The MAX3353E I2C-compatible USB On-the-Go (OTG)
regulated charge pump with switchable pullup/pulldown resistors allows peripherals and mobile devices
such as PDAs, cellular phones, and digital cameras to
be interconnected without a host PC.
The MAX3353E enables a system with an integrated
USB dual-role transceiver to function as a USB OTG
dual-role device. The charge pump in the MAX3353E
supplies V
BUS
power and signaling that is required by
the transceiver as defined in On-the-Go Supplement:USB 2.0, Revision 1.0. The MAX3353E provides the
switchable pullup and pulldown resistors on D+ and Drequired for a dual-role device.
The MAX3353E integrates a regulated charge pump,
switchable pullup/pulldown resistors, and an I2C-compatible 2-wire serial interface. The device provides a
detector to monitor ID status and operates with logic
supply voltages (V
L
) between +1.65V and VCCand
charge-pump supply voltages (V
CC
) from +2.6V to
+5.5V. The charge pump supplies an OTG-compatible
output on V
BUS
while sourcing 8mA output current.
The MAX3353E enables USB OTG communication
between digital logic parts that cannot supply or tolerate
the +5V V
BUS
levels that USB OTG requires. By control-
ling and measuring V
BUS
using internal comparators,
this device supports USB OTG session request protocol
(SRP) and host negotiation protocol (HNP).
The MAX3353E has built-in ±15kV ESD protection circuitry
to guard V
BUS
, ID_IN, D+, and D-. The MAX3353E is
available in a 5 x 4 chip-scale package (UCSP™) and
16-pin TSSOP package.
= 0.1µF, VCCdecoupled with 1µF capacitor to ground;
V
TRM
and VLdecoupled with 0.1µF capacitor to ground; C
VBUS
= 1µF (min), TA= T
MIN
to T
MAX
, unless otherwise noted. Typical
values are at V
CC
= +4V, VL= +1.8V, V
TRM
= +3.3V, and TA= +25°C.) (Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
CC,VL
, V
TRM
..........................................................-0.3V to +6V
D+, D-, ID_IN (Note 1)..............................................-0.3V to +6V
V
BUS
(Notes 1, 2) .....................................................-0.3V to +6V
= 0.1µF, VCCdecoupled with 1µF capacitor to ground.
V
TRM
and VLdecoupled with 0.1µF capacitor to ground. C
VBUS
= 1µF (min), TA= T
MIN
to T
MAX
, unless otherwise noted. Typical val-
ues are at T
A
= +25°C, VCC= +4V, VL = +1.8V, V
TRM
= +3.3V.) (Notes 3, 4)
I2C/SMBUS-COMPATIBLE TIMING SPECIFICATIONS
(VCC= +2.6V to +5.5V, VL = +1.65V to VCC, V
TRM
= +3V to +3.6V, C
FLYING
= 0.1µF, VCCdecoupled with 1µF capacitor to ground.
V
TRM
and VLdecoupled with 0.1µF capacitor to ground. C
VBUS
= 1µF (min). TA= T
MIN
to T
MAX
, unless otherwise noted. Typical val-
ues are at V
CC
= +4V, VL = +1.8V, V
TRM
= +3.3V, and TA= +25°C.) (Notes 3, 4)
Note 3: All currents into the device are negative; currents out of the device are positive. All voltages are referenced to device
ground unless otherwise specified.
Note 4: Parameters are 100% production tested at +25°C, limits over temperature are guaranteed by design.
Note 5: The V
BUS
current source and current gate time vary together with process and temperature such that the resulting V
BUS
pulse is guaranteed to drive a <13µF load to a voltage >2.0V, and to drive a >96µF load to a volatge <2.2V. See the SRP
V
BUS
Pulsing section for an explanation of this self-timed pulse.
Note 6: Guaranteed by design, not production tested.
Note 7: A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s falling
edge.
Note 8: C
B
is total capacitance of one bus line in pF. Tested with CB= 400pF.
Note 9: Input filters on SDA, SCL, and ADD suppress noise spikes less than 50ns.
