MAXIM MAX5026EUT User Manual
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MAX5026EUT
Rev. A
RELIABILITY REPORT
FOR
MAX5026EUT
PLASTIC ENCAPSULATED DEVICES
March 12, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by Reviewed by
Jim Pedicord Bryan J. Preeshl
Quality Assurance Quality Assurance
Reliability Lab Manager Executive Director
Conclusion
The MAX5026 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX5026 constant -frequency, pulse-width modulating (PWM), low-noise boost converter is intended for lowvoltage systems that often need a locally generated high voltage. This device is capable of generat ing low-noise, high
output voltages required for varactor diode biasing in TV tuners, set -top boxes, and PCI cable modems. The
MAX5026 operates from as low as 3V and switches at 500kHz.
The constant -frequency, current-mode PWM architecture provides for low output noise that is easy to filter. A 40V
lateral DMOS device is used as the internal power switch, making the devices ideal for boost converters up to 36V.
The MAX5026 adjustable version requires the use of external feedback resistors to set the output voltage.
B. Absolute Maximum Ratings
Item Rating
VCC to GND -0.3V to +12V
PGND to GND -0.1V to +0.1V
FB to GND -0.3V to (V CC + 0.3V)
SHDN to GND -0.3V to (V CC + 0.3V)
LX to GND -0.3V to +45V
Peak LX Current 600mA
Operating Temperature Range -40°C to +85°C
Junction Temperat ure +150°C
Storage Temperature Range -65°C to +165°C
Lead Temperature (soldering 10s) +300°C
Continuous Power Dissipation (TA = +70C)
6-PIN SOT23 696mW
Derates above +70°C
6-PIN SOT23 7.1mW/°C
II. Manufacturing Information
A. Description/Function: 500kHz, 36V Output, SOT23, PWM Step-Up DC-DC Converters
B. Process: BCD80
C. Number of Device Transistors: 365
D. Fabrication Location: Oregon, USA
E. Assembly Location: Malaysia
F. Date of Initial Production: April, 2001
III. Packaging Information
A. Package Type: 6-Pin SOT23
B. Lead Frame: Copper
C. Lead Finish: Solder Plate
D. Die Attach: Non-Conductive Epoxy
E. Bondwire: Gold (1 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: # 05-1301-0024
H. Flammability Rating: Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112: Level 1
IV. Die Information
A. Dimensions: 60 X 41 mils
B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect: Aluminum/Si (Si = 1%)
D. Backside Metallization: None
E. Minimum Metal Width: 3 microns (as drawn)
F. Minimum Metal Spacing: 3 microns (as drawn)
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Dielectric: SiO
2
I. Die Separation Method: Wafer Saw
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