_______________Detailed Description
The MAX4104/MAX4105/MAX4304/MAX4305 are ultrahigh-speed, low-noise amplifiers featuring -3dB bandwidths up to 880MHz, 0.1dB gain flatness up to
100MHz, and low differential gain and phase errors of
0.01% and 0.01°, respectively. These devices operate
on dual power supplies ranging from ±3.5V to ±5.5V
and require only 20mA of supply current.
The MAX4104/MAX4304/MAX4105/MAX4305 are optimized for minimum closed-loop gains of +1V/V, +2V/V,
+5V/V and +10V/V (respectively) with corresponding
-3dB bandwidths of 880MHz, 730MHz, 430MHz, and
350MHz. Each device in this family features a low input
voltage noise density of only 2.1nV/√Hz (at 1MHz), an
output current drive of ±70mA, and spurious-free
dynamic range as low as -88dBc (5MHz, RL= 100Ω).
___________Applications Information
Layout and Power-Supply Bypassing
The MAX4104/MAX4105/MAX4304/MAX4305 have an
extremely high bandwidth, and consequently require
careful board layout, including the possible use of
constant-impedance microstrip or stripline techniques.
To realize the full AC performance of these high-speed
amplifiers, pay careful attention to power-supply
bypassing and board layout. The PC board should
have at least two layers: a signal and power layer on
one side, and a large, low-impedance ground plane on
the other side. The ground plane should be as free of
voids as possible. With multilayer boards, locate the
ground plane on a layer that incorporates no signal or
power traces.
Regardless of whether or not a constant-impedance
board is used, it is best to observe the following guidelines when designing the board:
1) Do not use wire-wrapped boards (they are much too
inductive) or breadboards (they are much too
capacitive).
2) Do not use IC sockets. IC sockets increase reac tances.
3) Keep signal lines as short and straight as possible.
Do not make 90° turns; round all corners.
4) Observe high-frequency bypassing techniques to
maintain the amplifier’s accuracy and stability.
5) Bear in mind that, in general, surface-mount components have shorter bodies and lower parasitic reactance, resulting in greatly improved high-frequency
performance over through-hole components.
The bypass capacitors should include 1nF and 0.1µF
ceramic surface-mount capacitors between each supply pin and the ground plane, located as close to the
package as possible. Optionally, place a 10µF tantalum
capacitor at the power supply pins’ point of entry to the
PC board to ensure the integrity of incoming supplies.
The power-supply trace should lead directly from the
tantalum capacitor to the V
CC
and VEEpins. To minimize parasitic inductance, keep PC traces short and
use surface-mount components.
Input termination resistors and output back-termination
resistors, if used, should be surface-mount types, and
should be placed as close to the IC pins as possible.
DC and Noise Errors
The MAX4104/MAX4105/MAX4304/MAX4305 output
offset voltage, V
OUT
(Figure 1), can be calculated with
the following equation:
V
OUT
= [VOS+ (IB+x RS) + (IB-x (R
F
||
RG))] [1 + RF/ RG]
where:
VOS= input offset voltage (in volts)
1 + RF/RG= amplifier closed-loop gain (dimensionless)
IB+= noninverting input bias current (in amps)
IB-= inverting input bias current (in amps)
RG= gain-setting resistor (in ohms)
RF= feedback resistor (in ohms)
RS= source resistor at noninverting input (in ohms)
The following equation represents output noise density:
MAX4104/MAX4105/MAX4304/MAX4305
740MHz, Low-Noise, Low-Distortion
Op Amps in SOT23-5
_______________________________________________________________________________________ 9
_____________________Pin Description
SOT23-5 SO
OUT
V
CC
V
EE
IN+
IN-
N.C.
NAME
Amplifier Output61
Positive Power Supply75
Negative Power Supply 42
Amplifier Noninverting
Input
33
Amplifier Inverting Input24
Not internally connected.1, 5, 8
—
FUNCTION
PIN