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MAX4719
Technical data
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MAXIM MAX4719 Technical data

General Description
The MAX4719 low-voltage, low on-resistance (RON), dual single-pole/double throw (SPDT) analog switch operates from a single +1.8V to +5.5V supply. The MAX4719 features 20Ω RON(max) with 1.2Ω flatness and 0.4Ω matching between channels. The switch offers break-before-make switching (1ns) with tON<80ns and t
OFF
<40ns at +2.7V. The digital logic inputs are +1.8V
logic compatible with a +2.7V to +3.6V supply.
The switch is packaged in a chip-scale package (UCSP™), significantly reducing the required PC board area. The chip occupies only a 2.0mm ✕ 1.50mm area and has a 4 ✕ 3 bump array with a bump pitch of
0.5mm. The MAX4719 is also available in a 10-pin µMAX package.
Applications
Cell Phones
Battery-Operated Equipment
Audio/Video-Signal Routing
Low-Voltage Data-Acquisition Systems
Sample-and-Hold Circuits
PDAs
Features
♦ -3dB Bandwidth: >300MHz
♦ Low 15pF On-Channel Capacitance
♦ Single-Supply Operation from +1.8V to +5.5V
♦ 20Ω RON(max) Switch
0.4Ω (max) RONMatch (+3.0V Supply)
1.2Ω (max) R
ON
Flatness (+3.0V Supply)
♦ Rail-to-Rail®Signal Handling
♦ High Off-Isolation: -55dB (10MHz)
♦ Low Crosstalk: -80dB (10MHz)
♦ Low Distortion: 0.03%
♦ +1.8V CMOS-Logic Compatible
♦ <0.5nA Leakage Current at +25°C
MAX4719
20Ω, 300MHz Bandwidth, Dual SPDT Analog
Switch in UCSP
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-2626; Rev 0; 10/02
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Pin Configurations/Functional Diagrams/Truth Table
UCSP is a trademark of Maxim Integrated Products, Inc. Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
Note: UCSP package requires special solder temperature pro­file described in the Absolute Maximum Ratings section.
*UCSP reliability is integrally linked to the user’s assembly meth­ods, circuit board material, and environment. See the UCSP reli­ability notice in the UCSP Reliability section of this data sheet for more information.
PART TEMP RANGE
MAX4719EUB -40°C to +85°C 10 µMAX —
MAX4719EBC-T* -40°C to +85°C 12 UCSP-12 ABJ
PIN/BUMP­PACKAGE
TOP
MARK
TOP VIEW
(BUMP SIDE DOWN)
NC1
MAX4719
GND
C1
C2
C3
C4 B4 A4
V+
UCSP
A1B1
NC2
IN_
A2
IN2IN1
COM2COM1
A3
NO2NO1
0
1
SWITCHES SHOWN FOR LOGIC "0" INPUT
MAX4719
MAX4719
NO_
OFF
ON
NC_
ON
OFF
NO1
COM1
IN1
NC1
1
V+
2
3
4
5
µMAX
10
NO2
9
COM2
IN2
8
7
NC2
GND
6
MAX4719
20Ω, 300MHz Bandwidth, Dual SPDT Analog Switch in UCSP
2 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +2.7V to +3.6V, VIH= +1.4V, VIL= +0.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +3.0V,
T
A
= +25°C, unless otherwise noted.) (Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(All Voltages Referenced to GND)
V+, IN_...................................................................-0.3V to +6.0V
COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)
Continuous Current COM_, NO_, NC_ ...........................±100mA
Peak Current COM_, NO_, NC_
(pulsed at 1ms, 10% duty cycle)................................±200mA
Continuous Power Dissipation (T
A
= +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
12-Bump UCSP (derate 11.4mW/°C above +70°C) ....909mW
ESD Method 3015.7 ...............................................................2kV
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering) (Note 2)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi-
mum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom­mended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed.
