MAXIM MAX5852 Technical data

General Description
The MAX5852 dual, 8-bit, 165Msps digital-to-analog converter (DAC) provides superior dynamic performance in wideband communication systems. The device inte­grates two 8-bit DAC cores, and a 1.24V reference. The MAX5852 supports single-ended and differential modes of operation. The dynamic performance is maintained over the entire 2.7V to 3.6V power-supply operating range. The analog outputs support a -1.0V to +1.25V compliance voltage.
The MAX5852 can operate in interleaved data mode to reduce the I/O pin count. This allows the converter to be updated on a single, 8-bit bus.
The MAX5852 features digital control of channel gain matching to within ±0.4dB in sixteen 0.05dB steps. Channel matching improves sideband suppression in analog quadrature modulation applications. The on­chip 1.24V bandgap reference includes a control amplifier that allows external full-scale adjustments of both channels through a single resistor. The internal ref­erence can be disabled and an external reference may be applied for high-accuracy applications.
The MAX5852 features full-scale current outputs of 2mA to 20mA and operates from a 2.7V to 3.6V single sup­ply. The DAC supports three modes of power-control operation: normal, low-power standby, and complete power-down. In power-down mode, the operating current is reduced to 1µA.
The MAX5852 is packaged in a 40-pin thin QFN with exposed paddle (EP) and is specified for the extended (-40°C to +85°C) temperature range.
Pin-compatible, lower speed, and higher resolution ver­sions are also available. Refer to the MAX5853 (10 bit, 80Msps), the MAX5851 (8 bit, 80Msps), and the MAX5854 (10 bit, 165Msps) data sheets for more infor­mation. See Table 4.
Applications
Communications
VSAT, LMDS, MMDS, WLAN,
Point-to-Point Microwave Links Wireless Base Stations Quadrature Modulation Direct Digital Synthesis (DDS) Instrumentation/ATE
Features
8-Bit, 165Msps Dual DACLow Power
190mW with IFS= 20mA at f
CLK
= 165MHz
2.7V to 3.6V Single Supply Full Output Swing and Dynamic Performance at
2.7V Supply
Superior Dynamic Performance
67dBc SFDR at f
OUT
= 40MHz
Programmable Channel Gain MatchingIntegrated 1.24V Low-Noise Bandgap ReferenceSingle-Resistor Gain ControlInterleaved Data ModeSingle-Ended and Differential Clock Input ModesMiniature 40-Pin Thin QFN Package, 6mm x 6mmEV Kit Available—MAX5852 EV Kit
MAX5852
Dual, 8-Bit, 165Msps, Current-Output DAC
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-3232; Rev 0; 4/04
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
PART TEMP RANGE PIN-PACKAGE
MAX5852ETL -40°C to +85°C
40 Thin QFN-EP*
40 36373839
EP
18
21
23 22
24
25
19 2016 17
6
5
4
3
2
1
7 8 9 10
11
12
13
14
15
26
27
28
29
30
3132
33
3435
N.C.
DB6
AGND
MAX5852
THIN QFN
TOP VIEW
AVDDOUTPA
OUTNA
AGND
OUTPB
OUTNB
AV
DD
REFR
REFO
DB7
DB4
DB5
DV
DD
DB3
DB2
DGND
DB0
DB1
CV
DD
CGND CLK CV
DD
CLKXN CLKXP DCE CW N.C. N.C.
N.C.
DA0/G0
DA1/G1
DA2/G2
DA3/G3
DA4/REN
DA5/IDE
DA6/DACEN
DA7/PD
Pin Configuration
*EP = Exposed paddle.
