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MAX3283EAUT
Rev. A
RELIABILITY REPORT
FOR
MAX3283EAUT
PLASTIC ENCAPSULATED DEVICES
February 14, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by Reviewed by
Jim Pedicord Bryan J. Preeshl
Quality Assurance Quality Assurance
Reliability Lab Manager Executive Director
Conclusion
The MAX3283E successfully meets the quality and reliability standards required of all Maxim products. In
addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s
quality and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information ......Attachments
I. Device Description
A. General
The MAX3283E is a single receiver designed for RS -485 and RS-422 communication. This devices guarantee data
rates up to 52Mbps, even with a 3V power supply. Excellent propagation delay (15ns max) and package-to-package
skew time (8ns max) make this device ideal for multidrop clock distribution applications.
The MAX3283E has true fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are
opened or shorted. The receiver output will be a logic high if all transmitters on a terminated bus are disabled (high
impedance). This device features 1/4-unit-load receiver input impedance, allowing up to 128 receivers on the same
bus.
The MAX3283E single receivers have a receiver enable (EN or EN-bar) function and are offered in a 6-pin SOT23
package.
B. Absolute Maximum Ratings
Item Rating
(All Voltages Referenced to GND)
Supply Voltage (VCC) -0.3V to +6V
Control Input Voltage (EN, EN ) -0.3V to +6V
VL Input Voltage -0.3V to +6V
Receiver Input Voltage (A, B) -7.5V to +12.5V
Receiver Output Voltage (RO) -0.3V to (VCC + 0.3V)
Receiver Output Short -Circuit Current Continuous
Operating Temperature Range -40°C to +125°C
Storage Temperature Range -65°C to +150°C
Junction Temperature +150°C
Lead Temperature (soldering, 10s) +300°C
Continuous Power Dissipation (TA = +70°C)
6-Pin SOT23 696mW
Derates above +70°C
6-Pin SOT23 8.7mW/°C
II. Manufacturing Information
A. Description/Function: ±15kV ESD-Protected 52Mbps, 3V to 5.5V, RS-485/RS-422 True Fail-Safe Receivers
B. Process: S8 - Standard 8 micron silicon gate CMOS
C. Number of Device Transistors: 233
D. Fabrication Location: California, USA
E. Assembly Location: Malaysia or Thailand
F. Date of Initial Production: January, 2002
III. Packaging Information
A. Package Type: 6-Lead SOT23
B. Lead Frame: Copper
C. Lead Finish: Solder Plate
D. Die Attach: Silver-Filled Epoxy
E. Bondwire: Gold (1.0 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: Buildsheet # 05-9000-0327
H. Flammability Rating: Class UL94-V0
I. Classifi cation of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions: 43 X 35 mils
B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect: TiW/ AlCu/ TiWN
D. Backside Metallization: None
E. Minimum Metal Width: .8 microns (as drawn)
F. Minimum Metal Spacing: .8 microns (as drawn)
G. Bondpad Dimensions: 2.7 mil. Sq.
H. Isolation Dielectric: SiO
2
I. Die Separation Method: Wafer Saw