PARAMETERSYMBOLCONDITIONMINTYPMAXUNITS
INT Out Fall TimeC
ID_OUT Rise TimeC
ID_OUT Fall TimeC
Time to Exit Shutdown500µs
Time to Enter Shutdown1000µs
= 50pF20ns
LOAD
= 50pF30ns
LOAD
= 50pF10ns
LOAD
PARAMETERSYMBOLCONDITIONMINTYPMAXUNITS
Serial Clock Frequencyf
Bus Free Time Between Stop and
Start Conditions
Start Condition Hold Timet
Stop Condition Setup Timet
Clock Low Periodt
Clock High Periodt
Data Setup Timet
Data Hold Timet
Maximum Receive SCL/SDA Rise
Time
Minimum Receive SCL/SDA Rise
Time
Maximum Receive SCL/SDA Fall
Time
Minimum Receive SCL/SDA Fall
Time
Transmit SDA Fall Time (Note 4)
Pulse Width of Suppressed Spiket
SCL
t
BUF
HD:STA
SU:STO
LOW
HIGH
SU:DAT
HD:DAT
t
R
t
R
t
F
t
F
t
F
t
F
SP
DC400kHz
1.3µs
0.6µs
0.6µs
1.3µs
0.6µs
100ns
(Note 7)00.9µs
(Note 8)300ns
(Note 8)20 + 0.1C
B
(Note 8)300ns
(Note 8)20 + 0.1C
CB = 400pF, I
CB = 50pF, I
= 3mA, VL ≥ 2.5V20 + 0.1C
SDA
= 3mA, VL < 2.520 + 0.1C
SDA
B
B
B
250
250
(Note 9)50ns
ns
ns
ns
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
The MAX3353E integrates a regulated charge pump,
switchable pullup/pulldown resistors, and an I2Ccompatible 2-wire serial interface. The internal level
shifter allows the device to operate with logic supply voltages (VL) between +1.65V and VCC. The MAX3353E’s
OTG-compliant charge pump operates with input supply
voltages (VCC) from +2.6V to +5.5V and supplies an
OTG-compatible output on V
BUS
while sourcing 8mA
output current.
The MAX3353E level-detector comparators monitor important V
BUS
voltages needed to support SRP and HNP and
provides an interrupt output signal for OTG events that
require action. The V
BUS
power-control block performs the
various switching functions required by an OTG dual-role
device and is programmable by system logic.
For OTG operation, D+ and D- are connected to switchable pulldown resistors (host) and switchable pullup
resistors (peripheral) controlled by internal registers.
Charge Pump
The MAX3353E’s OTG-compliant charge-pump operates
with input supply voltages (VCC) from +2.6V to +5.5V
and supplies an OTG-compatible output on V
BUS
with
the capability of sourcing 8mA (min) output current.
When V
BUS
is not providing power, an input impedance
of no more than 100kΩ and no less than 40kΩ to GND is
present on V
BUS
. When V
BUS
provides power, the rise
time on V
BUS
from 0 to 4.4V is no longer than 100ms
when driving a constant current load of 8mA and an
external load capacitance of 13µF.
During a continuous short circuit on V
BUS
, the chargepump output is current limited to 140mA (typ). Thermalshutdown circuitry turns off the charge pump if the die
temperature exceeds +150°C and restarts when the die
cools to 140°C.
Level Shifters
Internal level shifters allow the system-side interface to
run at logic supply voltages as low as 1.65V. Interface
logic signals are referenced to the voltage applied to VL.
1C5VCCPower-Supply Input. VCC input range is +2.6V to +5.5V. Bypass VCC to GND with a 1µF capacitor.
2D5V
3D4SDASerial Data Input/Output. I2C bus serial data input/open-drain output can be driven above VL.
4C3ADD
5D3SCLSerial Clock Input. I2C bus serial clock input. Can be driven above VL.
6D2INT
7D1ID_OUT Device ID Output. Output of ID_IN level translated to VL.
8C1V
9B1D-USB D- (±15kV ESD Protected)
10A1D+USB D+ (±15kV ESD Protected)
11A2ID_IN
12—N.C.No Connection. Not internally connected.
13A3GNDGround
14A4C-Charge-Pump Capacitor Negative Connection
15A5C+Charge-Pump Capacitor Positive Connection
16B5V
NAMEFUNCTION
Logic Supply. VL sets the logic output high voltage and logic input high threshold for SDA, SCL,
L
INT, and ID_OUT. V
Address Select Input. Address selection for the I
110kΩ pulldown resistor (see the 2-Wire I
Interrupt Output. INT is an active-low output and can be set either open-drain or push/pull output
through control register 1 (default = open drain).
