MAX3301E/MAX3302E
USB On-the-Go Transceivers and Charge Pumps
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC= +3V to +4.5V, VL= +1.65V to +3.6V, C
FLYING
= 100nF, C
VBUS
= 1µF, ESR
CVBUS
= 0.1Ω (max), TA= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.7V, VL= +2.5V, TA= +25°C.) (Note 2)
Note 1: The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the
device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is
required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
All voltages are referenced to GND.
V
CC
, VL.....................................................................-0.3V to +6V
TRM (regulator off or supplied by V
BUS
)..-0.3V to (V
BUS
+ 0.3V)
TRM (regulator supplied by V
CC
)...............-0.3V to (VCC+ 0.3V)
D+, D- (transmitter tri-stated) ...................................-0.3V to +6V
D+, D- (transmitter functional)....................-0.3V to (V
CC
+ 0.3V)
V
BUS
.........................................................................-0.3V to +6V
ID_IN, SCL, SDA.......................................................-0.3V to +6V
INT, SPD, RESET, ADD, OE/INT, RCV, VP,
VM, SUS, DAT_VP, SE0_VM ......................-0.3V to (V
L
+ 0.3V)
C+.............................................................-0.3V to (V
BUS
+ 0.3V)
C-................................................................-0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration, V
BUS
to GND .........................Continuous
Continuous Power Dissipation (T
A
= +70°C)
5 x 5 UCSP (derate 12.2mW/°C above +70°C) ...........976mW
32-Pin TQFN (5mm x 5mm x 0.8mm) (derate 21.3mW/°C
above +70°C).............................................................1702mW
28-Pin TQFN (4mm x 4mm x 0.8mm) (derate 20.8mW/°C
above +70°C).............................................................1666mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Reflow Temperature (Note 1)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C