MAX5852
Dual, 8-Bit, 165Msps, Current-Output DAC
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 165Msps, differential clock, external reference, V
REF
= 1.2V,
I
FS
= 20mA, output amplitude = 0dB FS, differential output, TA= T
MIN
to T
MAX
, unless otherwise noted. TA≥ +25°C guaranteed by
production test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
AVDDto AGND ...................................................... -0.3V to +4V
DV
DD
to DGND...................................................... -0.3V to +4V
CV
DD
to CGND...................................................... -0.3V to +4V
AV
DD
to DVDD.............................................................-4V to +4V
AV
DD
to CVDD.............................................................-4V to +4V
DV
DD
to CVDD.............................................................-4V to +4V
AGND to DGND.....................................................-0.3V to +0.3V
AGND to CGND.....................................................-0.3V to +0.3V
DGND to CGND ....................................................-0.3V to +0.3V
DA7–DA0, DB7–DB0,
CW, DCE to DGND ...............-0.3V to +4V
CLK to CGND ..........................................-0.3V to (CV
DD
+ 0.3V)
CLKXN, CLKXP to CGND.........................................-0.3V to +4V
REFR, REFO to AGND .............................-0.3V to (AV
DD
+ 0.3V)
OUTPA, OUTNA to AGND ..........(AV
DD
- 4.8V) to (AVDD+ 0.3V)
OUTPB, OUTNB to AGND..........(AV
DD
- 4.8V) to (AVDD+ 0.3V)
Maximum Current into Any Pin
(excluding power supplies)..........................................±50mA
Continuous Power Dissipation (T
A
= +70°C)
40-Pin QFN (derate 26.3mW/°C above +70°C) .........2105mW
Operating Temperature Range ..........................-40°C to +85°C
Storage Temperature Range ..............................65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
CONDITIONS
UNITS
STATIC PERFORMANCE
Resolution N 8 Bits Integral Nonlinearity INL RL = 0
LSB
Differential Nonlinearity DNL Guaranteed monotonic, RL = 0
LSB
Offset Error V
OS
LSB
Internal reference (Note1) -10
+8
Gain Error (See Also Gain Error Definition Section)
GE
External reference
%FSR
Internal reference
Gain-Error Temperature Drift
External reference
ppm/°C
DYNAMIC PERFORMANCE
f
OUT
= 10MHz
67
f
OUT
= 20MHz 66
f
CLK
= 165MHz,
A
OUT
= -1dBFS
f
OUT
= 40MHz 67
f
OUT
= 10MHz 67
f
OUT
= 20MHz 67
f
CLK
= 100MHz,
A
OUT
= -1dBFS
f
OUT
= 30MHz 66
Spurious-Free Dynamic Range to Nyquist
SFDR
f
CLK
= 25MHz,
A
OUT
= -1dBFS
f
OUT
= 1MHz 64
dBc
f
CLK
= 165MHz, f
OUT
= 10MHz,
A
OUT
= -1dBFS, span = 10MHz
68
f
CLK
= 100MHz, f
OUT
= 5MHz,
A
OUT
= -1dBFS, span = 4MHz
70
Spurious-Free Dynamic Range Within a Window
SFDR
f
CLK
= 25MHz, f
OUT
= 1MHz,
A
OUT
= -1dBFS, span = 2MHz
67
dBc
Multitone Power Ratio to Nyquist
MTPR
8 tones at 400kHz spacing, f
CLK
= 78MHz,
f
OUT
= 15MHz to 18.2MHz
63 dBc
SYMBOL
MIN TYP MAX
-0.25 ±0.05 +0.25
-0.15 ±0.05 +0.15
-0.1 ±0.02 +0.1 ±1.5
-5.5 ±0.7 +5.0
±150 ±100
64.3
MAX5852
Dual, 8-Bit, 165Msps, Current-Output DAC
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 165Msps, differential clock, external reference, V
