MAXIM MAX3372E, MAX3379E, MAX3390E Technical data
General Description
The MAX3372E–MAX3379E and MAX3390E–MAX3393E
±15kV ESD-protected level translators provide the level
shifting necessary to allow data transfer in a multivoltage
system. Externally applied voltages, VCCand VL, set the
logic levels on either side of the device. A low-voltage
logic signal present on the VLside of the device appears
as a high-voltage logic signal on the VCCside of the
device, and vice-versa. The MAX3374E/MAX3375E/
MAX3376E/MAX3379E and MAX3390E–MAX3393E unidirectional level translators level shift data in one direction
(VL→ VCCor VCC→ VL) on any single data line. The
MAX3372E/MAX3373E and MAX3377E/MAX3378E bidirectional level translators utilize a transmission-gatebased design (Figure 2) to allow data translation in either
direction (VL↔ VCC) on any single data line. The
MAX3372E–MAX3379E and MAX3390E–MAX3393E
accept VLfrom +1.2V to +5.5V and VCCfrom +1.65V to
+5.5V, making them ideal for data transfer between lowvoltage ASICs/PLDs and higher voltage systems.
All devices in the MAX3372E–MAX3379E, MAX3390E–
MAX3393E family feature a three-state output mode that
reduces supply current to less than 1µA, thermal shortcircuit protection, and ±15kV ESD protection on the V
CC
side for greater protection in applications that route signals externally. The MAX3372E/MAX3377E operate at a
guaranteed data rate of 230kbps. Slew-rate limiting
reduces EMI emissions in all 230kbps devices. The
MAX3373E–MAX3376E/MAX3378E/MAX3379E and
MAX3390E–MAX3393E operate at a guaranteed data rate
of 8Mbps over the entire specified operating voltage
range. Within specific voltage domains, higher data rates
are possible. (See the Timing Characteristics table.)
The MAX3372E–MAX3376E are dual level shifters
available in 3 x 3 UCSP™, 8-pin TDFN, and 8-pin
SOT23-8 packages. The MAX3377E/MAX3378E/
MAX3379E and MAX3390E–MAX3393E are quad level
shifters available in 3 x 4 UCSP, 14-pin TDFN, and 14pin TSSOP packages.
________________________Applications
SPI™, MICROWIRE™, and I2C Level
Translation
Low-Voltage ASIC Level Translation
Smart Card Readers
Cell-Phone Cradles
Portable POS Systems
Portable Communication Devices
Low-Cost Serial Interfaces
Cell Phones
GPS
Telecommunications Equipment
Features
♦ Guaranteed Data Rate Options
230kbps
8Mbps (+1.2V ≤ VL≤ VCC≤ +5.5V)
10Mbps (+1.2V ≤ VL≤ VCC≤ +3.3V)
16Mbps (+1.8V ≤ VL≤ VCC≤ +2.5V and +2.5V ≤
VL≤ VCC≤ +3.3V)
♦ Bidirectional Level Translation
(MAX3372E/MAX3373E and
MAX3377E/MAX3378E)
♦ Operation Down to +1.2V on V
L
♦ ±15kV ESD Protection on I/O VCCLines
♦ Ultra-Low 1µA Supply Current in Three-State
Output Mode
♦ Low-Quiescent Current (130µA typ)
♦ UCSP, TDFN, SOT23, and TSSOP Packages
♦ Thermal Short-Circuit Protection
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
________________________________________________________________ Maxim Integrated Products 1
14
13
12
11
10
9
8
1
2
3
4
5
6
7
V
CC
I/0 VCC1
I/0 V
CC
2
N.C.N.C.
I/O V
L
2
I/O V
L
1
MAX3377E/
MAX3378E
V
L
I/0 VCC3
GND
I/O V
L
4
I/O V
L
3
TDFN-14
(3mm x 3mm)
THREE-STATE
I/0 VCC4
TOP VIEW
Pin Configurations
19-2328; Rev 1; 12/06
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Ordering Information
UCSP is a trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
Ordering Information continued at end of data sheet.
