The MAX3535E/MXL1535E isolated RS-485/RS-422 fullduplex transceivers provide 2500V
RMS
of galvanic isolation between the RS-485/RS-422 side and the processor
or control logic side. These devices allow fast,
1000kbps communication across an isolation barrier
when the common-mode voltages (i.e., the ground
potentials) on either side of the barrier are subject to
large differences. Isolation is achieved through integrated high-voltage capacitors. The MAX3535E/MXL1535E
also feature a 420kHz transformer driver that allows
power transfer to the RS-485 side using an external
transformer.
The MAX3535E/MXL1535E include one differential driver,
one receiver, and internal circuitry to send the RS-485
signals and control signals across the isolation barrier
(including the isolation capacitors). The MAX3535E/
MXL1535E RS-485 receivers are 1/8 unit load, allowing
up to 256 devices on the same bus.
The MAX3535E/MXL1535E feature true fail-safe circuitry.
The driver outputs and the receiver inputs are protected
from ±15kV electrostatic discharge (ESD) on the interface side, as specified in the Human Body Model (HBM).
The MAX3535E/MXL1535E feature driver slew-rate
select that minimizes electromagnetic interference (EMI)
and reduces reflections. The driver outputs are short-circuit and overvoltage protected. Other features are hotswap capability and isolation-barrier fault detection.
The MAX3535E operates with a single +3V to +5.5V
power supply. The improved secondary supply range of
the MAX3535E allows the use of step-down transformers
for +5V operation, resulting in considerable power savings. The MXL1535E operates with a single +4.5V to
+5.5V power supply. The MXL1535E is a function-/pincompatible improvement of the LTC1535. The
MAX3535E/MXL1535E are available over the commercial 0°C to +70°C and extended -40°C to +85°C temperature ranges.
= +3.13V to +7.5V, TA= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC1
= +3.3V,
V
CC2
= +5V, TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Logic Side—All Voltages Referenced to GND1.
V
CC1
.........................................................................-0.3V to +6V
RE, DE, DI.................................................................-0.3V to +6V
RO1, ST1, ST2 ..........................................-0.3V to (V
CC1
+ 0.3V)
Isolated Side—All Voltages Referenced to GND2.
V
CC2
.........................................................................-0.3V to +8V
SLO...........................................................-0.3V to (V
CC2
+ 0.3V)
A, B ......................................................................................±14V
RO2 .....................-0.3V to the lower of (V
CC2
+ 0.3V) and +3.4V
Y, Z ............................................................................-8V to +13V
= +4.5V to +7.5V, RL= 27Ω, CL= 50pF, TA= -40°C to +85°C, unless otherwise noted. Typical values
are at V
CC1
= +5V, V
CC2
= +5V, TA= +25°C.)
Note 1: Receiver inputs are 96kΩ minimum resistance, which is 1/8 unit load.
Note 2: 60s test result is guaranteed by correlation from 1s result.
Note 3: V
ISO
is the voltage difference between GND1 and GND2.
Note 4: The maximum data rate is specified using the maximum jitter value according to the formula: data rate = 1 / (4tJ). See the
Skew
section for more information.
Note 5: Initial startup time is the time for communication to recover after a fault condition. Internal communication timeout fault time
is the time before a fault is indicated on RE, after internal communication has stopped.
Note 6: Bd = 2 bits.
Data Sample Jittert
Max Baud Ratef
Driver-Differential Output Delay
Time
Driver-Differential Output
Transition Time
Driver-Output Enable Timet
Driver-Output Disable Timet
Receiver-Propagation Delay Time
to RO1
Receiver-Propagation Delay Time
to RO2
RO1, RO2 Rise or Fall TimetR, t
Receiver-Output Enable Time
RO1
Receiver-Output Disable Time
RO1
Initial Startup Time (from Internal
Communication Fault)
Logic-Side/Transformer-Driver Power Input. Bypass V
capacitors.
Transformer-Driver Phase 1 Power Output. Connect ST1 to isolation-transformer
primary to send power to isolation side of barrier.
Transformer-Driver Phase 2 Power Output. Connect ST2 to isolation-transformer
primary to send power to isolation side of barrier.
RS-485/RS-422 Inverting Driver Output. Output floats when DE is low or in a barrier fault
event. (See the Detailed Description section for more information.)
