MAXIM MAX3355E Technical data

现货库存、技术资料、百科信息、热点资讯，精彩尽在鼎好!

General Description

The MAX3355E integrates a charge pump and com­parators to enable a system with an integrated USB on­the-go (OTG) dual-role transceiver to function as a USB
OTG dual-role device. USB OTG facilitates the direct
connection of peripherals and mobile devices such as
PDAs, cellular phones, MP3 players, and digital cam­eras to one another without a host PC.

The MAX3355E’s internal charge pump supplies V

BUS

power and signaling that is required by the transceiver as
defined in On-the-Go Supplement to the USB 2.0
Specification, Revision 1.0. The MAX3355E features ID
detection and internal comparators for monitoring
V

BUS

. The V

BUS

status outputs are used during negoti­ation for the USB according to the session request pro­tocol (SRP) and host negotiation protocol (HNP).

The MAX3355E operates with logic supply voltages
(VL) as low as 1.65V, ensuring compatibility with low­voltage ASICs. The device also features a logic-selec­table 1µA shutdown mode.

The MAX3355E has built-in ±15kV ESD-protection cir­cuitry to protect the V

BUS

and ID_IN pins. The device is
available in a miniature 4 x 3 chip-scale package
(UCSP), as well as a 14-pin TSSOP package, and is
specified for operation over the -40°C to +85°C extended
temperature range.

Applications

Cell Phones MP3 Players

PDAs Digital Cameras

Features

♦ Guaranteed 8mA (min) V

BUS

Charge-Pump Output

♦ ±15kV ESD Protection on V

BUS

and ID_IN

♦ Up to +6.0V Backdrive Capability for V

BUS

♦ +2.6V to +5.5V Operating Voltage Range

♦ V

L

Operates Down to +1.65V

♦ Guaranteed V

BUS

Input Impedance When Not

Driven

♦ Automatic C

LOAD

Detection

♦ Comparators for Host Negotiation Protocol

♦ ID_IN Detection

♦ Available in 4 x 3 UCSP or 14-Pin TSSOP Package

MAX3355E

±15kV ESD-Protected USB On-the-Go

Charge Pump and Comparators in UCSP

________________________________________________________________ Maxim Integrated Products 1

Ordering Information

CHARGE

PUMP

5V AT 8mA

40kΩ TO

100kΩ

STATUS2

STATUS1

ON/OFF

MAX3355E

V

BUS

COMPARATORS

CURRENT

SOURCE

V

BUS

V

BUS

GND

USB CONNECTOR

ID_IN

GND

ID

D+

D-

V

CC

V

L

C+

V

CC

C-

ESD

LEVEL

SHIFTER

OFFVBUS

SHDN

STATUS1

STATUS2

ID_OUT

DUAL-ROLE

ASIC

LOGIC SUPPLY
+1.65V TO V

CC

USB

XCVR

ESD

Functional Diagram

19-2844; Rev 1; 8/03

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

Pin Configurations appear at end of data sheet.

PART TEMP RANGE

MAX3355EEBC-T -40°C to +85°C 4 x 3 UCSP ABE

MAX3355EEUD -40°C to +85°C 14 TSSOP —

PIN­PACKAGE

TOP

MARK

MAX3355E

±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC= +2.6V to +5.5V, VL= +1.65V to VCC, C1 = 0.1µF, VCCdecoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF
capacitor to GND, C

LOAD

= 1µF (min), ESR

LOAD

= 1Ω (max), TA= T

MIN

to T

MAX

. Typical values are at VCC= +3.0V, VL= 1.8V, TA=

+25°C, unless otherwise noted.) (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND)
V

CC

, VL, V

BUS

, ID_IN.............................................-0.3V to +6.0V

C+..................................................................(V

CC

- 0.3V) to +6V

C-................................................................-0.3V to (V

CC

+ 0.3V)

OFFVBUS, SHDN, STATUS1,

STATUS2, ID_OUT ....................................-0.3V to (V

L

+ 0.3V)

V

BUS

Short Circuit to GND .........................................Continuous

Output Current (all other pins)..........................................±15mA

Continuous Power Dissipation (T

A

= +70°C)