Selector Guide appears at end of data sheet.
Pin Configurations continued at end of data sheet.
PART
TEMP
RANGE
PIN-
PKG
CODE
MAX3372EEKA-T
-40°C to +85°C
8 SOT23
K8S-3
PACKAGE
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, I/O VL_and I/O V
CC_
unconnected, TA= T
MIN
to T
MAX
, unless other-
wise noted. Typical values are at V
CC
= +3.3V, VL= +1.8V, TA= +25°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
CC
...........................................................................-0.3V to +6V
I/O V
CC_
......................................................-0.3V to (VCC+ 0.3V)
I/O V
L_
...........................................................-0.3V to (VL+ 0.3V)
THREE-STATE...............................................-0.3V to (VL+ 0.3V)
Short-Circuit Duration I/O V
L
, I/O VCCto GND...........Continuous
Short-Circuit Duration I/O V
L
or I/O VCCto GND
Driven from 40mA Source
(except MAX3372E and MAX3377E) .....................Continuous
Continuous Power Dissipation (T
A
= +70°C)
8-Pin SOT23 (derate 8.9mW/°C above +70°C)...........714mW
8-Pin TDFN (derate 18.2mW/°C above +70°C) ........1455mW
3 x 3 UCSP (derate 4.7mW/°C above +70°C) ............379mW
3 x 4 UCSP (derate 6.5mW/°C above +70°C) ............579mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C) ........727mW
14-Pin TDFN (derate 18.2mW/°C above +70°C) ......1454mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS
UNITS
POWER SUPPLIES
VL Supply Range V
L
V
VCC Supply Range V
CC
V
Supply Current from V
CC
I
QV
CC
µA
Supply Current from V
L
I
QV
L
16
µA
V
CC
Three-State Output Mode
Supply Current
TA = +25°C, THREE-STATE = GND
1µA
V
L
Three-State Output Mode
Supply Current
TA = +25°C, THREE-STATE = GND
1µA
Three-State Output Mode
Leakage Current
I/O V
L_
and I/O V
CC_
TA = +25°C, THREE-STATE = GND
1µA
THREE-STATE P in Inp ut Leakag eT
A
= +25°C
1µA
ESD PROTECTION
IEC 1000-4-2 Air-Gap Discharge ±8
IEC 1000-4-2 Contact Discharge ±8I/O VCC (Note 3)
Human Body Model
kV
LOGIC-LEVEL THRESHOLDS (MAX3372E/MAX3377E)
I/O VL_ Input-Voltage High V
IHL
VL - 0.2 V
I/O VL_ Input-Voltage Low V
ILL
V
MIN TYP MAX
1.2 5.5
1.65 5.50
130 300
100
I
THREE-STATE-VCC
I
THREE-STATE-VL
I
THREE-STATE-LKG
0.03
0.03
0.02
0.02
±15
0.15
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, I/O VL_and I/O V
CC_
unconnected, TA= T
MIN
to T
MAX
, unless other-
wise noted. Typical values are at V
CC
= +3.3V, VL= +1.8V, TA= +25°C.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS
UNITS
I/O V
CC_
Input-Voltage High V
IHC
VCC - 0.4 V
I/O V
CC_
Input-Voltage Low V
ILC
V
I/O VL_ Output-Voltage High V
OHL
I/O V
L_
source current = 20µA,
I/O V
CC_
>
VCC - 0.4V
0.67
✕
V
L
V
I/O VL_ Output-Voltage Low V
OLL
I/O V
L_
sink current = 20µA,
I/O V
CC_
<
0.15V
V
I/O V
CC_
Output-Voltage High V
OHC
I/O V
CC_
source current = 20µA,
I/O V
L _
>
V
L
- 0.2V
0.67
✕
V
CC