Termination Supply Input. Connect +3V to +3.6V supply voltage for internal USB pullup resistors.
TRM
Bypass V
Device ID Input. Internally pulled up to V
can be read through the I
OTG Bus Supply. Provides power to the bus. V
BUS
GND with a 1µF capacitor.
TRM
can range from +1.65V to VCC. Bypass VL to GND with a 0.1µF capacitor.
L
2
C-compatible interface. ADD has an internal
2
C Compatible Serial Interface section for details).
to GND with a 0.1µF capacitor.
. ID_IN logic state is VL level translated to ID_OUT and
2
C interface (±15kV ESD protected).
CC
can be back-driven to +6V. Bypass V
BUS
BUS
to
MAX3353E
V
BUS
Level-Detection Comparators
Comparators drive status register bits 0, 1, and 2 to
indicate these important USB OTG V
BUS
voltage levels:
•V
BUS
is valid (V
BUS
> 4.6V)
• A USB session is valid (V
BUS
> 1.4V)
• A USB session is ended (V
BUS
< 0.5V)
The 4.6V comparator sets bit 0 in status register
V
BUS_VALID
to 1 if V
BUS
> 4.6V. The A Device uses the
V
BUS
valid status bit (V
BUS_VALID
) to determine if the B
Device is sinking too much current (i.e., is not supported).
The interrupt can be associated to either a positive or a
negative transition. The 1.4V comparator sets bit 1 of status register SESSION_VALID to 1 if V
BUS
> 1.4V. This status bit indicates that a data transfer session is valid and
the interrupt can be associated to either a positive or a
negative transition. The session-end comparator sets bit
2 in the status register SESSION_END to a 1 when V
BUS
< 0.5V, and generates an interrupt when V
BUS
falls below
0.5V. Figure 1 shows the level-detector comparators.
Interrupt Logic
When OTG events require action, the MAX3353E provides an interrupt output signal on INT. An interrupt is
triggered (INT goes low) when one of the conditions
specified by the interrupt-mask register and interruptedge register is verified. INT stays active until the interrupt is cleared by reading the interrupt latch register.
Shutdown
In shutdown mode, the MAX3353E’s quiescent current
is reduced to less than 2µA. Bit 0 in control register 2
controls the shutdown feature. Setting bit 0 = 1 places
the device in shutdown mode (Figure 2, Table 5). When
in shutdown, the MAX3353E’s charge-pump current
generator and V
BUS
detection comparators are turned
off. During shutdown, the I2C serial interface is fully
functional and registers can be read from or written to.
ID_IN and ID_OUT are both functional in shutdown.
V
BUS
Power Control
V
BUS
is a dual-function I/O that can supply USB OTG-
compliant voltage to the USB. The V
BUS
power-control
block performs the various switching functions required
by an OTG dual-role device. This action is programmed
by the system logic using internal register control bits in
control register 2.
• Discharge V
BUS
through a resistor to ensure a ses-
sion is not in progress.
• Charge V
BUS
through an internal current generator
to initiate SRP (session request protocol).
• Connect the charge pump to V
BUS
to provide power
on V
BUS
.
Bit 0 (SDWN) in control register 2 is used to place the
MAX3353E in normal operation or shutdown mode.
Setting bit 1 (V
BUS_CHG1
) issues a timed pulse on V
BUS
suitable for implementing the session request protocol
(see the SRP V
BUS
Pulsing section). The pulse is created
by turning a current source – supplied by VCCand connected to V
BUS
– on and off. Setting control register bit
2 (V
BUS_CHG2
) to 1 charges VBUS through the current
source continuously. Setting V
BUS_CHG2
to zero discon-
nects the current source. Bit 3 (V
BUS_DRV
) turns the
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
NOTE: SWITCHES ARE SHOWN IN THEIR DEFAULT
(POWER-ON) POSITIONS. A "1" CLOSES A SWITCH.
