MAXIM MAX5853 Technical data

General Description
The MAX5853 dual, 10-bit, 80Msps digital-to-analog converter (DAC) provides superior dynamic performance in wideband communication systems. The device inte­grates two 10-bit DAC cores, and a 1.24V reference. The converter supports single-ended and differential modes of operation. The MAX5853 dynamic performance is maintained over the entire 2.7V to 3.6V power-supply operating range. The analog outputs support a -1.0V to +1.25V compliance voltage.
The MAX5853 can also operate in interleave data mode to reduce the I/O pin count. This allows the converter to be updated on a single, 10-bit bus.
The MAX5853 features digital control of channel gain matching to within ±0.4dB in sixteen 0.05dB steps. Channel matching improves sideband suppression in analog quadrature modulation applications. The on­chip 1.24V bandgap reference includes a control amplifier that allows external full-scale adjustments of both channels through a single resistor. The internal ref­erence can be disabled and an external reference may be applied for high-accuracy applications.
The MAX5853 features full-scale current outputs of 2mA to 20mA and operates from a 2.7V to 3.6V single supply. The DAC supports three modes of power-control opera­tion: normal, low-power standby, and complete power­down. In power-down mode, the operating current is reduced to 1µA.
The MAX5853 is packaged in a 40-pin thin QFN with exposed paddle (EP) and is specified for the extended (-40°C to +85°C) temperature range.
Pin-compatible, higher speed, and lower resolution versions are also available. Refer to the MAX5854 (10-bit, 165Msps), the MAX5852** (8-bit, 165Msps), and the MAX5851** (8-bit, 80Msps) data sheets for more information. See Table 4 at the end of the data sheet.
Applications
Communications
SatCom, LMDS, MMDS, HFC, DSL, WLAN, Point-to-Point Microwave Links
Wireless Base Stations
Quadrature Modulation
Direct Digital Synthesis (DDS)
Instrumentation/ATE
Features
10-Bit, 80Msps Dual DAC
Low Power
77mW with IFS= 5mA at f
CLK
= 80MHz
2.7V to 3.6V Single Supply
Full Output Swing and Dynamic Performance at
2.7V Supply
Superior Dynamic Performance
78dBc SFDR at f
OUT
= 20MHz
Programmable Channel Gain Matching
Integrated 1.24V Low-Noise Bandgap Reference
Single-Resistor Gain Control
Interleaved Data Mode
Single-Ended and Differential Clock Input Modes
Miniature 40-Pin Thin QFN Package, 6mm x 6mm
EV Kit Available—MAX5854 EV Kit
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-3196; Rev 0; 2/04
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
E
V
A
L
U
A
T
I
O
N
K
I
T
A
V
A
I
L
A
B
L
E
PART TEMP RANGE PIN-PACKAGE
MAX5853ETL -40°C to +85°C
40 Thin QFN-EP*
40 36373839
EP
18
21
23
22
24
25
19 2016 17
6
5
4
3
2
1
7
8
9
10
11
12
13
14
15
26
27
28
29
30
3132
33
3435
DA0
DB8
AGND
MAX5853
THIN QFN
TOP VIEW
AVDDOUTPA
OUTNA
AGND
OUTPB
OUTNB
AV
DD
REFR
REFO
DB9
DB6
DB7
DV
DD
DB5
DB4
DGND
DB2
DB3
CV
DD
CGND
CLK
CV
DD
CLKXN
CLKXP
DCE
CW
DB0
DB1
DA1
DA2/G0
DA3/G1
DA4/G2
DA5/G3
DA6/REN
DA7/IDE
DA8/DACEN
DA9/PD
Pin Configuration
*EP = Exposed paddle.
