MAXIM MAX4684, MAX4685 User Manual

General Description
The MAX4684/MAX4685 low on-resistance (RON), low­voltage, dual single-pole/double-throw (SPDT) analog switches operate from a single +1.8V to +5.5V supply. The MAX4684 features a 0.5Ω (max) R
for its NC
switch and a 0.8Ω (max) R
ON
for its NO switch at a +2.7V supply. The MAX4685 features a 0.8Ω max on­resistance for both NO and NC switches at a +2.7V supply.
Both parts feature break-before-make switching action (2ns) with t
ON
= 50ns and t
OFF
= 40ns at +3V. The digi­tal logic inputs are 1.8V logic-compatible with a +2.7V to +3.3V supply.
The MAX4684/MAX4685 are packaged in the chipscale package (UCSP)™, significantly reducing the required PC board area. The chip occupies only a 2.0mm
1.50mm area. The 4 ✕3 array of solder bumps are spaced with a 0.5mm bump pitch.
________________________Applications
Speaker Headset Switching
MP3 Players
Power Routing
Battery-Operated Equipment
Relay Replacement
Audio and Video Signal Routing
Communications Circuits
PCMCIA Cards
Cellular Phones
Modems
Features
12-Bump, 0.5mm-Pitch UCSPNC Switch R
ON
0.5Ω max (+2.7V Supply) (MAX4684)
0.8Ω max (+2.7V Supply) (MAX4685)
NO Switch R
ON
0.8Ω max (+2.7V Supply)
R
ON
Match Between Channels
0.06Ω (max)
RONFlatness Over Signal Range
0.15Ω (max)
+1.8V to +5.5V Single-Supply OperationRail-to-Rail Signal Handling1.8V Logic CompatibilityLow Crosstalk: -68dB (100kHz)High Off-Isolation: -64dB (100kHz)THD: 0.03%50nA (max) Supply CurrentLow Leakage Currents
1nA (max) at T
A
= +25°C
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
________________________________________________________________
Maxim Integrated Products
1
19-1977; Rev 4; 1/09
Pin Configurations/Functional Diagrams/Truth Table
UCSP is a trademark of Maxim Integrated Products, Inc. µMAX is a registered trademark of Maxim Integrated Products, Inc.
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Continued at end of data sheet.
Ordering Information
+
Denotes a lead(Pb)-free/RoHS-compliant package. Note: Requires special solder temperature profile described in the Absolute Maximum Ratings section.
*
UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this data sheet for more information.
**
EP = Exposed Pad
T = Tape and reel.
PART
PIN /B U M P­PACKAGE
TOP
MARK
M A X4 6 8 4 E BC + T
12 UCSP* AAF
M AX 4684E TB+ T
AAG
M AX 4684E U B+ T
10 µMAX
®
M A X4 6 8 5 E BC + T
12 UCSP* AAG
M AX 4685E TB+ T
AAH
M AX 4685E U B+ T
10 µMAX
TOP VIEW
MAX4684/MAX4685
GND
C1
NC1
C2
C3
C4 B4 A4
V+
UCSP
A1B1
NC2
A2
IN2IN1
COM2COM1
A3
NO2NO1
MAX4684/MAX4685
IN_
NO_
0
1
SWITCHES SHOWN FOR LOGIC "0" INPUT
NC_
ON
OFF
OFF
ON
V+
NO1
COM1
IN1
NC1
TEMP RANGE
-40°C to +85°C
-40°C to +85°C 10 TD FN - E P **
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C 10 TD FN - E P **
-40°C to +85°C
MAX4684/MAX4685
1
2
3
4
5
µMAX
10
NO2
9
COM2
IN2
8
7
NC2
GND
6
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(All Voltages Referenced to GND)
V+, IN_......................................................................-0.3V to +6V
COM_, NO_, NC_ (Note1) ........................... -0.3V to (V+ + 0.3V)
Continuous Current NO_, NC_, COM_ .......................... ±300mA
Peak Current NO_, NC_, COM_
(pulsed at 1ms, 50% duty cycle).................................±400mA
Peak Current NO_, NC_, COM_
(pulsed at 1ms, 10% duty cycle).................................±500mA
Continuous Power Dissipation (T
A
= +70°C)
10-Pin TDFN (derate 18.5mW/°C above +70°C)........1482mW
12-Bump UCSP (derate 11.4mW/°C above +70°C) ...909mW
10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW
Operating Temperature Ranges..........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering) (Note 2)
Infared (15s)................................................................+220°C
Vapor Phase (60s) ......................................................+215°C
Note 1: Signals on NO_, NC_, and COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
maximum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom­mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre­heating is required. Hand or wave soldering is not allowed.
