MAXIM MAX3656 User Manual

General Description
The MAX3656 is a burst-mode laser driver that oper­ates at data rates from 155Mbps up to 2.5Gbps. The laser driver accepts either positive-referenced emitter­coupled logic (PECL) or current-mode logic (CML) data inputs and provides bias and modulation current for the laser diode. The device can switch the laser diode from a completely dark (off) condition to a full (on) condition (with proper bias and modulation currents) in less than 2ns. The MAX3656 incorporates DC-coupling between laser driver and laser diode and operates with a single­supply voltage as low as +3.0V.
A digital automatic power-control (APC) loop is provided to maintain the average optical power over the full tem­perature range and lifetime. The APC loop is functional for a minimum burst on-time of 576ns and minimum burst off-time of 96ns, with no limit on the maximum burst on- or off-time. A fail monitor is provided to indi­cate when the APC loop can no longer maintain the average power. The MAX3656 can be configured for nonburst-mode applications (continuous mode) by con­necting burst enable (BEN) high. For power saving, the MAX3656 provides enabling and disabling functionality. The modulation current can be set from 10mA to 85mA and the bias current can be set from 1mA to 70mA.
The MAX3656 is packaged in a small, 24-pin, 4mm
4mm thin QFN package and consumes only 132mW (typ), excluding bias and modulation currents.
Applications
Fiber-to-the-Home (FTTH) and Fiber-to-the­Business (FTTB) Broadband Access Systems
Passive Optical Network (PON) Transmitters
APON, EPON, and GPON Upstream Transmitters
Features
Multirate Operation from 155Mbps to 2.5GbpsBurst Enable/Disable Delay <2nsBurst On-Time of 576ns to InfinityInfinite Bias-Current Hold Time Between BurstsDC-Coupled Operation with Single +3.3V Power
Supply
40mA Typical Supply CurrentProgrammable Bias Current from 1mA to 70mAProgrammable Modulation Current from 10mA
to 85mA
Automatic Average Power Control with Failure
Monitor (No C
APC
Capacitor Needed)
APC Loop Initialization ≤3 Bursts
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
________________________________________________________________ Maxim Integrated Products 1
Pin Configuration
SERIAL
DATA
SOURCE
IN+
IN-
BEN+
BEN-
V
CC
100
100
OUT-
APCSET
MODSET
BIASMAX
EN
GND
FAIL
LONGB
OUT+
BIAS+
BIAS-
MD
MAX3656
BURST
CONTROL
V
CC
V
CC
V
CC
Typical Application Circuit
19-2790; Rev 2; 10/04
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
+ Denotes lead-free package. *Dice are designed to operate from T
J
= -40°C to +120°C, but
are only tested and guaranteed at T
A
= +25°C.
**EP = Exposed pad.
Ordering Information
Functional Diagram appears at end of data sheet.
PART TEMP RANGE PIN-PACKAGE
MAX3656E/D Dice* — MAX3656ETG -40°C to +85°C 24 Thin QFN-EP** T2444-1 MAX3656ETG+ -40°C to +85°C 24 Thin QFN-EP** T2444-1
PKG
CODE
TOP VIEW
V
CC
IN+
IN-
V
CC
BEN+
BEN-
**EXPOSED PAD IS CONNECTED TO GND
MODSET
APCSET
1
2
3
4
5
6
MAX3656
7891011 12
CC
EN
V
GND
THIN QFN
GND
MD
VCCBIASMAX
192021222324
18
V
CC
17
OUT-
16
LONGB
OUT+
V
15
CC
14
BIAS+
BIAS-
13
FAIL
GND
MAX3656
155Mbps to 2.5Gbps Burst-Mode Laser Driver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Supply Voltage, VCC..............................................-0.5V to +6.0V
Current into BIAS+, BIAS-, OUT+, OUT- ........-20mA to +150mA
Current into MD.................................................... -5mA to +5mA
Current into FAIL ...............................................-10mA to +10mA
Voltage at IN+, IN-, BEN+, BEN-, EN,
LONGB...................................................-0.5V to (V
CC
+ 0.5V)
Voltage at MODSET, APCSET, BIASMAX .............-0.5V to +3.0V
Voltage at OUT+, OUT-.............................+0.5V to (V
CC
+ 1.5V)
Voltage at BIAS+, BIAS-............................+0.5V to (V
CC
+ 0.5V)
Continuous Power Dissipation (T
A
= +85°C) 24-Lead Thin QFN-EP
(derate 27.8mW/°C above +85°C).............................1805mW
Operating Ambient Temperature
Range (T
A
).......................................................-40°C to +85°C
Operating Junction Temperature
Range (T
J
) .....................................................-55°C to +150°C
Storage Ambient Temperature
Range (T
STG
).................................................-55°C to +150°C
Processing Temperature (die) .........................................+400°C
Lead Temperature (soldering,10s) ..................................+300°C
OPERATING CONDITIONS
Note 1: Larger MD capacitance increases the minimum burst on-time. Note 2: Laser-to-monitor gain equals the laser slope efficiency multiplied by the photodiode responsivity multiplied by the losses due
to laser-to-monitor diode coupling (A
LMD
= η
LASER
ρ
MONITORDIODE
L
LASER-TO-MONITORDIODE
).
where L = laser-to-monitor diode coupling loss. A
LMD
can also be calculated by:
where I
MD
, I
MOD
, and re(extinction ratio) are set externally.