RS-485/RS-422 Noninverting Driver Output. Output floats when DE is low or in a barrier
fault event. (See the Detailed Description section for more information.)
Isolated-Side Power Input. Connect V
secondary. Bypass V
Isol ated - S i d e Recei ver O utp ut. RO2 i s al w ays enab l ed . RO 2 g oes hi g h i f A - B > - 10m V .
RO2 g oes l ow i f A - B < - 200m V . Fai l - safe ci r cui tr y causes RO 2 to g o hi g h w hen A and B
fl oat or ar e shor ted .
to GND2 with 10µF and 0.1µF capacitors.
CC2
to the rectified output of transformer
CC2
to GND1 with 10µF and 0.1µF
CC1
18SLOIsolated
25DILogic
26DELogic
27RELogic
28RO1Logic
Driver Slew-Rate Control Logic Input. Connect SLO to GND2 for data rates up to
400kbps. Connect SLO to V
Driver Input. Pull DI low (high) to force driver output Y low (high) and driver output Z
high (low).
Driver-Enable Input. The driver outputs are enabled and follow the driver input (DI)
when DE is high. When DE is floated, the driver is disabled. DE does not affect whether
the receiver is on or off.
Receiver-Output Enable and Fault Current Output. The receiver output (RO1) is
enabled and follows the differential-receiver inputs, A and B, when RE is low, otherwise
RO1 floats. RE does not affect RO2 and does not disable the driver. The asserted fault
output is a pullup current, otherwise RE shows a pulldown current.
Receiver Output. RO1 is enabled when RE is low. RO1 goes high if A - B > -10mV. RO1
goes low if A - B < -200mV. Fail-safe circuitry causes RO1 to go high when A and B
float or are shorted.
The MAX3535E/MXL1535E isolated RS-485/RS-422 fullduplex transceivers provide 2500V
RMS
of galvanic isolation between the RS-485/RS-422 isolation side and the
processor or logic side. These devices allow fast,
1000kbps communication across an isolation barrier even
when the common-mode voltages (i.e., the ground potentials) on either side of the barrier are subject to large differences. The isolation barrier consists of two parts. The
first part is a capacitive isolation barrier (integrated highvoltage capacitors) that allows data transmission
between the logic side and the RS-485/RS-422 isolation
side. Data is sampled and encoded before it is transmitted across the isolation barrier introducing sampling jitter
and further delay into the communication system.
The second part of the isolation barrier consists of an
external transformer with the required primary-to-secondary isolation, allowing the transmission of operating
power from the logic side across the isolation barrier to
the isolation side. Connect the primary of the external
transformer to the MAX3535E/MXL1535E’s 420kHz
transformer driver outputs ST1 and ST2. Since the
MXL1535E and the MAX3535E operate with different
supply-voltage requirements at their respective isolated
and logic sides, different isolation transformers must be
used with each device (see the
Transformer Selection
section). The only external components needed to
complete the system are the isolation transformer, two
diodes, and two low-voltage, 10µF decoupling capacitors (see the
Typical Application Circuit
).
The MAX3535E/MXL1535E include one differential driver, one receiver, and internal circuitry to send the RS485 signals and logic signals across the isolation barrier
(including the isolation capacitors). The MAX3535E/
MXL1535E receivers are 1/8 unit load, allowing up to 256
devices on a single bus.
The MAX3535E/MXL1535E feature fail-safe circuitry
ensuring the receiver output maintains a logic-high
state when the receiver inputs are open or shorted, or
when connected to a terminated transmission line with
all drivers disabled (see the
Fail Safe
section).
The MAX3535E/MXL1535E feature driver slew-rate
select that minimizes electromagnetic interference
(EMI) and reduces reflections caused by improperly
terminated cables at data rates below 400kbps. The
driver outputs are short-circuit protected for sourcing or
sinking current and have overvoltage protection. Other
features include hot-swap capability, which holds the
driver off if the driver logic signals are floated after
power is applied. The MAX3535E/MXL1535E have
error-detection circuitry that alerts the processor when
there is a fault and disables the driver until the fault is
removed.