PARAMETER SYMBOL CONDITIONS T
A
MIN
ANALOG SWITCH
Analog Signal Range
V
NO
_, VNC_,
V
COM
_
E0 V+V
0.3
E
NC_ On-Resistance (Note 4)
R
ON(NC)
VNC_ = 0 to V+
E
Ω
NO_ On-Resistance (Note 4)
R
ON(NO)
V+ = 2.7V; I
COM
_ = 100mA;
V
NO
_ = 0 to V+
E
Ω
On-Resistance Match Between Channels (Notes 4, 5)
ΔR
ON
V+ = 2.7V; I
COM
_ = 100mA;
V
NO
_ or VNC_ = 1.5V
E
Ω
E
NC_ On-Resistance Flatness (Note 6)
R
FLAT (NC)
V
N C
_ = 0 to V +
E
Ω
NO_ On-Resistance Flatness (Note 6)
R
FLAT (NO)
V+ = 2.7V; I
COM
= 100mA;
V
NO
_ = 0 to V+
E
Ω
-1 1
NO_ or NC_ Off­Leakage Current (Note 7)
INC_(OFF)
V+ = 3.3V; V
NO
_ or VNC_ = 3V, 0.3V;
V
COM
_ = 0.3V, 3V
E -10 10
nA
-2 2
COM_ On-Leakage Current (Note 7)
I
COM
_(ON)
V + = 3.3V ; V
N O
_ or V
N C
_ = 3V , 0.3V , or
unconnected ; V
C OM
_ = 3V , 0.3V , or
unconnected
E -20 20
nA
DYNAMIC CHARACTERISTICS
30 50
Turn-On Time t
ON
V+ = 2.7V, VNO_ or VNC_ = 1.5V; R
L
= 50Ω; CL = 35pF; Figure 2
E60
ns
ELECTRICAL CHARACTERISTICS—+3V SUPPLY
(V+ = +2.7V to +3.3V, VIH= +1.4V, VIL= +0.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at +3V and +25°C.)
(Notes 3, 9, 10)
TYP MAX UNITS
INO_(OFF) or
V + = 2.7V ; I
V + = 2.7V ; I
_ = 100mA;
C OM
= 100mA;
C OM
MAX4684
MAX4685
MAX4684
MAX4685
+25°C
+25°C0.450.8
+25°C0.450.8
+25°C0.06
+25°C
+25°C
+25°C
0.5
0.5
0.8
0.8
0.06
0.15
0.35
0.35
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS—+3V SUPPLY (continued)
(V+ = +2.7V to +3.3V, VIH= +1.4V, VIL= +0.5V, TA= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at +3V and +25°C.)
(Notes 3, 9, 10)
PARAMETER SYMBOL CONDITIONS T
A
MIN
25 30
Turn-Off Time t
OFF
V+ = 2.7V, VNO_ or VNC_ = 1.5V;
R
L
= 50Ω; CL = 35pF; Figure 2
E40
ns
Break-Before-Make Delay
t
BBM
V+ = 2.7V, VNO_, or VNC_ = 1.5V;
R
L
= 50Ω; CL = 35pF; Figure 3
E 2 15 ns
Charge Injection Q
200 pC
Off-Isolation (Note 8) V
ISO
CL = 5pF; RL = 50Ω; f = 100kHz; V
COM
_ = 1V
RMS
; Figure 5
-64 dB
Crosstalk V
CT
CL = 5pF; RL = 50Ω; f = 100kHz; V
COM
_ = 1V
RMS
; Figure 5
-68 dB
Total Harmonic Distortion
THD
RL = 600Ω, IN_ = 2Vp-p, f = 20Hz to
20kHz
%
NC_ Off-Capacitance
)
f = 1MHz; Figure 6
84 pF
NO_ Off-Capacitance
C
NO_(OFF)
f = 1MHz; Figure 6
37 pF
NC_ On-Capacitance
C
NC_(ON)
f = 1MHz; Figure 6
190 pF
NO_ On-Capacitance
C
NO_(ON)
f = 1MHz; Figure 6
150 pF
DIGITAL I/O
Input Logic High V
IH
E1.4 V
Input Logic Low V
IL
E
V
IN_ Input Leakage Current
I
IN
_V
IN
_ = 0 or V+ E -1 1 µA
POWER SUPPLY
Power-Supply Range V+ E 1.8
V
-50
50
S up p l y C ur r ent ( N ote 4)
I+ V+ = 5.5V; VIN_ = 0 or V+
E
nA
Note 3: The algebraic convention used in this data sheet is where the most negative value is a minimum and the most positive
value a maximum.