Note 3: Operation outside this range degrades APC loop performance.
ELECTRICAL CHARACTERISTICS
(Typical values are at VCC= +3.3V, I
BIAS
= 20mA, I
MOD
= 25mA, extinction ratio = 10dB, and TA= +25°C, unless otherwise noted.)
Supply Voltage V
Supply Turn-On Time 10% to 90% 0.001 10 ms Ambient Temperature -40 +85 °C
Data Mark Density Average 50 %
Consecutive Identical Digits CID 80 Bits
Data Rate 155 2500 Mbps
Monitor Diode Capacitance C
Laser-to-Monitor Diode Gain A
Extinction Ratio r
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CC
For minimum burst on-time (Note 1) 15 pF
MD
( m oni tor cur r ent) / ( l aser cur r ent ( ab ove I
LMD
( N otes 2, 3)
10 log (P1/P0) (Note 3) 8.2 12.0 dB
e
A
=
LMD
×
I
MOD
MD
e
rI
e
2I r I
+
 
T H
3.0 3.3 3.6 V
) )
0.005 0.050 A/A
POWER SUPPLY
Power-Supply Current I
INPUT SPECIFICATIONS
Differential Input Voltage V
Common-Mode Input Voltage V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
, V
I N
CC
CM
(Note 1) 40 70 mA
B E N
0.2 1.6 V
VCC -
1.49
VCC -
1.32
V
V
C C
IN
P-P
-
/4
V
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(Typical values are at VCC= +3.3V, I
BIAS
= 20mA, I
MOD
= 25mA, extinction ratio = 10dB, and TA= +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Single-Ended Input Voltage
EN Input High Voltage V EN Input Low Voltage V FAIL Output High Voltage V FAIL Output Low Voltage V
V
BEN+
V
BEN-
,
IH
IL
S our ci ng 50µA, VCC = 3.0V 2.4 V
OH
S i nki ng 100µA, V CC = 3.6V 0.4 V
OL
0.8 V
2.0 V
0.8 V
BIAS GENERATOR
Bias-On Current Range I
Bias-Off Current Range I
BIAS
BIAS-OFF
Bias-Current Temperature Stability
Bias-Current Absolute Accuracy APC open-loop I
Voltage at BIAS pin 0.6V 1 70 mA EN = high or BEN = low, V
I
APC open loop
BIAS
I
BIAS
> 20mA (Note 3) -15 +15 %
BIAS
2.6V (Note 2) 5 100 µA
BIAS
= 70mA 148
= 15mA 98
ppm/°C
BIAS M AX C ur r ent- S etti ng Rang e1570mA
APC LOOP
MD Reverse-Bias Voltage V
MD Bias-Setting Stability (Note 4)
MD Bias-Setting Accuracy (Note 3)
MD DC-Current Range I
MD
With respect to V
CC
1.6 V
IMD = 50µA -750 +750
= 1500µA -480 +480
I
MD
IMD = 50µA -25 +25
= 1500µA -15 +15
I
MD
Average current into MD pin 50 1500 µA
MD
ppm/°C
%
Case 1 (Note 5) (LONGB = 0) 12
APC Loop Initialization Time (Note 4)
t
INIT
Case 2 (Note 6) (LONGB = 0) 2.12
µs
Case 3 (Note 7) (LONGB = 0) 1.60 1.92
LASER MODULATOR
Modulation ON Current Range I
Modulation OFF Current I
MOD
MOD-OFF
Data rate 1.25Gbps 10 85
Data rate >1.25Gbps 10 60
mA
EN = high or BEN = low, IN = low (Note 2) 16 150 µA
Modulation-Current Stability (Note 13) -480 +480 ppm/°C
Modulation-Current Absolute Accuracy
Instantaneous Voltage at Modulator Output (OUT+)
Modulation-Current Rise Time t
Modulation-Current Fall Time t
R
F
> 15mA (Note 3) -15 +15 %
I
MOD
10mA I 60mA I 10mA I 10mA I
< 60mA 0.6
MOD
85mA 0.75
MOD
85mA (Notes 8, 13) 40 85 ps
MOD
85mA (Notes 8, 13) 40 85 ps
MOD
V
Output Over-/Undershoot 20 %
Deterministic Jitter (Notes 9, 13)
DJ
155Mbps to 1.25Gbps, 10mA I
1.25Gbps to 2.5Gbps, 10mA I
Random Jitter RJ (Note 13) 0.8 1.4 ps
85mA 17 45
MOD
60mA 17 40
MOD
ps
P-P
RMS
MAX3656
155Mbps to 2.5Gbps Burst-Mode Laser Driver
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(Typical values are at VCC= +3.3V, I
BIAS
= 20mA, I
MOD
= 25mA, extinction ratio = 10dB, and TA= +25°C, unless otherwise noted.)