REF
= 1.2V,
I
FS
= 20mA, output amplitude = 0dB FS, differential output, TA= T
MIN
to T
MAX
, unless otherwise noted. TA≥ +25°C guaranteed by
production test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
CONDITIONS
UNITS
Multitone Spurious-Free Dynamic Range Within a Window
8 tones at 2.1M H z sp aci ng , f
C LK
= 165M H z, f
OU T
= 28.3M H z to 45.2M H z,
sp an = 50M H z
61 dBc
f
OUT
= 10MHz -71
f
OUT
= 20MHz -72
f
CLK
= 165MHz,
A
OUT
= -1dBFS
f
OUT
= 40MHz -72
f
OUT
= 10MHz -71
f
OUT
= 20MHz -74
f
CLK
= 100MHz,
A
OUT
= -1dBFS
f
OUT
= 30MHz -69
Total Harmonic Distortion to Nyquist (2nd- Through 8th-Order Harmonics Included)
THD
f
CLK
= 25MHz,
A
OUT
= -1dBFS
f
OUT
= 1MHz -69
dBc
Output Channel-to-Channel Isolation
f
OUT
= 10MHz 90 dB
Channel-to-Channel Gain Mismatch
f
OUT
= 10MHz, G[3:0] = 1000
dB
Channel-to-Channel Phase Mismatch
f
OUT
= 10MHz
Degrees
f
C LK
= 165M Hz, f
OU T
= 10M H z, I
FS
= 20m A
f
CLK
= 165MHz, f
OUT
= 10MHz, I
FS
= 5mA
f
CLK
= 65MHz, f
OUT
= 10MHz, I
FS
= 20mA 51
Signal-to-Noise Ratio to Nyquist
SNR
f
CLK
= 65MHz, f
OUT
= 10MHz, I
FS
= 5mA 51
dB
Interleaved mode disabled, IDE = 0
Maximum DAC Conversion Rate
f
DAC
Interleaved mode enabled, IDE = 1
Msps
Glitch Impulse 5
pV•s
Output Settling Time t
S
To ±0.1% error band (Note 3) 12 ns Output Rise Time 10% to 90% (Note 3) 2.2 ns Output Fall Time 90% to 10% (Note 3) 2.2 ns
ANALOG OUTPUT
Full-Scale Output Current Range
I
FS
220mA
Output Voltage Compliance Range
V
Output Leakage Current Shutdown or standby mode -5 +5 µA
REFERENCE
Internal-Reference Output Voltage
V
REFO
REN = 0
V
SYMBOL
MIN TYP MAX
165 200
82.5 100
-1.00 +1.25
1.13 1.24 1.32
0.025
0.05
50.5
50.5
MAX5852
Dual, 8-Bit, 165Msps, Current-Output DAC
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 165Msps, differential clock, external reference, V
REF
= 1.2V,
I
FS
= 20mA, output amplitude = 0dB FS, differential output, TA= T
MIN
to T
MAX
, unless otherwise noted. TA≥ +25°C guaranteed by
production test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
CONDITIONS
UNITS
Internal-Reference Supply Rejection
AV
DD
varied from 2.7V to 3.6V 0.5
mV/V
Internal-Reference Output­Voltage Temperature Drift
REN = 0
ppm/°C
Internal-Reference Output Drive Capability
REN = 0 50 µA
External-Reference Input Voltage Range
REN = 1
1.2
V
Current Gain
32
mA/mA
LOGIC INPUTS (DA7–DA0, DB7–DB0, CW)
Digital Input-Voltage High V
IH
0.65 x V
Digital Input-Voltage Low V
IL
0.3 x V
Digital Input Current I
IN
-1 +1 µA
Digital Input Capacitance C
IN
3pF
SINGLE-ENDED CLOCK INPUT/OUTPUT AND DCE INPUT (CLK, DCE)
Digital Input-Voltage High V
IH
DCE = 1
0.65 x V
Digital Input-Voltage Low V
IL
DCE = 1
0.3 x V
Digital Input Current I
IN
DCE = 1 -1 +1 µA
Digital Input Capacitance C
IN
DCE = 1 3 pF
Digital Output-Voltage High V
OH
DCE = 0, I
SOURCE
= 0.5mA, Figure 1
V
Digital Output-Voltage Low V
OL
DCE = 0, I
SINK
= 0.5mA, Figure 1
0.1 x V
DIFFERENTIAL CLOCK INPUTS (CLKXP/CLKXN) Differential Clock Input Internal
Bias
V
Differential Clock Input Swing 0.5 V Clock Input Impedance Measured single ended 5 k
POWER REQUIREMENTS