Note 4: Guaranteed by design. Note 5: ΔR
ON
= R
ON(MAX)
- R
ON(MIN)
, between NC1 and NC2 or between NO1 and NO2.
Note 6: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the
specified analog signal ranges.
Note 7: Leakage parameters are 100% tested at T
A
= +85°C, and guaranteed by correlation over rated temperature range.
Note 8: Off-isolation = 20log
10(VCOM
/ VNO), V
COM
= output, VNO= input to off switch.
Note 9: UCSP and TDFN parts are 100% tested at +25°C only and guaranteed by design and correlation at the full hot-rated
temperature.
Note 10: -40°C specifications are guaranteed by design.
COM_ = 0; RS = 0; CL = 1nF; Figure 4 +25°C
C
NC_(OFF
+25°C
+25°C
+25°C
+25°C0.03
+25°C
+25°C
+25°C
+25°C
TYP MAX
0.5
UNITS
+25°C
-200 200
5.5
0.04
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
4 _______________________________________________________________________________________
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
0
0.4
0.2
1.0
0.8
0.6
1.6
1.4
1.2
1.8
021 345
MAX4684
NC ON-RESISTANCE vs. COM VOLTAGE
MAX4684/5 toc01
V
COM
(V)
R
ON
(Ω)
V+ = +3.0V
V+ = +5.0V
V+ = +1.8V
V+ = +2.0V
V+ = +2.3V
V+ = +2.5V
NO ON-RESISTANCE vs. COM VOLTAGE
0
0.5
1.5
1.0
2.0
2.5
021345
R
ON
(Ω)
MAX4684/5 toc03
V
COM
(V)
V+ = +5.0V
V+ = +1.8V
V+ = +2.0V
V+ = +2.3V
V+ = +2.5V
V+ = +3.0V
MAX4685
NC ON-RESISTANCE vs. COM VOLTAGE
0
0.2
0.4
0.6
0.8
1.2
1.4
1.8
1.0
1.6
2.0
021345
R
ON
(Ω)
MAX4684/5 toc02
V
COM
(V)
V+ = +5.0V
V+ = +2.3V
V+ = +3.0V
V+ = +1.8V
V+ = +2.0V
V+ = +2.5V
0.10
0.12
0.14
0.16
0.20
0.18
0.22
0.24
0.26
0.28
021345
MAX4684/5 toc04
MAX4684
NC ON-RESISTANCE vs. COM VOLTAGE
V
COM
(V)
R
ON
(Ω)
TA = +85°C
V+ = +5V
TA = -40°C
TA = +25°C
0.10
0.15
0.20
0.25
0.30
0.35
0.40
012345
MAX4684/5 toc06
NO ON-RESISTANCE vs. COM VOLTAGE
V
COM
(V)
R
ON
(Ω)
TA = +85°C
V+ = +5V
TA = -40°C
TA = +25°C
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
012345
MAX4684/5 toc05
MAX4685
NC ON-RESISTANCE vs. COM VOLTAGE
V
COM
(V)
R
ON
(Ω)
V+ = +5V
TA = +25°C
TA = -40°C
TA = +85°C
01.01.50.5 2.0 2.5 3.0
0.10
0.15
0.20
0.25
0.30
0.35
MAX4684/5 toc07
MAX4684
NC ON-RESISTANCE vs. COM VOLTAGE
V
COM
(V)
R
ON
(Ω)
V+ = +3V
TA = +85°C
TA = -40°C
TA = +25°C
0.15
0.10
0.20
0.25
0.30
0.35
0.40
0.45
0.50
01.00.5 1.5 2.0 2.5 3.0
MAX4684/5 toc09
NO ON-RESISTANCE vs. COM VOLTAGE
V
COM
(V)
R
ON
(Ω)
V+ = +3V
TA = +85°C
TA = +25°C
TA = -40°C
0.15
0.10
0.20
0.25
0.30
0.35
0.40
0.45
0.50
01.00.5 1.5 2.0 2.5 3.0
MAX4684/5 toc08
MAX4685
NC ON-RESISTANCE vs. COM VOLTAGE
V
COM
(V)
R
ON
(Ω)
V+ = +3V
TA = +85°C
TA = +25°C
TA = -40°C
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 5
0
20
60
40
80
100
021 3456
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX4684/5 toc10
V
SUPPLY
(V)
SUPPLY CURRENT (pA)
0
20
10
40
30
50
60
70
80
1.8 2.8 3.32.3 3.8 4.3 4.8 5.3
MAX4684/5 toc11
V
SUPPLY
(V)
t
ON
/t
OFF
(ns)
TURN-ON/TURN-0FF TIMES
vs. SUPPLY VOLTAGE
t
ON
t
OFF
0
15
10
5
20
25
30
35
40
45
50
-40 10-15 356085
MAX4684/5 toc12
TURN-ON/TURN-0FF TIMES
vs. TEMPERATURE
V+ = +3V
t
ON
/t
OFF
(ns)
TEMPERATURE (°C)
t
ON
t
OFF
2.0
1.5
1.0
0.5
0
0312 456
LOGIC THRESHOLD VOLTAGE
vs. SUPPLY VOLTAGE