4 x 3 UCSP (derate 6.5mW/°C above +70°C) .............520mW

14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Bump Temperature (soldering)

Infrared (15s) ...............................................................+200°C

Vapor Phase (20s) .......................................................+215°C

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Supply Voltage V

Logic Supply Voltage V

Logic Supply Current I

Operating Supply Current I

Shutdown Supply Current I

Thermal-Shutdown Protection
Threshold

Thermal-Shutdown Protection
Hysteresis

LOGIC INPUTS AND OUTPUTS

STATUS1, STATUS2, ID_OUT
Output Voltage

OFFVBUS, SHDN Input Voltage

Input Leakage Current I

V

OUTPUT VOLTAGE: DEVICE A CONFIGURED

BUS

V

Output Voltage

BUS

V

Leakage Voltage OFFVBUS = GND 200 mV

BUS

V

Sink Current OFFVBUS = GND, V

BUS

CC

L

L

CC

CCSHDN

V

OH

V

OL

V

IH

V

IL

LKG

No activity on V
reference active

Device A configured, OFFVBUS = VL,
I

= 8mA, charge pump on

LOAD

Device B configured, SHDN = GND 1
Device A configured, SHDN = GND 30

Device A configured, OFFVBUS = VL,
charge pump on

Device A configured, OFFVBUS = VL,
charge pump on

I

SOURCE

I

SINK

= +1mA 2/3 x V

= -1mA 0.4

OFFVBUS, SHDN = GND or V

I

= 0 to 8mA, C

LOAD

OFFVBUS = V

No load, C
ID_IN = GND

2.6 5.5 V

1.65 V

CC

100 µA

; comparator and

BUS

200 µA

20 mA

+150 °C

+20 °C

L

2/3 x V

L

0.4

±1 µA

= 1µF,

LOAD

, ID_IN = GND

L

= 1µF, OFFVBUS = VL,

LOAD

= +6.0V 150 µA

BUS

L

4.63 5.25

4.8

V

µA

V

V

V

MAX3355E

±15kV ESD-Protected USB On-the-Go

Charge Pump and Comparators in UCSP

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(VCC= +2.6V to +5.5V, VL= +1.65V to VCC, C1 = 0.1µF, VCCdecoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF
capacitor to GND, C

LOAD

= 1µF (min), ESR

LOAD

= 1Ω (max), TA= T

MIN

to T

MAX

. Typical values are at VCC= +3.0V, VL= 1.8V, TA=

+25°C, unless otherwise noted.) (Notes 1, 2)

V

BUS

V

BUS

V

BUS

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Source Current OFFVBUS = V

Short-Circuit Current Limit V

Output Ripple

Charge-Pump Switching
Frequency

V

Input Impedance R

BUS

LOAD DETECTION V

V

Output Voltage

BUS

V

Source Current OFFVBUS = VL, ID_IN = VCC (Note 4) 450 600 850 µA

BUS

V

Current Gate Time t

BUS

V

COMPARATOR

BUS

V

Valid Comparator Threshold V

BUS

V

Valid Comparator Hysteresis 20 mV

BUS

Session Valid Comparator
Threshold

Session Valid Comparator
Hysteresis

B-Session End Comparator
Threshold

B-Session End Comparator
Hysteresis

Shutdown Comparator V

ID_IN

ID_IN Voltage Input for Device B 2/3 x V

ID_IN Voltage Input for Device A 0.4 V

ID_IN Input Impedance 150 200 250 kΩ

ESD PROTECTION (ID_IN, V

Human Body Model ±15 kV

IFC 1000-4-2 Air-Gap Discharge ±15 kV

IFC 1000-4-2 Contact Discharge ±8 kV

OUTPUT VOLTAGE

BUS

BUS

INVBUS

VBUSCHRG

THVBUSVLDVBUS

V

THSESVLD

V

THSESEND

TH,SHDN

)

shorted to GND 200 mA

BUS

I

= 8mA, C

LOAD

OFFVBUS = V

ID_IN = GND 8 mA

L,

LOAD

, ID_IN = GND (Note 3)