GATE
TIMER
0 = OPERATING MODE
1 = SHUTDOWN MODE
BUS_VALID
SESSION_VALID
SESSION_END
67kΩ
5kΩ
CONTROL REGISTER 2
V
BUS
charge pump on and off to power V
BUS
. Bit 4 in control
register 2 (V
BUS_DISCHG
) is used to discharge V
BUS
through a 5kΩ resistor. Figure 2 and Table 2 show
power control.
Autoconnect and Autoresponse
USB OTG defines the HNP, where the default host (A
Device) can pass the host responsibilities off to the
default peripheral (B Device). This protocol can be handled entirely by the firmware and controlling logic that drives the OTG transceiver. The MAX3353E has the option
to automatically perform some of the required signaling
for some of the timing-critical events in the HNP process.
The automatic signaling used by the A Device, when it
transfers host control to the B Device, is defined by the
OTG transceiver supplement and is known as autoconnect. Autoconnect allows the transceiver to automatically
connect the A Device’s D+ pullup resistor during HNP.
Autoconnect is enabled when the MAX3353E is configured as an A Device (ID_IN = 0) and the BDISC_ACONN
control bit is set.
The MAX3353E also has the capability to automate the
signaling used by the B Device when it assumes host
control from the A Device. This autoresponse is not specified by the OTG-transceiver supplement. Autoresponse
causes the B Device to automatically assert a bus reset
by driving a single-ended zero (SE0: both D+ and D- driven low) onto USB in response to the A Device connecting its D+ pullup resistor. Autoresponse is enabled when
the MAX3353E is configured as a B Device and the
BDISC_ACONN control bit is set.
Note: In a system, D+ and D- are also driven by a transceiver in an ASIC or other device. The autoresponse
mode should not be used unless the system designer
can ensure that there is no bus conflict between the
transceiver and the MAX3353E driving USB to SE0.
Autoconnect Details
When the MAX3353E is configured as an A Device
(ID_IN = GND), it can enable autodetect by setting
BDISC_ACONN to one. This should be done after the
USB is in the suspend state (>3ms with no traffic). The
MAX3353E monitors D+/D- for an SE0. The presence of
the SE0 indicates that the B Device has disconnected
its pullup resistor, the first step in HNP. When SE0 is
detected, the MAX3353E automatically turns on its
internal pullup resistor to the D+ line within 3ms. There
are two ways for firmware to ascertain that the
MAX3353E has automatically turned on its D+ pullup
during HNP:
1) The A_HNP status bit goes high when the D+ pullup
is automatically connected during HNP
2) The A_HNP_EN control bit is set, and an interrupt is
issued as the D+ pullup is connected (see also the
Interrupt Logic section).
By clearing BDISC_ACONN bit, the D+ pullup is disconnected. After a successful autoconnect operation, the
firmware should set the DP_PULLUP control bit before
clearing the BDISC_ACONN bit; this ensures that the
D+ pullup remains connected.
Note: The autoconnect works only if MAX3353E is not
in shutdown.
Autoresponse Details
When the MAX3353E is configured as a B Device
(ID_IN = open), setting the BDISC_ACONN control bit
enables the autoresponse feature. Using this feature,
the MAX3353E automatically issues a USB bus reset
when the A Device becomes a peripheral. Firmware
can take advantage of the autoresponse feature of the
MAX3353E by doing the following:
• Ensure that the system transceiver is in USB-sus-
pend mode. Wait until the USB-suspend conditions
are met (no USB activity for >3ms). Enable autoresponse. Set the BDISC_ACONN control bit. Signal
a USB disconnect. Firmware clears the DP_PULLUP
control bit, which disconnects the D+ pullup resistor. At this point, the MAX3353E waits at least 25µs
before enabling its internal USB line monitor to
detect if the A Device has attached its D+ pullup;
this ensures that the D+ line is not high due to the
residual effect of the B Device pullup. When the A
Device has connected its D+ pullup, the MAX3353E
issues a bus reset (SE0) and the B_HNP status bit
goes high.
• Wait for B_HNP to go high; output SE0 from the
ASIC or other device on D+/D-. Disable autoresponse. By clearing BDISC_ACONN bit, the SE0
generator is turned off. The SE0 is maintained by the
system USB transceiver.
Note: The autoresponse works only if the MAX3353E is
not in shutdown.