V
I/O V
CC_
Output-Voltage Low V
OLC
I/O V
CC_
sink current = 20µA,
I/O V
L_
<
0.15V
V
THREE-STATE Input-Voltage
High
VL - 0.2 V
THREE-STATE Input-Voltage
Low
V
LOGIC-LEVEL THRESHOLDS (MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E)
I/O VL_ Input-Voltage High V
IHL
VL - 0.2 V
I/O V
L_
Input-Voltage Low V
ILL
V
I/O V
CC_
Input-Voltage High V
IHC
VCC - 0.4 V
I/O V
CC_
Input-Voltage Low V
ILC
V
I/O VL_ Output-Voltage High V
OHL
I/O V
L_
source current = 20µA,
I/O V
CC_
≥ VCC - 0.4V
0.67
✕
V
L
V
I/O VL_ Output-Voltage Low V
OLL
I/O V
L_
sink current = 1mA,
I/O V
CC_
≤ 0.15V
V
I/O V
CC_
Output-Voltage High V
OHC
I/O V
CC_
source current = 20µA,
I/O V
L_
≥ V
L
- 0.2V
0.67
✕
V
CC
V
I/O V
CC_
Output-Voltage Low V
OLC
I/O V
CC_
sink current = 1mA,
I/O V
L_
≤ 0.15V
V
THREE-STATE Input-Voltage
High
VL - 0.2 V
THREE-STATE Input-Voltage
Low
V
V
IL-THREE-STATE
V
IL-THREE-STATE
V
IH-THREE-STATE
V
IL-THREE-STATE
MIN TYP MAX
0.15
0.4
0.4
0.15
0.15
0.15
0.4
0.4
0.15
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
4 _______________________________________________________________________________________
TIMING CHARACTERISTICS
(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, R
LOAD
= 1MΩ, I/O test signal of Figure 1, TA= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.3V, VL= +1.8V, TA= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER
SYM B O L
CONDITIONS
MIN
TYP
MAX
UNITS
MAX3372E/MAX3377E (C
LOAD
= 50pF)
I/O VCC_ Rise Time (Note 4) t
RVCC
ns
I/O VCC_ Fall Time (Note 5) t
FVCC
ns
I/O VL _ Rise Time (Note 4) t
RVL
ns
I/O VL _ Fall Time (Note 5) t
FVL
ns
Driving I/O VL _
Propagation Delay
Driving I/O VCC_
µs
Channel-to-Channel Skew t
SKEW
Each translator equally loaded
ns
Maximum Data Rate CL = 25pF
kbps
M A X3 3 7 3 E– M A X3 3 7 6 E/M A X3 3 7 8 E/ M A X3 3 7 9 E a n d M A X3 3 9 0 E– M A X3 3 9 3 E ( C
LOA D
= 15 p F , Dr iv e r O u t p u t Im p e d a n c e ≤ 5 0 Ω)
+1.2V ≤ VL ≤ VCC ≤ +5.5V
725
I/O VCC_ Rise Time (Note 4) t
RVCC
Open-drain driving
ns
637
I/O VCC_ Fall Time (Note 5) t
FVCC
Open-drain driving 20 50
ns
830
I/O VL _ Rise Time (Note 4) t
RVL
Open-drain driving
ns
330
I/O VL _ Fall Time (Note 5) t
LFV
Open-drain driving 30 60
ns
530
Driving I/O VL _
Open-drain driving
430
Propagation Delay
Driving I/O VCC_
Open-drain driving
ns
20
Channel-to-Channel Skew t
SKEW
Each translator
equally loaded
Open-drain driving 50
ns
8
Mbps
Maximum Data Rate
Open-drain driving
kbps
I/O
VL-VCC
I/O
VCC-VL
230
1100
1000
600
1100
1.6
1.6
500
170 400
180 400
I/O
VL-VCC
I/O
VCC-VL
210 1000
190 1000
500
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
_______________________________________________________________________________________ 5
Note 1: All units are 100% production tested at TA= +25°C. Limits over the operating temperature range are guaranteed by design
and not production tested.