L

= 1µF,

100 mV

500 kHz

OFFVBUS = GND or SHDN = GND 40 100 kΩ

C

= 20µF, OFFVBUS = VL, ID_IN =

LOAD

V

, I

source on-time = t

BUS

VBUSCHRG

= 95µF, OFFVBUS = VL, ID_IN =

, I

source on-time = t

BUS

VBUSCHRG

C
V

CC

LOAD

CC

OFFVBUS = VL, ID_IN = VCC, Device B
(Note 4)

2.1

155

(max)

105

1.9

(min)

rising 4.4 4.55 4.63 V

1.12 1.4 1.68 V

15 mV

0.4 0.5 0.6 V

30 mV

0.8 2.4 V

cc

56

V

ms

V

MAX3355E

±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP

4 _______________________________________________________________________________________

Typical Operating Characteristics

(VCC, VL= +3.3V, C1 = 0.1µF, VCCdecoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF capacitor to GND, C

LOAD

= 1µF

min, ESR

LOAD

= 1Ω max, TA= +25°C, unless otherwise noted.)

0

40

20

80

60

100

120

050

VCC INPUT CURRENT

vs. V

BUS

OUTPUT CURRENT

MAX3355E toc01

V

BUS

OUTPUT CURRENT (mA)

V

CC

INPUT CURRENT (mA)

2010 30 40

VCC = 2.6V
V

CC

= 4.0V

V

CC

= 5.5V

4.00

4.50

4.25

4.75

5.00

5.25

050

V

BUS

OUTPUT VOLTAGE

vs. V

BUS

OUTPUT CURRENT

MAX3355E toc02

V

BUS

OUTPUT CURRENT (mA)

V

BUS

OUTPUT VOLTAGE (V)

2010 30 40

VCC = 4.0V

VCC = 5.5V

VCC = 2.6V

0

75

25

50

100

125

150

2.5 5.5

V

BUS

OUTPUT RIPPLE VOLTAGE

vs. V

CC

INPUT VOLTAGE

MAX3355E toc03

V

CC

INPUT VOLTAGE (V)

V

BUS

OUTPUT RIPPLE VOLTAGE (mV)

3.53.0 4.0 5.04.5

I

VBUS

= 8mA

TIMING CHARACTERISTICS

(VCC= +2.6V to +5.5V, VL= +1.65V to VCC, C1 = 0.1µF, VCCdecoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF
capacitor to GND, C

LOAD

= 1µF (min), ESR

LOAD

= 1Ω (max), TA= T

MIN

to T

MAX

. Typical values are at VCC= +3.0V, VL= 1.8V, TA=

+25°C, unless otherwise noted.) (Notes 1, 2)

Note 1: Limits are 100% production tested at +25°C. Limits over temperature are guaranteed by design.
Note 2: All currents out of the device are positive; all currents into the device are negative. All voltages are referenced to device

ground unless otherwise specified.

Note 3: The ripple voltage is strongly correlated to the bus capacitance and its ESR.
Note 4: The V

BUS

current source and current gate time vary together with process and temperature such that the resulting V

BUS

pulse is guaranteed to drive a <13µF load to a voltage >2.0V, and to drive a >96µF load to a voltage <2.2V.

V

BUS

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Rise Time 0 to 4.4V, C

OFFVBUS Propagation Delay 6µs

Comparator Propagation Delay 3µs

Time to Exit Shutdown 50 µs

Time to Shutdown 1µs

ID_OUT Rise Time C

ID_OUT Fall Time C

ID_OUT

ID_OUT

= 8mA 100 ms

LOAD

LOAD

= 1µF, I

= 50pF 10 ns

= 50pF 10 ns

MAX3355E

±15kV ESD-Protected USB On-the-Go

Charge Pump and Comparators in UCSP

_______________________________________________________________________________________ 5

Typical Operating Characteristics (continued)

(VCC, VL= +3.3V, C1 = 0.1µF, VCCdecoupled with 1µF capacitor to GND, VLdecoupled with 0.1µF capacitor to GND, C

LOAD

= 1µF

min, ESR

LOAD

= 1Ω max, TA= +25°C, unless otherwise noted.)