SRP V
BUS
Pulsing
Session request protocol (SRP) is designed to allow
the A Device (default host) to conserve power by turning off V
BUS
when there is no USB traffic. The B Device
(default peripheral) can request the A Device to turn
V
BUS
on and initiate a new session through SRP.
The B Device must initiate SRP in two ways: data-line
and V
BUS
pulsing. Firmware is responsible for turning
on and off the pullup resistor on D+ to implement
data-line pulsing. Firmware can also be used to turn on
and off a current source to implement V
The MAX3353E also has a special feature that allows it
to control the timing of the V
BUS
pulse.
Since an OTG device could be plugged into a PC, the
V
BUS
pulse must be particularly well controlled to prevent
damage to a PC host. For this reason, V
BUS
pulsing is
done by turning on and off a current source. The V
BUS
pulse must be timed so it drives a 13µF load (when it is
connected to the A Device) to a voltage greater than
2.1V, and it drives a >96µF load (when it is connected to
a standard PC) to a voltage less than 2.0V.
Firmware can control the current source and the timing
of the V
BUS
pulse through the V
BUS_CHG2
control bit.
The MAX3353E also has the capability to time the pulse
itself. Firmware initiates the self-timed V
BUS
pulse by
setting the V
BUS_CHG1
control bit to 1.
The internal timer and current generator guarantee that
the V
BUS
voltage goes above 2.1V if C
VBUS
< 13µF
within 90ms and stands below 2.0V if C
VBUS
>
96µF.
Once the time has elapsed, if another V
BUS
pulse is
required, it is necessary to clear the V
BUS_CHG1
bit and
then set it again.
Note: SRP V
BUS
pulsing and its associated current gen-
erator work only if the MAX3353E is not in shutdown.
Data-Line Pullup and Pulldown Resistance
For OTG operation, D+ and D- are connected to switchable pulldown resistors (host) and switchable pullup
resistors (peripheral). Data-line pullup/pulldown resistors
are individually controlled through data bits 4 through 7 in
control register 1. Two 15kΩ pulldown resistors allow the
device to be set as a host and are asserted by bits 6 and
7. The 1.5kΩ pullup resistor is applied to the data lines
through SW1 and SW2, which are controlled by bits 4 and
5. D+ pullup has higher priority to avoid direct connection
of D+ and D-. Each of the control bits controls a designated switch; therefore, pullup and pulldown switches can
be asserted at the same time. A simplified schematic of
the switching network is shown in Figure 3.
The bidirectional D+ and D- lines are ESD protected to
±15kV, reducing external components in many applications.
Applications Information
2-Wire I2C-Compatible Serial Interface
A register file that interfaces to the control logic uses a
simple 2-wire interface operating up to 400kHz to control the various switches and modes.
Serial Addressing
The MAX3353E operates as a slave that sends and
receives control and status signals through an I2Ccompatible 2-wire interface. The interface uses a serial
data line (SDA) and a serial clock line (SCL) to achieve
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
NOTE: SWITCHES ARE SHOWN IN THEIR DEFAULT
(POWER-ON) POSITIONS. A "1" CLOSES A SWITCH.
BIT 4
BIT 5
0
0
1
11CLOSED OPEN
0000
SW1
0
OPEN
1
OPEN
0
CLOSED
D+
D-
GND
SW2
OPEN
CLOSED
OPEN
SCL
t
SDA
HD:STA
t
F
t
LOW
t
SU:DAT
t
R
t
HIGH
t
HD:DAT
t
SU:STO
t
BUF
bidirectional communication between master(s) and
slave(s). A master (typically a microcontroller) initiates
all data transfers to and from the MAX3353E and generates the SCL clock that synchronizes the data transfer (Figure 4).
The MAX3353E SDA line operates as both an input and
an open-drain output. A pullup resistor (4.7kΩ typ) is
required on SDA. The MAX3353E SCL line operates
only as an input. A pullup resistor (4.7kΩ typ) is
required on SCL if there are multiple masters on the 2wire interface, or if the master in a single-master system
has an open-drain SCL output.
Each transmission consists of a START condition
(Figure 5) sent by a master, followed by the MAX3353E
7-bit slave address plus R/W bit (Figure 6), a register
address byte, one or more data bytes, and finally a
STOP condition (Figure 5).