MAX4684/5 toc13
LOGIC THRESHOLD VOLTAGE (V)
V
SUPPLY
(V)
V
IN
RISING
V
IN
FALLING
-500
-400
-300
-200
-100
0
100
200
300
021 3456
CHARGE INJECTION vs. COM VOLTAGE
MAX4684/5 toc14
Q (pC)
V
COM
(V)
-40 10-15 35 60 85
MAX4684/5 toc15
TEMPERATURE (°C)
ON/OFF-LEAKAGE CURRENT (pA)
1
10
100
1000
MAX4684
ON/OFF-LEAKAGE CURRENT
vs. TEMPERATURE
I
COM(ON)
I
COM(OFF)
-40 10-15 35 60 85
MAX4684/5 toc16
TEMPERATURE (°C)
ON/OFF-LEAKAGE CURRENT (pA)
1
10
100
1000
MAX4685
ON/OFF-LEAKAGE CURRENT
vs. TEMPERATURE
I
COM(ON)
I
COM(OFF)
FREQUENCY RESPONSE (µMAX)
FREQUENCY (MHz)
0.001 1 10 1000.01 0.1
LOSS (dB)
-120
-100
-80
-20
-40
-60
0
MAX4684/85 toc17
ON­RESPONSE
OFF­ISOLATION
CROSSTALK
10 100 1k 10k 100k
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. FREQUENCY
MAX4684/5 toc18
FREQUENCY (Hz)
THD + N (%)
0.01
0.1
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
Detailed Description
The MAX4684/MAX4685 are low on-resistance, low­voltage, dual SPDT analog switches that operate from a +1.8V to +5.5V supply. The devices are fully specified for nominal 3V applications. The MAX4684/MAX4685 have break-before-make switching and fast switching speeds (tON= 50ns max, t
OFF
= 40ns max).
The MAX4684 offers asymmetrical normally closed (NC) and normally open (NO) R
ON
for applications that require asymmetrical loads (examples include speaker headsets and internal speakers). The part features a
0.5Ω max R
ON
for its NC switch and a 0.8Ω max RON for its NO switch at the 2.7V supply. The MAX4685 fea­tures a 0.8Ω max on-resistance for both NO and NC switches at the +2.7V supply.
Applications Information
Digital Control Inputs
The MAX4684/MAX4685 logic inputs accept up to +5.5V regardless of supply voltage. For example, with a +3.3V supply, IN_ may be driven low to GND and high to 5.5V. Driving IN_ rail-to-rail minimizes power con­sumption. Logic levels for a +1.8V supply are 0.5V (low) and 1.4V (high).
Analog Signal Levels
Analog signals that range over the entire supply voltage (V+ to GND) are passed with very little change in on­resistance (see
Typical Operating Characteristics
). The switches are bidirectional, so the NO_, NC_, and COM_ pins can be either inputs or outputs.
Power-Supply Sequencing and
Overvoltage Protection
Caution: Do not exceed the absolute maximum rat­ings because stresses beyond the listed ratings may cause permanent damage to devices.
Proper power-supply sequencing is recommended for all CMOS devices. Always apply V+ before applying analog signals, especially if the analog signal is not current limited. If this sequencing is not possible, and if the analog inputs are not current limited to <20mA, add a small signal diode (D1) as shown in Figure 1. Adding a protection diode reduces the analog range to a diode drop (about 0.7V) below V+ (for D1). RONincreases slightly at low supply voltages. Maximum supply volt­age (V+) must not exceed +6V. Protection diode D1 also protects against some overvoltage situations. No damage will result on Figure 1’s circuit if the supply voltage is below the absolute maximum rating applied to an analog signal pin.