4.0

4.8

4.2

4.4

4.6

5.0

5.2

5.4

2.5 5.5

V

BUS

OUTPUT VOLTAGE

vs. V

CC

INPUT VOLTAGE

MAX3355E toc04

VCC INPUT VOLTAGE (V)

V

BUS

OUTPUT VOLTAGE (V)

3.53.0 4.0 5.04.5

I

VBUS

= 0mA

I

VBUS

= 8mA

65

67

66

68

69

70

-40 85

V

BUS

INPUT IMPEDANCE

vs. TEMPERATURE

MAX3355E toc05

TEMPERATURE (°C)

V

BUS

INPUT IMPEDANCE (kΩ)

10-15 35 60

16

17

18

19

20

-40 85

SUPPLY CURRENT

vs. TEMPERATURE

MAX3355E toc06

TEMPERATURE (°C)

SUPPLY CURRENT (mA)

10-15 35 60

I

VBUS

= 8mA

VCC = 4.0V

VCC = 2.6V

VCC = 5.5V

V

BUS

vs. CAPACITANCE LOAD

DURING LOAD DETECTION

MAX3355E toc07

C

VBUS

= 10µF

1V/div

C

VBUS

= 96µF

1V/div

40ms/div

0

0

MAX3355E

±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP

6 _______________________________________________________________________________________

Typical Application Circuit

Pin Description

PIN

UCSP TSSOP

A1 2 V

A2 3 ID_OUT Device ID Output. Output of ID_IN level translated to VL.

A3 5 STATUS1

A4 6 STATUS2

B1 1 V

B2 4 OFFVBUS V

B3 11 SHDN

B4 9 V

C1 14 C+ Charge-Pump Positive Connection

C2 13 C- Charge-Pump Negative Connection

C3 12 GND Ground

C4 10 ID_IN

— 7, 8 N.C. No Connection

NAME FUNCTION

CC

Power Supply. +2.6V to +5.5V input supply. Bypass VCC to GND with a 1µF capacitor.

Status Output 1. Provides output voltage detection for use during HNP handshaking (Tables 1
and 2).

Status Output 2. Provides output voltage detection for use during HNP handshaking (Tables 1
and 2).

BUS

U S B S up p l y. V
V

i s l ow er than + 2.1V w hen ID _IN i s op en or a l oad g r eater than 96.5µF i s sensed . V

B U S

p r ovi d es a nom i nal + 5.0V outp ut w hen ID _IN i s l ow and O FFVBUS i s hi g h.

B U S

b e b ackd r i ven to + 6.0V w i thout any conseq uence. Byp ass V

Off. Turns the internal charge pump providing V

BUS

Shutdown. Connect SHDN to GND to enter shutdown and reduce supply current to less than
1µA. Connect SHDN to V

Logic Supply. VL sets the logic output high voltage and logic input high threshold. VL must be

L

between +1.65V and V

Device ID. ID_IN is internally pulled up to V

for normal operation.

L

.

CC

Leave ID_IN open for device B and connect

CC.

ID_IN to GND for device A.

B U S

on and off.

BUS

can

to G N D w i th a 1µF cap aci tor .

B U S

V

CC

V

1µF

L

0.1µF

V

CC

V

L

MAX3355E

OFFVBUS

ID_OUT

STAT US1

µP

OTG SIE

D+

D-

STAT US2

SHDN

V

BUS

ID_IN

GND

C+

C1

0.1µF

C-

C

LOAD

1µF

USB OTG

CONNECTOR

Detailed Description

USB OTG is an emerging USB standard that enables
devices to talk in a peer-to-peer manner on a USB bus.
OTG allows peripherals and mobile devices such as
PDAs, cellular phones, and digital cameras to be
attached directly to one another without requiring a
PC host.

The MAX3355E integrates a charge pump and compara­tors to enable a system with an integrated USB OTG
dual-role transceiver to function as a USB OTG dual-role
device. The MAX3355E’s internal charge pump supplies
V

BUS

power and signaling as defined in On-the-Go
Supplement: USB 2.0, Revision 1.0. The MAX3355E’s
internal level-detection comparators monitor important
V

BUS

voltages needed to support SRP and HNP.

