The MAX4721/MAX4722/MAX4723 low-voltage, low onresistance (RON), dual single-pole/single throw (SPST)
analog switches operate from a single +1.8V to +5.5V
supply. These devices are designed for USB 1.1 and
audio switching applications.
The MAX4721/MAX4722/MAX4723 feature 4.5Ω R
ON
(max) with 1.2Ω flatness and 0.3Ω matching between
channels. These new switches feature guaranteed
operation from +1.8V to +5.5V and are fully specified at
3V and 5V. These switches offer break-before-make
switching (1ns) with tON<80ns and t
OFF
<40ns at
+2.7V. The digital logic inputs are +1.8V logic compatible with a +2.7V to +3.6V supply.
These switches are packaged in a chip-scale package
(UCSP™), significantly reducing the required PC board
area. The chip occupies only a 1.52mm ✕ 1.52mm area
and has a 3 ✕ 3 bump array with a bump pitch of
0.5mm. These switches are also available in an 8-pin
µMAX package.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
UCSP is a trademark of Maxim Integrated Products, Inc.
Note: UCSP package requires special solder temperature profile described in the Absolute Maximum Ratings section.
*UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. See the UCSP reliability notice in the UCSP Reliability section of this data sheet for
more information.
(V+ = +2.7V to +3.6V, VIH= +1.4V, VIL= +0.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +3.0V,
T
A
= +25°C, unless otherwise noted.) (Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All Voltages Referenced to GND, Unless Otherwise Noted.)
V+, IN_...................................................................-0.3V to +6.0V
COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)
Continuous Current COM_, NO_, NC_ ...........................±100mA
Peak Current COM_, NO_, NC_
(pulsed at 1ms, 10% duty cycle)................................±200mA
Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi-
mum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
The MAX4721/MAX4722/MAX4723 dual SPST analog
switches operate from a single +1.8V to +5.5V supply.
The MAX4721/MAX4722/MAX4723 offer excellent AC
characteristics, <0.5nA leakage current, less than 2ms
differential skew, and 15pF on-channel capacitance. All
of these devices are CMOS-logic compatible with railto-rail signal handling capability.
The MAX4721/MAX4722/MAX4723 are USB-compliant
switches that provide 4.5Ω (max) on-resistance, and
15pF on-channel capacitance to maintain signal integrity. At 12Mbps (USB full-speed data rate specification)
the MAX4721/MAX4722/MAX4723 introduce less than
2ns propagation delay between input and output signals and less than 0.5ns change in skew for the output
signals (see Figure 3 for more details).
The MAX4721 has two normally open (NO) switches, the
MAX4722 has two normally closed (NC) switches, and
the MAX4723 has one NO switch and one NC switch.
Applications Information
Digital Control Inputs
The MAX4721/MAX4722/MAX4723 logic inputs accept
up to +5.5V regardless of supply voltage. For example,
with a +3.3V supply, IN_ can be driven low to GND and
high to +5.5V allowing for mixing of logic levels in a
system. Driving the control logic inputs rail-to-rail minimizes power consumption. For a +3.0V supply voltage,
the logic thresholds are 0.5V (low) and 1.4V (high); for
a +5V supply voltage, the logic thresholds are 0.8V
(low) and 2.0V (high).
Analog Signal Levels
Analog signals that range over the entire supply voltage
(V+ to GND) are passed with very little change in on-resistance (see the Typical Operating Characteristics). The
switches are bidirectional, so the NO_, NC_, and COM_
pins can be either inputs or outputs.
Pin Description
PIN
MAX4721
UCSPµMAXUCSPµMAXUCSPµMAX
A13A13A13IN2Logic-Control Digital Input
A24A24A24GNDGround. Connect to digital ground.
A35—— — —NO2Analog-Switch Normally Open Terminal
B12B12B12COM1Analog-Switch Common Terminal
B36B36B36COM2Analog-Switch Common Terminal
C11——C11NO1Analog-Switch Normally Open Terminal
C28C28C28V+Positive Analog Supply
C37C37C37IN1Logic-Control Digital Input
——C11——NC1Analog-Switch Normally Closed Terminal
——A35A35NC2Analog-Switch Normally Closed Terminal
MAX4722MAX4723
NAME
FUNCTION
Power-Supply Bypassing
Power-supply bypassing improves noise margin and
prevents switching noise from propagating from the V+
supply to other components. A 0.1µF capacitor connected from V+ to GND is adequate for most applications.
Power-Supply Sequencing
and Overvoltage Protection
Caution: Do not exceed the absolute maximum ratings because stresses beyond the listed ratings may
cause permanent damage to the device.
UCSP Package Considerations
For general UCSP package information and PC layout
considerations, please refer to the Maxim Application
Note (Wafer-Level Chip-Scale Package).
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the
user’s assembly methods, circuit board material, and
usage environment. The user should closely review
these areas when considering use of a UCSP package.
Performance through Operating Life Test and Moisture
Resistance remains uncompromised as it is primarily
determined by the wafer-fabrication process.
Mechanical stress performance is a greater consideration for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered. Information on Maxim’s qualification plan, test
data, and recommendations are detailed in the UCSP
application note, which can be found on Maxim’s website at www.maxim-ic.com.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
MAX4721/MAX4722/MAX4723
4.5
Ω
Dual SPST Analog Switches in UCSP
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
8
b
EH
A1
A
ÿ 0.50±0.1
0.6±0.1
0.6±0.1
1
D
TOP VIEW
A2
e
FRONT VIEW
4X S
BOTTOM VIEW
c
L
SIDE VIEW
8
1
6∞
MILLIMETERS
MIN
0.050.15
0.250.36
0.130.18
2.953.05
2.953.05
4.78
0.41
MAX
-1.10
0.950.75
0.65 BSC
5.03
0.66
0.5250 BSC
8LUMAXD.EPS
6∞0∞
DIM
A
A1
A2
b
c
D
e
E
H
L
α
S
INCHES
MIN
-
0.002
0.030
0.010
0.005
0.116
0.0256 BSC
0.116
0.188
0.016
0∞
0.0207 BSC
MAX
0.043
0.006
0.037
0.014
0.007
0.120
0.120
0.198
0.026
α
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 8L uMAX/uSOP
REV.DOCUMENT CONTROL NO.APPROVAL
21-0036
1
J
1
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.