Analog Power-Supply Voltage AV
DD
2.7 3 3.6 V
Digital Power-Supply Voltage DV
DD
2.7 3 3.6 V
Clock Power-Supply Voltage CV
DD
2.7 3 3.6 V
SYMBOL
MIN TYP MAX
TCV
REFO
IFS/I
REF
±50
0.10
DV
DD
CV
DD
0.9 x
CV
DD
1.32
DV
DD
CV
DD
CV
DD
CVDD/2
MAX5852
Dual, 8-Bit, 165Msps, Current-Output DAC
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 165Msps, differential clock, external reference, V
REF
= 1.2V,
I
FS
= 20mA, output amplitude = 0dB FS, differential output, TA= T
MIN
to T
MAX
, unless otherwise noted. TA≥ +25°C guaranteed by
production test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
I
FS
= 20mA, single-ended clock mode
46
I
FS
= 20mA, differential clock mode
I
FS
= 2mA, single-ended clock mode 5
Analog Supply Current (Note 2) I
AVDD
I
FS
= 2mA, differential clock mode 5
mA
I
FS
= 20mA, single-ended clock mode 6 6.9
Digital Supply Current (Note 2) I
DVDD
I
FS
= 20mA, differential clock mode 6
mA
Single-ended clock mode (DCE = 1)
Clock Supply Current (Note 2) I
CVDD
Differential clock mode (DCE = 0)
mA
Total Standby Current
I
AVDD
+ I
DVDD
+ I
CVDD
3.1 3.7 mA
Total Shutdown Current I
SHDNIAVDD
+ I
DVDD
+ I
CVDD
A
I
FS
= 20mA
Single-ended clock mode (DCE = 1)
I
FS
= 2mA 74
I
FS
= 20mA
Differential clock mode (DCE = 0)
I
FS
= 2mA
Standby 9.3
Total Power Dissipation (Note 2)
P
TOT
Shutdown
mW
TIMING CHARACTERISTICS (Figure 5, Figure 6)
Propagation Delay 1
Clock
cycles
Single-ended clock mode (DCE = 1) 1.2
DAC Data to CLK Rise/Fall Setup Time (Note 4)
t
DCS
Differential clock mode (DCE = 0) 2.7
ns
Single-ended clock mode (DCE = 1) 0.8
DAC Data to CLK Rise/Fall Hold Time (Note 4)
t
DCH
Differential clock mode (DCE = 0)
ns
Control Word to CW Rise Setup Time
t
CS
2.5 ns
Control Word to CW Rise Hold Time
t
CW
2.5 ns
CW High Time t
CWH
5ns
CW Low Time t
CWL
5ns
DACEN = 1 to V
OUT
Stable Time
(Coming Out of Standby)
t
STB
s
I
STANDBY
-0.5
43.2
43.2
13.8 16.5
23.7
190 209
219 104
0.003
11.1
MAX5852
Dual, 8-Bit, 165Msps, Current-Output DAC
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, f
DAC
= 165Msps, differential clock, external reference, V
REF
= 1.2V,
I
FS
= 20mA, output amplitude = 0dB FS, differential output, TA= T
MIN
to T
MAX
, unless otherwise noted. TA≥ +25°C guaranteed by
production test. T
A
< +25°C guaranteed by design and characterization. Typical values are at TA= +25°C.)
PARAMETER
CONDITIONS
UNITS
PD = 0 to V
OUT
Stable Time
(Coming Out of Power-Down)
t
SHDN
µs
Maximum Clock Frequency at CLKXP/CLKXN Input
f
CLK
MHz
Clock High Time t
CXH
CLKXP or CLKXN input 1.5 ns
Clock Low Time t
CXL
CLKXP or CLKXN input 1.5 ns
CLKXP Rise to CLK Output Rise Delay
t
CDH
DCE = 0 2.7 ns
CLKXP Fall to CLK Output Fall Delay
t
CDL
DCE = 0 2.7 ns
Note 1: Including the internal reference voltage tolerance and reference amplifier offset. Note 2: f
DAC
= 165Msps, f
OUT
= 10MHz.
Note 3: Measured single-ended with 50load and complementary output connected to AGND. Note 4: Guaranteed by design, not production tested.
TO OUTPUT
PIN
5pF
0.5mA
0.5mA
1.6V
Figure 1. Load Test Circuit for CLK Outputs
SYMBOL
MIN TYP MAX
500
165 200
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