MAX5885
3.3V, 16-Bit, 200Msps High Dynamic
Performance DAC with CMOS Inputs
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AVDD= DVDD= VCLK = 3.3V, AGND = DGND = CLKGND = 0V, external reference, V
REFIO
= 1.25V, RL= 50Ω, I
OUT
= 20mA,
f
CLK
= 200Msps, TA= T
MIN
to T
MAX
, unless otherwise noted. ≥+25°C guaranteed by production test, <+25°C guaranteed by design
and characterization. Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD, DVDD, VCLK to AGND................................-0.3V to +3.9V
AV
DD
, DVDD, VCLK to DGND ...............................-0.3V to +3.9V
AVDD, DVDD, VCLK to CLKGND ...........................-0.3V to +3.9V
AGND, CLKGND to DGND....................................-0.3V to +0.3V
DACREF, REFIO, FSADJ to AGND.............-0.3V to AVDD+ 0.3V
IOUTP, IOUTN to AGND................................-1V to AVDD+ 0.3V
CLKP, CLKN to CLKGND...........................-0.3V to VCLK + 0.3V
B0–B15, SEL0, PD, XOR to DGND.............-0.3V to DVDD+ 0.3V
Continuous Power Dissipation (T
A
= +70°C)
48-Pin QFN (derate 27mW/°C above +70°C)............2162.2mW
Thermal Resistance (
θJA) ..............................................+37°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C