Start and Stop Conditions
Both SCL and SDA remain high when the interface is
not busy. A master signals the beginning of a transmission with a START (S) condition by transitioning SDA
from high to low while SCL is high. When the master
has finished communicating with the slave, it issues a
STOP (P) condition by transitioning the SDA from low to
high while SCL is high. The bus is then free for another
transmission (Figure 5).
Bit Transfer
One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable while SCL
is high (Figure 7).
Acknowledge
The acknowledge bit is the clocked ninth bit that the
recipient uses to handshake receipt of each byte of
data (Figure 8). Thus, each byte transferred effectively
requires 9 bits. The master generates the 9th clock
pulse, and the recipient pulls down SDA during the
acknowledge clock pulse, such that the SDA line is stable low during the high period of the clock pulse. When
the master is transmitting to the MAX3353E, the
MAX3353E generates the acknowledge bit because it
is the recipient. When the MAX3353E is transmitting to
the master, the master generates the acknowledge bit
because the master is the recipient.
Slave Address
The MAX3353E has a 7-bit-long slave address. The
eighth bit following the 7-bit slave address is the R/W
bit. It is low for a write command, high for a read command. The first 6 bits (MSBs) of the MAX3353E slave
address are always 010110. Select slave address bit
A0 by connecting the address input ADD to VL, GND,
or leave floating (ADD is internally pulled to GND
through a 110kΩ resistor). The MAX3353E has two possible slave addresses (Table 1). As a result, only two
MAX3353E devices can share the same interface.
Write Byte Format
A write to the MAX3353E comprises the transmission of
the MAX3353E’s slave address with the R/W bit set to
zero, followed by 2 bytes of information. The first byte
of information is the command byte that determines
which register of the MAX3353E is to be written by the
second byte. The second byte is the data that goes into
the register that is set by the first byte. Figure 9 shows
the typical write byte format.
Read Byte Format
A read from the MAX3353E comprises the transmission
of the MAX3353E’s slave address (from the master)
with the R/W bit set to zero, followed by one byte containing the address of the register, from which the master is going to read data, and then followed by
MAX3353E’s slave address again with the R/W bit set
to one. After that one byte of data is being read by the
master. Figure 10 shows the read byte format that must
be used. To read many contiguous registers, multiple
accesses are required.
Registers
Control Registers (10h, 11h)
There are two read/write control registers. Control register 1 is used to set D+, D- pullup or pulldown, and to
set interrupt output to open-drain or push-pull. Control
register 2 is the bus control register used to control the
bus operation and put the device into shutdown mode.
(Tables 3, 4, and 5.)
Status Register (13h)
The status register is a read-only register for determining
valid bus and session comparator thresholds, ID_IN status, and HNP success. Tables 6 and 7 show status register address map, bit configuration, and description.
Slave address: Part addressP: Stop condition
Register address: Selecting which register to write toACK: Acknowledge bit from the slave
Data: Data byte being read by the masterNACK: Not acknowledged bit from the master
R/W: Read/Write (R/W = 1: Read; R/W = 0: Write)Blank: Master transmission
S: Start conditionShaded: Slave transmisstion
0
MSB
CHANGE OF
DATA ALLOWED
1
7 bitsW8 bits
DATAACKP
8 bits
0
1
1
SDA BY
TRANSMITTER
SDA BY
RECEIVER
0A0
LSB
START
CONDITION
SCL
S
CLOCK PULSE FOR ACKNOWLEDGMENT
12 8 9
R/W
ACK
0
SPART ADDRESSR/W ACKREGISTER ADDRESSACK
A
6A5A4A3A2A1A0
RSPART ADDRESSR/W ACKDATANACK
A
6A5A4A3A2A1A0
Where:
Slave address: Part addressP: Stop condition
Register address: Selecting which register to write toACK: Acknowledge bit from the slave
Data: Data byte being read by the masterNACK: Not acknowledged bit from the master
R/W: Read/Write (R/W = 1: Read; R/W = 0: Write)Blank: Master transmission
S: Start conditionShaded: Slave transmisstion
7 bits8 bits
7 bits8 bits
0
00
01
1
P
Interrupt Registers (14h, 15h, 16h)
There are three interrupt registers. Interrupt mask register is a read/write register used to enable interrupts and
read status of interrupts. Interrupt edge register is a
read/write register for setting and determining interrupts for positive and negative edges. Interrupt latch
register is a read only register to check and validate
interrupt requests. Table 8 shows the interrupt mask,
Session-valid comparator, threshold = 1.4V:
0 = V
1 = V
V
0 = V
1 = V
ID_IN grounded:
0 = not grounded
1 = grounded
ID_IN floating:
0 = not floating
1 = floating
Set when Device A is configured, BDISC_ACONN is enabled and has attached pullup during HNP;
cleared by resetting BDISC_ACONN bit in control register 1.
