MAXIM MAX4172ExA User Manual

查询MAX4172EXA供应商

MAX4172ExA Rev. B

RELIABILITY REPORT

FOR

MAX4172ExA

PLASTIC ENCAPSULATED DEVICES

January 23, 2003

MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086

Written by Reviewed by

Jim Pedicord Bryan J. Preeshl Quality Assurance Quality Assurance Reliability Lab Manager Executive Director

Conclusion The MAX4172 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards.

Table of Contents

I. ........Device Description V. ........Quality Assurance Information

II. ........Manufacturing Information VI. .......Reliability Evaluation

III. .......Packaging Information

IV. .......Die Information ......Attachments

I. Device Description A. General

The MAX4172 is a low-cost, precision, high-side current-sense amplifier for portable PCs, telephones, and other systems where battery/DC power-line monitoring is critical. High-side power-line monitoring is especially useful in battery-powered systems, since it does not interfere with the battery charger’s ground path. Wide bandwidth and ground-sensing capability make the MAX4172 suitable for closed-loop battery charger and general-purpose current-source applications. The 0V and 32V input common-mode range is independent of the supply voltage, which ensures that current-sense feedback remains viable, even when connected to a battery in deep discharge.

To provide a high level of flexibility, the MAX4172 functions with an external sense resistor to set the range of load current to be monitored. It has a current output that can be converted to a ground-referred voltage with a single resistor, accommodating a wide range of battery voltages and currents.

An open-collector power-good output (/PG) indicates when the supply voltage reaches an adequate level to guarantee proper operation of the current -sense amplifier. The MAX4172 operates with a 3.0V to 32V supply voltage.

B. Absolute Maximum Ratings Item Rating V+, RS+, RS -, /PG -0.3V to +36V

OUT -0.3V to (V+ + 0.3V) Differential Input Voltage, V

RS+

-V

±700mV

Current into Any Pin ±50mA Storage Temp. -65°C to +150°C Lead Temp. (10 sec.) +300°C

Continuous Power Dissipation (TA = +70°C) 8-Lead µMAX 330mW 8-Lead NSO 471mW

Derate above +70°C 8-Lead µMAX 4.10mW/°C 8-Lead NSO 5.88mW/°C

II. Manufacturing Information

A. Description/Function: Low-Cost, Precision, High-Side Current -Sense Amplifier B. Process: SG3 - Standard 3 micron silicon gate CMOS C. Number of Device Transistors: 177 D. Fabrication Location: Oregon, USA E. Assembly Location: Malaysia, Philippines or Thailand F. Date of Initial Production: December, 1996

III. Packaging Information A. Package Type: 8 Lead µMAX 8-Lead NSO B. Lead Frame: Copper Copper C. Lead Finish: Solder Plate Solder Plate D. Die Attach: Silver-filled Epoxy Silver-filled Epoxy E. Bondwire: Gold (1.3 mil dia.) Gold (1.3 mil dia.) F. Mold Material: Epoxy with silica filler Epoxy with silica filler G. Assembly Diagram: Buildsheet # 05-3001-0063 Buildsheet # 05-3001-0062 H. Flammability Rating: Class UL94-V0 Class UL94-V0 I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-A112: Level 1 Level 1

IV. Die Information A. Dimensions: 84 x 58 mils

B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: 3 microns (as drawn) F. Minimum Metal Spacing: 3 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO

I. Die Separation Method: Wafer Saw

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