Note 1: Excludes I
BIAS
and I
MOD
. Maximum value is specified at I
MOD
= 85mA, I
BIAS
= 70mA, and IMD= 1.5mA.
Note 2: For safety purposes, both the bias and modulation currents are switched off if any of the current set pins (BIASMAX, MODSET)
are grounded.
Note 3: Accuracy refers to part-to-part variation. Note 4: APC loop initialization definitions:
I
BIAS
Error: I
BIAS
- I
BIASSET
, where I
BIAS
= the actual bias current and I
BIASSET
= the level of bias current set by the R
APCSET
resistor. Initialization Case 1: Continuous Mode Power-Up. In this case, EN = low, BEN = high, and then V
CC
is ramped up from
0V to 3.0V.
Initialization Case 2: Chip-Enable Reset. In this case, 3.0V VCC≤ 3.6V, BEN = high, and then EN changes from high to low. Initialization Case 3: Burst-Mode Startup. In this case, 3.0V V
CC
3.6V, EN = low, and then BEN changes from low to high.
Note 5: I
BIAS
error is less than 3.8mA (for an extinction ratio of 10dB and IMD= 1500µA) within 12µs from the time that VCC≥ 3.0V.
Note 6: I
BIAS
error is less than 3.8mA (for an extinction ratio of 10dB and IMD= 1500µA) within 2.1µs (typ) from the time that EN < 0.8V.
Note 7: I
BIAS
error must be less than 3.8mA (for an extinction ratio of 10dB and IMD= 1500µA) at or before the end of the third burst following the transition of BEN from low to high. For the shortest burst on- and off-time (576ns and 96ns), this trans­lates to 1.92µs from when BEN toggles from low to high for the first time after startup.
Note 8: Rise and fall times are measured as 20% to 80% of the output amplitude with a repeating 0000011111. Note 9: Deterministic jitter is measured with a continuous data pattern (no bursting) of 2
7
- 1 PRBS + 80 consecutive ones + 27- 1
PRBS + 80 consecutive zeros.
Note 10: Measured electrically with a resistive load matched to the laser driver output. Note 11: Enable delay is measured between (1) the time at which the rising edge of the differential burst enable input signal reach-
es the midpoint of the voltage swing, and (2) the time at which the combined output currents (bias and modulation) reach 90% of the final level set by R
APCSET
, R
BIASMAX
, and R
MODSET
(after all transients such as overshoot, ringing, etc., have
settled to within 10% of their final values). See Figure 1. Measurement done for 10mA ≤ I
MOD
85mA and 4mA I
BIAS
70mA.
Note 12: Disable delay is measured between (1) the time at which the falling edge of the differential burst enable input signal reaches
the midpoint of the voltage swing, and (2) the time at which the combined output currents (bias and modulation) fall below 10% of the bias on current (after transients have settled). See Figure 1. Measurement done for 10mA ≤ I
MOD
85mA and
4mA ≤ I
BIAS
70mA.
Note 13: Guaranteed by design and characterization.
BURST-MODE SPECIFICATIONS
Burst Enable Delay APC closed loop (Notes 10, 11, 13) 2.3 ns
Burst Disable Delay APC closed loop (Notes 10, 12, 13) 2.0 ns
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
OPTICAL EVALUATION
Optical Eye Diagram Mask Margin
B-ON
B-OFF
155Mbps 2881
622Mbps 720Burst On-Time (Note 13) t
1.25Gbps, 2.5Gbps 576
155Mbps 192
622Mbps 96Burst Off-Time (Note 13) t
1.25Gbps, 2.5Gbps 96
E xceLi g ht S LT3120- D N l aser d i od e ( or eq ui val ent)
155.52Mbps 42
622.08Mbps 30
1.25Gbps 23
2.48832Gbps 18
ns
ns
%
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
_______________________________________________________________________________________ 5
Figure 1. Enable and Disable Delay Times
Figure 2. Output Termination for Characterization
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
OPTICAL EYE DIAGRAM
(155.52Mbps, 117MHz FILTER,
PATTERN = PRBS 2
7
- 1 + 80 CID)
MAX3656 toc01