Set when Device B is configured, BDISC_ACONN is enabled and has asserted an SE0 during HNP;
cleared by resetting BDISC_ACONN bit in control register 1.
lower than threshold
BUS
higher than threshold
BUS
lower than threshold
BUS
higher than threshold
BUS
session-end comparator, threshold = 0.5V:
BUS
higher than threshold
BUS
lower than threshold
BUS
valid comparator, threshold = 4.55V:
BUS
REGISTERADDRESS
Interrupt Mask14h00000000
Interrupt Edge15h00000000
Interrupt Latch16h00000000
BIT7BIT6BIT5BIT4BIT3BIT2BIT1BIT0
POWER-UP REGISTER STATUS
BIT
NUMBER
0V
1
2
3ID_GND_ENEnables ID_GND interrupt
4ID_FLOAT_ENEnables ID_FLOAT interrupt
5A_HNP_ENEnables A_HNP interrupt
6—Not used
7—Not used
SYMBOLOPERATION
BUS_VALID_EN
SESSION_
VALID_EN
SESSION_
END_EN
Enables V
Enables SESSION_VALID
interrupt
Enables SESSION_END
interrupt
BUS_VALID
interrupt
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
Connect all capacitors as close to the device as possible.
V
BUS
and VCCbypass capacitors should have trace
lengths as short as possible
±15kV ESD Protection
To protect the MAX3353E against ESD, D+, D-, ID_IN,
and V
BUS,
have extra protection against static electricity
to protect the device up to ±15kV. The ESD structures
withstand high ESD in all states—normal operation,
shutdown, and powered down. In order for the 15kV
ESD structures to work correctly, a 1µF or greater
capacitor must be connected from V
BUS
to GND. ESD
protection can be tested in various ways; D+, D-, ID_IN,
and V
BUS
are characterized for protection to the follow-
ing limits:
1) ±15kV using the Human Body Model
2) ±6kV using the IEC 1000-4-2 Contact Discharge
method
3) ±11kV using the IEC 1000-4-2 Air-Gap Discharge
method
ESD Test Conditions: ESD performance depends on
a variety of conditions. Contact Maxim for a reliability
report that documents test setup, test methodology,
and test results.
Human Body Model
Figure 11 shows the Human Body Model and Figure 12
shows the current waveform it generates when discharged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device
through a 1.5kΩ resistor.
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifically refer to integrated circuits. The major difference
between tests done using the Human Body Model and
IEC 1000-4-2 is a higher peak current in IEC 1000-4-2,
because series resistance is lower in the IEC 1000-4-2
model. Hence, the ESD withstand voltage measured to
IEC 1000-4-2 is generally lower than that measured
using the Human Body Model. Figure 13 shows the IEC
1000-4-2 model. The Air-Gap Discharge test involves
approaching the device with a charged probe. The
Contact Discharge method connects the probe to the
device before the probe is energized. Figure 14 shows
the IEC 1000-4-2 current waveform.
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing. The Machine Model is less relevant to
I/O ports after PC board assembly.
Layout Considerations
The MAX3353E high oscillator frequency makes proper
layout important to ensure stability and maintain the
output voltage under all loads. For best performance,
minimize the distance between the capacitors and the
MAX3353E.
UCSP Reliability
For the latest application details on UCSP construction,
dimensions, tape-carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, refer to Maxim Application Note:
UCSP – A Wafer-Level Chip Scale Package available on
Maxim’s website at www.maxim-ic.com/ucsp.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages
.)
5x4 UCSP.EPS
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages
.)
TSSOP4.40mm.EPS
PACKAGE OUTLINE, TSSOP 4.40mm BODY
21-0066
1
1
I
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