Note 2: For normal operation, ensure V
L
< (VCC+ 0.3V). During power-up, VL> (VCC+ 0.3V) will not damage the device.
Note 3: To ensure maximum ESD protection, place a 1µF capacitor between V
CC
and GND. See Applications Circuits.
Note 4: 10% to 90%
Note 5: 90% to 10%
TIMING CHARACTERISTICS (continued)
(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, R
LOAD
= 1MΩ, I/O test signal of Figure 1, TA= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.3V, VL= +1.8V, TA= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER
CONDITIONS
UNITS
+1.2V ≤ VL ≤ VCC ≤ +3.3V
I/O VCC_ Rise Time (Note 4) t
RVCC
25 ns
I/O VCC_ Fall Time (Note 5) t
FVCC
30 ns
I/O VL _ Rise Time (Note 4) t
RVL
30 ns
I/O VL _ Fall Time (Note 5) t
FVL
30 ns
Driving I/O VL _20
Propagation Delay
Driving I/O VCC_20
ns
Channel-to-Channel Skew t
SKEW
Each translator equally loaded
10 ns
Maximum Data Rate
10
Mbps
+2.5V ≤ VL ≤ VCC ≤ +3.3V
I/O VCC_ Rise Time (Note 4) t
RVCC
15 ns
I/O VCC_ Fall Time (Note 5) t
FVCC
15 ns
I/O VL _ Rise Time (Note 4) t
RVL
15 ns
I/O VL _ Fall Time (Note 5) t
FVL
15 ns
Driving I/O VL _15
Propagation Delay
Driving I/O VCC_15
ns
Channel-to-Channel Skew t
SKEW
Each translator equally loaded 10 ns
Maximum Data Rate 16
Mbps
+1.8V ≤ VL ≤ VCC ≤ +2.5V
I/O VCC_ Rise Time (Note 4) t
RVCC
15 ns
I/O VCC_ Fall Time (Note 5) t
FVCC
15 ns
I/O VL _ Rise Time (Note 4) t
RVL
15 ns
I/O VL _ Fall Time (Note 5) t
FVL
15 ns
Driving I/O VL _15
Propagation Delay
Driving I/O VCC_15
ns
Channel-to-Channel Skew t
SKEW
Each translator equally loaded 10 ns
Maximum Data Rate 16
Mbps
SYM B O L
I/O
VL-VCC
I/O
VCC-VL
I/O
VL-VCC
I/O
VCC-VL
I/O
VL-VCC
I/O
VCC-VL
MIN TYP MAX
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
6 _______________________________________________________________________________________
Typical Operating Characteristics
(R
LOAD
= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and
500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
VL SUPPLY CURRENT vs. SUPPLY VOLTAGE
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc01
V
CC
(V)
SUPPLY CURRENT (μA)
4.954.403.853.302.752.20
100
200
300
400
500
600
0
1.65 5.50
8Mbps, C
LOAD
= 15pF
230kbps, C
LOAD
= 50pF
500kbps, OPEN-DRAIN, C
LOAD
= 15pF
VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc02
V
CC
(V)
SUPPLY CURRENT (mA)
4.954.403.853.302.752.20
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
1.65 5.50
8Mbps, C
LOAD
= 15pF
230kbps, C
LOAD
= 50pF
500kbps, OPEN-DRAIN, C
LOAD
= 15pF
VL SUPPLY CURRENT vs. TEMPERATURE
(DRIVING I/O V
CC
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc03
TEMPERATURE (°C)
SUPPLY CURRENT (μA)
6035-15 10
50
100
150
200
250
300
350
400
0
-40 85
8Mbps, C
LOAD
= 15pF
230kbps, C
LOAD
= 50pF
500kbps, OPEN-DRAIN, C
LOAD
= 15pF
V
CC
SUPPLY CURRENT vs. TEMPERATURE
(DRIVING I/O V
CC
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc04
TEMPERATURE (°C)
SUPPLY CURRENT (μA)
6035-15 10
200
400
600
800
1000
1200
1400
1600
0
-40 85
8Mbps, C
LOAD
= 15pF
230kbps, C
LOAD
= 50pF
500kbps, OPEN-DRAIN, C
LOAD
= 15pF
VL SUPPLY CURRENT vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc05
CAPACITIVE LOAD (pF)
SUPPLY CURRENT (μA)
8570554025
50
100
150
200
250
300
350
0
10 100
8Mbps
230kbps
500kbps, OPEN-DRAIN
VCC SUPPLY CURRENT vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc06