)
),
)
)
ABSOLUTE MAXIMUM RATINGS
Analog Signal Range
PARAMETER SYMBOL CONDITIONS T
V
,
COM_
V
, V
NO_
NC_
ANALOG SWITCH
On-Resistance (Note 5) R
On-Resistance Match Between Channels (Notes 5, 6)
On-Resistance Flatness (Note 7)
NO_, NC_ Off-Leakage Current (Note 8)
COM_ On-Leakage Current (Note 8)
R
FLAT(ON
I
NO_(OFF
I
NC_(OFF
I
COM_(ON
∆R
ON
ON
V+ = 2.7V, I V
V+ = 2.7V, I V
V+ = 2.7V, I V
V+ = 3.6V, V V
V+ = 3.6V, V V floating
DYNAMIC CHARACTERISTICS
Turn-On Time t
ON
V R
or V
NO_
NO_
NO_
NO_
NO_
NO_
L
NC_
or V
NC_
or V
NC_
or V
NC_
or V
NC_
, V
= 1.5V;
NC_
= 300Ω, CL = 35pF, Figure 1
COM_
= 1.5V
COM_
= 1.5V
COM_
= 1.0V, 1.5V, 2.0V
COM_
= 3.3V, 0.3V
COM_
= 0.3V, 3.3V, or
MIN TYP MAX UNITS
to
0V+V
to
to
to
to
to
-1 +1
-2 +2
= 10mA;
= 10mA;
= 10mA;
= 0.3V, 3.3V;
= 0.3V, 3.3V;
A
T
MIN
T
MAX
+25°C1420
T
MIN
T
MAX
+25°C 0.15 0.4
T
MIN
T
MAX
+25°C 0.6 1.2
T
MIN
T
MAX
+25°C -0.5 0.01 +0.5
T
MIN
T
MAX
+25°C -1 0.01 +1
T
MIN
T
MAX
+25°C4080
T
to
MIN
T
MAX
25
0.5
1.5
100
Ω
Ω
Ω
nA
nA
ns
MAX4719
20Ω, 300MHz Bandwidth, Dual SPDT Analog
Switch in UCSP
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS—Single +3V Supply (continued)
(V+ = +2.7V to +3.6V, VIH= +1.4V, VIL= +0.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +3.0V,
T
A
= +25°C, unless otherwise noted.) (Notes 3, 4)
)
)
Turn-Off Time t
Break-Before-Make Time Delay (Note 8)
Charge Injection Q
PARAMETER SYMBOL CONDITIONS T
V
, V
OFF
t
BBM
NO_
R
= 300Ω, CL = 35pF, Figure 1
L
V
, V
NO_
= 300Ω, CL = 35pF, Figure 2
R
L
V
= 2V, R
GEN
= 1.0nF, Figure 3
C
L
f = 10MHz; V
= 50Ω, CL = 5pF, Figure 4
R
Off-Isolation V
ISO
L
f = 1MHz; V
= 50Ω, CL = 5pF, Figure 4
R
L
f = 10MHz; V
= 50Ω, CL = 5pF, Figure 4
R
Crosstalk (Note 9) V
CT
On-Channel -3dB Bandwidth BW
Total Harmonic Distortion THD V
C
NO_, NC_ Off-Capacitance
Switch On-Capacitance C
NO_(OFF
C
NC_(OFF
ON
L
f = 1MHz; V
= 50Ω, CL = 5pF, Figure 4
R
L
Signal = 0dBm, R C
= 5pF, Figure 4
L
= 2V
COM
f = 1MHz, Figure 5 +25°C9 pF
f = 1MHz, Figure 5 +25°C20 pF
DIGITAL I/O
Input Logic High Voltage V
Input Logic Low Voltage V
Input Leakage Current I
IH
IL
IN
V+ = +3.6V, V
POWER SUPPLY
Power-Supply Range V+
Supply Current I+ V+ = +5.5V, V
= 1.5V;
NC_
