MAXIM MAX4989 Technical data

General Description

The MAX4989 is a bidirectional 2-of-4 USB 2.0 cross­point switch. The MAX4989 features the low on-capaci­tance and low on-resistance necessary to switch USB

2.0 low-/full-/Hi-Speed signals at data rates up to
480Mbps. This device allows any 2-of-4 USB pairs to
be connected together and is configured through a
simple 3-input control logic interface.

The MAX4989 operates from a single +2.7V to +5.5V
supply and features an internal charge pump to permit
full rail-to-rail swing. This device also features a high­impedance shutdown mode to reduce supply current to
100nA (typ).

The MAX4989 is available in a 14-pin, 3mm x 3mm
TDFN package and operates over the extended -40°C
to +85°C temperature range.

Applications

Notebook Computers

Cell Phones

Features

o Single +2.7V to +5.5V Supply Voltage

o Low 1µA (typ) Supply Current

o -3dB Bandwidth: 1GHz (typ)

o Low 5Ω (typ) R

ON

o High-Impedance Shutdown Mode

o Logic Inputs Control Signal Routing

o +1.8V CMOS-Logic Compatible

o Ultra-Small 14-Pin, 3mm x 3mm, TDFN Package

MAX4989

USB 2.0 Hi-Speed 2-of-4 Crosspoint Switch

________________________________________________________________

Maxim Integrated Products

1

19-4206; Rev 0; 8/08

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

Ordering Information

+

Denotes a lead-free/RoHS-compliant package.

*

EP = Exposed pad.

Pin Configuration

EVALUATION KIT

AVAILABLE

EVALUATION KIT

AVAILABLE

PART TEMP RANGE

MAX4989ETD+ -40°C to +85°C

PACKAGE

14 TDFN-EP*

(3mm x 3mm)

PIN-

PKG

CODE

T1433-2

TOP VIEW

114

+

213

Y+

312

411

Z+

510

Z-

C0

69

78

*EP = EXPOSED PAD. CONNECT EP TO GROUND.

MAX4989

*EP

3mm x 3mm TDFN

W-Y-

W+

GNDGND

X+

X-

V

C2C1

CC

MAX4989

USB 2.0 Hi-Speed 2-of-4 Crosspoint Switch

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC= +2.7V to +5.5V, TA= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +3.3V, TA= +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial

.

(Voltages referenced to GND.)
V

CC

....................................................................... -0.3V to +6.0V

C_ ......................................................................... -0.3V to +6.0V

W_, X_, Y_, Z_ ........................................... -0.3V to (V

CC

+ 0.3V)

Continuous Current C_ .................................................... ±30mA

Continuous Current W_, X_, Y_, Z_................................ ±120mA

Peak Current W_, X_, Y_, Z_

(pulsed at 1ms, 10% duty cycle) .............................. ±240mA

Continuous Power Dissipation (T

A

= +70°C)

14-Pin TDFN (derate 24.4mW/°C above +70°C) ..... 1951mW

Junction-to-Case Thermal Resistance (Θ

JC

) (Note 1)

14-Pin TDFN ................................................................. 8°C/W

Junction-to-Ambient Thermal Resistance (Θ

JA

) (Note 1)

14-Pin TDFN ............................................................... 41°C/W

Operating Temperature Range ......................... -40°C to +85°C

Junction Temperature .................................................... +150°C

Storage Temperature Range ........................... -65°C to +150°C

Lead Temperature (soldering, 10s) ................................+300°C

)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Operating Power-Supply Range V

Supply Current I

Shutdown Supply Current I

Analog Signal Range

On-Resistance R

On-Resistance Match Between
Channels

On-Resistance Flatness R

Off-Leakage Current I

On-Leakage Current I

SHDN

V

W_

V

Y_,VZ_

ΔR

IN(OFF

IN(ON)

CC

CC

, VX_,

ON

ON

FLAT

Switch enabled

C1 = C2 = C3 = GND or V

VIN = +3.0V, I

= 10mA (Note 3) 5 9 Ω

OUT

VCC = +3.3V 1 3.5

= +5.5V 3 6.5

V

CC

CC

VCC = +3.3V, VIN = +1.5V,

= 10mA (Note 3)

I

OUT

VCC = +3.3V, VIN = 0V to VCC,

= 10mA (Notes 3, 4, 5)

I

OUT

VCC = +5.5V, VIN = 0V or VCC, V
or 0V or unconnected (Note 3)

VCC = +5.5V, VIN = 0V or VCC, V
unconnected (Note 3)

OUT

OUT

= V

=

AC PERFORMANCE (Note 4)

On-Channel -3dB Bandwidth BW RL = RS = 50Ω, VIN = 0dBm, Figure 1 1 GHz

Insertion Loss S

Off-Isolation (Note 3) Figure 1 V

Crosstalk V

ISO

CT

RL = RS = 50Ω, f = 10MHz 0.5 dB

12

f = 10MHz, VIN = 0dBm, RL = RS = 50Ω -43

f = 250MHz, VIN = 0dBm, RL = RS = 50Ω -15

f = 50MHz, VIN = 0dBm, RL = RS = 50Ω,
between adjacent pairs (Note 3), Figure 1

2.7 5.5 V

0V

CC

-1 +1 µA

-1 +1 µA

0.1 0.5 µA

CC

0.5 Ω

0.4 Ω

-50 dB

µA

V

dB

MAX4989

USB 2.0 Hi-Speed 2-of-4 Crosspoint Switch

_______________________________________________________________________________________ 3

Note 2: All devices are 100% production tested at TA= +25°C. All temperature limits are guaranteed by design.
Note 3: IN and OUT refer to input and output terminals (W_, X_, Y_, Z_) of any switch configuration.
Note 4: Not production tested. Guaranteed by design.
Note 5: Flatness is defined as the difference between the maximum and minimum value of on-resistance, as measured over specified

analog signal ranges.

ELECTRICAL CHARACTERISTICS (continued)

(VCC= +2.7V to +5.5V, TA= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +3.3V, TA= +25°C.) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DYNAMIC (Note 4)

Turn-On Time t

Turn-Off Time t

Propagation Delay t

Output Skew Between Switches t

PLH

SK(O)

Output Skew Same Switch t

Off-Capacitance C

On-Capacitance C

LOGIC INPUTS

Input Logic High V

Input Logic Low V

Input Logic Hysteresis V

Input Leakage Current I

ON

OFF

, t

SK(P)

OFF

ON

IH

IL

HYST

IN

VIN = +1.5V, RL = 300Ω, CL = 35pF,

= 0V to VCC, Figure 2

V

C_

VIN = +1.5V, RL = 300Ω, CL = 35pF,

= 0V to VCC, Figure 2

V

C_

PHLRL

= RS = 50Ω, Figure 3 120 ps

RL = RS = 50Ω, Figure 3 50 ps

RL = RS = 50Ω, Figure 3 50 ps

f = 1MHz, V

f at -3dB = 240MHz, V
V

= 0.5V

IN

f = 1MHz, V

f at -3dB = 240MHz, V

= 0.5V

V

IN

= 0V, VIN = 0.5V

BIAS

P-P

= 0V, VIN = 0.5V

BIAS

P-P

BIAS

BIAS

P-P

= 0V,

P-P

= 0V,

1.7 V

VCC = +5.5V, VC_= GND or V

CC

-1 +1 µA

15 100 µs

26µs

13.5

4

6pF

0.5 V

75 mV

pF