Fail Safe
The MAX3535E/MXL1535E guarantee a logic-high
receiver output when the receiver inputs are shorted or
open, or when connected to a terminated transmission
line with all drivers disabled. The receiver threshold is
fixed between -10mV and -200mV. If the differential
receiver input voltage (A - B) is greater than or equal to
-10mV, RO1 is logic-high (Table 2). In the case of a terminated bus with all transmitters disabled, the receiver’s differential input voltage is pulled to zero by the
termination. Due to the receiver thresholds of the
MAX3535E/MXL1535E, this results in a logic-high at
RO1 with a 10mV minimum noise margin.
Driver Output Protection
Two mechanisms prevent excessive output current and
power dissipation caused by faults or by bus contention. The first, a foldback current limit on the output
stage, provides immediate protection against short circuits over the entire common-mode voltage range. The
second, a thermal-shutdown circuit, forces the driver
outputs into a high-impedance state if the die temperature exceeds +150°C.
Monitoring Faults on
RE
RE functions as both an input and an output. As an
input, RE controls the receiver output enable (RO1). As
an output, RE is used to indicate when there are faults
associated with the operation of the part. This dual
functionality is made possible by using an output driver
stage that can easily be overdriven by most logic
gates. When an external gate is not actively driving RE,
it is driven either high using a 100µA internal pullup
current (fault present), or low using a 60µA internal pulldown current (no fault). When using RE to control the
receiver-enable output function, be sure to drive it
using a gate that has enough sink and source capability to overcome the internal drive.
When not actively driving RE, it functions as the fault
indicator (Table 3). A low on RE indicates the part is
functioning properly, while a high indicates a fault is
present. The four causes of a fault indication are:
1) The voltage on V
CC1
is below its undervoltage-lock-
out threshold (2.69V nominal)
2) The voltage on V
CC2
is below its undervoltage-lock-
out threshold (2.80V nominal)
3) There is a problem that prevents the MAX3535E/
MXL1535E from communicating across its isolation
barrier
4) The die temperature exceeds +150°C nominally,
causing the part to go into thermal shutdown
When a fault occurs, RO1 is switched to a logic-high
state if RE is low (Table 3). Open-circuit or short-circuit
conditions on the receiver inputs do not generate fault
conditions; however, any such condition also puts RO1
in a logic-high state (see the
Fail Safe
section).
Read RE for fault conditions by using a bidirectional
microcontroller I/O line or a tri-stated buffer as shown in
Figure 10. When using a tri-stated buffer, enable the
driver whenever the voltage on RE needs to be forced
to a logic-high or logic-low. To read RE for a fault condition, disable the driver.
Slew-Rate Control Logic
The SLO input selects between a fast and a slow slew
rate for the driver outputs. Connecting SLO to GND2
selects the slow slew-rate option that minimizes EMI
and reduces reflections caused by improperly terminated cables at data rates up to 400kbps. This occurs
because lowering the slew rate decreases the rise and
fall times for the signal at the driver outputs, drastically
reducing the high-frequency components and harmonics at the output. Floating SLO or connecting it to V
CC2
selects the fast slew rate, which allows high-speed
operation.
The MAX3535E/MXL1535E transceivers facilitate bidirectional data communications on multipoint bus
transmission lines. Figure 11 shows a typical RS-485
multidrop-network applications circuit. Figure 12 shows
the MAX3535E/MXL1535E functioning as line repeaters
with cable lengths longer than 4000ft. To minimize
reflections, terminate the line at both ends in its characteristic impedance. Keep stub lengths off the main line
as short as possible.
The MXL1535E is a pin-for-pin compatible upgrade of
the LTC1535, making any transformer designed for that
device suitable for the MXL1535E (see Table 4). These
transformers all have a turns ratio of about 1:1.3CT.
The MAX3535E can operate with any of the transformers
listed in Table 4, in addition to smaller, thinner transformers designed for the MAX845 and MAX253. The 420kHz
transformer driver operates with single primary and center-tapped secondary transformers. When selecting a
transformer, do not exceed its ET product, the product of
the maximum primary voltage and half the highest period
of oscillation (lowest oscillating frequency). This ensures
that the transformer does not enter saturation. Calculate
the minimum ET product for the transformer primary as:
ET = V
MAX
/ (2 x f
MIN
)
where, V
MAX
is the worst-case maximum supply voltage,
and f
MIN
is the minimum frequency at that supply voltage.
