MAXIM MAX4888B, MAX4888C Technical data
19-5706; Rev 0; 12/10
EVALUATION KIT
AVAILABLE
Up to 8.0Gbps Dual Passive Switches
General Description
The MAX4888B/MAX4888C dual double-pole/doublethrow (2 x DPDT), high-speed passive switches are
ideal for switching two half-lanes of PCI ExpressM (PCIe)
data between two possible destinations. These devices
feature a dual digital control input to switch signal paths.
The MAX4888C is intended for use in systems where
both the input and output are capacitively coupled (e.g.,
SAS, SATA, XAUI, and PCIe) and provides a 10FA (typ)
source current and a 60kI (typ) internal biasing resistor
to GND at the AOUT_ and BOUT_ pins.
The devices are fully specified to operate from a single
+3.3V (typ) power supply. Both devices are available
in an industry-standard 3.5mm x 5.5mm, 28-pin TQFN
package. They operate over the -40NC to +85NC extended temperature range.
Applications
Desktop PCs
Notebook PCs
Servers
Typical Operating Circuit
Features
S Single +3.3V Power-Supply Voltage
S Supports PCIe Gen I, Gen II, and Gen III Data
Rates
S Supports Up To and Including 6.0Gbps SAS/SATA
Signals
S Supports Other High-Speed Interfaces (e.g., XAUI)
S Superior Bandwidth Return Loss
S Small, 3.5mm x 5.5mm, 28-Pin TQFN Package
Ordering Information
PART TEMP RANGE PIN-PACKAGE
MAX4888BETI+
MAX4888CETI+
-40NC to +85NC
-40NC to +85NC
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
28 TQFN-EP*
28 TQFN-EP*
MAX4888B/MAX4888C
V
CC
AOUTA+
PCIe HOST
SAS HOST
NOTE: CAPACITIVE COUPLING WAS OMITTED TO SIMPLIFY ILLUSTRATION.
AOUTABOUTA+
BOUTA-
MAX4888C
AOUTB+
AOUTBBOUTB+
BOUTB-
GND
PCI Express is a registered trademark of PCI-SIG Corp.
CONNECTION SELECT
SEL
SELB
AIN+
AINBIN+
BIN-
SEL
SELB
AIN+
AINBIN+
BIN-
V
CC
MAX4888C
GND
AOUTA+
AOUTA-
BOUTA+
BOUTA-
AOUTB+
AOUTB-
BOUTB+
BOUTB-
PCIe DEVICE
SAS DEVICE
_______________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Up to 8.0Gbps Dual Passive Switches
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
VCC ..........................................................................-0.3V to +4V
SEL, SELB, AIN+, AIN-, BIN+, BIN-, AOUTA+,
AOUTA-, AOUTB+, AOUTB-, BOUTA+,
BOUTA-, BOUTB+, BOUTB- (Note 1) .. -0.3V to (VCC + 0.3V)
Continuous Current (AIN_ to AOUTA_/AOUTB_,
BIN_ to BOUTA_/BOUTB_) .......................................... Q15mA
Peak Current (AIN_ to AOUTA_/AOUTB_,
BIN_ to BOUTA_/BOUTB_)
(pulsed at 1ms, 10% duty cycle) ................................ Q70mA
Note 1: Signals on SEL, SELB, AIN_, BIN _, AOUTA_, AOUTB_, BOUTA_, and BOUTB_ exceeding VCC or GND are clamped by
internal diodes. Limit forward-diode current to maximum current rating.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (qJA) ..........35°C/W
Junction-to-Case Thermal Resistance (qJC) .................2°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
MAX4888B/MAX4888C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Continuous Current (SEL, SELB) .................................... Q10mA
Peak Current (SEL, SELB)