EXCELIGHT SLT3120-DN LASER
AVERAGE OPTICAL POWER = -4dBm EXTINCTION RATIO = 15.2dB MASK MARGIN = 42%
OPTICAL EYE DIAGRAM
(622.08Mbps, 467MHz FILTER,
PATTERN = PRBS 2
7
- 1 + 80 CID)
MAX3656 toc02
EXCELIGHT SLT3120-DN LASER
AVERAGE POWER = -4dBm EXTINCTION RATIO = 15.1dB MASK MARGIN = 30%
OPTICAL EYE DIAGRAM
(1.25Gbps, 933MHz FILTER,
PATTERN = PRBS 2
7
- 1 + 80 CID)
MAX3656 toc03
EXCELIGHT SLT3120-DN LASER
AVERAGE POWER = -3.5dBm EXTINCTION RATIO = 14dB MASK MARGIN = 23%
V
CC
BEN+
BEN-
I
BIAS
+ I
MOD
ENABLE DELAY
10% OF I
BEN ±MIDPOINT
BIAS
DISABLE DELAY
I
FINAL
I
I
FINAL
FINAL
× 110%
× 90%
22.1
OUT-
49.9
V
CC
MAX3656
22.1
26.7
121
Z0 = 50
= 50
Z
0
V
CC
V
CC
OSCILLOSCOPE
26.7
35.7
OUT+
BIAS+
BIAS-
I
MOD
I
BIAS
50
50
10
20
15
30
25
35
40
200 800 1000400 600 1200 1400 1600
DETERMINISTIC JITTER
vs. INPUT AMPLITUDE
MAX3656 toc07
INPUT AMPLITUDE (mV
P-P
)
DETERMINISTIC JITTER (ps
P-P
)
I
MOD
= 30mA
PATTERN = 2
7
- 1PRBS + 80 CID
DATA RATE = 2.5Gbps
0.5
0.7
0.6
0.9
0.8
1.1
1.0
1.2
1.4
1.3
1.5
10 30
402050 60 70 80
RANDOM JITTER vs. I
MOD
MAX3656 toc08
I
MOD
(mA)
RANDOM JITTER (ps
RMS
)
10,000
10
0.1 10 100
IMD vs. R
APCSET
100
1000
MAX3656 toc09
R
APCSET
(k)
I
MD
(µA)
1
100
90
80
70
60
50
40
30
20
10
0
110100
I
MOD
vs. R
MODSET
MAX3656 toc10
R
MODSET
(k)
I
MOD
(mA)
100
90
80
70
60
50
40
30
20
10
0
110100
I
BIASMAX
vs. R
BIASMAX
MAX3656 toc11
R
BIASMAX
(k)
I
BIASMAX
(mA)
MAX3656
155Mbps to 2.5Gbps Burst-Mode Laser Driver
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
ELECTRICAL EYE DIAGRAM
(2.5Gbps, I
PATTERN = PRBS 2
MOD
100ps/div
= 30mA,
7
- 1 + 80 CID)
MAX3656 toc04
SUPPLY CURRENT vs. TEMPERATURE
(EXCLUDES I
80
75
70
65
60
55
50
45
SUPPLY CURRENT (mA)
40
35
30
-40 -20 -10-30 0 10 20 304050607080
BIAS, IMOD,
TEMPERATURE (°C)
15 LOAD)
MAX3656 toc05
DETERMINISTIC JITTER vs. I
40
DATA RATE = 2.5Gbps PATTERN = 2
35
)
V
P-P
30
25
20
DETERMINISTIC JITTER (ps
15
10
10 30 4020 50 60 70 80
= 200mV
IN
7
- 1PRBS + 80 CID
P-P
I
(mA)
MOD
MOD
MAX3656 toc06
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
_______________________________________________________________________________________ 7
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
Pin Description
PIN NAME FUNCTION
1, 4, 9,
15, 18, 21
2 IN+ Noninverting Data Input with On-Chip Biasing
3 IN- Inverting Data Input with On-Chip Biasing
5 BEN+ Noninverting Burst-Enable Input with On-Chip Biasing
6 BEN- Inverting Burst-Enable Input with On-Chip Biasing
7 EN
8, 11, 19 GND Power-Supply Ground
10 FAIL TTL/CMOS Failure Output. Indicates APC failure when low.
12 LONGB TTL/CMOS Long Burst (See the Setting the LONGB Input Pin Section) 13 BIAS- Inverting Laser Bias-Current Output. Connect through 15 to VCC.
14 BIAS+
16 OUT+
17 OUT- Inverting Laser Modulation-Current Output. Connect through 15 to VCC.
20 MD
TIMING DIAGRAM, BURST ON
V
MOD+
V
BIAS+
BURST-ENABLE SIGNAL
500ps/div
V
CC
Power-Supply Voltage
TTL/CMOS Enable Input. Low for normal operation. Float or pull high to disable laser bias and modulation currents.
Noninverting Laser Bias-Current Output. Bias current flows into this pin when BEN is high. Minimize capacitance on this pin.
Noninverting Laser Modulation-Current Output. Modulation current flows into this pin when BEN and IN are high.
Monitor Diode Input. Connect this pin to the anode of the monitor diode. Leave floating for open-loop operation. Minimize capacitance on this pin.
MAX3656 toc12
TIMING DIAGRAM, BURST OFF
BURST-DISABLE
SIGNAL
1ns/div
MAX3656 toc13
V
MOD+
V
BIAS+
Maximum Bias Current Set. A resistor connected from this pin to ground sets the maximum bias
22 BIASMAX
23 MODSET M od ul ati on C ur r ent S et. A r esi stor connected fr om thi s p i n to g r ound sets the d esi r ed m od ul ati on cur r ent.