Using +5.5V and 290kHz gives a required minimum ET
product of 9.5V-µs. The commercially available transformers for the MAX845 listed in Table 5 meet that
requirement. In most cases, use half of the center-tapped
primary winding with the MAX3535E and leave the other
end of the primary floating. Most of the transformers in
Table 5 are 1:1:1 or 1:1:1:1 turns ratio.
For +3.3V operation (+3.6V maximum) the required primary ET product is 6.2V-µs. All of the previously mentioned transformers meet this requirement. Table 6 lists
some other transformers with step-up turns ratios
specifically tailored for +3.3V operation. Most of the
transformers in Table 6 are 1:1:1.3:1.3.
By using a HALO TGM-010 or Midcom 95061 transformer, it becomes possible to build a complete isolated
RS-485/RS-422 transceiver with a maximum thickness
less than 0.1in. To minimize power consumption, select
the turns ratio of the transformer to produce the minimum
DC voltage required at V
CC2
(+3.13V) under worst-case,
high-temperature, low-V
CC1
, and full-load conditions. For
light loads on the isolated side, ensure that the voltage at
V
CC2
does not exceed +7.5V. For example, the CTX01-
14659 transformer results in 85mA (typ) V
CC1
supply current with full load on the RS-485 driver. Using a TGM250
1:1:1 transformer lowers the V
CC1
supply current to 65mA
(typ), while maintaining good margin on the V
CC2
supply.
A slight step-down transformer can result in extra power
savings in some situations. A custom wound sample
transformer with 23 primary turns and 20:20 secondary
turns on a Ferronics 11-050B core operates well with a
V
CC1
supply current of 51mA (typ).
Table 4. Transformers for the MXL1535E/MAX3535E
Table 5. Transformers for MAX3535E at +5V
MANUFACTURERPART NUMBERISOLATION VOLTAGE (1s)PHONE NUMBER
Cooper Electronic Technologies, Inc.CTX01-14659500V561-241-7876
Cooper Electronic Technologies, Inc.CTX01-146083750V
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electrostatic discharges encountered during handling and
assembly. The driver outputs and receiver inputs have
extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage.
The ESD structures withstand high ESD in all states.
After an ESD event, the MAX3535E/MXL1535E keep
working without latchup. ESD protection can be tested
in various ways. The transmitter outputs and receiver
inputs of this product family are characterized for protection to ±15kV using the Human Body Model.
ESD Test Conditions
The ±15kV ESD test specifications apply only to the A,
B, Y, and Z I/O pins. The test surge is referenced to
GND2. All remaining pins are ±2kV ESD protected.
Human Body Model
Figure 14 shows the Human Body Model, and Figure
15 shows the current waveform it generates when dis-
charged into low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resistance. Its objective is to simulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing, not just inputs and outputs. Therefore,
after PC board assembly, the Machine Model is less
relevant to I/O ports.
Skew
The self-oscillation circuit shown in Figure 5 is an excellent way to get an approximate measure of the speed
of the MAX3535E/MXL1535E. An oscillation frequency
of 250kHz in this configuration implies a data rate of at
least 500kbps for the receiver and transmitter combined. In practice, data can usually be sent and
received at a considerably higher data rate, normally
limited by the allowable jitter and data skew. If the system can tolerate a 25% data skew, (the difference
between t
PLH1
and t
PHL1
), the 285ns maximum jitter
specification implies a data rate of 877kbps. Lower
data rates result in less distortion and jitter (Figure 16).
Higher rates are possible but with more distortion and
jitter. The data rate should always be limited below
1.75Mbps for both receiver and driver to avoid interference with the internal barrier communication.
Layout Considerations
The MAX3535E/MXL1535E pin configurations enable
optimal PC board layout by minimizing interconnection
lengths and crossovers:
• For maximum isolation, the isolation barrier should not
be breached except by the MAX3535E/MXL1535E and
the transformer. Connections and components from
one side of the barrier should not be located near those
of the other side of barrier.
• A shield trace connected to the ground on each side of
the barrier can help intercept capacitive currents that
might otherwise couple into the DI and SLO inputs. In a
double-sided or multilayer board, these shield traces
should be present on all conductor layers.
• Try to maximize the width of the isolation barrier
wherever possible. A clear space of at least 0.25in
between GND1 and GND2 is recommended.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages
.)
MAX3535E/MXL1535E
28L 16L SOIC.EPS
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