(pulsed at 1ms, 10% duty cycle) ................................ Q10mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 28.6mW/NC above +70NC)..................2286mW
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VCC = 3.3V Q10%, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 3.3V, TA = +25NC, unless otherwise
noted.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC PERFORMANCE
Analog-Signal Range V
On-Resistance R
On-Resistance Match
Between Channels
On-Resistance Flatness R
_OUTA_ or _OUTB_
Off-Leakage Current
AIN_, BIN_ On-Leakage Current
DR
FLAT(ON)
I_
OUTA_(OFF),
I_
OUTB_(OFF)
I
AIN_(ON),
I
BIN_(ON)
Output Short-Circuit Current
Output Open-Circuit Voltage
INPUT
ON
ON
AIN_, BIN_, AOUTA_, BOUTA_, AOUTB_,
BOUTB_
VCC = +3.0V, I
V_
OUTA_
= V_
VCC = +3.0V, I
V_
OUTA_
= V_
VCC = +3.0V, I
V_
OUTA_
= V_
VCC = +3.6V, V
V
_OUTA_
or V
= I
AIN_
BIN_
= 0V, 1.2V
OUTB_
= I
AIN_
BIN_
= 0V (Note 4)
OUTB_
= I
AIN_
BIN_
= 0V, 1.2V (Note 5)
OUTB_
= V
AIN_
= 1.2V, 0V
_OUTB_
= 15mA,
= 15mA,
= 15mA,
BIN_
= 0V, 1.2V;
(MAX4888B)
VCC = +3.6V , V
V
_OUTA_
or V
AIN_
_OUTB_
= V
= V
= 0V, 1.2V;
BIN_
= V
AIN_
BIN_
or
unconnected (MAX4888B)
All other ports are unconnected
(MAX4888C)
All other ports are unconnected
(MAX4888C)
-0.3
6.4 8.4
0.2 1.5
0.3 1
-1 +1
-1 +1
5 15
0.2 0.6 0.9 V
VCC -
1.8
V
I
I
I
FA
FA
FA
2
Up to 8.0Gbps Dual Passive Switches
ELECTRICAL CHARACTERISTICS (continued)
(VCC = 3.3V Q10%, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 3.3V, TA = +25NC, unless otherwise
noted.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
AC PERFORMANCE
Switch Turn-On Time t
Switch Turn-Off Time t
Propagation Delay t
Output Skew Between Pairs t
Output Skew Between Same
Pair
Differential Return Loss (Note 6) S
Differential Insertion Loss S
Bandwidth S
Differential Crosstalk (Note 6) S
Differential Off-Isolation (Note 6) S
CONTROL INPUT
Input Logic-High V
Input Logic-Low V
Input Logic Hysteresis V
POWER SUPPLY
Power-Supply Range V
VCC Supply Current I
Note 3: All units are 100% production tested at TA = +85NC. Limits over the operating temperature range are guaranteed by
design and characterization and are not production tested.
Note 4: DRON = R
Note 5: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the
specified analog-signal range.
Note 6: Guaranteed by design; not production tested.
ON(MAX)
- R
ON(MIN)
ON_SEL
OFF_SEL
PD
SK1
t
SK2
DD11
DD21
DD12/SDD21
DDCTK
DD21_OFF
IH
IL
HYST
CC
CC
.
ZS = ZL = 50I
ZS = ZL = 50I, Figure 1, measured at
500MHz
ZS = ZL = 50I, Figure 2, measured at
500MHz
ZS = ZL = 50I, Figure 2, measured at
500MHz
ZS = ZL = 50I, Figure2
0Hz < f P 2.8GHz
2.8GHz < f P 5.0GHz
5.0GHz < f P 8.0GHz
f > 8.0GHz -1
Table 1 dB
0Hz < f P 2.5GHz
2.5GHz < f P 5.0GHz
5.0GHz < f P 8.0GHz
f > 8.0GHz -35
0Hz < f P 2.5GHz
2.5GHz < f P 5.0GHz
5.0GHz < f P 8.0GHz
f > 8.0GHz -12
-14
-8
-5
1.4 V
3.0 3.6 V
65 ns
7 ns
43 ps
8 ps
10 ps
dB
8 GHz
-30
-25
-35
-15
-12
-12
0.6 V
130 mV
1 mA
dB
dB
MAX4888B/MAX4888C
3
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