Charge Pump

The MAX3355E provides power for the V

BUS

line using
an internal charge pump. The charge pump provides
an OTG-compliant output on V

BUS

while sourcing 8mA
load current. The charge pump can be powered from
voltages between +2.6V and +5.5V. A 0.1µF flying
capacitor, connected between C+ and C-, and a 1µF
(min) decoupling reservoir capacitor on V

BUS

are

required for proper operation.
The charge pump is active if OFFVBUS is connected to

VLand the MAX3355E is configured as device A (ID_IN
connected to GND). To minimize V

BUS

ripple, select a
reservoir capacitor value between 1µF and 6.8µF. The
charge-pump output is protected from short-circuit con­ditions on V

BUS

by an internal current clamp that limits

the V

BUS

current to 200mA.

Current Generator

An internal current generator injects up to 600µA of cur­rent onto the V

BUS

line. The current generator is stable
over the supply voltage variation. The current generator
is connected to V

BUS

when OFFVBUS and SHDN are 1

and ID_IN is open. It remains connected for t

VBUSCHRG

or until the V

BUS

line voltage exceeds the lower of V

CC

and 4.82V.

Comparators

The MAX3355E contains internal comparators for moni­toring the V

BUS

voltage. The status of V

BUS

is summa­rized in two status outputs: STATUS1 and STATUS2.
The status outputs can be used to negotiate for the
USB OTG bus. The V

BUS

status is conveyed according
to Table 1. While in shutdown mode, the STATUS2 out­put can be used to indicate V

BUS

voltage (Table 2).

Device ID

Configure the MAX3355E as device A by connecting
ID_IN to GND and as device B by leaving ID_IN open
(Table 3). ID_IN is level translated to VLand provided
as an output at ID_OUT. VL sets the logic output high
level. ID_IN is internally pulled up to VCC.

MAX3355E

±15kV ESD-Protected USB On-the-Go

Charge Pump and Comparators in UCSP

_______________________________________________________________________________________ 7

Table 1. Status Bit Significance

Table 2. Status Bit Shutdown
Functionality (SHDN = GND)

Table 3. Device ID

Table 4. Function Select

Note: The 600µA current source is supplied for t

VBUSCHRG

(see the Current Generator section).

STATUS1 STATUS2 SIGNIFICANCE

00 V

10V

01V

11 V

THSESEND

THSESVLD

BUS

BUS

< V

< V

< V

> V

THSESEND

< V

BUS

< V

BUS

THVBUSVLD

THVBUSVLD

THSESVLD

STATUS1 STATUS2 SIGNIFICANCE

01 V

00 V

ID_IN ID_OUT CONFIGURATION

0 0 Device A

Open V

L

BUS

BUS

< V

TH,SHDN

> V

TH,SHDN

Device B

SHDN OFFVBUS ID_IN V

0XXR

10XR

1 1 0 5V Active Active

111R

BUS

INVBUS

INVBUS

(Note 5) Inactive Active

INVBUS

CHARGE PUMP COMPARATORS

Inactive Inactive

Inactive Active

MAX3355E

OFFVBUS

Connect OFFVBUS to GND to disable V

BUS

and the

charge pump (Table 4). For normal V

BUS

operation,

connect OFFVBUS to VL. When OFFVBUS = GND, V

BUS

impedance is between 40kΩ to 100kΩ as defined in On-

the-Go Supplement: USB 2.0, Revision 1.0.

SHDN

The MAX3355E shutdown mode reduces supply current
to less than 1µA. To enter shutdown mode, connect
SHDN to GND. Shutdown mode disables the charge
pump and comparators (Table 4). While in shutdown
mode, the STATUS1 output defaults to logic 0 and STA­TUS2 indicates V

BUS

. During shutdown, if V

BUS

is exter-

nally driven above V

TH,SHDN

(defined in the Comparators

section), the MAX3355E sinks current from VCC.

Applications Information

±15kV ESD Protection

To protect the MAX3355E against ESD, ID_IN and V

BUS

have extra protection against static electricity to protect
the device up to ±15kV. For ±15kV protection on V

BUS

,

a 1µF capacitor must be connected from V

BUS

to GND
as close to the device as possible. The ESD structures
withstand high ESD in all states—normal operation,
shutdown, and powered down. ESD protection can be
tested in various ways. The ID_IN input and V

BUS

are

characterized for protection to the following limits:

1) ±15kV using the Human Body Model

2) ±8kV using the IEC 1000-4-2 Contact Discharge

method

3) ±15kV using the IEC 1000-4-2 Air-Gap Discharge

method

ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.