CAPACITIVE LOAD (pF)
SUPPLY CURRENT (μA)
8570554025
500
1000
1500
2000
2500
0
10 100
8Mbps
230kbps
500kbps, OPEN-DRAIN
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc07
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
90807060504030
500
1000
1500
2000
2500
0
20 100
DATA RATE = 230kbps
t
HL
t
LH
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc08
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
454030 3520 2515
2
4
6
8
10
12
14
16
18
0
10 50
DATA RATE = 8Mbps
t
HL
t
LH
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc09
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
45403530252015
50
100
150
200
250
0
10 50
t
LH
t
HL
DATA RATE = 500kbps,
OPEN-DRAIN
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
_______________________________________________________________________________________ 7
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc10
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
90807060504030
100
200
300
400
500
600
700
0
20 100
DATA RATE = 230kbps
t
PHL
t
PLH
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc11
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
45403530252015
3
6
9
12
15
0
10 50
DATA RATE = 8Mbps
t
PLH
t
PHL
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc12
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
45403530252015
50
100
150
200
250
300
0
10 50
DATA RATE = 500kbps,
OPEN-DRAIN
t
PHL
t
PLH
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, V
CC
= +2.5V, VL = +1.8V)
MAX3372E toc13
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
90807060504030
500
1000
1500
2000
2500
0
20 100
DATA RATE = 230kbps
t
HL
t
LH
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
L
, VCC = +2.5V, VL = +1.8V)
MAX3372E toc14
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
45403530252015
2
4
6
8
10
12
14
0
10 50
DATA RATE = 8Mbps
t
LH
t
HL
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +2.5V, VL = +1.8V)
MAX3372E toc15
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
45403530252015
50
100
150
200
250
300
0
10 50
DATA RATE = 500kbps,
OPEN-DRAIN
t
HL
t
LH
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc16
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
90807060504030
500
1000
1500
2000
2500
0
20 100
DATA RATE = 230kbps
t
LH
t
HL
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc17
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
45403530252015
2
4
6
8
10
12
0
10 50
DATA RATE = 8Mbps
t
HL
t
LH
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc18
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
45403530252015
50
100
150
200
250
300
0
10 50
DATA RATE = 500kbps,
OPEN-DRAIN
t
HL
t
LH
Typical Operating Characteristics (continued)
(R
LOAD
= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and
500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
8 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(R
LOAD
= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and
500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, VCC = +3.3V, VL = +1.8V)
MAX3372E toc19
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
90807060504030
100
200
300
400
500
600
700
0
20 100
DATA RATE = 230kbps
t
PHL
t
PHL
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc20
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
45403530252015
1
2
3
4
5
6
0