**Future product—contact factory for availability.
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 80Msps, differential clock, external reference, V
REF
= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, T
A
= T
MIN
to T
MAX
, unless otherwise noted. TA ≥ +25°C, guaranteed by produc-
tion test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
AVDDto AGND .........................................................-0.3V to +4V
DV
DD
to DGND.........................................................-0.3V to +4V
CV
DD
to CGND.........................................................-0.3V to +4V
AV
DD
to DVDD.............................................................-4V to +4V
AGND to DGND.....................................................-0.3V to +0.3V
AGND to CGND.....................................................-0.3V to +0.3V
DGND to CGND ....................................................-0.3V to +0.3V
DA9–DA0, DB9–DB0,
CW, DCE to DGND ...............-0.3V to +4V
CLK to CGND ..........................................-0.3V to (CV
DD
+ 0.3V)
CLKXN, CLKXP to CGND.........................................-0.3V to +4V
REFR, REFO to AGND .............................-0.3V to (AV
DD
+ 0.3V)
OUTPA, OUTNA to AGND..........(AV
DD
- 4.8V) to (AVDD+ 0.3V)
OUTPB, OUTNB to AGND..........(AV
DD
- 4.8V) to (AVDD+ 0.3V)
Maximum Current into Any Pin
(excluding power supplies) ..........................................±50mA
Continuous Power Dissipation (T
A
= +70°C)
40-Pin Thin QFN (derate 26.3mW/°C above +70°C)....2105mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
CONDITIONS
UNITS
STATIC PERFORMANCE
Resolution N 10 Bits
Integral Nonlinearity INL RL = 0
LSB
Differential Nonlinearity DNL Guaranteed monotonic, RL = 0
LSB
Offset Error V
OS
LSB
Internal reference (Note1)
Gain Error (See Also Gain Error Definition Section)
GE
External reference
%FSR
Internal reference
Gain-Error Temperature Drift
External reference
ppm/°C
DYNAMIC PERFORMANCE
f
OUT
= 10MHz
78
f
OUT
= 20MHz 78
f
CLK
= 80MHz,
A
OUT
= -1dBFS
f
OUT
= 30MHz 72
f
CLK
= 44MHz,
A
OUT
= -1dBFS
f
OUT
= 10MHz 78
Spurious-Free Dynamic Range to Nyquist
SFDR
f
CLK
= 25MHz,
A
OUT
= -1dBFS
f
OUT
= 1MHz 79
dBc
f
CLK
= 80MHz, f
OUT
= 10MHz,
A
OUT
= -1dBFS, span = 10MHz
85
f
CLK
= 65MHz, f
OUT
= 5MHz,
A
OUT
= -1dBFS, span = 2.5MHz
82
Spurious-Free Dynamic Range Within a Window
SFDR
f
CLK
= 25MHz, f
OUT
= 1MHz,
A
OUT
= -1dBFS, span = 2MHz
82
dBc
Multitone Power Ratio to Nyquist
MTPR
8 tones at 400kHz spacing, f
CLK
= 78MHz,
f
OUT
= 15MHz to 18.2MHz
74 dBc
SYMBOL
MIN TYP MAX
-1.0 ±0.25 +1.0
-0.5 ±0.2 +0.5
-0.5 ±0.1 +0.5
-11.0 ±1.5 +6.8
-6.25 ±0.7 +4.10
±150
±100
69.5
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 80Msps, differential clock, external reference, V
REF
= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, T
A
= T
MIN
to T
MAX
, unless otherwise noted. TA ≥ +25°C, guaranteed by produc-
tion test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
CONDITIONS
UNITS
Multitone Spurious-Free Dynamic Range Within a Window
8 tones at 811kH z sp aci ng , f
C LK
= 80M H z,
76 dBc
f
OUT
= 10MHz -76
f
OUT
= 20MHz -75
f
CLK
= 80MHz,
A
OUT
= -1dBFS
f
OUT
= 30MHz -70
f
CLK
= 44MHz,
A
OUT
= -1dBFS
f
OUT
= 10MHz -76
Total Harmonic Distortion to Nyquist (2nd- Through 8th-Order Harmonics Included)
THD
f
CLK
= 25MHz,
A
OUT
= -1dBFS
f
OUT
= 1MHz -76
dBc
Output Channel-to-Channel Isolation
f
OUT
= 10MHz 90 dB
Channel-to-Channel Gain Mismatch
f
OUT
= 10MHz, G[3:0] = 1000
dB
Channel-to-Channel Phase Mismatch
f
OUT
= 10MHz
Degrees
f
CLK
= 80MHz, f
OUT
= 5MHz, I
FS
= 20mA 62
Signal-to-Noise Ratio to Nyquist SNR
f
CLK
= 80MHz, f
OUT
= 5MHz, I
FS
= 5mA 62
dB
Interleaved mode disabled, IDE = 0 80
Maximum DAC Conversion Rate
f
DAC
Interleaved mode enabled, IDE = 1 80
Msps
Glitch Impulse 5
pV-s
Output Settling Time t
S
To ±0.1% error band (Note 3) 12 ns
Output Rise Time 10% to 90% (Note 3) 2.2 ns
Output Fall Time 90% to 10% (Note 3) 2.2 ns
ANALOG OUTPUT
Full-Scale Output Current Range
I
FS
220mA
Output Voltage Compliance Range
V
Output Leakage Current Shutdown or standby mode -5 +5 µA
REFERENCE
Internal-Reference Output Voltage
V
REFO
REN = 0
V
Internal-Reference Supply Rejection
AV
DD
varied from 2.7V to 3.6V 0.5
mV/V
Internal-Reference Output­Voltage Temperature Drift
REN = 0
ppm/°C
SYMBOL
f
OU T
TCV
REFO
= 10.8M H z to 17.2M H z, sp an = 15M H z