24 APCSET
EP Exposed Pad Ground. This pad must be soldered to ground.
current. The bias current cannot exceed this level. The APC loop controls the bias current up to the level of the BIASMAX. For APC open-loop operation, this pin sets the laser bias current.
Average Power Control Set. A resistor connected from this pin to ground sets the desired average optical power. Connect a 50k resistor to ground for APC open-loop operation.
MAX3656
Detailed Description
The MAX3656 laser driver has three main parts: a high­speed modulator, a high-speed bias driver, and a laser­biasing block with automatic power control (see the Functional Diagram). Both the bias and modulation output stages are composed of differential pairs with program­mable current sources. The circuit design is optimized for high-speed, low-voltage (3.3V), DC-coupled operation. The device is ideal for burst-mode operation with turn-on and turn-off times less than 2ns. The MAX3656 can be configured for nonburst-mode applications (continuous mode) by connecting BEN high.
The MAX3656 modulation output is optimized for dri­ving a 15load. The modulation current can swing up to 85mA for data rates less than or equal to 1.25Gbps and up to 60mA for data rates greater than 1.25Gbps when the laser is DC-coupled. To interface with the laser diode, a damping resistor (RD) is required for impedance matching. The combined resistance due to the series damping resistor and the equivalent series resistance (ESR) of the laser diode should be equal to 15. The OUT- pin should be connected with a 15 resistor to VCC. To reduce optical output aberrations and duty-cycle distortion caused by laser diode para­sitic inductance, an RC shunt network is necessary.
The currents in the BIAS output switch at high speeds when bursting. Therefore, the BIAS+ pin should be con­nected directly through a resistor to the cathode of the laser. The BIAS- pin should be connected to V
CC
through a 15resistor.
Automatic Power Control
To maintain constant average optical power, the MAX3656 incorporates a digital automatic power-con­trol (APC) loop to compensate for the changes in laser threshold current over temperature and lifetime. A back-facet photodiode mounted in the laser package converts the optical power into a photocurrent. The APC loop adjusts the laser bias current so the monitor current is matched to a reference current set by R
APCSET
.
At startup, the APC loop traverses through a pseudo­binary search algorithm to set the proper monitor current that translates to the proper bias current. When BEN is high, the APC loop maintains constant optical power by digitally controlling the bias current. When BEN is low, the APC loop digitally stores the bias current value of the previous burst. The APC loop is reset in two ways, either power cycling or toggling the EN pin.
An external resistor (R
BIASMAX
) sets the maximum allow­able bias current during closed-loop operation and sets the bias current during open-loop operation. An APC fail-
ure flag (FAIL) is set low during initialization and when the bias current cannot be adjusted to achieve the desired average optical power.
APC closed-loop operation requires that the user set three currents with external resistors connected between GND, BIASMAX, MODSET, and APCSET pins. Detailed guidelines for these resistor settings are described in the Design Procedure section.
If necessary, the MAX3656 is fully operational without APC. To operate the MAX3656 open loop, connect a 50kresistor from APCSET to ground and leave the MD pin unconnected. In this case, two external resis­tors connected from BIASMAX and MODSET to GND directly set the laser current.
APC Failure Monitor
The MAX3656 provides an APC failure monitor (TTL) to indicate an APC loop-tracking failure. FAIL is set low when the APC loop cannot adjust the bias current to maintain the desired monitor current. For example, the laser diode requires more bias current (to maintain a constant optical output) than maximum bias current set by R
BIASMAX
. The bias current is limited and FAIL is
asserted. In an alternate example, assume that a circuit failure causes the cathode of the laser diode to be short­ed to GND, thereby causing an uncontrolled high optical output. In this case, the APC loop cannot decrease the user current, and FAIL is asserted. FAIL is also set low during initialization.
Slow-Start
For safety reasons, at initial power-up or after toggling EN, the MAX3656 incorporates a slow-start circuit that provides a typical delay of 450ns during the beginning of APC loop initialization.
Enable Control
The MAX3656 features a chip-enable function. When EN is high, the bias and modulation currents are off and the digital state of the APC loop is reset. When EN is toggled from a high to a low, the APC loop begins ini­tialization. The initialization time is typically 2.1µs (LONGB = low) and 3.72µs (LONGB = high).
APC Loop Initialization
The digital APC loop is reset whenever the power is turned off and/or the EN input is driven high. When power is turned on or when EN is toggled low, the APC loop automatically performs an initialization routine that quickly adjusts the bias current from its reset level to its initialized level. The initialized bias current level is defined to be within 3.8mA of the final bias current level set by the APCSET resistor. Once initialized, the APC
155Mbps to 2.5Gbps Burst-Mode Laser Driver
8 _______________________________________________________________________________________
loop enters its fine-adjustment mode of operation and adjusts the bias current to match the level set by the APCSET resistor. There are three different cases in which the APC loop starts initialization, and each has a unique initialization time. These cases are defined as follows:
Continuous-Mode Power-Up
In continuous-mode power-up, the chip is enabled (EN = low) and the burst-enable input is high (BEN = high) when power is applied to the laser driver. APC loop initialization begins when the power-supply volt­age rises above the minimum specified limit of +3.0V. The BEN input remains high indefinitely and the laser driver operates in continuous (nonbursting) mode. In this case, the initialization time is 12µs (typ).