10 50
DATA RATE = 8Mbps
t
PLH
t
PHL
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +3.3V, VL = +1.8V)
MAX3372E toc21
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
45403530252015
50
100
150
200
250
300
0
10 50
DATA RATE = 500kbps,
OPEN-DRAIN
t
PHL
t
PLH
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +2.5V, VL = +1.8V)
MAX3372E toc22
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
90807060504030
500
1000
1500
2000
2500
0
20 100
DATA RATE = 230kbps
t
LH
t
HL
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +2.5V, VL = +1.8V)
MAX3372E toc23
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
403020
2
4
6
8
10
12
0
10 50
t
LH
t
HL
DATA RATE = 8Mbps
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O V
CC
, V
CC
= +2.5V, VL = +1.8V)
MAX3373E toc24
CAPACITIVE LOAD (pF)
RISE/FALl TIME (ns)
403020
50
100
150
200
250
300
350
0
10 50
DATA RATE = 500kbps,
OPEN-DRAIN
t
LH
t
HL
RAIL-TO-RAIL DRIVING
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V,
C
LOAD
= 50pF, DATA RATE = 230kbps)
MAX3372E toc25
I/O V
L_
I/O V
CC_
1V/div
2V/div
1μs/div
RAIL-TO-RAIL DRIVING
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V,
C
LOAD
= 15pF, DATA RATE = 8Mbps)
MAX3372E toc26
I/O V
L_
I/O V
CC_
1V/div
2V/div
200ns/div
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
_______________________________________________________________________________________ 9
Typical Operating Characteristics (continued)
(R
LOAD
= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and
500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
EXITING THREE-STATE OUTPUT MODE
(V
CC
= +3.3V, VL = +1.8V, C
LOAD
= 50pF)
MAX3372E toc28
I/O V
L_
I/O V
CC_
2μs/div
THREE-STATE
2V/div
1V/div
1V/div
Pin Description
PIN
3 x 4
UCSP
3 x 3
TDFN8TDFN
14
NAME FUNCTION
A1 2 5 C2 6 1 I/O VL1 Input/Output 1. Referenced to VL. (Note 6)
A2 3 4 C3 8 2 I/O VL2 Input/Output 2. Referenced to VL. (Note 6)
A3 4 — — — 5 I/O VL3 Input/Output 3. Referenced to VL. (Note 6)
A4 5 — — — 6 I/O VL4 Input/Output 4. Referenced to VL. (Note 6)
B1 14 7 A1 4 14 V
CC
VCC Input Voltage +1.65V ≤ VCC ≤ +5.5V.
B2 1 3 C1 7 10 V
L
Logic Input Voltage +1.2V ≤ VL ≤ (VCC + 0.3V)
B3 8 6 B1 5 3
THREE-
STATE
Thr ee- S tate Outp ut M od e E nab l e. P ul l THRE E - S TATE l ow
to p l ace d evi ce i n thr ee- state outp ut m od e. I/O V
C C _
and
I/O V L_ ar e hi g h i m p ed ance i n thr ee- state outp ut m od e.
N OTE : Log i c r efer enced to V L ( for l og i c thr eshol d s see
the E l ectr i cal C har acter i sti cs tab l e) .
B4 7 2 B3 2 7 GND Ground
C1 13 8 A2 3 13 I/O VCC1 Input/Output 1. Referenced to VCC. (Note 6)
C2 12 1 A3 1 12 I/O VCC2 Input/Output 2. Referenced to VCC. (Note 6)
C3 11 — — — 9 I/O VCC3 Input/Output 3. Referenced to VCC. (Note 6)
C4 10 — — — 8 I/O VCC4 Input/Output 4. Referenced to VCC. (Note 6)
— 6, 9 — B2 —
N.C. No Connection. Not internally connected.
— — — — EP EP EP Exposed Pad. Connect to ground.
Note 6: For unidirectional devices (MAX3374E/MAX3375E/MAX3376E/MAX3379E and MAX3390E–MAX3393E) see the Pin
Configurations for input/output configurations.
OPEN-DRAIN DRIVING
(DRIVING I/O V
L
, VCC = +3.3V, VL = +1.8V,
C
LOAD
= 15pF, DATA RATE = 500kbps)
MAX3372E toc27
I/O V
L_
I/O V
CC_
1V/div
2V/div
200ns/div
TSSOP SOT23-8
UCSP
4, 11
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