MIN TYP MAX
0.025
0.05
-1.00 +1.25
1.13 1.24 1.32
±50
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 80Msps, differential clock, external reference, V
REF
= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, T
A
= T
MIN
to T
MAX
, unless otherwise noted. TA ≥ +25°C, guaranteed by produc-
tion test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
CONDITIONS
UNITS
Internal-Reference Output Drive Capability
REN = 0 50 µA
External-Reference Input Voltage Range
REN = 1
1.2
V
Current Gain
32
mA/mA
LOGIC INPUTS (DA9–DA0, DB9DB0, CW)
Digital Input-Voltage High V
IH
V
Digital Input-Voltage Low V
IL
0.3 x V
Digital Input Current I
IN
-1 +1 µA
Digital Input Capacitance C
IN
3pF
SINGLE-ENDED CLOCK INPUT/OUTPUT AND DCE INPUT (CLK, DCE)
Digital Input-Voltage High V
IH
DCE = 1
0.65 x V
Digital Input-Voltage Low V
IL
DCE = 1
0.3 x V
Digital Input Current I
IN
DCE = 1 -1 +1 µA
Digital Input Capacitance C
IN
DCE = 1 3 pF
Digital Output-Voltage High V
OH
DCE = 0, I
SOURCE
= 0.5mA, Figure 1
V
Digital Output-Voltage Low V
OL
DCE = 0, I
SINK
= 0.5mA, Figure 1
V
DIFFERENTIAL CLOCK INPUTS (CLKXP/CLKXN)
Differential Clock Input Internal Bias
CV
DD
/ 2 V
Differential Clock Input Swing 0.5 V
Clock Input Impedance Measured single ended 5 k
POWER REQUIREMENTS
Analog Power-Supply Voltage AV
DD
2.7 3 3.6 V
Digital Power-Supply Voltage DV
DD
2.7 3 3.6 V
Clock Power-Supply Voltage CV
DD
2.7 3 3.6 V
I
FS
= 20mA (Note 2), single-ended clock
mode
46
I
FS
= 2mA (Note 2), single-ended clock
mode
5
Analog Supply Current I
AVDD
5
mA
SYMBOL
MIN TYP MAX
IFS/I
REF
0.10
0.65 x DV
DD
CV
DD
0.9 x
CV
DD
1.32
DV
CV
0.1 x
CV
DD
DD
DD
I
= 20mA (Note 2), differential clock mode 43.2
FS
I
= 2mA (Note 2), differential clock mode
FS
43.2
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 80Msps, differential clock, external reference, V
REF
= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, T
A
= T
MIN
to T
MAX
, unless otherwise noted. TA ≥ +25°C, guaranteed by produc-
tion test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
CONDITIONS
UNITS
I
FS
= 20mA (Note 2), single-ended clock
mode
3.4 4
Digital Supply Current I
DVDD
3.4
mA
Single-ended clock mode (DCE = 1) (Note 2)
Clock Supply Current I
CVDD
Differential clock mode (DCE = 0) (Note 2)
mA
Total Standby Current
I
AVDD
+ I
DVDD
+ I
CVDD
3.1 3.7 mA
Total Shutdown Current I
SHDNIAVDD
+ I
DVDD
+ I
CVDD
A
191
Single-ended clock mode (DCE = 1)
I
FS
= 2mA (Note 2) 58
Differential clock mode (DCE = 0)
I
FS
= 2mA (Note 2) 75
Standby 9.3
Total Power Dissipation P
TOT
Shutdown
mW
TIMING CHARACTERISTICS (Figures 5 and 6)
Propagation Delay 1
Clock
cycles
1.2
DAC Data to CLK Rise/Fall Setup Time
t
DCS
Differential clock mode (DCE = 0) (Note 4) 2.7
ns
0.8
DAC Data to CLK Rise/Fall Hold Time
t
DCH
Differential clock mode (DCE = 0) (Note 4)
ns
Control Word to CW Rise Setup Time
t
CS
2.5 ns
Control Word to CW Rise Hold Time
t
CW
2.5 ns
CW High Time t
CWH
5ns
CW Low Time t
CWL
5ns
SYMBOL
I
= 20mA (Note 2), differential clock mode
FS
I
STANDBY
I
= 20mA (Note 2) 173
FS
I
= 20mA (Note 2) 190
FS
S i ng l e- end ed cl ock m od e ( D CE = 1) ( N ote 4)
S i ng l e- end ed cl ock m od e ( D CE = 1) ( N ote 4)
MIN TYP MAX
11.1 13.5
16.7
11.1
0.003
-0.5
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 80Msps, differential clock, external reference, V
REF
= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, T
A
= T
MIN
to T
MAX
, unless otherwise noted. TA ≥ +25°C, guaranteed by produc-
tion test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
CONDITIONS
UNITS
DACEN = 1 to V
OUT
Stable Time
(Coming Out of Standby)
t
STB
s
PD = 0 to V
OUT
Stable Time
(Coming Out of Power-Down)
t
SHDN
µs
Maximum Clock Frequency at CLKXP/CLKXN Input
f
CLK
80
MHz
Clock High Time t
CXH
CLKXP or CLKXN input 3 ns
Clock Low Time t
CXL
CLKXP or CLKXN input 3 ns
CLKXP Rise to CLK Output Rise Delay
t
CDH
DCE = 0 2.7 ns
CLKXP Fall to CLK Output Fall Delay
t
CDL
DCE = 0 2.7 ns
Note 1: Including the internal reference voltage tolerance and reference amplifier offset. Note 2: f
DAC
= 80Msps, f
OUT
= 10MHz.
Note 3: Measured single ended with 50load and complementary output connected to ground. Note 4: Guaranteed by design, not production tested.
TO OUTPUT
PIN
5pF
0.5mA
0.5mA
1.6V
Figure 1. Load Test Circuit for CLK Outputs
SYMBOL
MIN TYP MAX
500
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