Chip-Enable Reset
In chip-enable reset, the power-supply voltage is within the specified limits and BEN is high. The chip-enable input (EN) is initially high (chip dis­abled and APC loop reset), and then it is driven low (chip-enabled). In this case, APC loop initialization begins when the voltage at EN drops below the specified EN input low voltage of 0.8V. After initial­ization begins, the laser driver can be operating in burst mode (BEN toggling high and low) or continu­ous mode (BEN = high). In this case, the initializa­tion time is 2.1µs (typ).
Burst-Mode Startup
In burst-mode startup, the power-supply voltage is within the specified limits and the chip is enabled (EN = low). The burst-enable input is low (BEN = low) and has not been in the high state since the APC loop was reset. APC loop initialization begins when the BEN input is driven high. After initialization begins, the laser driver can be operating in burst mode (BEN toggling high and low) or continuous mode (BEN = high). In this case, the initialization time is 1.6µs (typ).
In each of the three cases listed, initialization is complete within three bursts (bursts must comply with specified burst on- and burst off-time) or the time specified in the Electrical Characteristics table, whichever comes first.
Burst-Mode Operation
The bias and modulation outputs (BIAS+ and OUT+) can be switched on and off quickly using the differential burst-enable inputs (BEN+ and BEN-). Once the APC loop has initialized, the bias and modulation outputs are switched on when BEN+ = high and BEN- = low and are switched off when BEN+ = low and BEN- = high.
When BEN is switched on, the laser driver sinks the bias and modulation currents set by the APCSET, BIASMAX, and MODSET resistors within the maximum BEN delay time of 2.3ns. For stable APC loop operation, the mini­mum burst length is limited to the burst on-time listed in the Electrical Characteristics table. The maximum burst- on time is unlimited.
When BEN is switched off, the bias and modulation cur­rents fall below the specified bias-off and modulation­off currents within the maximum burst disable delay time of 2.0ns. For stable APC loop operation, the mini­mum burst off-time is limited to the value listed in the Electrical Characteristics table. The maximum burst off­time is unlimited.
Short-Circuit Protection
The MAX3656 provides short-circuit protection for the modulation and bias-current sources. If BIASMAX or MODSET is shorted to ground, the bias and modulation outputs are turned off.
Design Procedure
When designing a laser transmitter, the optical output is usually expressed in terms of average power and extinction ratio. Table 1 shows the relationships helpful in converting between the optical average power and the modulation current. These relationships are valid if the mark density and duty cycle of the optical wave­form are 50%.
Programming the Modulation Current
For a given laser power (P
AVG
), slope efficiency (η),
and extinction ratio (re), the modulation current can be calculated using Table 1. See the I
MOD
vs. R
MODSET
graph in the Typical Operating Characteristics, and select the value of R
MODSET
that corresponds to the
required current at +25°C.
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
_______________________________________________________________________________________ 9
Table 1. Optical Power Definition
PARAMETER SYMBOL RELATION
Average power P
Extinction ratio r
Optical power high P
Optical power low P
Optical amplitude P
Laser slope efficiency
Modulation current I
Laser-to-monitor diode gain
AVGPAVG
e
1
0
P-P
ηη = P
MODIMOD
A
LMD
= (P0 + P1) / 2
re = P1 / P
P1 = 2P
P0 = 2P
P
P-P
(2 x I (r
e
= P1 - P
P-P
= P
MD
+ 1))
0
× re / (re + 1)
AVG
/ (re + 1)
AVG
0
/ I
MOD
/ η
P-P
/ I
)((re - 1) /
MOD
MAX3656
Programming the Bias Current
When the MAX3656 is used in open-loop operation, the R
BIASMAX
resistor determines the bias current. To select this resistor, determine the required bias current. See the I
BIASMAX
vs. R
BIASMAX
graph in the Typical Operating Characteristics, and select the value of R
BIASMAX
that corresponds to the required current. For
open-loop operation, connect a 50kresistor from R
APCSET
to GND, and leave the MD pin open.
When using the MAX3656 in closed-loop operation, the R
BIASMAX
resistor sets the maximum bias current avail­able to the laser diode over temperature and lifetime. The APC loop can subtract from this maximum value, but cannot add to it. See the I
BIASMAX
vs. R
BIASMAX
graph in the Typical Operating Characteristics and select the value of R
BIASMAX
that corresponds to the
end-of-life bias current at +85°C.
Programming the APC Loop
When using the MAX3656’s APC feature, program the average optical power by adjusting the APCSET resis­tor. To select this resistor, determine the desired moni­tor current to be maintained over temperature and lifetime. See the IMDvs. R
APCSET
graph in the Typical Operating Characteristics and select the value of R
APCSET
that corresponds to the required current.
Setting the LONGB Input Pin
Set the LONGB pin according to Table 2 to optimize APC loop operation.