POSITIVE SUPPLY
COM
NO
D1
GND
V
g
V+
MAX4684 MAX4685
Figure 1. Overvoltage Protection Using Two External Blocking Diodes
PIN
NAME
UCSP
FUNCTION
NC_ A1, C1 5, 7 Analog Switch—Normally Closed Terminal
IN_ A2, C2 4, 8 Digital Control Input
COM_ A3, C3 3, 9 Analog Switch—Common Terminal
NO_ A4, C4 2, 10 Analog Switch—Normally Open Terminal
V+ B4 1 Positive Supply Voltage Input
GND B1 6 Ground
EP Exposed Pad. Connect EP to GND (for TDFN only.)
Pin Description
6 _______________________________________________________________________________________
µMAX/TDFN
UCSP Package Consideration
For general UCSP package information and PC layout considerations, please refer to the Maxim Application Note (Wafer-Level Ultra-Chip-Board-Scale Package).
UCSP Reliability
The chip-scale package (UCSP) represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical relia­bility tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as it is primarily determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera­tion for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid­ered. Information on Maxim’s qualification plan, test data, and recommendations are detailed in the UCSP application note, which can be found on Maxim’s web­site at www.maxim-ic.com.
Chip Information
PROCESS: BiCMOS
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 7
tr < 5ns tf < 5ns
50%
V
IL
LOGIC INPUT
R
L
50Ω
COM_
GND
IN_
C
L
INCLUDES FIXTURE AND STRAY CAPACITANCE.
V
OUT
= V
N_ (
R
L
)
RL + R
ON
V
IN_
V
IH
t
OFF
0
NO_ OR NC
0.9 x V
0UT
0.9 x V
OUT
t
ON
V
OUT
SWITCH OUTPUT
LOGIC
INPUT
LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES THAT HAVE THE OPPOSITE LOGIC SENSE.
V+
C
L
35pF
V+
V
OUT
MAX4684 MAX4685
Figure 2. Switching Time
Test Circuits/Timing Diagrams
50%
V
IH
V
IL
LOGIC INPUT
V
OUT
0.9 x V
OUT
t
D
LOGIC INPUT
R
L
50Ω
GND
C
L
INCLUDES FIXTURE AND STRAY CAPACITANCE.
NO_
IN_
NC_
V
OUT
V+
V+
C
L
35pF
V
N_
COM_
MAX4684 MAX4685
Figure 3. Break-Before-Make Interval
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
8 _______________________________________________________________________________________
V
GEN
GND
COM_
C
L
V
OUT
V+
V
OUT
IN
OFF
ON
OFF
ΔV
OUT
Q = (ΔV
OUT
)(CL)
NC_
IN DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH.
OFF
ON
OFF
IN
V
IL
TO V
IH
V+
R
GEN
IN_
MAX4684 MAX4685
OR NO_
Figure 4. Charge Injection
MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM_ AND "ON" NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO ALL OTHER CHANNELS. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.
+5V
V
OUT
V+
IN_
NC_
COM
NO
V
IN
MAX4684 MAX4685
OFF-ISOLATION = 20log
V
OUT
V
IN
ON-LOSS = 20log
V
OUT
V
IN
CROSSTALK = 20log
V
OUT
V
IN
NETWORK
ANALYZER
50Ω
50Ω 50Ω
50Ω
MEAS REF
10nF
0V OR V+
50Ω
GND
Figure 5. On-Loss, Off-Isolation, and Crosstalk
CAPACITANCE
METER
NC_ or NO_
COM_
GND
IN
V
IL
OR
V
IH
10nF
V+
f = 1MHz
V+
MAX4684 MAX4685
Figure 6. Channel Off/On-Capacitance
Test Circuits/Timing Diagrams (continued)
Pin Configurations (continued)
TOP VIEW
MAX4684/MAX4685
V+
1
2
NO1
3
COM1
IN1
4
NC1
5
3mm ✕ 3mm TDFN
*CONNECT EP TO GND.
*EP
NO2
10
COM2
9
IN2
8
NC2
7
GND
6
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________ 9
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
12 UCSP B12-4
21-0104
10 TDFN-EP T1033-1
21-0137
10 µMAX U10-2
21-0061
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
MAX4684/MAX4685
0.5ΩΩ/0.8
ΩΩ
Low-Voltage, Dual SPDT
Analog Switches in UCSP
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2009 Maxim Integrated Products is a registered trademark of Maxim Integrated Products.
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGES
3 2/03 Added TDFN packaging, noted parts are now UCSP qualified
4 1/09 Added lead-free packaging and exposed pad note 1, 2, 6–9
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