= 1.5V;
NC_
GEN
NO_
NO_
NO_
NO_
, RL = 600Ω +25°C 0.03 %
P-P
IN_
IN_
A
MIN TYP MAX UNITS
+25°C2040
to
T
MIN
T
MAX
+25°C8
T
to
= 0Ω;
, V
= 1V
NC_
, V
= 1V
NC_
, V
= 1V
NC_
, V
= 1V
NC_
= 50Ω;
L
= 0V or 5.5V
= 0V or V+
P-P
P-P
MIN
T
MAX
+25°C18 pC
;
P-P
+25°C
;
;
P-P
+25°C
;
+25°C 300 MHz
T
to
MIN
T
MAX
T
to
MIN
T
MAX
T
to
MIN
T
MAX
T
to
MIN
T
MAX
T
to
MIN
T
MAX
1
1.4 V
-100 +100 nA
1.8 5.5 V
-55
-80
-80
-110
50
ns
ns
dB
dB
0.5 V
1µA
MAX4719
20Ω, 300MHz Bandwidth, Dual SPDT Analog Switch in UCSP
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS—Single +5V Supply
(V+ = +4.2V to +5.5V, VIH= +2.0V, VIL= +0.8V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +5.0V,
T
A
= +25°C, unless otherwise noted.) (Notes 3, 4)
)
),
)
)
Analog Signal Range
PARAMETER SYMBOL CONDITIONS T
V
,
COM_
V
, V
NO_
NC_
ANALOG SWITCH
On-Resistance (Note 5) R
On-Resistance Match Between Channels (Notes 5, 6)
On-Resistance Flatness (Note 7)
NO_, NC_ Off-Leakage Current (Note 8)
COM_ On-Leakage Current (Note 8)
ON
∆R
ON
R
FLAT(ON
I
NO_(OFF
I
NC_(OFF
I
COM_(ON
DYNAMIC CHARACTERISTICS
Turn-On Time t
Turn-Off Time t
Break-Before-Make Time Delay (Note 8)
ON
OFF
t
BBM
DIGITAL I/O
Input Logic High Voltage V
Input Logic Low Voltage V
Input Leakage Current I
IH
IL
IN
V+ = 4.2V, I
or V
V
NO_
V+ = 4.2V, I
or V
V
NO_
V+ = 4.2V, I V
or V
NO_
V+ = 5.5V; V
or V
V
NO_
V+ = 5.5V, V V
or V
NO_
floating
V
, V
NO_
= 300Ω, CL = 35pF, Figure 1
R
L
V
, V
NO_
R
= 300Ω, CL = 35pF, Figure 1
L
V
, V
NO_
= 300Ω, CL = 35pF, Figure 2
R
L
V+ = 5.5V, VIN_ = 0V or V+
NC_
NC_
NC_
= 10mA;
COM_
= 3.5V
NC_
= 10mA;
COM_
= 3.5V
NC_
= 10mA;
COM_
= 1.0V, 2.0V, 4.5V
NC_
= 1.0V, 4.5V;
COM_
= 4.5V, 1.0V
NC_
= 1.0V, 4.5V;
COM_
= 1.0V, 4.5V, or
NC_
= 3.0V;
= 3.0V;
= 3.0V;
MIN TYP MAX UNITS
to
0V+V
T
MIN
T
A
MAX
+25°C1220
T
to
MIN
T
MAX
+25°C 0.15 0.4
T
to
MIN
T
MAX
+25°C 0.4 1
T
to
MIN
T
MAX
+25°C -0.5 +0.01 +0.5
T
to
MIN
T
MAX
-1 +1
+25°C -1 +0.01 +1
to
T
MIN
T
MAX
-2 +2
+25°C3080
T
to
MIN
T
MAX
+25°C2040
T
to
MIN
T
MAX
+25°C8
T
to
T
T
T
MIN
T
MIN
T
MIN
T
MIN
T
MAX
to
MAX
to
MAX
to
MAX
1
2.0 V
-0.1 +0.1 µA
25
0.5
1.2
100
50
0.8 V
Ω
Ω
Ω
nA
nA
ns
ns
ns
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