Interfacing with Laser Diodes
To minimize optical output aberrations caused by sig­nal reflections at the electrical interface to the laser diode, a series-damping resistor (RD) is required (see the Functional Diagram). Additionally, the MAX3656 outputs are optimized for a 15load. Therefore, the series combination of RDand RL(where RLrepresents the laser-diode resistance) should equal 15. Typical values for RDare 8to 13. For best performance, a bypass capacitor (0.01µF typical) should be placed as close as possible to the anode of the laser diode. An RC shunt network between the OUT+ pin and ground helps minimize optical output aberrations. Starting val­ues for most coaxial lasers are R = 56in series with C = 10pF. Adjust these values experimentally until the
optical output waveform is optimized (refer to Application Note HFAN 3.0: Interfacing Maxim’s Laser Drivers with Laser Diodes).
Input Termination Requirements
The MAX3656 data and BEN inputs are internally biased. Although the inputs are compatible with LVPECL signals, it is not necessary to drive the MAX3656 with a standard LVPECL signal. While DC-coupled, the MAX3656 oper­ates properly as long as the specified common-mode voltage and differential voltage swings are met. Because of the on-chip biasing network (Figure 3), the MAX3656 inputs self-bias to the proper operating point to accommodate AC-coupling.
See Figures 4 and 5 for connecting to PECL or CML data outputs.
155Mbps to 2.5Gbps Burst-Mode Laser Driver
10 ______________________________________________________________________________________
Table 2. Setting the LONGB Input Pin
Figure 3. MAX3656 Internal Biasing
LONGB CONDITION
0 Burst on-time 1.2µs
0 or 1
1 Data rates of 155Mbps
Burst on-time >1.2µs or
continuous mode operation
V
V
CC
V
CC
IN+
V
IN-
V
BEN+
V
BEN-
5k
CC
5k
CC
5k
CC
5k
16k
24k
V
CC
16k
24k
CC
MAX3656
V
CC
Design Example
Select Laser
Select a communication-grade laser for the proper data rate. Assume the laser output average power is P
AVG
=
0dBm, the operating temperature is -40°C to +85°C
,
and the laser diode has the following characteristics: wavelength: λ = 1.3µm, threshold current: ITH= 22mA at +25°C, threshold temperature coefficient: βTH=
1.3%/°C, laser-to-monitor transfer: ρ
MON
= 0.2A/W
(ρ
MON
= ρ
MONITORDIODE
x L
LASER-TO-MONITORDIODE)
,
and laser slope efficiency: η = 0.05mW/mA at +25°C.
Determining R
APCSET
The desired monitor diode current is estimated by IMD= P
AVG
ρ
MON
= 200µA. The IMDvs. R
APCSET
graph in the
Typical Operating Characteristics shows R
APCSET
at 12kΩ.
Determining R
MODSET
Assuming re= 10 and an average power of 0dBm (1mW), the peak-to-peak optical power P
P-P
= 1.64mW (Table 1). The required modulation current is 1.64(mW)/0.05(mW/mA) = 32.8mA. The I
MOD
vs. R
MODSET
graph in the Typical Operating Characteristics shows R
MODSET
at 9kΩ.
Determining R
BIASMAX
Determine the maximum threshold current (I
TH(MAX)
) at
TA= +85°C and end of life. Assuming (I
TH(MAX)
) =
50mA, the maximum bias current should be:
I
BIASMAX
= I
TH(MAX)
In this example, I
BIASMAX
= 50mA. The I
BIASMAX
vs. R
BIASMAX
graph in the Typical Operating Charact-
eristics shows R
BIASMAX
at 8kΩ.
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
______________________________________________________________________________________ 11
Figure 4. Connecting to PECL Outputs
Figure 5. Connecting to CML Outputs
Figure 6. Single-Ended Biasing for Burst Enable
V
CC
130
ZO = 50
ZO = 50
82
V
IN+
CC
MAX3656
130
IN-
ZO = 50
ZO = 50
ZO = 50
ZO = 50
100
100
IN+
IN-
BEN+
BEN-
MAX3656
82
V
CC
130
ZO = 50
82
V
CC
130
ZO = 50
82
BEN+
BEN-
V
+ (100mV to 800mV)
CMBEN
V
CMBEN
- (100mV to 800mV)
V
CMBEN
V
CMBEN
= +2.0V
3.3V
R
= 1.65k
1
= 2.54k
R
2
IN+
IN-
BEN+
BEN-
MAX3656
MAX3656
Applications Information
Running Burst Enable Single-Ended
With PECL signal levels, for single-ended operation of burst enable, connect the BEN+ to the burst-enable con­trol. Connect a resistor (R1) from VCCto BEN- and resis­tor (R2) from BEN- to ground. The parallel combination of R1and R2should be less than 1k. Choose the values of R1and R2to set the common-mode voltage in the range defined in the Electrical Characteristics table (see Figure 6).