Human Body Model

Figure 1 shows the Human Body Model and Figure 2
shows the current waveform it generates when dis­charged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a

1.5kΩ resistor.

IEC 1000-4-2

The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment. It does not specifi­cally refer to integrated circuits. The MAX3355E helps
the user design equipment that meets Level 4 of IEC
1000-4-2, without the need for additional ESD-protec­tion components. The major difference between tests
done using the Human Body Model and IEC 1000-4-2
is a higher peak current in IEC 1000-4-2. This occurs
because series resistance is lower in the IEC 1000-4-2
model. Hence, the ESD withstand voltage measured to

±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP

8 _______________________________________________________________________________________

Figure 1. Human Body ESD Test Model

Figure 2. Human Body Current Waveform

Figure 3. IEC 1000-4-2 ESD Test Model

R

D

1.5kΩ

DISCHARGE

RESISTANCE

STORAGE
CAPACITOR

HIGH-

VOLTAGE

DC

SOURCE

R

C

1MΩ

CHARGE-CURRENT-

LIMIT RESISTOR

C

100pF

s

IP 100%

90%

AMPERES

36.8%

10%

0

0

t

RL

TIME

t

DL

CURRENT WAVEFORM

PEAK-TO-PEAK RINGING

I

r

(NOT DRAWN TO SCALE)

DEVICE
UNDER

TEST

R

C

50Ω to 100Ω

CHARGE-CURRENT-

LIMIT RESISTOR

HIGH-

VOLTAGE

DC

SOURCE

150pF

C

s

R

D

330Ω

DISCHARGE

RESISTANCE

STORAGE
CAPACITOR

DEVICE
UNDER

TEST

MAX3355E

±15kV ESD-Protected USB On-the-Go

Charge Pump and Comparators in UCSP

_______________________________________________________________________________________ 9

Pin Configurations

Chip Information

TRANSISTOR COUNT: 1601

PROCESS: BiCMOS

IEC 1000-4-2 is generally lower than that measured
using the Human Body Model. Figure 3 shows the IEC
1000-4-2 model. The Air-Gap Discharge test involves
approaching the device with a charged probe. The
contact-discharge method connects the probe to the
device before the probe is energized.

Machine Model

The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis­tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing. After PC board assembly, the Machine
Model is less relevant to I/O ports.

Layout Considerations

The MAX3355E charge-pump switching frequency
makes proper layout important to ensure stability and
maintain the output voltage under all loads. For best
performance, minimize the distance between the
capacitors and the MAX3355E.

UCSP Applications Information

For the latest application details on UCSP construc­tion, dimensions, tape-carrier information, printed cir­cuit board techniques, bump-pad layout, and
recommended reflow temperature profile, as well as
the latest information on reliability testing results, refer
to Maxim Application Note: UCSP–A Wafer-Level
Chip-Scale Package available on Maxim’s web site at
www.maxim-ic.com/ucsp.

TOP VIEW

V

BUS

V

ID_OUT

STATUS1

STATUS2

1

2

CC

3

4

MAX3355E

5

6

7

14

C+

13

C-

12

GND

11

SHDNOFFVBUS

ID_IN

10

9

V

L

N.C.N.C.

8

TOP VIEW

A

B

C

1

ID_OUT STATUS1

V

CC

OFFVBUS SHDN

V

BUS

C+ C- GND ID_IN

MAX3355E

32

4

STATUS2

V

L

TSSOP

UCSP

MAX3355E

±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP

10 ______________________________________________________________________________________

Package Information

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

MAX3355E Package Code: B12-1

12L, UCSP 4x3.EPS

PACKAGE OUTLINE, 4x3 UCSP

21-0104

1

F

1

MAX3355E

±15kV ESD-Protected USB On-the-Go

Charge Pump and Comparators in UCSP

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11

© 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

TSSOP4.40mm.EPS