pi-network could also improve performance.
The exposed paddle MUST be soldered to the ground.
Use multiple vias, an array of at least 4 x 4 vias, directly
under the EP to provide a low thermal and electrical
impedance path for the IC.
Figure 18. Typical External Reference Circuit
Figure 19. Internal Reference Architecture
Table 5. I
OUTFS
and R
SET
Selection Matrix Based on a Typical 1.20V Reference Voltage
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best-straight-line
fit (closest approximation to the actual transfer curve)
or a line drawn between the end points of the transfer
function, once offset and gain errors have been nullified. For a DAC, the deviations are measured at every
individual step.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1 LSB. A DNL
error specification greater than -1 LSB guarantees a
monotonic transfer function.
Offset Error
The offset error is the difference between the ideal and
the actual offset current. For a DAC, the offset point is
the average value at the output for the two midscale
digital input codes with respect to the full scale of the
DAC. This error affects all codes by the same amount.
Gain Error
A gain error is the difference between the ideal and the
actual full-scale output voltage on the transfer curve,
after nullifying the offset error. This error alters the slope
of the transfer function and corresponds to the same
percentage error in each step.
Dynamic Performance
Parameter Definitions
Settling Time
The settling time is the amount of time required from the
start of a transition until the DAC output settles its new
output value to within the specified accuracy.
Noise Spectral Density
The DAC output noise is the sum of the quantization
noise and thermal noise. Noise spectral density is the
noise power in a 1Hz bandwidth, specified in dBFS/Hz.
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of
the full-scale analog output (RMS value) to the RMS
quantization error (residual error). The ideal, theoretical
maximum SNR can be derived from the DAC’s resolution (N bits):
SNR
dB
= 6.02dBx N + 1.76
dB
However, noise sources such as thermal noise, reference noise, clock jitter, etc., affect the ideal reading.
Therefore, SNR is computed by taking the ratio of the
RMS signal to the RMS noise, which includes all spectral components minus the fundamental, the first four
harmonics, and the DC offset.
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio of the RMS amplitude of the carrier
frequency (maximum signal components) to the RMS
value of their next largest distortion component. SFDR
is usually measured in dBc with respect to the carrier
frequency amplitude or in dBFS with respect to the
DAC’s full-scale range. Depending on its test condition,
SFDR is observed within a predefined window or
to Nyquist.
Two-/Four-Tone Intermodulation
Distortion (IMD)
The two-/four-tone IMD is the ratio expressed in dBc (or
dBFS) of the worst 3rd-order (or higher) IMD products to
any output tone.
Adjacent Channel Leakage
Power Ratio (ACLR)
Commonly used in combination with WCDMA, ACLR
reflects the leakage power ratio in dB between the
measured powers within a channel relative to its adjacent channel. ACLR provides a quantifiable method of
determining out-of-band spectral energy and its influence on an adjacent channel when a bandwidth-limited
RF signal passes through a nonlinear device.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the
package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the
package regardless of RoHS status.
PACKAGE TYPEPACKAGE CODEOUTLINE NO.
LAND
PATTERN NO.
68 QFN (10mm x 10mm)G6800+4
21-0122
—
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the
package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the
package regardless of RoHS status.
MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________