With LVTTL or LVCMOS signal levels, for single-ended operation of burst enable connect a 3kΩ (R4) resistor from the burst-enable signal to BEN+. Connect a 5k (R3) resistor from VCCto BEN+. Connect a 5kresistor (R5) from VCCto BEN- and a 9kresistor (R6) from BEN­to ground. For typical LVTTL or LVCMOS specifications of VCCto 2.0V for a high and 0.8V to 0V for a low, the LVTTL or LVCMOS sources a maximum of 75µA and sinks a maximum of 500µA. See Figure 7 for setting up the sin­gle-ended LVTTL or LVCMOS biasing for burst enable.
Burst Enable Delay
For some lasers, replacing the 15resistors connected from OUT- and BIAS- to VCCwith surface-mount signal diodes can reduce burst-enable delay.
Wire-Bonding Die
For high-current density and reliable operation, the MAX3656 uses gold metalization. Make connections to the die with gold wire only, using ball-bonding tech­niques. Die-pad size is 4.03 mils (102.4µm) square, and die size is 98 mils ✕65 mils (2489.2µm ✕1651µm).
Layout Considerations
To minimize inductance, keep the connections between the MAX3656 output pins and laser diode as close as possible. Optimize the laser diode performance by plac­ing a bypass capacitor as close as possible to the laser anode. Take extra care to minimize stray parasitic capac­itance on the BIAS and MD pins. Use good high-frequen­cy layout techniques and multilayer boards with uninterrupted ground planes to minimize EMI and crosstalk.
155Mbps to 2.5Gbps Burst-Mode Laser Driver
12 ______________________________________________________________________________________
Table 3. Pad Locations
Figure 7. Single-Ended LVTTL or LVCMOS Biasing for Burst Enable
IN+
V
CC
LVTTL OR LVCMOS HIGH
LVTTL OR LVCMOS LOW
R3 = 5k
= 3k
R
4
R5 = 5k
= 9k
R
6
IN-
BEN+
V
CC
BEN-
MAX3656
PAD NAME COORDINATES (microns)
1VCC51.2 1146.0
2 IN+ 51.2 1003.2
3 IN- 51.2 856.2
4VCC51.2 709.2
5 BEN+ 51.2 198.2
6 BEN- 51.2 51.2
7 GND 142.2 -111.2 8 EN 282.2 -111.2
9 GND 423.6 -111.2
10 V 11 FAIL 1569.6 -111.2
12 GND 1738.2 -111.2
13 LONGB 1881.0 -111.2
14 GND 2023.8 -111.2
15 BIAS- 2257.6 87.6
16 BIAS+ 2257.6 236.0
17 V
18 OUT+ 2257.6 626.6
19 OUT+ 2257.6 768.0
20 OUT- 2257.6 931.8
21 OUT- 2257.6 1073.2
22 V
23 GND 2039.2 1242.6
24 MD 1893.6 1242.6
25 GND 1749.4 1242.6
26 V
27 GND 1461.0 1242.6
28 BIASMAX 700.8 1242.6
29 MODSET 555.2 1242.6
30 APCSET 412.4 1242.6
31 GND 262.6 1242.6
CC
CC
CC
CC
608.4 -111.2
2257.6 453.0
2257.6 1217.4
1603.8 1242.6
Laser Safety and IEC825
Using the MAX3656 laser driver alone does not ensure that a transmitter design is compliant with IEC825. The entire transmitter circuit and component selections must be considered. Each user must determine the level of fault tolerance required by the application, recognizing
that Maxim products are neither designed nor authorized for use as components in systems intended for surgical implant into the body, for applications intended to support or sustain life, or for any other application in which the fail­ure of a Maxim product could create a situation where personal injury or death can occur.
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
______________________________________________________________________________________ 13
Functional Diagram
MAX3656
IN+
V
CC
I
MOD
OUT+
OUT-
R
COMP
C
R
COMP
D
V
CC
IN-
BEN+
BEN-
R
MODSET
APC
DAC DSP ASP
R
BIASMAX
EN FAIL
LONGB
I
BIAS
R
APCSET
BIAS+
BIAS-
MD
V
CC
MAX3656
155Mbps to 2.5Gbps Burst-Mode Laser Driver
14 ______________________________________________________________________________________
Chip Topography
Chip Information
TRANSISTOR COUNT: 8153
SUBSTRATE: Electrically isolated
DIE SIZE: 2489.2µm X 1651µm
DIE THICKNESS: 12 mils
PROCESS: SiGe bipolar
MODSET
V
GND
V
CC
APCSET
BIASMAX
GND
GND
CC
MD
GND
V
CC
(0,0)
V
BEN+
BEN-
IN+
IN-
CC
GND
MAX3656
GND V
CC
0.098"
(2.489mm)
OUT-
OUT+
0.065"
(1.651mm)
V
CC
BIAS+
BIAS-
FAILEN
GND
LONGB
GND
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
______________________________________________________________________________________ 15
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages
.)
24L QFN THIN.EPS
PACKAGE OUTLINE, 12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
21-0139
1
D
2
MAX3656
155Mbps to 2.5Gbps Burst-Mode Laser Driver
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages
.)
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
PACKAGE OUTLINE, 12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
21-0139
2
D
2
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